Universal bearing device for integrated circuit automatic test equipment
By designing a square-centered symmetrical IO resource channel and resource switching module, the problem of poor compatibility between the integrated circuit test equipment carrier board and the ATE machine was solved, achieving rapid construction and efficient production.
Patent Information
- Application Number
- CN202422464901.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2025-09-16
- Estimated Expiration
- 2034-10-12
AI Technical Summary
Existing integrated circuit test equipment carrier boards have poor compatibility with ATE machines, resulting in low production efficiency and prone to poor contact problems.
A universal carrier device was designed, including an IO resource channel, a resource switching module, a test IO channel module, and a test power supply module. The IO resource channel was square and centrally symmetrical to ensure that the interfaces did not overlap. It was connected to the chip under test through the resource switching module and a shorting cap was used to connect the ground terminal to improve compatibility.
It enables the rapid construction of the hardware environment, improves the compatibility between the carrier board and the ATE machine, reduces poor contact problems, and improves production efficiency.
Smart Images

Figure CN223347007U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of integrated circuits, and in particular to a universal carrying device for integrated circuit automatic testing equipment. Background Art
[0002] With the rapid development of the integrated circuit industry, people have put forward higher and higher requirements for the testing of various integrated circuits and the allocation of automatic test equipment (ATE) resources.
[0003] Existing IC testing often requires the redevelopment of various carrier boards to accommodate a variety of different ATE machines and equipment resources, which reduces production efficiency. Some solutions utilize DuPont wires and other connection methods, but these methods often suffer from poor connection stability and can lead to problems such as poor contact. Utility Model Content
[0004] In order to solve the problem of poor compatibility between existing carrier boards and ATE machines, the utility model provides a universal carrier device for integrated circuit automatic test equipment, the universal carrier device for integrated circuit automatic test equipment comprising an IO resource channel for connecting to a chip under test, a resource switching module connected to a ground terminal of the chip under test, a test IO channel module, and a test power supply module connected to the resource switching module; the IO resource channel comprises a first IO resource channel unit, a second IO resource channel unit, a third IO resource channel unit, and a fourth IO resource channel unit;
[0005] The first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit form a square and are centrally symmetrical; the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit are connected to the test IO channel module through the resource switching module.
[0006] Preferably, each of the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit and the fourth IO resource channel unit includes at least one IO interface.
[0007] Preferably, the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit and the fourth IO resource channel unit include 64 IO interfaces respectively.
[0008] Preferably, the resource switching module includes a resource IO interface unit, and the resource IO interface unit is connected to the IO interfaces of the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit.
[0009] Preferably, the resource switching module includes a resource grounding interface unit, and the resource grounding interface unit is connected to the ground terminal on the chip to be tested through a shorting cap.
[0010] Preferably, the resource switching module includes a resource power interface unit, and the resource switching module is connected to the test power module via the resource power interface unit.
[0011] Preferably, the test IO channel module includes a test IO interface unit, and the test IO interface unit is adapted to the IO interface of the IO resource channel.
[0012] Preferably, the test IO interface unit includes at least one test IO interface sub-unit for ATE testing, and the test IO interface sub-unit is connected to the IO interface of the IO resource channel.
[0013] Preferably, the test IO interface subunit is arranged at the periphery of the IO resource channel.
[0014] Preferably, the test IO interface subunit is arranged on four sides with two test IO interface subunits on each side; the test IO interface unit includes a first test IO interface subunit, a second test IO interface subunit, a third test IO interface subunit, a fourth test IO interface subunit, a fifth test IO interface subunit, a sixth test IO interface subunit, a seventh test IO interface subunit, and an eighth test IO interface subunit; the first test IO interface subunit and the second test IO interface subunit are located on one side and are compatible with the first IO resource channel unit; the third test IO interface subunit and the fourth test IO interface subunit are located on one side and are compatible with the second IO resource channel unit; the fifth test IO interface subunit and the sixth test IO interface subunit are located on one side and are compatible with the third IO resource channel unit; the seventh test IO interface subunit and the eighth test IO interface subunit are located on one side and are compatible with the fourth IO resource channel unit.
[0015] Compared with the prior art, the universal carrier device for integrated circuit automatic test equipment of the present invention has the following beneficial effects:
[0016] The utility model discloses a universal carrier device for integrated circuit automatic test equipment. By designing the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit of the IO resource channel into a square and centrally symmetrical shape, it not only ensures that the IO channels corresponding to any two adjacent interfaces do not overlap, thereby achieving the purpose of quickly building an engineering debugging hardware environment, but also effectively solves the problem of poor contact caused by connection methods such as DuPont wires. Therefore, to a certain extent, the compatibility of the carrier board and the ATE machine is greatly improved.
[0017] Additional aspects and advantages of the present invention will be partially given in the following description, which will become apparent from the following description or be understood through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:
[0019] Figure 1 This is a structural schematic diagram of a universal carrier device for integrated circuit automatic test equipment according to an embodiment of the present utility model.
[0020] Figure 2 This is a schematic diagram of an IO resource channel structure in a universal carrier device for integrated circuit automatic test equipment according to an embodiment of the present utility model.
[0021] Description of the symbols in the figure:
[0022] 101, IO resource channel; 1011, first IO resource channel unit; 1013, second IO resource channel unit; 1015, third IO resource channel unit; 1017, fourth IO resource channel unit;
[0023] 103. Resource switching module;
[0024] 105. Test IO channel module;
[0025] 107. Test the power module. DETAILED DESCRIPTION
[0026] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.
[0027] See also Figure 1-2The present invention provides a universal carrier device for integrated circuit automatic test equipment, comprising an IO resource channel 101 connected to a chip under test, a resource switching module 103 connected to a ground terminal of the chip under test, a test IO channel module 105, and a test power supply module 107 connected to the resource switching module 103, wherein:
[0028] The IO resource channel 101 includes a first IO resource channel unit 1011, a second IO resource channel unit 1013, a third IO resource channel unit 1015, and a fourth IO resource channel unit 1017. The first IO resource channel unit 1011, the second IO resource channel unit 1013, the third IO resource channel unit 1015, and the fourth IO resource channel unit 1017 form a square and are centrally symmetrical. The first IO resource channel unit 1011, the second IO resource channel unit 1013, the third IO resource channel unit 1015, and the fourth IO resource channel unit 1017 are connected to the test IO channel module 105 via the resource switching module 103.
[0029] In some implementations, each of the first IO resource channel unit 1011 , the second IO resource channel unit 1013 , the third IO resource channel unit 1015 , and the fourth IO resource channel unit 1017 includes at least one IO interface.
[0030] For example, Figure 2 As shown, assuming IO resource channel 101 includes 16 IO interfaces, the first IO resource channel unit 1011, the second IO resource channel unit 1013, the third IO resource channel unit 1015, and the fourth IO resource channel unit 1017 are arranged clockwise to form a square with central symmetry. Notably, this design ensures that the IO channels corresponding to any two adjacent interfaces do not overlap, allowing for immediate use with different adapter boards, thereby enabling rapid switching to the corresponding machine power resource.
[0031] In some embodiments, the first IO resource channel unit 1011, the second IO resource channel unit 1013, the third IO resource channel unit 1015, and the fourth IO resource channel unit 1017 each include 64 IO interfaces, so that the IO resource channel 101 has a total of 256 IO interfaces, which is compatible with ATE machine testing of integrated circuit chips with no more than 256 pins.
[0032] The resource switching module 103 includes a resource grounding interface unit, a resource IO interface unit, and a resource power interface unit, wherein the resource IO interface unit is connected to the IO interfaces of the first IO resource channel unit 1011, the second IO resource channel unit 1013, the third IO resource channel unit 1015, and the fourth IO resource channel unit 1017; the resource grounding interface unit is connected to the ground terminal on the chip under test through a shorting cap; and the resource switching module 103 is connected to the test power module 107 through the resource power interface unit.
[0033] Specifically, when the ground terminal on the chip under test is connected to the IO interface on the IO resource channel 101, a shorting cap is used to directly connect the resource ground interface unit to the IO interface on the IO resource channel 101 connected to the ground terminal of the chip under test. This effectively accommodates the different ground terminal settings of different chips under test, greatly improving compatibility and reducing work such as wire bonding, greatly improving production efficiency.
[0034] The test IO channel module 105 includes a test IO interface unit adapted to the IO interface of the IO resource channel 101, wherein the test IO interface unit includes at least one for ATE testing.
[0035] Test the IO interface subunit, and test the IO interface connection between the IO interface subunit and the IO resource channel 101.
[0036] In order to facilitate circuit design and test adjustment, the test IO interface subunit is arranged on the periphery of the IO resource channel 101 .
[0037] In some embodiments, the test IO interface subunits are arranged on four sides, with two test IO interface subunits on each side. Specifically, the test IO interface subunits include a first test IO interface subunit, a second test IO interface subunit, a third test IO interface subunit, a fourth test IO interface subunit, a fifth test IO interface subunit, a sixth test IO interface subunit, a seventh test IO interface subunit, and an eighth test IO interface subunit, wherein the first test IO interface subunit and the second test IO interface subunit are located on one side and are compatible with the first IO resource channel unit 1011; the third test IO interface subunit and the fourth test IO interface subunit are located on one side and are compatible with the second IO resource channel unit 1013; the fifth test IO interface subunit and the sixth test IO interface subunit are located on one side and are compatible with the third IO resource channel unit 1015; and the seventh test IO interface subunit and the eighth test IO interface subunit are located on one side and are compatible with the fourth IO resource channel unit 1017.
[0038] In some embodiments, the test power supply module 107, the first test IO interface subunit, the second test IO interface subunit, the third test IO interface subunit, the fourth test IO interface subunit, the fifth test IO interface subunit, the sixth test IO interface subunit, the seventh test IO interface subunit, and the eighth test IO interface subunit are all bullnose interfaces.
[0039] In order to facilitate further understanding of the universal carrier device for integrated circuit automatic test equipment according to an embodiment of the present invention, the working principle thereof is briefly described below.
[0040] In the first step, the component to be tested is connected to a universal carrier device for integrated circuit automatic test equipment according to an embodiment of the present utility model.
[0041] In the second step, a universal carrier device for integrated circuit automatic test equipment according to an embodiment of the present invention is matched with an ATE machine through a cowl socket.
[0042] Finally, the ATE machine can directly test the device to be tested through the universal carrier device for integrated circuit automatic test equipment according to the embodiment of the utility model.
[0043] In some implementations, the universal carrier device for integrated circuit automatic test equipment of the embodiment of the present invention may also be reserved for the arrangement of relay modules, capacitor modules and other common test-related modules to further improve compatibility.
[0044] Compared with the prior art, the universal carrier device for integrated circuit automatic test equipment according to the embodiment of the present invention has the following beneficial effects:
[0045] The embodiment of the present invention is a universal carrier device for integrated circuit automatic test equipment. By designing the first IO resource channel unit 1011, the second IO resource channel unit 1013, the third IO resource channel unit 1015, and the fourth IO resource channel unit 1017 of the IO resource channel 101 into a square and centrally symmetrical shape, it not only ensures that the IO channels corresponding to any two adjacent interfaces do not overlap, thereby achieving the purpose of quickly building an engineering debugging hardware environment, but also effectively solves problems such as poor contact caused by connection methods such as DuPont wires. Therefore, to a certain extent, the compatibility of the carrier board with the ATE machine is greatly improved.
[0046] The above description is only part of the implementation methods of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.
Claims
1. A universal carrier device for integrated circuit automatic test equipment, characterized by: The universal carrier device for integrated circuit automatic test equipment includes an IO resource channel for connecting to a chip under test, a resource switching module connected to a ground terminal of the chip under test, a test IO channel module, and a test power supply module connected to the resource switching module; the IO resource channel includes a first IO resource channel unit, a second IO resource channel unit, a third IO resource channel unit, and a fourth IO resource channel unit; The first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit form a square and are centrally symmetrical; the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit are connected to the test IO channel module through the resource switching module.
2. The universal carrier device for integrated circuit automatic test equipment according to claim 1, wherein: The first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit each include at least one IO interface.
3. The universal carrier device for integrated circuit automatic test equipment according to claim 1, wherein: The first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit each include 64 IO interfaces.
4. The universal carrier device for integrated circuit automatic test equipment according to claim 2, wherein: The resource switching module includes a resource IO interface unit, and the resource IO interface unit is connected to the IO interfaces of the first IO resource channel unit, the second IO resource channel unit, the third IO resource channel unit, and the fourth IO resource channel unit.
5. The universal carrier device for integrated circuit automatic test equipment according to claim 4, characterized in that: The resource switching module includes a resource grounding interface unit, and the resource grounding interface unit is connected to the grounding terminal on the chip to be tested through a shorting cap.
6. The universal carrier device for integrated circuit automatic test equipment according to claim 5, characterized in that: The resource switching module includes a resource power interface unit, and the resource switching module is connected to the test power module through the resource power interface unit.
7. The universal carrier device for integrated circuit automatic test equipment according to claim 6, characterized in that: The test IO channel module includes a test IO interface unit, and the test IO interface unit is adapted to the IO interface of the IO resource channel.
8. The universal carrier device for integrated circuit automatic test equipment according to claim 7, characterized in that: The test IO interface unit includes at least one test IO interface sub-unit for ATE testing, and the test IO interface sub-unit is connected to the IO interface of the IO resource channel.
9. The universal carrier device for integrated circuit automatic test equipment according to claim 8, characterized in that: The test IO interface subunit is arranged on the periphery of the IO resource channel.
10. The universal carrier device for integrated circuit automatic test equipment according to claim 9, characterized in that: The test IO interface subunit is arranged on four sides, with two test IO interface subunits on each side; the test IO interface subunit includes a first test IO interface subunit, a second test IO interface subunit, a third test IO interface subunit, a fourth test IO interface subunit, a fifth test IO interface subunit, a sixth test IO interface subunit, a seventh test IO interface subunit, and an eighth test IO interface subunit; the first test IO interface subunit and the second test IO interface subunit are located on one side and are adapted to the first IO resource channel unit; The third test IO interface sub-unit and the fourth test IO interface sub-unit are located on one side and adapted to the second IO resource channel unit; The fifth test IO interface sub-unit and the sixth test IO interface sub-unit are located on one side and adapted to the third IO resource channel unit; The seventh test IO interface sub-unit and the eighth test IO interface sub-unit are located on one side and are adapted to the fourth IO resource channel unit.