Built-in heat dissipation module of notebook computer

Abstract

The utility model discloses a built-in heat dissipation module of a notebook computer, which comprises a heat conduction pipe, a heat absorption assembly arranged on a heat absorption section of the heat conduction pipe and a heat dissipation assembly arranged on a heat dissipation section of the heat conduction pipe, the heat dissipation assembly comprises a heat dissipation body and an installation seat used for installing a heat dissipation fan, and the heat dissipation body comprises a plurality of airflow channels arranged at intervals. The airflow channel is provided with a first flow channel and a second flow channel which are communicated with each other, and the cross-sectional area of the second flow channel is larger than that of the first flow channel, so that the volume is increased when airflow flows into the second flow channel from the first flow channel. According to the utility model, the heat-conducting sheet matched with the capacitor of the circuit board is arranged on the heat-absorbing copper sheet, so that heat generated by the chip and the capacitor can be efficiently conducted out of the system; the volume of airflow is increased when the airflow flows into the second flow channel from the first flow channel, so that the air outlet area of the air outlet is increased, and dust accumulation at the air outlet is effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation modules, in particular to a built-in heat dissipation module for a notebook computer. Background Art

[0002] With the advancement of electronics technology, the transistor density of various chips is increasing. As data processing speeds accelerate, the heat generated is also increasing. To ensure stable operation of circuit board chips, high-efficiency heat sinks have become an inevitable requirement.

[0003] In existing laptop designs, cooling modules utilize fans to drive airflow, exchanging heat with heat-collecting fins to remove heat from the fins and achieve cooling. However, in addition to the chips, other heat-generating electrical components on the circuit board, such as capacitors, also require heat dissipation to maintain stable operation. Furthermore, the existing fin structure easily allows dust to accumulate at the fin outlets, reducing heat dissipation efficiency and impacting data processing speed. Summary of the Invention

[0004] In order to overcome the above-mentioned defects, the utility model provides a built-in heat dissipation module for a notebook computer, so as to solve the technical problems that the existing radiator does not have the capacitor heat dissipation function and the air outlet is prone to dust accumulation.

[0005] The utility model adopts a technical solution to solve its technical problems: providing a built-in heat dissipation module for a laptop computer, comprising a heat pipe, a heat absorbing component provided on one side of the heat absorbing section of the heat pipe, and a heat dissipation component provided on one side of the heat dissipation section of the heat pipe, wherein the heat absorbing section and the heat dissipation section are integrally connected via a curved section, the heat absorbing component comprising a heat absorbing copper sheet for performing heat exchange with a chip on a circuit board and fixedly connected to the heat absorbing section, two positioning members provided on the heat absorbing copper sheet and respectively arranged on both sides of the width of the heat absorbing section, and a heat conducting sheet provided on one side of the heat absorbing copper sheet for performing heat exchange with a capacitor on the circuit board;

[0006] The heat dissipation assembly includes a heat dissipation body and a mounting base provided on the heat dissipation body and used to install a heat dissipation fan. The heat dissipation body includes a plurality of air flow channels arranged parallel and at intervals along its length direction. The air flow channel has a first flow channel and a second flow channel that are interconnected. The first flow channel is an air inlet on the side facing the mounting base, and the second flow channel is an air outlet on the side away from the air inlet. The cross-sectional area of ​​the second flow channel is larger than the cross-sectional area of ​​the first flow channel, so that the volume of the air flow increases when it flows from the first flow channel to the second flow channel; the mounting base is arranged toward the air inlet side, and one end is fixedly connected to the lower surface of the heat dissipation body, and the heat dissipation section of the heat pipe is fixedly connected to the upper surface of the heat dissipation body.

[0007] As a further improvement of the present invention, the heat-absorbing copper sheet is integrally formed by a die-casting process, and a groove adapted to the heat-absorbing section is provided in the middle of the heat-absorbing copper sheet along its length direction, and first connecting parts for fixedly connecting the positioning piece are respectively provided on both sides of the width direction of the groove, and a second connecting part for fixedly connecting the heat conducting sheet is provided on the side of one of the first connecting parts away from the groove.

[0008] As a further improvement of the present invention, the positioning member includes a base plate fixedly connected to the first connecting part, and two spring plates respectively arranged at both ends of the length direction of the base plate. The spring plates are arranged outward and upward along the length direction from one end of the base plate, and a connection hole for a bolt to be embedded is opened at the end of each spring plate.

[0009] As a further improvement of the present invention, the heat conductor is integrally formed of aluminum through a die-casting process, and a plurality of rivet holes are opened on it. The second connecting part of the heat-absorbing copper sheet is provided with a rivet part corresponding to the rivet hole, and the rivet part is embedded in the corresponding rivet hole for riveting connection.

[0010] As a further improvement of the present invention, the air outlet has a first air outlet arranged parallel to the conveying direction of the air flow channel, and a second air outlet arranged perpendicular to the conveying direction of the air flow channel, and the first air outlet and the second air outlet are connected to each other.

[0011] As a further improvement of the present invention, the heat dissipation body is provided with a plurality of notches at intervals along its length direction on one side of the air outlet.

[0012] As a further improvement of the present invention, the notch includes two first notches and two second notches, and the two first notches and the two second notches are spaced apart from each other;

[0013] The first notch is formed by a vertical upward concave arrangement of the bottom of the heat dissipation body, and the second notch is formed by an inward concave arrangement of one side of the second air outlet.

[0014] As a further improvement of the present invention, the cross-section of the heat conducting pipe is rectangular.

[0015] As a further improvement of the present invention, the heat pipe, the heat-absorbing copper sheet and the heat dissipation body are all fixedly connected by using thermal conductive adhesive, and the heat dissipation body and the mounting seat are fixedly connected by using thermal conductive adhesive.

[0016] The beneficial effects of the utility model are:

[0017] 1. By setting a heat-conducting sheet that matches the circuit board capacitor on the heat-absorbing copper sheet of the heat-absorbing component, the heat generated by the chip and capacitor is connected to the heat pipe through the heat-absorbing copper sheet, and the air flow channel of the heat dissipation component is used to efficiently guide the hot air generated inside the laptop to the outside of the system;

[0018] 2. By setting the air flow channel into two sections that are interconnected, and the cross-sectional area of ​​the second flow channel on the air outlet side is larger than the cross-sectional area of ​​the first flow channel on the air inlet side, the volume of the air flow increases when it flows from the first flow channel to the second flow channel, thereby increasing the air outlet area of ​​the air outlet and effectively avoiding the accumulation of dust at the air outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural diagram of the utility model;

[0020] Figure 2 This is a schematic diagram of the exploded structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the cross-sectional structure of the heat dissipation body of the utility model along the air flow channel direction;

[0022] Figure 4 This is a structural schematic diagram of the heat dissipation body of the utility model from another perspective.

[0023] The following description is made with reference to the accompanying drawings:

[0024] 1. Heat pipe; 101. Heat absorption section; 102. Heat dissipation section; 103. Bending section; 2. Heat absorption assembly; 201. Heat absorption copper sheet; 2010. Groove; 2011. First connecting portion; 2022. Second connecting portion; 20220. Rivet portion; 202. Positioning member; 2020. Base sheet; 2021. Spring piece; 20210. Connecting hole; 203. Heat conduction sheet; 2030. Riveting hole; 3. Heat dissipation assembly; 301. Heat dissipation body; 3011. Air flow channel; 30110. First flow channel; 30111. Second flow channel; 3012. Air inlet; 3013. Air outlet; 30130. First air outlet; 30131. Second air outlet; 3014. Notch; 30140. First notch; 30141. Second notch; 302. Mounting seat. DETAILED DESCRIPTION

[0025] A preferred embodiment of the present invention is described in detail below with reference to the accompanying drawings.

[0026] See Figures 1 to 4The utility model provides a built-in heat dissipation module for a laptop computer, comprising a heat pipe 1, a heat absorbing assembly 2 disposed on one side of a heat absorbing section 101 of the heat pipe 1, and a heat dissipation assembly 3 disposed on one side of a heat dissipation section 102 of the heat pipe 1. The heat absorbing section 101 and the heat dissipation section 102 are integrally connected by a curved section 103. The heat absorbing section 101 and the heat dissipation section 102 are arranged relatively parallel to each other, and the curved section 103 is formed in an "S" shape to integrally connect the heat absorbing section 101 and the heat dissipation section 102. The cross-section of the heat pipe 1 is rectangular to reduce the thickness of the heat dissipation module, making it light and thin. The heat dissipation process is specifically as follows: the heat generated by the chips and capacitors on the circuit board is absorbed by the heat absorbing assembly and transferred to the heat absorbing section 101 of the heat pipe 1. The heat is then transferred to the heat dissipation assembly 3 through the curved section 103 and the heat dissipation section 102. The heat is then transported to the exterior of the laptop computer through the heat dissipation assembly 3 to achieve the purpose of heat dissipation.

[0027] Specifically, heat sink assembly 2 includes a heat-absorbing copper sheet 201, fixedly connected to heat-absorbing section 101, for exchanging heat with the chip on the circuit board; two positioning members 202, disposed on heat-absorbing copper sheet 201 and arranged on either side of the width of heat-absorbing section 101; and a heat-conducting sheet 203, disposed on one side of heat-absorbing copper sheet 201, for exchanging heat with the capacitor on the circuit board. Heat-absorbing copper sheet 201 is integrally formed using a die-casting process, while heat-conducting sheet 203 is integrally formed using aluminum through a die-casting process, resulting in convenient and low-cost production. Copper's high thermal conductivity ensures efficient heat transfer to heat pipe 1. Considering the overall cost of the heat dissipation module, heat-conducting sheet 203 is made of aluminum, which not only meets thermal conductivity requirements but also reduces material costs, offering a high cost-performance ratio.

[0028] Furthermore, a groove 2010 is provided in the middle of the heat-absorbing copper sheet 201 along its length direction, which is compatible with the heat-absorbing section 101. The heat-absorbing section 101 of the heat pipe 1 is fixedly connected to the groove 2010 using thermal conductive glue to prevent the position of the heat pipe 1 from shifting, while improving the stability of the connection between the heat pipe 1 and the heat-absorbing copper sheet 201. A first connecting portion 2011 for fixing and connecting the positioning member 202 is provided on both sides of the groove 2010 in the width direction. The positioning member 202 includes a base plate 2020 fixedly connected to the first connecting portion 2011, and two spring plates 2021 respectively provided at both ends of the length direction of the base plate 2020. The spring plates 2021 are arranged outward and upward along the length direction from one end of the base plate 2020. The inclination angle can be controlled between 10° and 15°, and a connecting hole 20210 for a bolt to be inserted to assemble the heat-absorbing copper sheet with the circuit board is opened at the end of each spring plate 2021. By providing the spring plates 2021, elastic pressure is provided when the heat-absorbing copper sheet 201 is assembled with the circuit board, so as to achieve soft contact between the bottom surface of the heat-absorbing copper sheet and the chip, thereby effectively protecting the chip from damage. A second connecting portion 2022 for securely connecting to the heat conducting sheet 203 is provided on one side of the first connecting portion 2011, away from the groove 2010. Specifically, the second connecting portion 2022 extends horizontally outward from the first connecting portion 2011. The heat conducting sheet 203 is provided with a plurality of rivet holes 2030. The second connecting portion 2022 of the heat absorbing copper sheet 201 is provided with rivet portions 20220 corresponding to the rivet holes 2030. The rivet portions 20220 are inserted into the corresponding rivet holes 2030, thereby achieving a stable connection between the heat conducting sheet and the heat absorbing copper sheet 201.

[0029] Furthermore, the heat dissipation assembly 3 includes a heat dissipation body 301 and a mounting base 302 provided on the heat dissipation body 301 and used to install a heat dissipation fan. The heat dissipation body 301 includes a plurality of air flow channels 3011 arranged parallel and at intervals along its length direction. The air flow channel 3011 has a first flow channel 30110 and a second flow channel 30111 that are interconnected. The side of the first flow channel 30110 facing the mounting base 302 is an air inlet 3012, and the side of the second flow channel 30111 away from the air inlet 3012 is an air outlet 3013, and the cross-sectional area of ​​the second flow channel 30111 is larger than the cross-sectional area of ​​the first flow channel 30110, so that the volume of the air flow increases when it flows from the first flow channel 30110 into the second flow channel 30111, thereby increasing the air output of the air outlet and effectively preventing dust from accumulating at the air outlet. The mounting base 302 is arranged toward the air inlet 3012, and one end is fixedly connected to the lower surface of the heat dissipation body 301, and the heat dissipation section 102 of the heat pipe 1 is fixedly connected to the upper surface of the heat dissipation body 301, that is, the heat pipe 1 and the mounting base 302 are respectively fixedly connected to the upper and lower surfaces of the heat body 301 by thermal conductive glue, thereby realizing a stable connection between the heat dissipation component and the heat pipe.

[0030] Furthermore, the air outlet 3013 includes a first air outlet 30130 arranged parallel to the direction of the airflow channel 3011, and a second air outlet 30131 arranged perpendicular to the direction of the airflow channel 3011. The first air outlet 30130 and the second air outlet 30131 are interconnected. This allows air to be blown out from the front and top, increasing the air outlet area, achieving rapid heat dissipation, and effectively preventing dust accumulation at the air outlet.

[0031] In addition, the heat sink body 301 is provided with a plurality of notches 3014 spaced apart along its length on one side of the air outlet 3013. The notches 3014 include two first notches 30140 and two second notches 30141, spaced apart from each other. The first notches 30140 are formed by a vertically upward recessed recess at the bottom of the heat sink body 301, while the second notches 30141 are formed by an inward recessed recess on one side of the second air outlet 30131. This allows airflow from the air outlet and the notches to converge at the front of the notches, thereby increasing the flow rate at the notches and further preventing dust accumulation at the air outlet. The notches also serve to limit the mounting position of the heat sink body and the computer.

[0032] In summary, the built-in heat dissipation module of a laptop computer provided by the present invention is configured by arranging a heat conductive sheet that is compatible with the circuit board capacitor on the heat absorbing copper sheet of the heat absorbing component, so as to connect the heat generated by the chip and the capacitor to the heat conducting pipe through the heat absorbing copper sheet, and utilize the air flow channel of the heat dissipation component to efficiently discharge the hot air generated inside the laptop computer to the outside of the system; by arranging the air flow channel into two sections that are interconnected, and the cross-sectional area of ​​the second flow channel on the air outlet side is larger than the cross-sectional area of ​​the first flow channel on the air inlet side, the volume of the air flow increases when it flows from the first flow channel to the second flow channel, thereby increasing the air outlet area of ​​the air outlet, and effectively avoiding the accumulation of dust at the air outlet.

[0033] In the above description, many specific details are set forth in order to fully understand the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited by the specific implementation disclosed above. At the same time, any person skilled in the art can use the above-disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the present invention without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A built-in heat dissipation module for a notebook computer, comprising a heat pipe (1), a heat absorption component (2) provided on one side of a heat absorption section (101) of the heat pipe (1), and a heat dissipation component (3) provided on one side of a heat dissipation section (102) of the heat pipe (1), wherein the heat absorption section (101) and the heat dissipation section (102) are integrally connected via a bent section (103), and characterized in that: The heat absorption component (2) comprises a heat absorption copper sheet (201) for performing heat exchange with a chip on a circuit board and fixedly connected to the heat absorption section (101), two positioning members (202) provided on the heat absorption copper sheet (201) and arranged on both sides of the width of the heat absorption section (101), and a heat conducting sheet (203) provided on one side of the heat absorption copper sheet (201) for performing heat exchange with a capacitor on the circuit board; The heat dissipation assembly (3) comprises a heat dissipation body (301), and a mounting seat (302) provided on the heat dissipation body (301) and used for mounting a heat dissipation fan. The heat dissipation body (301) comprises a plurality of air flow channels (3011) arranged in parallel and spaced apart along its length. The air flow channels (3011) comprise a first flow channel (30110) and a second flow channel (30111) which are interconnected. The first flow channel (30110) is on a side facing the mounting seat (302) as an air inlet (3012), and the second flow channel (30111) is on a side facing away from the mounting seat (302). One side of the air inlet (3012) is an air outlet (3013), and the cross-sectional area of ​​the second flow channel (30111) is larger than the cross-sectional area of ​​the first flow channel (30110), so that the volume of the air flow increases when it flows from the first flow channel (30110) into the second flow channel (30111); the mounting seat (302) is arranged toward the side of the air inlet (3012), and one end is fixedly connected to the lower surface of the heat dissipation body (301), and the heat dissipation section (102) of the heat pipe (1) is fixedly connected to the upper surface of the heat dissipation body (301).

2. The notebook computer built-in heat dissipation module according to claim 1, characterized in that: The heat-absorbing copper sheet (201) is integrally formed by a die-casting process, and a groove (2010) adapted to the heat-absorbing section (101) is provided in the middle of the heat-absorbing copper sheet (201) along its length direction, and first connecting portions (2011) for fixedly connecting to the positioning member (202) are provided on both sides of the width direction of the groove (2010), and a second connecting portion (2022) for fixedly connecting to the heat-conducting sheet (203) is provided on a side of one of the first connecting portions (2011) away from the groove (2010).

3. The laptop computer built-in heat dissipation module according to claim 2, characterized in that: The positioning member (202) comprises a base plate (2020) fixedly connected to the first connecting portion (2011), and two spring pieces (2021) respectively provided at both ends of the base plate (2020) in the longitudinal direction, wherein the spring pieces (2021) are arranged outwardly and upwardly inclined from one end of the base plate (2020) along the longitudinal direction thereof, and a connection hole (20210) for a bolt to be embedded is provided at the end of each spring piece (2021).

4. The notebook computer built-in heat dissipation module according to claim 3, characterized in that: The heat conducting sheet (203) is integrally formed from aluminum through a die-casting process, and is provided with a plurality of rivet holes (2030). The second connecting portion (2022) of the heat absorbing copper sheet (201) is provided with rivet portions (20220) corresponding to the rivet holes (2030), and the rivet portions (20220) are embedded in the corresponding rivet holes (2030) for riveting connection.

5. The notebook computer built-in heat dissipation module according to claim 1, characterized in that: The air outlet (3013) comprises a first air outlet (30130) arranged parallel to the conveying direction of the air flow channel (3011), and a second air outlet (30131) arranged perpendicular to the conveying direction of the air flow channel (3011), and the first air outlet (30130) and the second air outlet (30131) are connected to each other.

6. The notebook computer built-in heat dissipation module according to claim 5, characterized in that: The heat dissipation body (301) is provided with a plurality of notches (3014) at intervals along the length direction of the air outlet (3013) on one side thereof.

7. The notebook computer built-in heat dissipation module according to claim 6, characterized in that: The notches (3014) include two first notches (30140) and two second notches (30141), and the two first notches (30140) and the two second notches (30141) are spaced apart from each other; The first notch (30140) is formed by a vertically upward concave arrangement of the bottom of the heat dissipation body (301), and the second notch (30141) is formed by an inward concave arrangement of one side of the second air outlet (30131).

8. The notebook computer built-in heat dissipation module according to claim 6, characterized in that: The cross-sectional shape of the heat conducting pipe (1) is rectangular.

9. The notebook computer built-in heat dissipation module according to claim 6, characterized in that: The heat pipe (1), the heat-absorbing copper sheet (201) and the heat dissipation body (301) are all fixedly connected by using heat-conducting adhesive, and the heat dissipation body (301) and the mounting seat (302) are also fixedly connected by using heat-conducting adhesive.

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