High-efficiency heat dissipation laser transmitter

Abstract

The utility model discloses an efficient heat dissipation laser emitter, which comprises a laser emission main body and a PCB, one side of the PCB is provided with a component, the other side of the PCB is provided with a water cooling heat dissipation pipe, the water cooling heat dissipation pipe is provided with a plurality of U-shaped bends, the PCB is provided with a plurality of heat dissipation holes, the heat dissipation holes are provided with metal heat dissipation columns, and the metal heat dissipation columns are provided with heat dissipation holes. And the U-shaped curve of the water-cooling heat dissipation pipe is wound on the metal heat dissipation column. The heat dissipation device can dissipate heat in time, the heat dissipation effect of the laser transmitter is improved, and the service life of the laser can be effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a laser emitter with high-efficiency heat dissipation. Background Art

[0002] As the performance of electronic devices continues to improve, their heat generation is also increasing. Heat dissipation has become one of the key factors affecting the stability and life of electronic devices.

[0003] In actual applications, it is found that due to the small size of the laser structure, it is not possible to install a traditional heat sink. Therefore, in actual applications, the laser cannot dissipate heat quickly and normally, resulting in very low laser power. If a high-power laser is used, the operating time will be limited and it will not be able to maintain working status for a long time, otherwise the service life of the laser will be greatly reduced. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the utility model proposes a laser emitter with high-efficiency heat dissipation, which can not only dissipate heat in time but also has good heat dissipation effect.

[0005] In order to solve the above technical problems, the technical solution of the utility model is:

[0006] A laser emitter with high heat dissipation efficiency includes a laser emitting body and a PCB board. Components are mounted on one side of the PCB board, and a water-cooled heat pipe is provided on the other side of the PCB board. The water-cooled heat pipe is provided with a plurality of U-shaped bends. The PCB board is provided with a plurality of heat dissipation holes. Metal heat dissipation columns are provided on the heat dissipation holes. The U-shaped bends of the water-cooled heat pipe are connected around the metal heat dissipation columns.

[0007] In the above technical solution, the metal heat dissipation columns arranged on the heat dissipation holes are in contact with the water-cooled heat pipes, which can quickly conduct the heat generated by the electrical components to the radiator surface and dissipate it through water circulation and air convection or radiation.

[0008] Preferably, the water-cooling heat dissipation pipe has a flat structure.

[0009] In the above technical solution, the water-cooled heat pipe is a U-shaped tubular profile formed by flattening a metal tube (with water flowing inside). The flat structure is not only convenient for installation on the PCB board, but also has a larger contact area with the PCB board, which can effectively improve the heat dissipation efficiency.

[0010] Preferably, the U-shaped curve is a smooth arc structure.

[0011] In the above technical solution, a plurality of bends are provided inside the water-cooled heat dissipation pipe, so that the heat dissipation structure extends in the horizontal direction and forms a plurality of heat dissipation surfaces. The bends are preferably smoothly transitioned to reduce water flow resistance and improve heat dissipation efficiency.

[0012] Preferably, the thickness of the water-cooling heat dissipation pipe is 1 mm, so that it can be effectively installed on a relatively small device such as a PCB board.

[0013] Preferably, a heat conducting layer is provided between the bottom side of the water-cooled heat dissipation pipe and the PCB board.

[0014] In the above technical solution, a heat-conducting layer is provided at the bottom of the water-cooled heat pipe to improve the heat transfer efficiency between the heat dissipation structure and the heating element of the electronic device.

[0015] Preferably, the water-cooling heat pipe is made of copper.

[0016] In the above technical solution, copper sheet is used as the main material of the radiator because copper has excellent thermal conductivity and can quickly conduct the heat generated by the electrical components to the surface of the radiator and dissipate it through water circulation and air convection or radiation.

[0017] Preferably, the heat-conducting layer is made of any one of thermal grease and thermal tape.

[0018] Preferably, the U-shaped bend on the water-cooling heat pipe is configured according to the pin layout of the electrical components on the PCB board.

[0019] In the above technical solution, the number of bends on each side of the U-shaped bend can be adjusted according to actual needs. Adding N more bends can increase the heat dissipation area, thereby improving heat dissipation efficiency. Furthermore, the size and shape of the bends can be optimized to meet the heat dissipation requirements of different electronic devices.

[0020] The utility model has the following characteristics and beneficial effects:

[0021] The above technical solution can be applied to the PCB board of the laser, and can complete the heat dissipation in time, so that the laser can maintain a working state for a long time and can be in a high-power state for a long time. While meeting the actual application needs, it effectively increases the service life of the laser. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0023] Figure 1 It is a three-dimensional structural diagram of an embodiment of the present utility model.

[0024] Figure 2 This is a schematic diagram of the three-dimensional structure of the embodiment of the utility model Figure 1 .

[0025] Figure 3 This is a schematic diagram of the three-dimensional structure of the embodiment of the utility model Figure 2 .

[0026] In the figure, 1-PCB board, 2-water cooling heat pipe, 3-metal heat dissipation column. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0029] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0030] The utility model provides a laser transmitter with high efficiency heat dissipation, such as Figure 1-Figure 3 As shown, the device comprises a laser emitting body and a PCB 1. Components are mounted on one side of the PCB 1, and a water-cooled heat pipe 2 is provided on the other side of the PCB. The water-cooled heat pipe 2 is provided with several U-shaped bends. These U-shaped bends are smooth, curved structures. This allows the heat dissipation structure to extend laterally and form multiple heat dissipation surfaces. The bends are preferably smoothly transitioned to reduce water flow resistance and improve heat dissipation efficiency.

[0031] In a further configuration of this embodiment, a plurality of heat dissipation holes are provided on the PCB board 1 , metal heat dissipation columns 3 are provided on the heat dissipation holes, and the U-shaped bend of the water-cooled heat dissipation pipe is wound around the metal heat dissipation columns 3 .

[0032] It can be understood that the metal heat dissipation column 3 is in direct contact with the water-cooled heat pipe 2, and the metal heat dissipation column 3 is welded in the heat dissipation hole on the PCB board, so that heat can be collected in a timely and rapid manner, and then the heat generated by the electrical components can be quickly conducted to the radiator surface and dissipated through water circulation and air convection or radiation.

[0033] Furthermore, the water-cooled heat pipe 2 is a U-shaped tubular profile formed by flattening a metal tube (with water flowing inside). The flat structure is not only convenient for installation on the PCB board, but also has a larger contact area with the PCB board, which can effectively improve the heat dissipation efficiency.

[0034] The water-cooled heat pipe is made of copper. Copper sheets are used as the main material of the radiator because copper has excellent thermal conductivity. It can quickly transfer the heat generated by the electrical components to the radiator surface and dissipate it through water circulation and air convection or radiation.

[0035] It can be understood that the surface of the PCB board is a smooth plane, so the flat structure is set up to facilitate installation, and the contact area between the water-cooled heat pipe 2 and the PCB board is larger, which can effectively improve the heat dissipation efficiency.

[0036] Furthermore, the thickness of the water-cooling heat pipe in this embodiment is 1 mm, which can be effectively installed on a device with a relatively small volume, such as a PCB board, and does not affect the overall structure of the PCB board, and therefore does not affect the packaging of the PCB board.

[0037] Furthermore, a heat conducting layer is provided between the bottom side of the water cooling heat pipe and the PCB board, and the heat conducting layer is made of any one of thermal conductive silicone grease and thermal conductive tape.

[0038] It can be understood that thermal grease and thermal tape as heat-conducting layers can not only be used to install the water-cooled heat pipe 2, but also have an insulating effect to prevent the water-cooled heat pipe 2 made of metal material from contacting the pins of components, thereby ensuring the normal operation of the PCB board.

[0039] Furthermore, a heat conducting layer is provided at the bottom of the water-cooled heat dissipation pipe to improve the heat transfer efficiency between the heat dissipation structure and the heating element of the electronic device.

[0040] In a further configuration of this embodiment, the U-shaped bend on the water-cooling heat dissipation pipe is configured according to the pin layout of the electrical components on the PCB board.

[0041] In the above technical solution, the number of bends on each side of the U-shaped bend can be adjusted according to actual needs. Adding N more bends can increase the heat dissipation area, thereby improving heat dissipation efficiency. Furthermore, the size and shape of the bends can be optimized to meet the heat dissipation requirements of different electronic devices.

[0042] It is understandable that when configuring the U-shaped bend, in order to avoid the water-cooling heat pipe from contacting the component pins and affecting the normal operation of the PCB board, the U-shaped bend needs to be configured according to actual conditions.

[0043] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations of these embodiments, including components, without departing from the principles and spirit of the present invention, still fall within the scope of protection of the present invention.

Claims

1. A laser emitter with high heat dissipation efficiency, comprising a laser emitting body and a PCB board, wherein components are mounted on one side of the PCB board, characterized in that: A water-cooled heat dissipation pipe is provided on the other side of the PCB board, and a plurality of U-shaped bends are provided on the water-cooled heat dissipation pipe. A plurality of heat dissipation holes are provided on the PCB board, and a metal heat dissipation column is provided on the heat dissipation holes. The U-shaped bends of the water-cooled heat dissipation pipe are wrapped around the metal heat dissipation column.

2. The laser emitter with high heat dissipation efficiency according to claim 1, characterized in that: The water-cooling heat dissipation pipe has a flat structure.

3. The laser emitter with high heat dissipation efficiency according to claim 1, characterized in that: The U-shaped curve is a smooth arc structure.

4. The laser emitter with high heat dissipation efficiency according to claim 2, characterized in that: The thickness of the water-cooling heat dissipation pipe is 1 mm.

5. The laser emitter with high heat dissipation efficiency according to claim 1, characterized in that: A heat conducting layer is provided between the bottom side of the water-cooling heat dissipation pipe and the PCB board.

6. The laser emitter with high heat dissipation efficiency according to claim 1, characterized in that: The water-cooling heat dissipation pipe is made of copper.

7. The laser emitter with high heat dissipation efficiency according to claim 5, characterized in that: The heat-conducting layer is made of any one of thermal grease and thermal tape.

8. The laser emitter with high heat dissipation efficiency according to any one of claims 1 to 7, characterized in that: The U-shaped bend on the water-cooling heat dissipation pipe is configured according to the pin layout of the electrical components on the PCB board.

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