Super-computing intelligent gateway equipment

By using conductive pins in the intelligent gateway device to cooperate with the conductive connection grooves on the back of the terminals, combined with the limit grooves and plug-in positioning groove structures, the problem of inconvenient terminal replacement is solved and convenient maintenance operations are achieved.

CN223348689UActive Publication Date: 2025-09-16HUAZHAN ANTE (NANTONG) ROBOT TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422586540.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-25
Publication Date
2025-09-16
Estimated Expiration
2034-10-25

AI Technical Summary

Technical Problem

Existing intelligent gateway devices are inconvenient to operate when replacing terminals, which affects the convenience of equipment maintenance.

Method used

A supercomputing intelligent gateway device was designed. The conductive pins were matched with the conductive connection slots on the back of the terminals, combined with the upper and lower limit grooves and the plug-in positioning slot structure. The terminals were removable and replaceable through the locking assembly, and the assembly studs were loosened using the knob block for disassembly.

Benefits of technology

The terminal can be easily replaced, which improves the maintenance convenience of the equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of gateway equipment, and discloses super-computing intelligent gateway equipment, which comprises an upper shell, a lower shell, a chip and a plurality of terminals, the upper shell is positioned above the lower shell, two locking assemblies are symmetrically arranged between the upper shell and the lower shell, a plurality of conductive pins are fixedly arranged on the chip at intervals, and the terminals are fixedly arranged on the chip. The back side of the terminal is provided with a conductive connection groove matched with the end portion of the conductive pin, the bottom end of the upper shell is provided with a plurality of upper limiting grooves at intervals, the upper end of the lower shell is provided with a plurality of lower limiting grooves at intervals, and the terminal abuts against the position between the upper limiting grooves and the lower limiting grooves. According to the utility model, the upper housing is detached and taken out, and at the moment, the terminals are in a movable state on the conductive pins of the chip, so that the terminals can directly slide out along the conductive pins to be replaced, and the detachment operation of the terminals on the chip is more convenient and simpler.
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Description

Technical Field

[0001] The utility model relates to the technical field of gateway equipment, and more specifically, to a supercomputing intelligent gateway device. Background Art

[0002] The edge supercomputing intelligent gateway device is suitable for smart terminals such as automobiles, low-altitude aircraft, and robots. It adds mainstream GPU / NPU supercomputing modules on the basis of traditional gateways, which can enhance edge computing capabilities and solve various security issues faced by new-generation robot products during operation, including network security and functional safety. In addition to traditional gateway functions (device networking, data collection, protocol parsing, etc.), its main functions use artificial intelligence machine learning technology to achieve more efficient active safety monitoring capabilities, such as situational awareness and predictive maintenance.

[0003] After searching, the Chinese patent authorization announcement number CN 216437689 U discloses an intelligent edge computing gateway device. Although the sliding engagement is completed by the card block and the card slot, and the locking member completes the locking of the L-shaped base and the shell, the installation of the shell is realized, which is convenient for the later disassembly and replacement of the shell. However, since the terminal is fixedly installed on the chip on the surface of the L-shaped base, if the terminal is damaged and replaced, even after the shell is disassembled, the terminal is still in a fixed state on the chip. The removal operation of the terminal on the chip is relatively inconvenient, affecting the convenience of later maintenance of the device. In view of this, we propose a supercomputing intelligent gateway device to solve the above problems. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the present invention provides a supercomputing intelligent gateway device to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A supercomputing intelligent gateway device includes an upper shell, a lower shell, a chip and several terminals. The upper shell is located above the lower shell, and two locking assemblies are symmetrically arranged between the upper shell and the lower shell. Several conductive pins are fixedly arranged at intervals on the chip, and the back side of the terminal is provided with a conductive connection groove that is compatible with the end of the conductive pin. The bottom end of the upper shell is provided with several upper limit grooves at intervals, and the upper end of the lower shell is provided with several lower limit grooves at intervals. The terminal is abutted between the upper limit groove and the lower limit groove. An insert block is fixedly installed in the upper limit groove, and the upper end of the terminal is provided with a positioning groove that is compatible with the insert block.

[0007] As a preferred technical solution of the present invention, the locking assembly includes an assembly stud, a first side block and a second side block, the first side block is fixedly connected to the bottom side of the upper shell, the second side block is fixedly connected to the top side of the lower shell, and the assembly stud is threadedly connected between the first side block and the second side block.

[0008] As a preferred technical solution of the present invention, the upper end of the assembly stud is fixedly connected to a knob block, and the cross-sectional shape of the knob block is a regular hexagon.

[0009] As a preferred technical solution of the present invention, a first heat dissipation port is provided on the side of the upper shell, and a second heat dissipation port is provided on the side of the lower shell. Dustproof nets are fixedly installed on the inner sides of the first heat dissipation port and the second heat dissipation port.

[0010] As a preferred technical solution of the present invention, the sides of the upper limit groove, the terminal and the lower limit groove are all flush.

[0011] As a preferred technical solution of the present invention, support feet are fixedly installed at each end corner of the bottom end of the lower shell, and anti-slip pads are fixedly installed at the bottom of the support feet.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0013] The utility model can achieve good upper and lower limit effects on the terminal by fitting the end of the conductive pin into the conductive connection groove on the back side of the terminal, and the terminal contacts between the upper limit groove and the lower limit groove. At the same time, the plug block is fitted into the positioning groove, and the assembly stud is threadedly connected between the first side block and the second side block, so that the upper shell can be installed on the lower shell, so that the terminal is tightly positioned. If the terminal is damaged and needs to be replaced, the assembly stud is loosened by using the knob block, the upper shell is disassembled and removed, and the plug block is separated from the positioning groove. At this time, the terminal is in a movable state on the conductive pin of the chip, and the terminal can be directly slid outward along the conductive pin for replacement, making the terminal disassembly operation on the chip more convenient and simple, which is conducive to improving the convenience of later maintenance of supercomputing intelligent gateway equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional structural diagram of a supercomputing intelligent gateway device of the present utility model;

[0015] Figure 2 This is a first cross-sectional structural diagram of a supercomputing intelligent gateway device of the present utility model;

[0016] Figure 3 for Figure 2 Schematic diagram of the enlarged structure of part A;

[0017] Figure 4 This is a second cross-sectional structural diagram of a supercomputing intelligent gateway device of the present invention;

[0018] Figure 5 This is a schematic diagram of the three-dimensional structure of the upper shell of a supercomputing intelligent gateway device of the present utility model.

[0019] In the figure: 1. Upper shell; 101. Upper limit groove; 1011. Insert block; 102. First heat dissipation vent; 2. Lower shell; 201. Lower limit groove; 202. Second heat dissipation vent; 3. Chip; 4. Conductive pin; 5. Locking assembly; 501. Assembly stud; 502. Side block; 503. Side block; 504. Knob block; 6. Terminal; 601. Conductive connection groove; 602. Positioning groove; 7. Dust screen; 8. Support foot. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0022] like Figures 1 to 5As shown, the utility model provides a supercomputing intelligent gateway device, including an upper shell 1, a lower shell 2, a chip 3 and a plurality of terminals 6. The upper shell 1 is located above the lower shell 2. Two locking components 5 are symmetrically arranged between the upper shell 1 and the lower shell 2. A plurality of conductive pins 4 are fixedly arranged at intervals on the chip 3. A conductive connection groove 601 adapted to the end of the conductive pin 4 is opened on the back side of the terminal 6, so that the end of the conductive pin 4 can be matched and plugged into the conductive connection groove 601 on the back side of the terminal 6 to ensure normal power-on effect. A number of upper positioning grooves 101 are spaced apart at the bottom end of the upper shell 1, and a number of lower positioning grooves 201 are spaced apart at the upper end of the lower shell 2. The terminal 6 is in contact between the upper positioning groove 101 and the lower positioning groove 201, which can have a good upper and lower limiting effect on the terminal 6. An insert block 1011 is fixedly installed in the upper positioning groove 101, and a positioning groove 602 adapted to the insert block 1011 is provided at the upper end of the terminal 6, so that the insert block 1011 can be inserted into the positioning groove 602, thereby making the terminal 6 tightly fixed in place.

[0023] Among them, Figure 4 As shown, the locking assembly 5 includes an assembly stud 501, a first side block 502 and a second side block 503. The first side block 502 is fixedly connected to the bottom side of the upper shell 1, and the second side block 503 is fixedly connected to the top side of the lower shell 2. The assembly stud 501 is threadedly connected between the first side block 502 and the second side block 503, so that the upper shell 1 can be disassembled and assembled on the lower shell 2.

[0024] Among them, Figure 4 As shown, the upper end of the assembly stud 501 is fixedly connected to a knob block 504 , and the cross-section of the knob block 504 is a regular hexagon, which facilitates the screwing and rotation of the assembly stud 501 .

[0025] Among them, Figure 1 As shown, a first heat dissipation port 102 is provided on the side of the upper shell 1, and a second heat dissipation port 202 is provided on the side of the lower shell 2. A dustproof net 7 is fixedly installed on the inner side of the first heat dissipation port 102 and the second heat dissipation port 202 to prevent external dust and impurities from easily entering the upper shell 1 and the lower shell 2.

[0026] Among them, Figure 1 and Figure 2 As shown, the upper limit groove 101, the terminal 6 and the side edges of the lower limit groove 201 are all flush, thereby achieving the purpose of ensuring the overall appearance of the device.

[0027] Among them, Figure 4 As shown, support feet 8 are fixedly installed at each corner of the bottom end of the lower shell 2, and anti-slip pads are fixedly installed at the bottom of the support feet 8, so as to achieve the purpose of stably supporting the equipment.

[0028] The working principle of this utility model:

[0029] By fitting the end of the conductive pin 4 into the conductive connection groove 601 on the back side of the terminal 6 to ensure normal power-on use, the terminal 6 is in contact between the upper limit groove 101 and the lower limit groove 201, which can have a good upper and lower limit effect on the terminal 6. At the same time, the plug 1011 is fitted into the positioning groove 602, and the assembly stud 501 is threadedly connected between the first side block 502 and the second side block 503. The upper shell 1 can be installed on the lower shell 2, so that the terminal 6 is tightly fixed in place. If the terminal 6 is damaged and needs to be replaced, the knob block 504 is used to loosen the assembly stud 501, and the upper shell 1 is disassembled and removed. The plug 1011 is disengaged from the positioning groove 602. At this time, the terminal 6 is in a movable state on the conductive pin 4 of the chip 3, and the terminal 6 can be directly slid outward along the conductive pin 4 for replacement.

[0030] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A supercomputing intelligent gateway device, characterized in that: It comprises an upper housing (1), a lower housing (2), a chip (3) and a plurality of terminals (6); The upper shell (1) is located above the lower shell (2), two locking assemblies (5) are symmetrically arranged between the upper shell (1) and the lower shell (2), a plurality of conductive pins (4) are fixedly arranged at intervals on the chip (3), and a conductive connection groove (601) adapted to the end of the conductive pin (4) is provided on the back side of the terminal (6); The bottom end of the upper shell (1) is provided with a plurality of upper limit grooves (101) at intervals, and the upper end of the lower shell (2) is provided with a plurality of lower limit grooves (201) at intervals. The terminal (6) is abutted between the upper limit groove (101) and the lower limit groove (201). An insert (1011) is fixedly installed in the upper limit groove (101). The upper end of the terminal (6) is provided with a positioning groove (602) adapted to the insert (1011).

2. A supercomputing intelligent gateway device according to claim 1, characterized in that: The locking assembly (5) comprises an assembly stud (501), a first side block (502) and a second side block (503), wherein the first side block (502) is fixedly connected to the bottom side of the upper shell (1), the second side block (503) is fixedly connected to the top side of the lower shell (2), and the assembly stud (501) is threadedly connected between the first side block (502) and the second side block (503).

3. A supercomputing intelligent gateway device according to claim 2, characterized in that: The upper end of the assembly stud (501) is fixedly connected to a knob block (504), and the cross-sectional shape of the knob block (504) is a regular hexagon.

4. A supercomputing intelligent gateway device according to claim 1, characterized in that: A first heat dissipation opening (102) is provided on the side of the upper shell (1), and a second heat dissipation opening (202) is provided on the side of the lower shell (2). Dustproof nets (7) are fixedly installed on the inner sides of the first heat dissipation opening (102) and the second heat dissipation opening (202).

5. A supercomputing intelligent gateway device according to claim 1, characterized in that: The upper limit groove (101), the terminal (6) and the side edges of the lower limit groove (201) are all flush.

6. A supercomputing intelligent gateway device according to claim 1, characterized in that: Support feet (8) are fixedly mounted at each end corner of the bottom end of the lower shell (2), and anti-slip pads are fixedly mounted at the bottom of the support feet (8).

Citation Information

Patent Citations

  • Intelligent edge computing gateway equipment

    CN216437689U