Module capable of performing shading protection on GIP circuit

Abstract

The utility model discloses a module capable of shading and protecting a GIP circuit. The module comprises CF glass, and TFT glass is attached to the lower portion of the CF glass. The GIP circuits are distributed on the two sides of the top of the TFT glass; the upper BM printing ink is arranged on the two sides of the bottom of the CF glass in a silk-screen mode; and the lower BM ink is silk-screen printed on two sides of the bottom wall of the TFT glass. According to the module capable of shading and protecting the GIP circuit, the gloss oil is coated on the surface of the lower BM printing ink below the GIP circuit in a conventional module, so that the solidified gloss oil can form a protective film on the surface of the lower BM printing ink, and the situations of scratching and light leakage caused by direct contact with an external object in the subsequent production and assembly process are avoided; stable shading protection of the GIP circuit is ensured; through the design of the alignment area, when gloss oil is coated on the surface of the lower BM ink, an operator can be assisted to grasp the coated edge, so that the coating is more accurate, and the situation that the gloss oil is mistakenly coated in a visible area to influence normal display is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of GIP circuits, in particular to a module capable of shielding the GIP circuits from light. Background Art

[0002] Currently, the conventional GIP circuit 1-1 is arranged between the CF glass 1-2 and the TFT glass 1-3. Since the GIP circuit 1-1 will exhibit horizontal stripe jitter and abnormality after being exposed to strong light from the backlight, affecting its own stable use, an upper BM ink area 1-4 and a lower BM ink area 1-5 are respectively provided above and below it. The upper upper BM ink area 1-4 is used to block external light, while the lower lower BM ink area 1-5 is used to block light emitted by the bottom backlight. However, in actual application, it is found that the upper upper BM ink area 1-4 is located between the CF glass 1-2 and the TFT glass 1-3 and is not easily scratched, while the lower BM ink area 1-5 is directly exposed to the outside. Therefore, it is easy to be scratched during the actual production, transportation and assembly process, resulting in it losing its light-shielding effect. Therefore, a module that can provide light-shielding protection for the GIP circuit is proposed. Utility Model Content

[0003] Based on this, it is necessary to provide a module that can provide light-shielding protection for the GIP circuit to address the above technical problems, and to apply varnish on the surface of the lower BM ink below to avoid the problem of losing the light-shielding effect due to scratches during the production process.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] A module capable of shielding a GIP circuit from light, comprising:

[0006] CF glass, with TFT glass laminated below the CF glass;

[0007] GIP circuits, which are distributed on both sides of the top of the TFT glass;

[0008] Apply BM ink, which is screen-printed on both sides of the bottom of the CF glass;

[0009] Lower BM ink, which is screen-printed on both sides of the bottom wall of the TFT glass;

[0010] The surface of the lower BM ink is also coated with varnish for covering and protecting it.

[0011] Furthermore, upper extension portions are extended inwardly from opposite sides of the two upper BM inks.

[0012] Furthermore, a registration area is silk-screened on one side of the lower BM ink.

[0013] Furthermore, a separation area is formed between the alignment area and the lower BM ink.

[0014] Furthermore, the lower BM ink includes a light-shielding area and a step area;

[0015] The light shielding area is arranged corresponding to the GIP circuit above, and the step area is arranged in the separation area.

[0016] Furthermore, the thickness of the step area is greater than the thickness of the light shielding area and the alignment area.

[0017] Furthermore, a separation groove is provided in the step area, and the separation groove can separate the step area into a plurality of step blocks distributed at equal intervals.

[0018] Furthermore, a groove is provided on the surface of the step block.

[0019] Furthermore, the varnish is coated on the surface of the light-shielding area and extends toward the alignment area, and is finally flush with the outer side of the alignment area.

[0020] Furthermore, the position and size of the upper extension portion and the alignment area are set correspondingly, and a visible area is provided in the middle of the CF glass and the TFT glass.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The utility model provides a module for shielding the GIP circuit from light. In conventional modules, varnish is applied to the surface of the lower BM ink below the GIP circuit. The solidified varnish forms a protective film on the surface of the lower BM ink, thus preventing scratches and light leakage caused by direct contact with external objects during subsequent production and assembly processes, thereby ensuring stable light shielding protection for the GIP circuit.

[0023] The design of the alignment area can assist the operator in controlling the edge of the coating when applying varnish on the surface of the lower BM ink, making the coating more accurate and avoiding accidental application in the visible area and affecting normal display. At the same time, since the alignment area has a certain thickness during the actual screen printing process, the alignment area with this thickness can actually achieve the alignment effect while blocking the edge of the varnish to prevent excess varnish from overflowing into the visible area.

[0024] Through the design of the step block, after the varnish is applied, the step position can be made to bulge below the alignment area and the lower BM ink area. In this way, after the actual transfer assembly, the step block can be preferentially contacted with external objects, thereby further realizing the support and protection of the lower BM ink.

[0025] By coordinating the separation grooves and the excavated grooves, the step blocks can be allowed to contact external objects first to protect the lower BM ink, while at the same time increasing the contact area between the varnish and the lower BM ink after coating, thereby increasing the overall stability of the varnish after solidification and preventing it from falling off easily. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a structural diagram of a module for light shielding protection of a GIP circuit provided by the present invention;

[0027] Figure 2 This is a schematic diagram of the lower BM ink structure of a module that can provide light shielding protection for GIP circuits provided by the utility model;

[0028] Figure 3 This is a schematic diagram of the alignment area structure of a module that can provide light shielding protection for a GIP circuit, provided by the present invention;

[0029] Figure 4 This is a schematic diagram of the step area structure of a module that can provide light shielding protection for a GIP circuit provided by the present invention;

[0030] Figure 5 This is a schematic diagram of the structure of a separation slot of a module that can provide light shielding protection for a GIP circuit provided by the present invention;

[0031] Figure 6 This is a schematic diagram of a groove structure of a module that can provide light shielding protection for a GIP circuit provided by the present invention;

[0032] Figure 7 This is a schematic diagram of the varnish structure of a module that can provide light shielding protection for GIP circuits provided by the utility model;

[0033] Figure 8 This is a schematic diagram of a conventional CIP circuit protection structure provided in the background technology of the present invention.

[0034] The markings in the figure are as follows:

[0035] CF glass 1, viewing area 11;

[0036] TFT glass 2, GIP circuit 21;

[0037] Apply BM ink 3;

[0038] Lower BM ink 4, alignment area 41, separation area 42, light shielding area 43, step area 44;

[0039] Separation groove 440, step block 441, and trench 442;

[0040] Varnish 5. DETAILED DESCRIPTION

[0041] In order to help those skilled in the art better understand the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0042] As described in the background technology, the current conventional GIP circuit 1-1 is arranged between the CF glass 1-2 and the TFT glass 1-3. Since the GIP circuit 1-1 will exhibit horizontal stripe jitter and abnormality after being exposed to strong light from the backlight, affecting its own stable use, an upper BM ink area 1-4 and a lower BM ink area 1-5 are respectively provided above and below it. The upper upper BM ink area 1-4 is used to block external light, while the lower lower BM ink area 1-5 is used to block light emitted by the bottom backlight. However, in actual application, it is found that the upper upper BM ink area 1-4 is located between the CF glass 1-2 and the TFT glass 1-3 and is not easily scratched, while the lower BM ink area 1-5 is directly exposed to the outside. Therefore, it is easy to be scratched during the actual production, transportation and assembly process, resulting in it losing its light-shielding effect.

[0043] In order to solve this technical problem, the utility model provides a module that can shield the GIP circuit from light, which is applied to the protection of the GIP circuit.

[0044] Specifically, please refer to Figures 1-8 The module for shielding the GIP circuit from light specifically includes:

[0045] CF glass 1, with TFT glass 2 laminated below the CF glass 1;

[0046] GIP circuits 21, which are distributed on both sides of the top of the TFT glass 2;

[0047] Apply BM ink 3, which is screen-printed on both sides of the bottom of the CF glass 1;

[0048] Lower BM ink 4, which is screen-printed on both sides of the bottom wall of the TFT glass 2;

[0049] The surface of the lower BM ink 4 is also coated with varnish 5 for covering and protecting it.

[0050] The present invention provides a module for shading and protecting the GIP circuit. In a conventional module, varnish 5 is applied to the surface of the lower BM ink 4 below the GIP circuit 21. The solidified varnish 5 can form a protective film on the surface of the lower BM ink 4, thereby avoiding scratches and light leakage caused by direct contact with external objects during the subsequent production and assembly process, thereby ensuring stable shading protection for the GIP circuit 21.

[0051] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0052] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions therein can be combined with each other.

[0053] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0054] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, a module for shielding GIP circuits from light is shown, comprising: CF glass 1, with TFT glass 2 laminated below the CF glass 1; GIP circuits 21 distributed on both sides of the top of the TFT glass 2; upper BM ink 3, screen-printed on both sides of the bottom of the CF glass 1; lower BM ink 4, screen-printed on both sides of the bottom wall of the TFT glass 2; and varnish 5 coated on the surface of the lower BM ink 4 for covering and protecting it.

[0055] The two opposite sides of the upper BM ink 3 each have an upper extension portion 31 extending inwardly;

[0056] One side of the lower BM ink 4 is screen-printed with an alignment area 41. The alignment area 41 in this embodiment is also formed by screen-printing ink of a light-shielding material on the surface of the TFT glass, thereby assisting the operator in controlling the edge of the varnish 5 for more precise application, thereby preventing the varnish from being mistakenly applied to the visible area 11 and affecting normal display. At the same time, since the alignment area 41 has a certain thickness during the actual screen printing process, the alignment area 41 of this thickness can actually achieve the alignment effect while blocking the edge of the varnish 5, preventing excess varnish 5 from overflowing into the visible area 11, thereby ensuring the accuracy of varnish application.

[0057] like Figure 7As shown, the positions and sizes of the upper extension portion 31 and the alignment area 41 are correspondingly set, and a visible area 11 is provided in the middle of the CF glass 1 and the TFT glass 2;

[0058] Since the upper extension portion 31 and the alignment area 41 in this embodiment are both disposed outside the visible area 11 , they will not affect the light emission of the module backlight during actual application.

[0059] A separation area 42 is formed between the alignment area 41 and the lower BM ink 4 .

[0060] The module for light shielding protection of the GIP circuit provided in Example 1 is further optimized. Specifically, Figure 4 As shown, the lower BM ink 4 includes a light shielding area 43 and a step area 44 , wherein the light shielding area 43 is arranged corresponding to the upper GIP circuit 21 , and the step area 44 is arranged in the separation area 42 ;

[0061] The thickness of the step area 44 is greater than the thickness of the light shielding area 43 and the alignment area 41;

[0062] In this embodiment, the shading area 43 and the alignment area 41 have the same thickness. Such a thickness design can improve the overall aesthetics. The thickness of the step area 44 is designed to be greater than the thickness of the shading area 43 and the alignment area 41 so that when the TFT glass 2 is placed for storage, transportation or assembly, the step area 44 at the bottom can protrude below the surface of the lower BM ink 4. This also allows the step area 44 and the varnish 5 thereon to contact the outside first when in contact with the outside, thereby reducing the wear of the lower BM ink 4 and the varnish on its surface. By reducing contact and reducing wear, the upper varnish can better protect the lower BM ink 4, thereby more stably achieving the light-shielding protection of the GIP circuit 21, so that it can be used more stably.

[0063] The module for shielding the GIP circuit provided in Example 1 or 2 is further optimized, such as Figure 5 、 Figure 6 and Figure 7 As shown, a separation groove 440 is provided in the step area 44. The separation groove 440 can separate the step area 44 into a plurality of equally spaced step blocks 441. The plurality of step blocks 441 after separation are linearly arranged on the surface of the TFT glass 2.

[0064] The surface of the step block 441 is provided with a groove 442;

[0065] Since the varnish 5 is in a certain fluid state during the actual coating process, the design of the step block 441 and the groove 442 can increase the contact state between the varnish 5 and the inner wall of the groove 442. This allows the varnish 5 to more fully contact the lower BM ink 4, increases the contact area, ensures the firmness of the connection, and prevents the varnish from falling off, thereby better protecting the lower BM ink 4.

[0066] like Figure 7 As shown, the varnish 5 is coated on the surface of the shading area 43 and extends toward the alignment area 41, and is finally flush with the outer side of the alignment area 41. In the actual varnish coating process, it can be coated from the leftmost side first, and then coated in the shading area 43, the socket block 441 and the partition area 42 in turn. Finally, the varnish is coated to the left side of the alignment area 41 and the coating is stopped. Wait until the varnish solidifies. In the above coating process, there is a groove 442 at the position of the step block 441. Therefore, the part of the groove 442 may need to be coated with varnish 5 several times, because part of the varnish 5 will penetrate into the groove 442. When the final coating is completed, the groove 442 is filled.

[0067] The use process of a module for shading protection of a GIP circuit provided by the present invention is as follows: a positioning area 41 is silk-screened on one side of the conventional lower BM ink 4, which is used for edge alignment when the varnish 5 is applied. At the same time, the conventional lower BM ink 4 is designed to be a combination of a shading area 43 and a step area 44, and the thickness of the step area 44 is increased compared to the shading area 43 and the positioning area 41. In this way, in the subsequent process of applying the varnish 5, the position of the step block 441 can better bulge below the shading area 43 and the positioning area 41, and when in contact with the outside, the step block 441 is preferentially in contact with external objects, reducing the wear of the varnish 5 in other areas, thereby better protecting the shading area 43 and meeting the requirements of blocking the light emitted by the backlight light source below the shading area 43, avoiding its direct exposure to the GIP circuit 21 above and destroying its stability in use.

[0068] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0069] Obviously, the embodiments described above are only some of the embodiments of the present invention, rather than all of the embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present invention specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of protection of the present invention patent.

Claims

1. A module capable of shielding a GIP circuit from light, characterized in that: It includes: CF glass (1), with TFT glass (2) laminated below the CF glass (1); GIP circuits (21) are distributed on both sides of the top of the TFT glass (2); Applying BM ink (3), which is screen-printed on both sides of the bottom of the CF glass (1); Lower BM ink (4), which is screen-printed on both sides of the bottom of the TFT glass (2); The surface of the lower BM ink (4) is also coated with varnish (5) for covering and protecting it.

2. A module capable of shielding a GIP circuit from light according to claim 1, characterized in that: Upper extension portions (31) are extended inwardly from opposite sides of the two upper BM inks (3).

3. The module capable of shielding the GIP circuit from light according to claim 2, characterized in that: One side of the lower BM ink (4) is screen-printed with an alignment area (41).

4. The module capable of shielding the GIP circuit from light according to claim 3, characterized in that: A separation area (42) is formed between the alignment area (41) and the lower BM ink (4).

5. The module capable of shielding the GIP circuit from light according to claim 4, characterized in that: The lower BM ink (4) includes a light-shielding area (43) and a step area (44); The light-shielding area (43) is arranged corresponding to the GIP circuit (21) above, and the step area (44) is arranged in the separation area (42).

6. The module capable of shielding the GIP circuit from light according to claim 5, characterized in that: The thickness of the step area (44) is greater than the thickness of the light shielding area (43) and the alignment area (41).

7. The module capable of shielding the GIP circuit from light according to claim 6, characterized in that: A separation groove (440) is provided in the step area (44), and the separation groove (440) can separate the step area (44) into a plurality of step blocks (441) distributed at equal intervals.

8. The module capable of shielding the GIP circuit from light according to claim 7, characterized in that: A groove (442) is formed on the surface of the step block (441).

9. The module capable of shielding the GIP circuit from light according to claim 8, characterized in that: The varnish (5) is applied to the surface of the light-shielding area (43) and extends toward the alignment area (41), and is finally flush with the outer side of the alignment area (41).

10. The module capable of shielding the GIP circuit from light according to claim 3, characterized in that: The positions and sizes of the upper extension portion (31) and the alignment area (41) are correspondingly arranged, and a visual area (11) is provided in the middle of the CF glass (1) and the TFT glass (2).

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