System-in-package module

Abstract

The utility model discloses a system-in-package module, which is applied to the technical field of radio frequency. The at least two packaging units are sequentially arranged in the thickness direction; every two adjacent packaging units comprise a lower-layer packaging unit and an upper-layer packaging unit; the lower-layer packaging unit comprises a first substrate, a first component and a first cavity cover plate; the first substrate and the first cavity cover plate are encircled to form a first accommodating cavity; the first component is positioned in the first accommodating cavity and is electrically connected with the first substrate; a transmission line is arranged on the surface, deviating from the first substrate, of the first cavity cover plate; the transmission line comprises a signal line and two comb-shaped structures. The signal wires are electrically connected with the lower-layer packaging unit and the upper-layer packaging unit respectively along two side ports in the first direction; the comb-shaped structures are arranged on the two sides of the signal wires in the second direction; the comb-shaped structure comprises a plurality of open-circuit branches, and the open-circuit branches extend in the direction away from the signal wires. According to the utility model, the reliability risk caused by the through holes is reduced, and the integration level of the system-in-package module is improved.

Description

Technical Field

[0001] The utility model relates to the field of radio frequency technology, in particular to a system-level packaging module. Background Art

[0002] Traditional common transmission lines such as coplanar waveguide (CPW) and substrate integrated waveguide (SIW) require ground vias for electric field shielding and electromagnetic wave guidance. Without ground vias, such transmission lines will not work in normal transmission mode or will have irremovable singular resonant frequency points within the band, such as Figure 1 As shown in the figure, the horizontal axis is frequency; the vertical axis S(1,1) on the left represents reflection loss. The larger the absolute value of S(1,1), the better the transmission effect; the vertical axis S(2,1) on the right represents transmission loss. The larger the absolute value of S(2,1), the greater the transmission loss, and the more difficult it is to transmit.

[0003] Existing RF microwave system-in-package (SiP) modules utilize an ultra-thin dielectric substrate within the housing. In locations where plated-through holes are unsuitable, such as on the top and bottom sides of the ultra-thin dielectric substrate, RF microwave transmission lines are typically not placed, as the use of vias can reduce reliability. Only low-frequency power and control lines are permitted. This arrangement significantly reduces the integration density within the housing and hinders the miniaturization of SiP modules. Utility Model Content

[0004] In view of this, an object of the present invention is to provide a system-level packaging module for solving the problem of reduced reliability caused by using a via process in an ultra-thin dielectric plate.

[0005] To solve the above technical problems, the present invention provides a system-level packaging module, comprising: at least two packaging units arranged sequentially along a thickness direction; two adjacent packaging units comprising a lower packaging unit and an upper packaging unit; the lower packaging unit comprising a first substrate, a first component, and a first cavity cover; the first substrate and the first cavity cover surround a first accommodating cavity; the first component is located in the first accommodating cavity and is electrically connected to the first substrate;

[0006] A transmission line is provided on a surface of the first cavity cover plate facing away from the first substrate; the transmission line includes a signal line and two comb-shaped structures; two side ports of the signal line along the first direction are electrically connected to the lower packaging unit and the upper packaging unit respectively;

[0007] The comb-shaped structure is arranged on both sides of the signal line along the second direction; the comb-shaped structure includes a plurality of open branches, and the open branches extend in a direction away from the signal line.

[0008] Optionally, the shape of the open branch is rectangular, curved, triangular, parallelogram or non-uniform;

[0009] And / or, the signal trace is in the form of a straight line, a curve or a broken line.

[0010] Optionally, the length of the open branch is 1 / 20 to 1 / 4 of the medium wavelength, inclusive;

[0011] And / or, the spacing between the open branches is 1 / 100 to 1 / 20 of the medium wavelength, including the values ​​at both ends.

[0012] Optionally, a groove is provided on the surface of the first cavity cover plate close to the first substrate; the thickness of the bottom of the groove does not exceed 0.5 mm; the transmission line covers the area corresponding to the groove on the surface of the first cavity cover plate away from the first substrate.

[0013] Optionally, a first through hole is provided in the non-groove area of ​​the first cavity cover plate; the first through hole penetrates the first cavity cover plate along the thickness direction; a first conductive structure is provided in the first through hole;

[0014] The first substrate is provided with a second through hole; the second through hole corresponds to the first through hole in position and penetrates the first substrate along the thickness direction; a second conductive structure is provided in the second through hole;

[0015] The signal line is electrically connected to the first conductive structure along the first side port in the first direction, and the first conductive structure is electrically connected to the second conductive structure.

[0016] Optionally, solder balls are provided on a surface of the first substrate facing away from the first cavity cover;

[0017] The second conductive structure is electrically connected to the solder ball.

[0018] Optionally, the upper packaging unit includes a second substrate and a second component; the second component is electrically connected to the second substrate.

[0019] Optionally, the upper packaging unit further includes a second cavity cover; the second substrate and the second cavity cover surround and form a second accommodating cavity; and the second component is located in the second accommodating cavity.

[0020] Optionally, the second substrate is provided with a third through hole; the third through hole penetrates the second substrate along the thickness direction; a third conductive structure is provided in the third through hole;

[0021] The signal trace is electrically connected to the third conductive structure along the second side port in the first direction.

[0022] Optionally, a bottom conductive structure is provided on a surface of the second substrate close to the first cavity cover; the bottom conductive structure is a solder ball, a eutectic solder sheet or a conductive adhesive;

[0023] The second side port of the signal line along the first direction is electrically connected to the bottom conductive structure, and the bottom conductive structure is electrically connected to the third conductive structure.

[0024] It can be seen that the present invention provides a system-level packaging module in which two adjacent packaging units adopt a vertical interconnection architecture, and the interconnection between the upper and lower packaging units is achieved through a transmission line arranged on the surface of the lower packaging unit, and the transmission line uses a comb-shaped open-circuit structure to replace the short-circuit vias in the traditional transmission line. On the one hand, there is no need to set short-circuit vias in the dielectric board on the top layer of the lower packaging unit, thereby reducing the reliability risk brought by the through-holes; on the other hand, the integration of the system-level packaging module is improved, which is conducive to the miniaturization and low-profile design of the system-level packaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0026] Figure 1 A schematic diagram of in-band resonance of a hole-free coplanar waveguide provided by an embodiment of the present utility model;

[0027] Figure 2 A schematic diagram of a SiP stacking architecture provided by an embodiment of the present utility model;

[0028] Figure 3 A schematic plan view of a non-hole transmission line provided by an embodiment of the present utility model;

[0029] Figure 4 A schematic diagram of a transmission line structure and its transmission characteristics provided by an embodiment of the present utility model;

[0030] Figure 5 A schematic diagram of the electric field distribution of a transmission line within a working band provided by an embodiment of the present utility model;

[0031] Figure 6 A schematic diagram of the electric field distribution of an out-of-band transmission line provided by an embodiment of the present utility model;

[0032] Figure 7 A schematic diagram of transmission characteristics of a transmission line for different operating frequency bands provided by an embodiment of the present utility model.

[0033] The following are the descriptions of the reference numerals:

[0034] 11-first substrate; 12-first component; 13-first cavity cover; 14-first through hole; 141-first conductive structure; 15-second through hole; 16-solder ball; 21-second substrate; 22-second component; 23-second cavity cover; 24-third through hole; 241-third conductive structure; 25-bottom conductive structure; 31-signal routing; 32-comb structure. DETAILED DESCRIPTION

[0035] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0036] Please refer to Figures 2 to 7 , Figure 1 A system-level packaging module provided by an embodiment of the present invention may include: at least two packaging units arranged sequentially along a thickness direction; the two adjacent packaging units include a lower packaging unit and an upper packaging unit; the lower packaging unit includes a first substrate 11, a first component 12, and a first cavity cover 13; the first substrate 11 and the first cavity cover 13 surround a first accommodating cavity; the first component 12 is located in the first accommodating cavity and is electrically connected to the first substrate 11;

[0037] A transmission line is provided on the surface of the first cavity cover 13 facing away from the first substrate 11; the transmission line includes a signal line 31 and two comb-shaped structures 32; two side ports of the signal line 31 along the first direction are electrically connected to the lower package unit and the upper package unit respectively;

[0038] The comb-shaped structure 32 is disposed on both sides of the signal line 31 along the second direction. The comb-shaped structure 32 includes a plurality of open branches, and the open branches extend in a direction away from the signal line 31 .

[0039] It should be noted that the system-level packaging module in this embodiment adopts package-on-package (PoP), and two adjacent packaging units from bottom to top adopt a vertical interconnection architecture.

[0040] It should be noted that, in this embodiment, the first direction and the second direction are both parallel to the surface of the first cavity cover 13 facing away from the first substrate 11 , wherein the first direction represents the extension direction of the signal trace 31 , and the second direction represents the direction perpendicular to the first direction.

[0041] This embodiment does not limit the specific structure and size of the first cavity cover 13. For example, a groove may be provided on the surface of the first cavity cover 13 close to the first substrate 11; the thickness of the bottom of the groove may not exceed 0.5 mm; and the transmission line may cover the area corresponding to the groove on the surface of the first cavity cover 13 facing away from the first substrate 11. It should be noted that in this embodiment, part of the area of ​​the first cavity cover 13 is hollowed, that is, the thickness of the part is less than the overall thickness, and the cavity formed is used to protect the components. In the area above the cavity where the thickness is insufficient, the upper and lower sides or one side support the implementation of the circuit routing process, and can be interconnected with the upper second substrate 21 by welding, bonding, crimping, etc.

[0042] like Figure 2 and Figure 3 As shown, in this embodiment, the transmission line is set between the first cavity cover 13 and the upper packaging unit, and is located above the local cavity of the cavity. The ports on both sides of the transmission line are electrically connected to the lower packaging unit and the upper packaging unit respectively. The rest of the line has no short-circuit structures such as vias and blind holes for grounding. Therefore, an ultra-thin dielectric plate without through holes can be used to achieve planar RF microwave transmission. Figure 4 As shown in the figure, the horizontal axis is frequency; the vertical axis S(1,1) on the left represents reflection loss. The larger the absolute value of S(1,1), the better the transmission effect; the vertical axis S(2,1) on the right represents transmission loss. The larger the absolute value of S(2,1), the greater the transmission loss, and the more difficult it is to transmit.

[0043] This embodiment does not limit the specific shape of the signal trace 31 . For example, the shape of the signal trace 31 may be a straight line, a curve, or a broken line.

[0044] This embodiment does not limit the specific shape of the open branches. For example, the shape of the open branches can be rectangular, curved, triangular, parallelogram or non-uniform. This embodiment does not limit the specific length of the open branches. For example, the length of the open branches can be 1 / 20 of the medium wavelength to 1 / 4 of the medium wavelength, including the values ​​at both ends. This embodiment does not limit the specific spacing of the open branches. For example, the spacing of the open branches can be 1 / 100 of the medium wavelength to 1 / 20 of the medium wavelength, including the values ​​at both ends. It should be noted that within the normal operating frequency band, the electric field distribution of the transmission line is as follows Figure 5 As shown, the following appears Figure 6 When the electric field distribution is as shown, the transmission line cannot work properly, showing the resonance characteristics of signal reflection. In this embodiment, the operating frequency band of the transmission line can be changed by adjusting the length or spacing of the open branches. Figure 7 As shown in the figure, the horizontal axis is frequency; the vertical axis S (1,1) on the left side represents the reflection loss; the three curves represent the lengths of different open-circuit branches respectively.

[0045] This embodiment does not limit the specific electrical connection method between the transmission line and the lower package unit. It only needs to ensure that the transmission line can be electrically connected to the lower package unit. For example, the following methods can be used:

[0046] A first through hole 14 is provided in the non-groove area of ​​the first cavity cover plate 13 ; the first through hole 14 penetrates the first cavity cover plate 13 along the thickness direction; a first conductive structure 141 is provided in the first through hole 14 ;

[0047] The first substrate 11 is provided with a second through hole 15; the second through hole 15 corresponds to the first through hole 14 and penetrates the first substrate 11 along the thickness direction; a second conductive structure is provided in the second through hole 15;

[0048] The signal trace 31 is electrically connected to the first conductive structure 141 along the first side port in the first direction, and the first conductive structure 141 is electrically connected to the second conductive structure.

[0049] In this embodiment, the signal trace 31 is electrically connected to the first substrate 11 through the first conductive structure 141 and the second conductive structure.

[0050] This embodiment does not limit the specific structure of the first conductive structure 141. For example, the first conductive structure 141 may be a metal layer covering the inner wall of the first through-hole 14; or, the first conductive structure 141 may be a conductor post filled in the interior of the first through-hole 14. This embodiment does not limit the specific structure of the second conductive structure. For example, the second conductive structure may be a metal layer covering the inner wall of the second through-hole 15; or, the second conductive structure may be a conductor post filled in the interior of the second through-hole 15. It should be noted that the first cavity cover 13 and the first substrate 11 can form a through hole from the top layer to the bottom layer. By metallizing the inner wall of the through hole (i.e., forming a metal via) or filling it with a conductor, the through hole can be used as a conductor to transmit signals or short-circuit to ground.

[0051] Furthermore, in this embodiment, solder balls 16 are disposed on the surface of the first substrate 11 facing away from the first cavity cover 13; the second conductive structure is electrically connected to the solder balls 16. It should be noted that the underlying solder balls 16 serve to interconnect the entire package with a PCB (Printed Circuit Board) or other circuit board, as well as to provide structural support and secure the entire package structure.

[0052] This embodiment does not limit the specific structure of the upper packaging unit. For example, the upper packaging unit may include a second substrate 21 and a second component 22 ; the second component 22 is electrically connected to the second substrate 21 .

[0053] Furthermore, in this embodiment, the upper packaging unit may also include a second cavity cover plate 23; the second substrate 21 and the second cavity cover plate 23 surround a second accommodating cavity; the second component 22 is located within the second accommodating cavity. It should be noted that the second cavity cover plate 23 can be used to protect the components above the second substrate 21. This embodiment does not limit the specific structure of the second cavity cover plate 23; for example, the surface of the second cavity cover plate 23 near the second substrate 21 may be provided with a groove.

[0054] This embodiment does not limit the specific electrical connection method between the transmission line and the upper packaging unit. It only needs to ensure that the transmission line can be electrically connected to the upper packaging unit. For example, the following methods can be used:

[0055] The second substrate 21 is provided with a third through hole 24 ; the third through hole 24 penetrates the second substrate 21 along the thickness direction; a third conductive structure 241 is provided in the third through hole 24 ;

[0056] The signal trace 31 is electrically connected to the third conductive structure 241 along the second side port in the first direction.

[0057] This embodiment does not limit the specific structure of the third conductive structure 241. For example, the third conductive structure 241 may be a metal layer covering the inner wall of the third through-hole 24; or, the third conductive structure 241 may be a conductor pillar filled within the third through-hole 24. It should be noted that the second substrate 21 can implement a through-hole from the top layer to the bottom layer. By metallizing the inner wall of the through-hole (i.e., forming a metal via) or filling it with a conductor, the through-hole can be used as a conductor to transmit signals or short-circuit to ground.

[0058] Furthermore, in this embodiment, a bottom conductive structure 25 may be provided on the surface of the second substrate 21 proximate to the first cavity cover 13; the signal trace 31 is electrically connected to the bottom conductive structure 25 along the second side port in the first direction, and the bottom conductive structure 25 is electrically connected to the third conductive structure 241. It should be noted that the substrate, cavity cover, and components, metal vias, and circuit traces within the cavity are generally referred to as a package unit. In this embodiment, the function of the bottom conductive structure 25 is to achieve electrical interconnection between the upper and lower package units and provide mechanical support. This embodiment does not limit the specific type of the bottom conductive structure 25; for example, the bottom conductive structure 25 may be a solder ball, a eutectic solder sheet, or a conductive adhesive.

[0059] In this embodiment, the signal trace 31 is electrically connected to the second substrate 21 through the bottom conductive structure 25 and the third conductive structure 241 .

[0060] This embodiment does not limit the specific types of the first substrate 11 and the second substrate 21. For example, the first substrate 11 and / or the second substrate 21 can be an organic substrate, a ceramic substrate, a silicon-based adapter board, or other circuit substrates having a top layer and a bottom layer of metal or multiple layers of metal such as a top layer, a middle layer, and a bottom layer; wherein two adjacent metal layers are separated by an insulator (a dielectric, including air).

[0061] This embodiment does not limit the specific types of the first component 12 and the second component 22. The first component 12 and / or the second component 22 may be chips or other components other than chips. In this embodiment, the first component 12 can be fixed to the top layer of the first substrate 11 by means of conductive glue, eutectic welding, silver paste sintering or flip-chip welding. This embodiment does not limit the specific electrical connection method between the first component 12 and the first substrate 11. For example, the pins of the first component 12 can be connected to the circuit conductors and pads on the first substrate 11 by means of gold wire bonding or flip-chip welding. In this embodiment, the second component 22 can be fixed to the top layer of the second substrate 21 by means of conductive glue, eutectic welding, silver paste sintering or flip-chip welding. This embodiment does not limit the specific electrical connection method between the second component 22 and the second substrate 21. For example, the pins of the second component 22 can be connected to the circuit conductors and pads on the second substrate 21 by means of gold wire bonding or flip-chip welding.

[0062] Based on the above embodiments, the two adjacent packaging units of the utility model adopt a vertical interconnection architecture, and the interconnection between the upper and lower packaging units is achieved through a transmission line arranged on the surface of the lower packaging unit, and the transmission line uses a comb-shaped open-circuit structure to replace the short-circuit vias in the traditional transmission line. On the one hand, there is no need to set short-circuit vias in the dielectric board on the top layer of the lower packaging unit, thereby reducing the reliability risk brought by the through-holes; on the other hand, the integration of the system-level packaging module is improved, which is conducive to the miniaturization and low-profile design of the system-level packaging module.

[0063] The above is a detailed introduction to a system-level packaging module provided by the present invention. For those skilled in the art, based on the ideas of the embodiments of the present invention, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A system-level package module, characterized in that: include: At least two packaging units are arranged in sequence along the thickness direction; two adjacent packaging units include a lower packaging unit and an upper packaging unit; the lower packaging unit includes a first substrate, a first component and a first cavity cover; the first substrate and the first cavity cover surround a first accommodating cavity; the first component is located in the first accommodating cavity and is electrically connected to the first substrate; A transmission line is provided on a surface of the first cavity cover plate facing away from the first substrate; the transmission line includes a signal line and two comb-shaped structures; two side ports of the signal line along the first direction are electrically connected to the lower packaging unit and the upper packaging unit respectively; The comb-shaped structure is arranged on both sides of the signal line along the second direction; the comb-shaped structure includes a plurality of open branches, and the open branches extend in a direction away from the signal line.

2. The system-level package module according to claim 1, wherein: The shape of the open branches is rectangular, curved, triangular, parallelogram or non-uniform; And / or, the signal trace is in the form of a straight line, a curve or a broken line.

3. The system-in-package module according to claim 1, wherein: The length of the open branch is 1 / 20 to 1 / 4 of the medium wavelength, inclusive; And / or, the spacing between the open branches is 1 / 100 to 1 / 20 of the medium wavelength, including the values ​​at both ends.

4. The system-in-package module according to claim 1, wherein: A groove is provided on the surface of the first cavity cover plate close to the first substrate; the thickness of the bottom of the groove does not exceed 0.5 mm; the transmission line covers the area corresponding to the groove on the surface of the first cavity cover plate away from the first substrate.

5. The system-in-package module according to claim 4, wherein: A first through hole is provided in the non-groove area of ​​the first cavity cover plate; the first through hole penetrates the first cavity cover plate along the thickness direction; a first conductive structure is provided in the first through hole; The first substrate is provided with a second through hole; the second through hole corresponds to the first through hole in position and penetrates the first substrate along the thickness direction; a second conductive structure is provided in the second through hole; The signal line is electrically connected to the first conductive structure along the first side port in the first direction, and the first conductive structure is electrically connected to the second conductive structure.

6. The system-in-package module according to claim 5, wherein: Solder balls are provided on a surface of the first substrate facing away from the first cavity cover; The second conductive structure is electrically connected to the solder ball.

7. The system-in-package module according to claim 1, wherein: The upper packaging unit includes a second substrate and a second component; the second component is electrically connected to the second substrate.

8. The system-in-package module according to claim 7, wherein: The upper packaging unit further includes a second cavity cover; the second substrate and the second cavity cover surround and form a second accommodating cavity; the second component is located in the second accommodating cavity.

9. The system-in-package module according to claim 7, wherein: The second substrate is provided with a third through hole; the third through hole penetrates the second substrate along the thickness direction; a third conductive structure is provided in the third through hole; The signal trace is electrically connected to the third conductive structure along the second side port in the first direction.

10. The system-in-package module according to claim 9, wherein: A bottom conductive structure is provided on a surface of the second substrate close to the first cavity cover; the bottom conductive structure is a solder ball, a eutectic solder sheet or a conductive glue; The second side port of the signal line along the first direction is electrically connected to the bottom conductive structure, and the bottom conductive structure is electrically connected to the third conductive structure.

Images