Machining process structure for improving alignment capability of pattern and laser hole

Abstract

A processing technology structure for improving the alignment capability of a pattern and a laser hole relates to the field of circuit board production, and comprises a PCB body, the PCB body is subjected to laser ablation at the position where pattern alignment ring targets are designed to form grooves, the depth of each alignment ring target groove is smaller than the thickness of the PCB body, and the thickness of each alignment ring target groove is smaller than the thickness of the PCB body. The alignment ring targets are arranged in the PCB body, dry films cover the alignment ring targets through film pasting, exposure and development, laser holes are filled with copper through electroplating of the PCB body, then the dry films are removed, grooves of the alignment ring targets are not electroplated with copper, the diameters of the grooves of the alignment ring targets are consistent, and the two pairs of alignment ring targets are designed in a staggered mode. According to the utility model, the ablated groove is protected in the electroplating process in a manner that the alignment ring target is ablated and then the dry film is electroplated, so that the contrast ratio between the groove of the alignment ring target and a copper point is improved, the edge of the alignment ring target is easy to identify during pattern exposure, the problem that the pattern ring is small in width and easy to crack is solved, and the product yield is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit board production, in particular to a processing technology structure for improving the alignment capability of graphics and laser holes. Background Art

[0002] With the increasing density of printed circuit boards (PCBs), pattern alignment needs to be improved. In particular, as annular ring size decreases, improving the alignment between the pattern transfer aperture plate and the laser aperture is crucial. Large misalignment during pattern transfer exposure can lead to via collapse, resulting in electrical connection defects or reliability issues. Therefore, it is necessary to develop a processing structure that improves pattern alignment between the pattern and the laser aperture, thereby enhancing pattern transfer exposure alignment and addressing these issues. Summary of the Invention

[0003] The purpose of the present utility model is to provide a processing structure for improving the alignment capability between graphics and laser holes, so as to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] A processing structure for improving the alignment capability between patterns and laser holes includes a PCB board body. Laser ablation is performed on the PCB board body at locations where pattern alignment ring targets are designed, forming grooves. The depth of each alignment ring target groove is less than the thickness of the PCB board body. A dry film is then applied to the alignment ring target locations through lamination, exposure, and development. The PCB board body is electroplated to fill the laser holes with copper, after which the dry film is removed. The alignment ring target grooves are not electroplated with copper. The diameter of each alignment ring target groove is consistent, and the alignment ring targets on both sides are staggered.

[0006] Furthermore: the PCB board body is laser ablated at a position where a graphic alignment ring target is designed to form a groove, and the laser ablation includes UV laser and CO2 laser.

[0007] Furthermore: the number of the alignment targets is 4 or 8.

[0008] Furthermore: the depth of each alignment ring target groove is less than the thickness of the PCB board body, which is 1 / 2-3 / 4 of the thickness of the PCB board body.

[0009] Furthermore: the target position of the alignment ring is covered with a dry film through film lamination, exposure and development, and the dry film thickness is 30-40 μm.

[0010] Furthermore: each alignment ring target has a ring width of 0.2 mm, an inner circle of 1.5 mm, and an outer circle of 1.9 mm.

[0011] Furthermore: the two-sided positioning ring targets are staggered in design, with the edges staggered by 0.5mm-2mm.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention protects the groove of the alignment ring target by covering the alignment ring target with a dry film, and the groove of the alignment ring target will not be electroplated with copper during the laser hole electroplating filling process, thereby ensuring clear contrast of the edge of the alignment ring target, improving the problem of pattern exposure alignment target recognition, improving the alignment accuracy of the pattern and the laser hole, and improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic top-down perspective structural diagram of a processing structure for improving the alignment capability between a pattern and a laser hole;

[0014] Figure 2 A schematic diagram of a front-side view of a laser drilling structure of a processing technology structure for improving the alignment capability between a pattern and a laser hole;

[0015] Figure 3 A schematic diagram of a side view of a laser drilling process structure for improving the alignment between a pattern and a laser hole;

[0016] Figure 4 A schematic diagram of a side view of a processing structure for improving the alignment between a pattern and a laser hole after film exposure and development;

[0017] Figure 5 A schematic diagram of the side view of a processing structure for improving the alignment between patterns and laser holes, showing the electroplating hole filling and film stripping process;

[0018] In the figure: 1-PCB board body, 2-alignment ring target, 3-alignment ring target groove, 4-dry film. DETAILED DESCRIPTION

[0019] Referring to the figure, an embodiment of the present invention provides a processing structure for improving pattern alignment accuracy, including a PCB body 1. Laser ablation is performed on the PCB body 1 at locations where pattern alignment ring targets 2 are designed, forming alignment ring target grooves 3. The depth of each alignment ring target groove 3 is less than the thickness of the PCB body 1. A dry film 4 is then applied to the alignment ring target 2 locations through a process of lamination, exposure, and development. The PCB body 1 is electroplated to fill the laser holes with copper, after which the dry film 4 is removed. The alignment ring target grooves 3 are not electroplated with copper. The diameter of each alignment ring target groove 3 is uniform, and the alignment ring targets 2 on both sides are staggered.

[0020] The alignment ring target groove 3 has a uniform diameter and a depth less than the thickness of the PCB body 1. The alignment ring target 2 has a ring width of 0.2 mm, an inner diameter of 1.5 mm, and an outer diameter of 1.9 mm. The depth of the alignment ring target groove 3 is 1 / 2-3 / 4 of the thickness of the PCB body. Preferably, CO2 is used as the laser method.

[0021] The dry film 4 is covered on the position of the alignment ring target 2 by film lamination, exposure and development. The dry film thickness is 30-40 μm. Preferably, the dry film thickness is 1 / 2 of the depth of the ring target groove 3.

[0022] This module includes the following operations when used:

[0023] (1) According to the size of the alignment ring target designed on the PCB body, exposure etching is performed at the corresponding position, and the corresponding blind hole is opened at the same time;

[0024] (2) ablate an annular groove at the alignment ring target position by laser, and perform laser drilling at the window position;

[0025] (3) Covering the dry film at the target position of the alignment ring by film application, exposure, and development;

[0026] (4) Fill the blind hole with copper by copper deposition-flash plating-electrofilling;

[0027] (5) Remove the dry film on the target position of the alignment ring by stripping the film;

[0028] (6) The designed circuit pattern is obtained by exposing, developing and etching the dry film.

[0029] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A processing structure for improving the alignment capability between a pattern and a laser hole, comprising a PCB board body; It is characterized by: Laser ablation is performed on the PCB body to form a groove at the position where the pattern alignment ring target is designed; The depth of each alignment ring target groove is less than the thickness of the PCB board; Cover the dry film at the target position of the registration ring by film application, exposure and development; After the laser holes are filled with copper by electroplating on the PCB body, the dry film is removed, but the target groove of the alignment ring is not electroplated with copper; The diameter of each alignment ring target groove is consistent; The two-sided positioning ring targets are staggered.

2. The processing structure for improving the alignment capability between a pattern and a laser hole according to claim 1, characterized in that: The PCB board body is laser ablated at a position where a pattern alignment ring target is designed to form a groove, and the laser ablation includes UV laser and CO2 laser.

3. The processing structure for improving the alignment capability between a pattern and a laser hole according to claim 1, characterized in that: The number of the alignment targets is 4 or 8.

4. The processing structure for improving the alignment capability between a pattern and a laser hole according to claim 1, characterized in that: The depth of each alignment ring target groove is less than the thickness of the PCB board body, which is 1 / 2-3 / 4 of the thickness of the PCB board body.

5. The processing structure for improving the alignment capability between patterns and laser holes according to claim 1, characterized in that: The target position of the alignment ring is covered with a dry film through film lamination, exposure, and development, and the dry film thickness is 30-40 μm.

6. The processing structure for improving the alignment capability between a pattern and a laser hole according to claim 1, characterized in that: Each alignment ring target has a ring width of 0.2 mm, an inner circle of 1.5 mm, and an outer circle of 1.9 mm.

7. The processing structure for improving the alignment capability between a pattern and a laser hole according to claim 1, characterized in that: The two-sided positioning ring targets are designed to be staggered, with the edges staggered by 0.5mm-2mm.

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