Crystal pushing thrust test tool bit protection mechanism for semiconductor packaging test

Abstract

The utility model relates to a semiconductor sealing crystal pushing thrust test tool bit protection mechanism, which measures the distance through a mechanical structure while not influencing normal detection, can effectively limit a tool bit, and prevents the situations that the frame is damaged and the tool bit of a push broach is fractured due to excessive descending and contact between the tool bit and a platform frame, so that the service life of the push broach is prolonged, and the service life of the push broach is prolonged. The utility model relates to the technical field of semiconductor testing. According to the semiconductor sealing crystal pushing thrust test tool bit protection mechanism, the distance is measured through a mechanical structure while normal detection is not affected, the tool bit can be effectively limited, the situations that too much descending occurs, the tool bit makes contact with a platform frame, the frame is damaged, and the tool bit of a push broach is broken are prevented, and the protection effect is better.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor testing, in particular to a semiconductor packaging and testing crystal pushing force test tool head protection mechanism. Background Art

[0002] When viewing the pusher tester from the side, the mechanism moves the X and Y axes. Observing through the high-power eyepiece, the pusher blade's Z axis is moved up and down to the appropriate height. The blade's X and Y axes are then fixed, along with the mechanism's plane, and the pusher blade begins pushing in the negative direction of the Y axis. Because the pusher blade is pushed in the negative direction of the Y axis, the chip will block the blade's position as it descends to the frame, preventing direct visibility. If the blade descends too far and contacts the platform frame, it can damage the frame and break the blade. Utility Model Content

[0003] In view of the deficiencies in the prior art, the present invention provides a semiconductor packaging and testing wafer pushing force test tool head protection mechanism, which solves the above-mentioned problems.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor packaging and testing wafer pushing force test tool head protection mechanism, including a connecting frame fixed above the tool head, the inner cavity of the connecting frame is respectively provided with a mechanical detection component and a sensor detection component for measuring the distance to the test table;

[0005] The mechanical detection assembly includes a return spring fixed to the inner cavity of the connecting frame, the inner cavity of the connecting frame is slidably connected to an upper sleeve fixedly connected to the bottom end of the return spring, the bottom of the upper sleeve is threadedly connected to the lower sleeve, and the bottom of the lower sleeve is rotatably connected to a ball that abuts the surface of the test table, the upper sleeve is located on the surface of the inner cavity of the connecting frame and is fixedly connected to a sliding block, the inner cavity of the connecting frame is provided with a sliding groove adapted to the sliding block, the top of the sliding groove is fixedly connected to a trigger switch electrically connected to the cutter head drive assembly, and the height of the ball is adjusted by rotating the lower sleeve during use, so that when the sliding block abuts the trigger switch, the position of the ball is 4mm lower than the position of the cutter head, and then the cutter head is driven to move by the driving mechanism. When the cutter head moves downward, it drives the connecting frame to move. When the descending position cannot be observed, the ball first contacts the test table, and then squeezes the reset spring to drive the upper sleeve to move upward, driving the sliding block to move upward in the sliding groove. When the sliding block contacts the trigger switch, a stop signal is sent to the cutter head drive assembly, and it descends into place. Then the cutter head is moved horizontally to perform a thrust test on the chip to detect whether the welding is firm, and the ball rolls above the test table while moving. Without affecting normal detection, the distance is measured by a mechanical structure, which can effectively limit the cutter head and prevent it from descending too much, contacting the cutter head with the platform frame, causing damage to the frame and breakage of the push cutter head, thereby providing better protection.

[0006] As a further solution of the present invention: the sensor detection component includes a distance sensor that is slidably arranged in the inner cavity of the connecting frame through a top block, and the model is a Keyence CMOS laser sensor. The distance to the test table is detected by the distance sensor, and when the set threshold is reached, a stop signal is triggered to the tool head drive component.

[0007] As a further solution of the present invention: the sensor detection assembly also includes a threaded rod threadedly connected under the connecting frame, and the top of the threaded rod abuts against the bottom of the top block. The height of the distance sensor can be quickly adjusted by rotating the threaded rod, and the stability of the distance sensor can be ensured by utilizing its own weight. When the side locking method is adopted, vibration will be generated when the cutter head contacts the chip. After long-term use, the position of the distance sensor will be offset. The bottom lifting method is adopted to make the positioning more accurate.

[0008] As a further solution of the present invention: the connecting frame is fastened to the surface of the cutter head by bolts or is welded to the surface of the cutter head.

[0009] As a further solution of the present invention: the width of the connecting frame is smaller than the distance between two chips on the test table.

[0010] Compared with the prior art, the present invention has the following beneficial effects:

[0011] 1. The utility model measures the distance through a mechanical structure without affecting normal detection, which can effectively limit the cutter head and prevent the cutter head from falling too much and contacting the platform frame, resulting in damage to the frame and breakage of the push knife head, thereby providing better protection.

[0012] 2. In this utility model, when the side locking method is adopted, vibration will be generated when the cutter head contacts the chip. After long-term use, the position of the distance sensor will be offset. The bottom lifting method is adopted to make the positioning more accurate. The distance to the test table is detected by the distance sensor. When the set threshold is reached, a stop signal is triggered to the cutter head drive assembly. Multiple detection methods are used, and the safety is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural diagram of the utility model;

[0014] Figure 2 This is the structural front view of the utility model;

[0015] Figure 3 For this utility model Figure 2 A partial enlarged view of point A in the middle.

[0016] In the figure: 1. Test table; 2. Chip; 3. Cutting head; 4. Connecting frame; 5. Return spring; 6. Upper sleeve; 7. Lower sleeve; 8. Ball bearing; 9. Sliding groove; 10. Sliding block; 11. Trigger switch; 12. Top block; 13. Distance sensor; 14. Threaded rod. DETAILED DESCRIPTION

[0017] In order to further illustrate the technical means and effects adopted by the present invention to achieve the predetermined purpose of the utility model, the following is a detailed description of the specific implementation method, structure, characteristics and effects of the present invention in combination with the accompanying drawings and preferred embodiments.

[0018] See also Figure 1-3 The present invention provides a technical solution: a semiconductor packaging and testing push-crystal thrust test tool head protection mechanism, comprising a connecting frame 4 fixed above the tool head 3, wherein the inner cavity of the connecting frame 4 is respectively provided with a mechanical detection component and a sensor detection component for measuring the distance from the test table 1;

[0019] The mechanical detection assembly includes a reset spring 5 fixed in the inner cavity of the connecting frame 4, the inner cavity of the connecting frame 4 is slidably connected to an upper sleeve 6 fixedly connected to the bottom end of the reset spring 5, the bottom of the upper sleeve 6 is threadedly connected to the lower sleeve 7, and the bottom of the lower sleeve 7 is rotatably connected to a ball 8 abutting the surface of the test table 1, the upper sleeve 6 is located on the surface of the inner cavity of the connecting frame 4 and is fixedly connected to a sliding block 10, the inner cavity of the connecting frame 4 is provided with a sliding groove 9 adapted to the sliding block 10, and the top of the sliding groove 9 is fixedly connected to a trigger switch 11 electrically connected to the cutter head drive assembly. When in use, the height of the ball 8 is adjusted by rotating the lower sleeve 7, so that when the sliding block 10 abuts the trigger switch 11, the position of the ball 8 is 4 mm lower than the position of the cutter head 3, and then the cutter head 3 is driven to move by the driving mechanism, and the cutter head 3 is When the head 3 moves downward, it drives the connecting frame 4 to move. When the descending position cannot be observed, the ball 8 first contacts the test table 1, and then squeezes the reset spring 5 to drive the upper sleeve 6 to move upward, driving the sliding block 10 to move upward in the sliding groove 9. When the sliding block 10 contacts the trigger switch 11, a stop signal is sent to the cutter head drive assembly, and it descends into place. Then the cutter head 3 is moved horizontally to perform a thrust test on the chip 2 to detect whether the welding is firm, and the ball 8 rolls above the test table 1 while moving. Without affecting the normal detection, the distance is measured by the mechanical structure, which can effectively limit the cutter head 3 to prevent it from descending too much and contacting the platform frame, resulting in damage to the frame and breakage of the push cutter head 3, thereby achieving better protection.

[0020] The sensor detection assembly includes a distance sensor 13 slidably arranged in the inner cavity of the connecting frame 4 through the top block 12, and the model is a Keyence CMOS laser sensor. The distance to the test table 1 is detected by the distance sensor 13. When the set threshold is reached, a stop signal is triggered to the tool head drive assembly.

[0021] The sensor detection assembly also includes a threaded rod 14 threadedly connected to the bottom of the connecting frame 4. The top of the threaded rod 14 abuts against the bottom of the top block 12. The height of the distance sensor 13 can be quickly adjusted by rotating the threaded rod 14, and the stability of the distance sensor 13 can be ensured by its own weight. When the side locking method is adopted, the cutter head 3 will vibrate when it contacts the chip 2. After long-term use, the position of the distance sensor 13 will be offset. The bottom lifting method is adopted to make the positioning more accurate.

[0022] The connecting frame 4 is fastened to the surface of the cutter head 3 by bolts or welded to the surface of the cutter head 3 .

[0023] The width of the connecting frame 4 is smaller than the distance between two chips 2 on the test platform 1 .

[0024] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to equivalent embodiments using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A semiconductor packaging and testing wafer pushing force test tool head protection mechanism, comprising a connecting frame (4) fixed above the tool head (3), characterized in that: The inner cavity of the connecting frame (4) is respectively provided with a mechanical detection component and a sensor detection component for measuring the distance from the test table (1); The mechanical detection component includes a reset spring (5) fixed in the inner cavity of the connecting frame (4), the inner cavity of the connecting frame (4) is slidably connected to an upper sleeve (6) fixedly connected to the bottom end of the reset spring (5), the bottom of the upper sleeve (6) is threadedly connected to a lower sleeve (7), the bottom of the lower sleeve (7) is rotatably connected to a ball (8) abutting against the surface of the test table (1), the upper sleeve (6) is located on the surface of the inner cavity of the connecting frame (4) and is fixedly connected to a sliding block (10), the inner cavity of the connecting frame (4) is provided with a sliding groove (9) adapted to the sliding block (10), and the top of the sliding groove (9) is fixedly connected to a trigger switch (11) electrically connected to the tool head drive component.

2. The semiconductor packaging and testing wafer pushing force test blade protection mechanism according to claim 1, characterized in that: The sensor detection assembly comprises a distance sensor (13) slidably arranged in the inner cavity of the connecting frame (4) through a top block (12).

3. The semiconductor packaging and testing wafer pushing force test blade protection mechanism according to claim 1, characterized in that: The sensor detection assembly further comprises a threaded rod (14) threadedly connected below the connecting frame (4), wherein the top end of the threaded rod (14) abuts against the bottom end of the top block (12).

4. The semiconductor packaging and testing wafer pushing force test blade protection mechanism according to claim 1, characterized in that: The connecting frame (4) is fastened to the surface of the cutter head (3) by means of bolts or is connected to the surface of the cutter head (3) by means of welding.

5. The semiconductor packaging and testing wafer pushing force test blade protection mechanism according to claim 1, characterized in that: The width of the connecting frame (4) is smaller than the distance between two chips (2) on the test table (1).

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