PXI case with front heat dissipation device

Abstract

The utility model relates to the field of signal measurement and control equipment, in particular to a PXI (PCI eXtensions for Instrumentation) case with a front heat dissipation device, which comprises a case body, an air inlet is arranged on the case body, an air outlet is arranged at one end of the case body provided with the air inlet, and a first cross beam and a second cross beam are arranged in the case body. The first cross beam and the second cross beam are arranged at the end, provided with the air outlet, of the box body, and a heat dissipation assembly is arranged between the first cross beam and the second cross beam. The PXI computer case has the effects of improving air circulation in the PXI computer case and improving the heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the field of signal measurement and control equipment, in particular to a PXI chassis with a front heat dissipation device. Background Art

[0002] The PXI chassis has mechanical, electrical, and software interfaces, ensuring system integration and reducing software costs. It also allows products from multiple vendors to be seamlessly integrated into the same system. However, this also causes the components in the PXI chassis to release a lot of heat when they are operating, further causing the temperature inside the PXI chassis to be too high.

[0003] Currently, rear-mounted fans typically draw in air, which is then transferred through built-in air ducts to the front slots for cooling boards, including the chassis controller. However, due to power and size limitations, existing PXI chassis cooling fans typically have low speeds, resulting in low airflow through the ducts. This results in poor cooling for the PXI chassis and boards. Utility Model Content

[0004] In order to solve the problem of poor heat dissipation effect of a PXI chassis, the utility model provides a PXI chassis with a front heat dissipation device.

[0005] The utility model provides a PXI chassis with a front heat sink, which adopts the following technical solutions:

[0006] A PXI chassis with a front heat sink includes a chassis, an air inlet is provided on the chassis, an air outlet is provided at one end of the chassis where the air inlet is provided, a first crossbeam and a second crossbeam are provided in the chassis, the first crossbeam and the second crossbeam are arranged at the end of the chassis where the air outlet is provided, and a heat sink assembly is provided between the first crossbeam and the second crossbeam.

[0007] In a specific possible implementation scheme, the heat dissipation assembly includes a fixed sheet metal and a fan, the fixed sheet metal is arranged in the chassis, and the fan is arranged on the fixed sheet metal.

[0008] In a specific possible implementation scheme, an air guide mounting piece is provided at one end of the fixed sheet metal.

[0009] In a specific possible implementation scheme, the box body includes an upper cover plate, a lower cover plate, a first support plate and a second support plate. The upper cover plate and the lower cover plate are connected in a frame shape, and the first support plate and the second support plate are both arranged between the upper cover plate and the lower cover plate.

[0010] In a specific possible implementation scheme, a front panel is provided at one end of the box body where the air inlet is opened.

[0011] In a specific possible implementation scheme, the front panel includes an upper plate beam, a lower plate beam, a first side panel and a second side panel, and the upper plate beam, the lower plate beam, the first side panel and the second side panel are fixedly connected to each other to form a frame shape.

[0012] Compared with the prior art, the present invention has the following beneficial technical effects:

[0013] The heat dissipation component is set below the board, and the air inlet and outlet are set at the same end of the box, so that the flow path of the airflow in the box is shortened, the airflow in the box is accelerated, and the heat dissipation effect of the box and the board is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure.

[0015] Figure 2 It is a structural diagram of the heat dissipation component.

[0016] Explanation of the accompanying drawings: 1. Air guide mounting member; 2. Fan; 3. Fixed sheet metal; 101. Upper cover; 102. Upper plate beam; 103. First support plate; 104. First side plate; 105. First cross beam; 106. Lower plate beam; 107. Second side plate; 108. Second support plate; 109. Second cross beam; 110. Lower cover. DETAILED DESCRIPTION

[0017] The following is combined with Figure 1-2 The utility model is described in further detail.

[0018] Reference Figure 1 The PXI chassis with a front heat sink includes a chassis, which includes an upper cover 101, a lower cover 110, a first support plate 103, and a second support plate 108. The cross-sections of the upper cover 101 and the lower cover 110 are approximately C-shaped. The openings of the upper cover 101 and the lower cover 110 are connected to form a square frame. The first support plate 103 and the second support plate 108 are arranged in the square frame, specifically at the joint between the upper cover 101 and the lower cover 110. The chassis is formed by fixing the upper cover 101 and the lower cover 110 to the first support plate 103 and the second support plate 108.

[0019] Reference Figure 1 A front panel is fixed at one end of the box, and the front panel includes an upper plate beam 102, a lower plate beam 106, a first side panel 104 and a second side panel 107. The upper plate beam 102, the lower plate beam 106, the first side panel 104 and the second side panel 107 are fixedly connected to each other to form a frame shape. The frame formed by the upper plate beam 102, the lower plate beam 106, the first side panel 104 and the second side panel 107 is fixed at one end of the box opening.

[0020] Reference Figure 1The upper cover 101 has an air outlet at one end near the front panel, and the lower cover 110 has an air inlet at one end near the front panel. A heat dissipation component is installed inside the cabinet. The heat dissipation component draws air from outside the cabinet through the air inlet and discharges it to the air outlet, pushing the air inside the cabinet to flow quickly out of the cabinet to dissipate heat from the cabinet. During the cabinet heat dissipation process, the airflow changes from flowing from the end of the cabinet away from the front panel to flowing from the air inlet to the air outlet. This shortens the airflow path within the cabinet and reduces the attenuation of the airflow during the flow within the cabinet, thereby increasing the airflow speed within the cabinet and providing more efficient heat dissipation for the cabinet.

[0021] Reference Figure 1 A first crossbeam 105 and a second crossbeam 109 are fixed to the housing. Both are located at the end of the lower cover 110 where the air inlet is located. The first and second crossbeams 105, 109 are spaced apart, with the heat sink assembly positioned between them. The first and second crossbeams 105, 109 are used to mount card slots, which are used to mount boards. The boards are positioned above the heat sink assembly, where heat dissipated by the boards is discharged through the outlet by the fast-flowing airflow, thereby enhancing heat dissipation.

[0022] Reference Figure 1 and Figure 2 The heat dissipation assembly includes a fixed sheet metal 3 and a fan 2. Multiple fans 2 are provided, each of which is fixed to the fixed sheet metal 3. One end of the fixed sheet metal 3 is fixedly connected to the second support plate 108. An air guide mounting member 1 is fixedly connected to the end of the fixed sheet metal 3 away from the second support plate 108. The air guide mounting member 1 is also fixedly connected to the first support plate 103. The air guide mounting member 1 is used to mount an air guide plate or other device that directs airflow. The fan 2 draws air from the outside and inputs it into the chassis to dissipate heat from the boards and chassis.

[0023] The above are all preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A PXI chassis with a front heat sink, characterized by: The invention comprises a box body, an air inlet is provided on the box body, an air outlet is provided at one end of the box body where the air inlet is provided, a first crossbeam (105) and a second crossbeam (109) are provided in the box body, the first crossbeam (105) and the second crossbeam (109) are arranged at the end of the box body where the air outlet is provided, and a heat dissipation component is provided between the first crossbeam (105) and the second crossbeam (109).

2. The PXI chassis with a front heat sink according to claim 1, wherein: The heat dissipation assembly comprises a fixed sheet metal (3) and a fan (2); the fixed sheet metal (3) is arranged in the chassis, and the fan (2) is arranged on the fixed sheet metal (3).

3. The PXI chassis with a front heat sink according to claim 2, wherein: An air guide mounting piece (1) is provided at one end of the fixed sheet metal (3).

4. The PXI chassis with a front heat sink according to claim 1, wherein: The box body comprises an upper cover plate (101), a lower cover plate (110), a first support plate (103) and a second support plate (108); the upper cover plate (101) and the lower cover plate (110) are connected to form a frame shape; the first support plate (103) and the second support plate (108) are both arranged between the upper cover plate (101) and the lower cover plate (110).

5. The PXI chassis with a front heat sink according to claim 1, wherein: The end of the box body where the air inlet is located is provided with a front panel.

6. The PXI chassis with a front heat sink according to claim 5, wherein: The front panel comprises an upper plate beam (102), a lower plate beam (106), a first side panel (104) and a second side panel (107); the upper plate beam (102), the lower plate beam (106), the first side panel (104) and the second side panel (107) are fixedly connected to each other to form a frame shape.

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