Double-sided heat dissipation power module

Abstract

The utility model discloses a double-sided heat dissipation power module, belongs to the field of heat dissipation of power modules, and solves the problem of low heat dissipation efficiency of the power module in the prior art. The power module mainly comprises a substrate, a plurality of power devices are welded on the substrate, a plurality of middle layer conductors are arranged in the substrate, a radiating fin I is arranged at the top of the substrate, radiating fins II are arranged on the power devices, and bonding pads of the power devices are connected with the middle layer conductors. Heat can be dissipated from the top of the substrate and the surface of the power device through a double-sided heat dissipation mode, the heat dissipation efficiency is remarkably improved, the working temperature of the power device is reduced, and the service life of the power device is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to power module heat dissipation field, concretely, especially relates to a double -sided heat dissipation power module. BACKGROUND

[0002] At present, the use of power devices is more and more extensive, with the reduction of product size, the increase of power density, the original single -sided heat dissipation is difficult to meet the application demand of high power density, such as the application of the announcement no. CN212485311U discloses a kind of power module, the power chip is installed on the mounting position of the heat dissipation substrate, but its heat dissipation area is smaller. At present, a kind of power module with better heat dissipation efficiency is needed. The utility model adopts the design scheme of double -sided heat dissipation, meets the power density demand of product, and increases the heat dissipation effect of product, and can be widely applied to high power density scheme and product design. SUMMARY

[0003] The utility model discloses a double -sided heat dissipation power module to solve the problem of low heat dissipation efficiency of power module in prior art.

[0004] The utility model is realized through the following technical schemes:

[0005] A double -sided heat dissipation power module, including substrate, a plurality of power devices are welded on the substrate, the inside of the substrate is equipped with a plurality of intermediate layer conductors, the top of the substrate is equipped with fin I, the power device is equipped with fin II, and the solder pad of the power device is connected with the intermediate layer conductor. Double -sided heat dissipation design can dissipate heat from the top of the substrate and the surface of the power device simultaneously, significantly improve the heat dissipation efficiency, reduce the working temperature of the power device, and prolong its service life. Fin I and fin II can take away heat from different directions respectively, make heat distribution more uniform, and avoid local overheating.

[0006] Further, it further includes the package shell, the one side of the substrate is equipped with chip, and the chip is connected with the package shell. The package shell can protect the chip in the inside from the influence of external environment, such as dust, humidity and the like, improve the reliability and stability of the module, and the package shell can be combined with the fin, to further improve the heat dissipation effect.

[0007] Further, the plurality of intermediate layer conductors are connected through the embedded hole, and the embedded hole provides an additional current path for the intermediate layer conductor, improves the conductivity, and reduces the resistance and loss.

[0008] Further, the intermediate layer conductor is connected with the power device or fin I through the blind hole, and the blind hole can ensure the accurate connection of the intermediate layer conductor with the power device or fin I, improve the electrical performance and heat dissipation effect.

[0009] Further, the material of the heat dissipation fin I and the heat dissipation fin II is ceramic or aluminum, both of which have high thermal conductivity, can effectively conduct heat away, and improve the heat dissipation efficiency; the aluminum material is relatively light, can reduce the weight of the module, and is suitable for portable equipment.

[0010] Further, the substrate is provided with a through hole, the heat dissipation fin I is connected with the pad of the power device through the through hole, and the heat dissipation fin I and the heat dissipation fin II can jointly dissipate heat for the power device.

[0011] Compared with the prior art, the utility model has the advantages that:

[0012] The utility model discloses a substrate, heat dissipation fin I and heat dissipation fin II cooperate, and the heat dissipation area and the heat dissipation capacity are added, the power density is increased, and the heat dissipation effect of product is improved;Buried hole, blind hole and through hole are adopted, and the heat dissipation thermal resistance is reduced. DRAWINGS

[0013] Figure 1 It is the structural schematic diagram of the utility model.

[0014] In the drawing: 1, substrate;2, heat dissipation fin I;3, heat dissipation fin II;4, intermediate layer conductor;5, power device;6, pad;7, blind hole;8, buried hole;9, through hole. CONCRETE IMPLEMENTING METHOD

[0015] In order to make the personnel of the prior art better understand the technical scheme of the utility model, the technical scheme of the utility model is clearly and completely described below in combination with the drawings of the utility model, and based on the embodiment in the application, other similar embodiments obtained by the ordinary skill in the art without creative labor should belong to the protection scope of the application. In addition, the direction words mentioned in the following embodiments, for example, "up", "down", "left", "right" and the like are only the direction of the drawing, therefore, the direction words used are used to explain and not to limit the creation of the utility model.

[0016] The utility model will be further described in combination with the drawings.

[0017] Embodiment 1, a double-sided heat dissipation power module, as shown in the figure, includes a substrate 1, a plurality of power devices 5 are welded on the substrate 1, a plurality of intermediate layer conductors 4 are arranged in the substrate 1, and a heat dissipation fin I 2 is arranged on the top of the substrate 1. Figure 1 The heat dissipation fin I 2 and the heat dissipation fin II 3 can respectively take away heat from different directions, so that the heat distribution is more uniform, and local overheating is avoided.

[0018] The double-sided heat dissipation power module of the embodiment 2 further comprises a package shell, the substrate 1 is flip-chip bonded with the chip, and the chip is connected with the package shell; the package shell can protect the internal chip from the external environment such as dust and moisture, thereby improving the reliability and stability of the module; the package shell can be combined with the heat sink, thereby further improving the heat dissipation effect; the intermediate layer conductors 4 are connected through the embedded holes 8, the embedded holes 8 provide additional current paths for the intermediate layer conductors 4, thereby improving the conduction performance and reducing the resistance and loss; the intermediate layer conductors are connected with the power device 5 or the heat sink I 2 through the blind holes 7, the blind holes 7 can ensure the accurate connection of the intermediate layer conductors with the power device 5 or the heat sink I 2, thereby improving the electrical performance and the heat dissipation effect; the heat sink I 2 and the heat sink II 3 are made of ceramic or aluminum, the ceramic can be selected from the DBC substrate 1 or the AMB substrate 1, and the ceramic and the aluminum both have high thermal conductivity, thereby effectively conducting heat away and improving the heat dissipation efficiency; the aluminum material is relatively light, thereby reducing the weight of the module and being suitable for portable devices; the through hole 9 is arranged on the substrate 1, the heat sink I 2 is connected with the bonding pad 6 of the power device 5 through the through hole 9, and the heat sink I 2 and the heat sink II 3 can jointly dissipate heat for the power device 5, and the other parts are the same as those of the embodiment 1.

[0019] The substrate 1 is made of a printed board, the bonding pad 6 of the power device 5, the intermediate layer conductors 4 and the heat sink I 2 are connected with each other through the embedded holes 8, the through holes 9 and the blind holes 7, and the heat is transferred through the large-area copper coating of the intermediate layer conductors 4 and the copper plating of the holes. The heat sink I 2 is made of metal, and the bonding pad 6 thereof is not electrically connected with the power device 5. The double-sided heat dissipation mode is adopted, the power density requirement of the product is met, the heat dissipation effect of the product is increased, and the double-sided heat dissipation power module can be widely applied to high-power-density power modules.

[0020] The above has described the utility model in detail, the above is only the preferred embodiment of the utility model, and cannot limit the utility model implementation range, namely, all equivalent changes and modifications made according to the application range should still belong to the utility model coverage.

Claims

1. A double-sided heat dissipating power module comprising a substrate (1) on which a number of power devices (5) are soldered, characterized in that: The substrate (1) is internally provided with a plurality of intermediate layer conductors (4), the top of the substrate (1) is provided with a heat sink I (2), the power device (5) is provided with a heat sink II (3), the power device (5) is connected with the intermediate layer conductor (4); the substrate (1) is provided with a through hole (9) penetrating therethrough, the heat sink I (2) is connected with the power device (5) through the through hole (9); the power device (5) is welded on the substrate through a soldering pad (6), the heat sink I (2) is connected with the soldering pad (6) at the bottom of the power device (5) through the through hole (9).

2. The double-sided, heat dissipating power module of claim 1, wherein: Further comprising a packaging shell, one side of the substrate (1) is provided with a chip, and the chip is connected with the packaging shell.

3. The double-sided, heat dissipating power module of claim 1, wherein: The plurality of intermediate layer conductors (4) are connected through a buried hole (8).

4. The double-sided, heat sinking power module of claim 2, wherein: The intermediate layer conductor (4) is connected with the power device (5) or the heat sink I (2) through a blind hole (7).

5. The double-sided, heat sinking power module of claim 1, wherein: The materials of the heat sink I (2) and the heat sink II (3) are ceramic or aluminum.

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