Three-phase PFC module packaging structure

Abstract

The utility model discloses a three-phase power factor correction (PFC) module packaging structure, the packaging structure is a dual in-line package (DIP), a plurality of layout areas are arranged on a substrate of the packaging structure, and a first single-phase PFC circuit, a second single-phase PFC circuit and a third single-phase PFC circuit are sequentially arranged on the plurality of layout areas from left to right; on a layout area corresponding to each single-phase PFC circuit, a voltage regulating circuit, a backflow diode and an upper diode in each single-phase PFC circuit are arranged according to the same layout position relation; the packaging structure further comprises an upper side pin and a lower side pin which are arranged in parallel, the low-voltage contact of each single-phase PFC circuit is connected with the upper side pin, and the high-voltage contact of each single-phase PFC circuit is connected with the lower side pin. According to the three-phase PFC module, DIP packaging is adopted, the three single-phase PFC circuits are arranged in a distributed mode, devices in the single-phase PFC circuits are arranged close to each other in a concentrated mode, the high-voltage pins and the low-voltage pins are arranged in two rows in parallel, the miniaturization design of the three-phase PFC circuits is achieved, and the three-phase PFC module is easy to install on a PCB.

Description

Technical Field

[0001] The present application relates to the field of integrated circuits, and in particular to a three-phase PFC module packaging structure. Background Art

[0002] The three-phase buck power factor correction (PFC) circuit can rectify the three-phase AC power supply into a lower voltage DC power supply to power the load. The structure of the three-phase Buck PFC circuit is as follows: Figure 1 shown.

[0003] Since the three-phase Buck PFC circuit includes three single-phase PFC circuits (also known as bridge arms) involving multiple switches and diodes, using discrete components to build the circuit will lead to problems such as difficult PCB board layout, large board area, and weak electromagnetic compatibility. Utility Model Content

[0004] In view of this, an embodiment of the present application provides a three-phase PFC module packaging structure, aiming to achieve a miniaturized design of a three-phase PFC circuit.

[0005] The technical solution of the embodiment of the present application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a three-phase power factor correction (PFC) module packaging structure. The packaging structure is a dual in-line package (DIP). A substrate of the packaging structure is provided with multiple layout areas. A first single-phase PFC circuit, a second single-phase PFC circuit, and a third single-phase PFC circuit are arranged in sequence from left to right on the multiple layout areas. In the layout areas corresponding to the single-phase PFC circuits, the voltage regulating circuit, the return diode, and the upper diode in each single-phase PFC circuit are arranged in the same layout position relationship.

[0007] The packaging structure further includes upper pins and lower pins arranged in parallel, the low-voltage contacts of each single-phase PFC circuit are connected to the upper pins, and the high-voltage contacts of each single-phase PFC circuit are connected to the lower pins.

[0008] In some embodiments, the plurality of layout areas include a plurality of first areas for arranging the voltage regulating circuits, a plurality of second areas for arranging the upper diodes, and a plurality of third areas for arranging the return diodes.

[0009] Among them, the voltage regulating circuit includes a switching tube, an input diode, and a lower diode. In each of the single-phase PFC circuits, the input end of the switching tube is respectively connected to the cathodes of the input diode and the lower diode, and the output end of the switching tube is connected to the anode of the return diode.

[0010] In some embodiments, the upper pins include a first upper pin, a second upper pin, a third upper pin, a fourth upper pin, a fifth upper pin, and a sixth upper pin arranged sequentially from left to right;

[0011] Among them, the low-voltage contact includes the driving end and the output end of each switching tube, and the driving end of each switching tube is connected to the first upper pin, the third upper pin and the fifth upper pin in sequence; the output end of each switching tube is connected to the second upper pin, the fourth upper pin and the sixth upper pin in sequence from left to right.

[0012] In some embodiments, the lower pins include a first lower pin, a second lower pin, and a third lower pin arranged in sequence from left to right, and the first lower pin, the second lower pin, and the third lower pin are AC power input terminals of the three-phase PFC module package structure; the high-voltage contact includes a cathode of each of the return diodes and an anode of the input diode, and the cathode of each of the return diodes is connected to the first lower pin, the second lower pin, and the third lower pin in sequence from left to right; the anode of each of the input diodes is connected to the first lower pin, the second lower pin, and the third lower pin in sequence from left to right;

[0013] Among them, the lower side pins also include a fourth lower side pin and a fifth lower side pin, the fourth lower side pin is the ground terminal, and the fifth lower side pin is the output terminal of the three-phase PFC module packaging structure; the high-voltage contact also includes the anode of each of the lower diodes and the cathode of each of the upper diodes; the anode of each of the lower diodes is connected to the fourth lower side pin, and the cathode of each of the upper diodes is connected to the fifth lower side pin.

[0014] In some embodiments, the package structure further includes a freewheeling diode and a temperature detection unit, and the plurality of layout areas further include a fourth area for arranging the freewheeling diode and a fifth area for arranging the temperature detection unit;

[0015] Among them, the upper pin also includes a seventh upper pin and an eighth upper pin, and the low-voltage contact also includes the two ends of the temperature detection unit; the first end of the temperature detection unit is connected to the seventh upper pin, and the second end of the temperature detection unit is connected to the eighth upper pin; the high-voltage contact also includes the anode and cathode of the freewheeling diode, the anode of the freewheeling diode is connected to the fourth lower pin, and the cathode of the freewheeling diode is connected to the fifth lower pin.

[0016] In some embodiments, the voltage regulating circuit in each of the single-phase PFC circuits is arranged on the upper side of the upper diode, and the return diode is arranged on the lower side of the upper diode; the freewheeling diode is arranged at the lower left corner of the substrate, and the temperature detection unit is arranged at the upper right corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the right side of the sixth upper pin; the fifth lower pin is arranged on the left side of the first lower pin, and the fourth lower pin is arranged on the left side of the fifth lower pin.

[0017] In some embodiments, the upper diode in each of the single-phase PFC circuits is arranged on the upper side of the voltage regulating circuit, and the return diode is arranged on the lower side of the voltage regulating circuit; the freewheeling diode is arranged at the lower left corner of the substrate, and the temperature detection unit is arranged at the upper right corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the right side of the sixth upper pin; the fifth lower pin is arranged on the left side of the first lower pin, and the fourth lower pin is arranged on the left side of the fifth lower pin.

[0018] In some embodiments, the upper diode in each of the single-phase PFC circuits is arranged at the upper left corner of the voltage regulating circuit, and the return diode is arranged at the lower right corner of the voltage regulating circuit; the freewheeling diode is arranged at the lower left corner of the substrate, and the temperature detection unit is arranged at the upper right corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the right side of the sixth upper pin; the fourth lower pin is arranged on the left side of the first lower pin, and the fifth lower pin is arranged on the left side of the fourth lower pin.

[0019] In some embodiments, the upper diode in each of the single-phase PFC circuits is arranged at the upper right corner of the voltage regulating circuit, and the return diode is arranged at the lower left corner of the voltage regulating circuit; the freewheeling diode is arranged at the lower right corner of the substrate, and the temperature detection unit is arranged at the upper left corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the left side of the first upper pin; the fifth lower pin is arranged on the right side of the third lower pin, and the fourth lower pin is arranged on the right side of the fifth lower pin.

[0020] In some embodiments, the switch tube, the input diode, the return diode, the upper diode, the lower diode, and the freewheeling diode are packaged in the form of bare chips.

[0021] The three-phase PFC module packaging structure provided in the embodiment of the present application is a DIP package. A substrate of the packaging structure is provided with multiple layout areas, in which a first single-phase PFC circuit, a second single-phase PFC circuit, and a third single-phase PFC circuit are arranged sequentially from left to right. In the layout areas corresponding to each single-phase PFC circuit, the voltage regulating circuit, the return diode, and the upper diode in each single-phase PFC circuit are arranged in the same layout position relationship. The packaging structure further includes upper and lower pins arranged in parallel, with the low-voltage contact of each single-phase PFC circuit connected to the upper pin and the high-voltage contact of each single-phase PFC circuit connected to the lower pin. Thus, the three-phase PFC module in the embodiment of the present application adopts a DIP package, with three single-phase PFC circuits arranged in a distributed manner. The components in each single-phase PFC circuit are arranged close together, with the high-voltage pins and low-voltage pins arranged in two parallel rows. This achieves a miniaturized design of the three-phase PFC circuit and facilitates installation on a PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the structure of a three-phase Buck PFC circuit according to an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the circuit structure of a three-phase PFC module according to an embodiment of the present application;

[0024] Figure 3 This is a schematic diagram of the packaging structure of a three-phase PFC module according to an embodiment of the present application;

[0025] Figure 4 This is a schematic diagram of a three-phase PFC module packaging structure in an application example of this application;

[0026] Figure 5 This is a schematic diagram of a three-phase PFC module packaging structure in an application example of this application;

[0027] Figure 6 This is a schematic diagram of the device layout of a three-phase PFC module according to an embodiment of the present application;

[0028] Figure 7 This is a schematic diagram of the wiring of the three-phase PFC module packaging structure according to an embodiment of the present application;

[0029] Figure 8 This is a schematic diagram of the device layout of a three-phase PFC module according to another embodiment of the present application;

[0030] Figure 9 This is a wiring diagram of a three-phase PFC module packaging structure according to another embodiment of the present application;

[0031] Figure 10 This is a schematic diagram of the device layout of a three-phase PFC module according to another embodiment of the present application;

[0032] Figure 11 This is a wiring diagram of a three-phase PFC module packaging structure according to another embodiment of the present application;

[0033] Figure 12 This is a schematic diagram of the device layout of a three-phase PFC module according to another embodiment of the present application;

[0034] Figure 13 This is a wiring diagram of a three-phase PFC module packaging structure according to another embodiment of the present application.

[0035] Description of reference numerals:

[0036] 100. First single-phase PFC circuit; 200. Second single-phase PFC circuit;

[0037] 300, third single-phase PFC circuit; 400, substrate; 401, first region;

[0038] 402, second area; 403, third area; 404, fourth area; 405, fifth area. DETAILED DESCRIPTION

[0039] The present application will be described in further detail below with reference to the accompanying drawings and embodiments.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0041] In the description of this application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood broadly. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0043] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," "above," and "upper side" of a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," "below," and "lower side" of a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0044] Here, the circuit structure of the three-phase Buck PFC circuit is as follows Figure 1 As shown, the three-phase AC power supply includes three phases A, B, and C. The three-phase AC power supply is filtered by a filter circuit consisting of a first inductor L1, a second inductor L2, a third inductor L3, a first capacitor C1, a second capacitor C2, and a third capacitor C3, and then connected to a three-phase PFC circuit. Among them, the A-phase power supply is connected to a first single-phase PFC circuit 100, the B-phase power supply is connected to a second single-phase PFC circuit 200, and the C-phase power supply is connected to a third single-phase PFC circuit 300. The single-phase PFC circuits have the same circuit structure. The first single-phase PFC circuit 100 includes a first diode D1, a second diode D2, a seventh diode D7, an eighth diode D8, and a first switching transistor Q1. The second single-phase PFC circuit 200 includes a third diode D3, a fourth diode D4, a ninth diode D9, a tenth diode D10, and a second switching transistor Q2. The third single-phase PFC circuit 300 includes a fifth diode D5, a sixth diode D6, an eleventh diode D11, a twelfth diode D12, and a third switching transistor Q3. The first diode D1, the third diode D3, and the fifth diode D5 are upper diodes; the second diode D2, the fourth diode D4, and the sixth diode D6 are lower diodes; the seventh diode D7, the ninth diode D9, and the eleventh diode D11 are return diodes; and the eighth diode D8, the tenth diode D10, and the twelfth diode D12 are input diodes. The three-phase PFC circuit also includes a thirteenth diode D13, which is a freewheeling diode.

[0045] Here, in addition to the filter circuit and the three-phase PFC circuit, the three-phase Buck PFC circuit also includes a fourth inductor L4, a fifth inductor L5, and a fourth capacitor C4. These are located at the power supply end of the load. When the three-phase AC power supply is supplied to the load, the fourth inductor L4, the fifth inductor L5, and the fourth capacitor C4 store electrical energy to achieve a voltage reduction effect. Specifically, when all switches are in the on state, the three-phase AC power supply is supplied to the load via the filter circuit and the three-phase PFC circuit. At this time, the fourth inductor L4, the fifth inductor L5, and the fourth capacitor C4 are in a charged state. When all switches are in the off state, the fourth inductor L4, the load, the fifth inductor L5, and the thirteenth diode D13 form a energized circuit. The fourth inductor L4 and the fifth inductor L5 discharge the energy into the load and the fourth capacitor C4. After the fourth inductor L4 and the fifth inductor L5 have completely discharged, the fourth capacitor C4 discharges the energy into the load to maintain the voltage across the load.

[0046] It should be noted that since the three-phase Buck PFC circuit includes thirteen diodes, three switching tubes, five inductors and four capacitors, if discrete components are used to build the circuit, there will be problems such as difficult PCB board layout, large board area and weak electromagnetic compatibility.

[0047] Based on this, an embodiment of the present application provides a three-phase PFC module packaging structure to achieve a miniaturized design of a three-phase PFC circuit.

[0048] Here, since inductive components such as inductors and capacitors are large in size and are not convenient to package into modules, the three-phase PFC module packaging structure of the embodiment of the present application is suitable for a three-phase PFC module including a three-phase PFC circuit and a temperature detection unit, wherein the temperature detection unit is used to detect the temperature value inside the three-phase PFC module.

[0049] Specifically, the circuit structure of the three-phase PFC module is as follows: Figure 2 As shown, the three-phase PFC module includes a first single-phase PFC circuit 100, a second single-phase PFC circuit 200, a third single-phase PFC circuit 100, a thirteenth diode D13, and a temperature detection unit T. The three-phase PFC module includes eight low-voltage contacts and five high-voltage contacts. The eight low-voltage contacts are respectively a driving terminal contact of the first switch tube Q1, an output terminal contact of the first switch tube Q1, a driving terminal contact of the second switch tube Q2, an output terminal contact of the second switch tube Q2, a driving terminal contact of the third switch tube Q3, an output terminal contact of the third switch tube Q3, a first temperature detection contact connected to the first end of the temperature detection unit T, and a second temperature detection contact connected to the second end of the temperature detection unit T. The five high-voltage contacts are respectively a contact connected to the A-phase power supply, a contact connected to the B-phase power supply, a contact connected to the C-phase power supply, a contact connected to the positive power supply terminal of the load, and a contact connected to the negative power supply terminal of the load.

[0050] In some embodiments, the first switch tube Q1, the second switch tube Q2 and the third switch tube Q3 can be triodes, the driving end of the switch tube is the base of the triode, and the output end of the switch tube is the emitter of the triode; the temperature detection unit T can be a thermistor.

[0051] like Figure 3 As shown, the three-phase PFC module package structure of the embodiment of the present application is a DIP package. A substrate 400 of the package structure is provided with multiple layout areas. A first single-phase PFC circuit 100, a second single-phase PFC circuit 200, and a third single-phase PFC circuit 300 are arranged in sequence from left to right on the multiple layout areas. In the layout areas corresponding to the single-phase PFC circuits, the voltage regulating circuit, the return diode, and the upper diode in each single-phase PFC circuit are arranged in the same layout position relationship. The package structure further includes upper and lower pins arranged in parallel. The low-voltage contact of each single-phase PFC circuit is connected to the upper pin, and the high-voltage contact of each single-phase PFC circuit is connected to the lower pin.

[0052] Specifically, the voltage regulating circuit includes a switching tube, an input diode and a lower diode. In each single-phase PFC circuit, the input end of the switching tube is connected to the cathode of the input diode and the cathode of the lower diode respectively, and the output end of the switching tube is connected to the anode of the return diode.

[0053] Here, the first voltage regulating circuit includes a first switching tube Q1, a second diode D2 and an eighth diode D8, the second voltage regulating circuit includes a second switching tube Q2, a fourth diode D4 and a tenth diode D10, and the third voltage regulating circuit includes a third switching tube Q3, a sixth diode D6 and a twelfth diode D12.

[0054] Here, DIP packaging is a type of integrated circuit packaging. DIP-packaged integrated circuits have a rectangular shape and two rows of parallel pins. DIP-packaged integrated circuits can be directly mounted in a DIP socket or directly inserted into a printed circuit board with the same number of solder holes and geometric arrangement for soldering.

[0055] It can be understood that the components of each single-phase PFC circuit in the embodiment of the present application are arranged centrally, and the three single-phase PFC circuits are distributed from left to right, which facilitates the routing design of the three-phase PFC module packaging structure.

[0056] For example, the top pins of a three-phase PFC module package structure include, arranged from left to right, a first top pin GA, a second top pin EA, a third top pin GB, a fourth top pin EB, a fifth top pin GC, and a sixth top pin EC. The low-voltage contacts include the driver and output terminals of each switching transistor. The driver terminal of each switching transistor is sequentially connected to the first top pin GA, the third top pin GB, and the fifth top pin GC, respectively. The output terminal of each switching transistor is correspondingly connected to the second top pin EA, the fourth top pin EB, and the sixth top pin EC, in order from left to right.

[0057] Specifically, the driving end of the first switch tube Q1 is connected to the first upper pin GA, the output end of the first switch tube Q1 is connected to the second upper pin EA, the driving end of the second switch tube Q2 is connected to the third upper pin GB, the output end of the second switch tube Q2 is connected to the fourth upper pin EB, the driving end of the third switch tube Q3 is connected to the fifth upper pin GC, and the output end of the third switch tube Q3 is connected to the sixth upper pin EC.

[0058] Exemplarily, the three-phase PFC module packaging structure also includes a temperature detection unit T, the upper pins also include a seventh upper pin T1 and an eighth upper pin T2, and the low-voltage contact also includes two ends of the temperature detection unit T; the first end of the temperature detection unit T is connected to the seventh upper pin T1, and the second end of the temperature detection unit T is connected to the eighth upper pin T2.

[0059] It can be understood that the upper pins of the three-phase PFC module packaging structure of the embodiment of the present application are arranged close to the corresponding single-phase PFC circuits or temperature detection units T, which facilitates wiring between the upper pins and the corresponding devices.

[0060] It should be noted that the arrangement positions of the seventh upper pin T1 and the eighth upper pin T2 on the upper pins are not limited to Figure 3 As shown in the arrangement position, the arrangement position of the seventh upper pin T1 and the eighth upper pin T2 in the upper pins is not specifically limited in the embodiment of the present application. The seventh upper pin T1 and the eighth upper pin T2 can be set on the left side of the first upper pin GA or on the right side of the sixth upper pin EC. The arrangement position of the seventh upper pin T1 and the eighth upper pin T2 is specifically determined based on the layout position of the temperature detection unit T.

[0061] Exemplarily, the lower pins of the three-phase PFC module packaging structure include a first lower pin a, a second lower pin b, and a third lower pin c arranged in sequence from left to right, and the first lower pin a, the second lower pin b, and the third lower pin c are the AC power input ends of the three-phase PFC module packaging structure; the high-voltage contacts include the cathodes of each return diode and the anodes of the input diodes, and the cathodes of each return diode are correspondingly connected to the first lower pin a, the second lower pin b, and the third lower pin c in order from left to right; the anodes of each input diode are correspondingly connected to the first lower pin a, the second lower pin b, and the third lower pin c in order from left to right.

[0062] Specifically, the first lower pin a is used to connect to the A-phase power supply, the second lower pin b is used to connect to the B-phase power supply, the third lower pin c is used to connect to the C-phase power supply, the cathode of the seventh diode D7 and the anode of the eighth diode D8 are connected to the first lower pin a, the cathode of the ninth diode D9 and the anode of the tenth diode D10 are connected to the second lower pin b, and the cathode of the eleventh diode D11 and the anode of the twelfth diode D12 are connected to the third lower pin c.

[0063] Exemplarily, the lower pins also include a fourth lower pin n and a fifth lower pin p, the fourth lower pin n is the ground terminal, and the fifth lower pin p is the output terminal of the three-phase PFC module packaging structure; the high-voltage contact also includes the anode of each lower diode and the cathode of each upper diode; the anode of each lower diode is connected to the fourth lower pin n, and the cathode of each upper diode is connected to the fifth lower pin p.

[0064] Specifically, the fourth lower pin n is used to connect the negative pole of the power supply terminal of the load, the fifth lower pin p is used to connect the positive pole of the power supply terminal of the load, the anode of the second diode D2, the anode of the fourth diode D4 and the anode of the sixth diode D6 are all connected to the fourth lower pin n, and the cathode of the first diode D1, the cathode of the third diode D3 and the cathode of the fifth diode D5 are all connected to the fifth lower pin p.

[0065] Exemplarily, the three-phase PFC package structure further includes a freewheeling diode, and the high-voltage contact further includes an anode and a cathode of the freewheeling diode, the anode of the freewheeling diode is connected to the fourth lower pin n, and the cathode of the freewheeling diode is connected to the fifth lower pin p.

[0066] Here, the freewheeling diode is the thirteenth diode D13.

[0067] It can be understood that the lower pins of the three-phase PFC module packaging structure of the embodiment of the present application are arranged close to the corresponding single-phase PFC circuits or the thirteenth diode D13, which facilitates the connection between the lower pins and the corresponding devices.

[0068] It should be noted that the arrangement positions of the fourth lower pin n and the fifth lower pin p on the lower pins are not limited to Figure 3 As shown in the arrangement position, the arrangement position of the fourth lower pin n and the fifth lower pin p in the lower pins is not specifically limited in the embodiment of the present application. The fourth lower pin n and the fifth lower pin p can be set on the left side of the first lower pin a, or on the right side of the third lower pin c. The arrangement position of the fourth lower pin n and the fifth lower pin p is specifically determined based on the layout position of the thirteenth diode D13.

[0069] It can be understood that the upper pins of the three-phase PFC module packaging structure in the embodiment of the present application are all low-voltage pins, and the lower pins are all high-voltage pins.

[0070] It can be understood that the three-phase PFC module in the embodiment of the present application adopts a DIP package, and the high-voltage pins and the low-voltage pins are arranged in two parallel rows, which realizes a miniaturized design of the three-phase PFC circuit and is easy to install on a substrate.

[0071] Exemplarily, the first switching tube Q1, the second switching tube Q2, the third switching tube Q3, the first diode D1, the second diode D2, the third diode D3, the fourth diode D4, the fifth diode D5, the sixth diode D6, the seventh diode D7, the eighth diode D8, the ninth diode D9, the tenth diode D10, the eleventh diode D11, the twelfth diode D12 and the thirteenth diode D13 are all packaged in the form of bare chips.

[0072] Specifically, the above devices are packaged in the form of bare chips and covered on the top layer of the corresponding wafer, and are connected to devices or copper foils in other layout areas by setting bonding wires.

[0073] Exemplarily, the multiple layout areas include multiple first areas for arranging each voltage regulating circuit, multiple second areas for arranging each upper diode, multiple third areas for arranging each return diode, a fourth area for arranging the freewheeling diode, and a fifth area for arranging the temperature detection unit T.

[0074] Specifically, the multiple first areas include three first areas, which are respectively used to arrange the first voltage regulating circuit, the second voltage regulating circuit and the third voltage regulating circuit; the multiple second areas include three second areas, which are respectively used to arrange the first diode D1, the third diode D3 and the fifth diode D5; the multiple third areas include three third areas, which are respectively used to arrange the seventh diode D7, the ninth diode D9 and the eleventh diode D11.

[0075] It should be noted that copper foil is laid on the top plate of the substrate 400 , and the copper foil is divided into a plurality of layout areas so that devices arranged in the same area are connected.

[0076] In one application example, Figure 4 As shown, the substrate 400 is a ceramic substrate, copper foil is directly laid on the ceramic substrate, and various components are arranged on the copper foil.

[0077] In one application example, Figure 5 As shown, the substrate 400 is a metal substrate, on which a copper sheet is laid after being isolated by a polymer insulating layer, and various devices are arranged on the copper sheet.

[0078] In one embodiment, the device layout of the three-phase PFC module is as follows: Figure 6 The layout area of ​​each single-phase PFC circuit includes a first area 401, a second area 402, and a third area 403. The first area 401 is arranged above the corresponding second area 402, and the third area 403 is arranged below the corresponding second area 402. The fourth area 404 is arranged at the lower left corner of the substrate 400, and the fifth area 405 is arranged at the upper right corner of the substrate 400.

[0079] based on Figure 6 In the layout area shown, the voltage regulating circuit in each single-phase PFC circuit is arranged on the upper side of the upper diode, and the return diode is arranged on the lower side of the upper diode; the freewheeling diode is arranged at the lower left corner of the substrate 400, and the temperature detection unit T is arranged at the upper right corner of the substrate 400.

[0080] based on Figure 6 In the layout area shown, the seventh upper pin T1 and the eighth upper pin T2 are arranged close to the fifth area 405, and the arrangement positions of the upper pins are, from left to right, the first upper pin GA, the second upper pin EA, the third upper pin GB, the fourth upper pin EB, the fifth upper pin GC, the sixth upper pin EC, the seventh upper pin T1 and the eighth upper pin T2; the fourth lower pin n and the fifth lower pin p are arranged close to the fourth area 404, and the arrangement positions of the lower pins are, from left to right, the fourth lower pin n, the fifth lower pin p, the first lower pin a, the second lower pin b and the third lower pin c.

[0081] Here, the positional relationship between the switch tube, input diode and lower switch tube arranged on each first area 401 is determined based on the arrangement position of the upper pin corresponding to the switch tube. The switch tube is arranged close to the corresponding upper pin to facilitate wiring of the driving end and input end of the switch tube.

[0082] based on Figure 6 The specific structural diagram of the three-phase PFC module packaging structure is shown in the layout area shown in FIG. Figure 7As shown. The devices arranged in the same layout area are connected to the same potential through copper wiring, and the devices are connected to the devices or copper foils in other layout areas by setting binding wires on the top layer. Specifically, a grounding copper foil is set on the substrate 400 (shown in the shaded area), and the three-phase PFC module is provided with two fourth lower side pins n, and the two fourth lower side pins n are connected to the grounding copper foil through binding wires, and the second diode D2, the fourth diode D4, the sixth diode D6 and the thirteenth diode D13 are connected to the grounding copper foil through binding wires; multiple second areas are connected to the fourth area, and the fifth lower side pin p is connected to the copper foils of multiple second areas and the fourth area; the first lower side pin a, the second lower side pin b and the third lower side pin c are connected to the copper foils of the corresponding third area, and the eighth diode D8, the tenth diode D10 and the twelfth diode D12 are connected to the copper foils of the corresponding third area through binding wires to achieve connection with the corresponding The first switch tube Q1 is arranged on the right side of the second diode D2 and the eighth diode D8, and is connected to the first upper pin GA and the second upper pin EA through a binding wire; the second switch tube Q2 is arranged on the upper side of the fourth diode D4 and the tenth diode D10, and is connected to the third upper pin GB and the fourth upper pin EB through a binding wire; the third switch tube Q3 is arranged on the right side of the sixth diode D6 and the twelfth diode D12, and is connected to the fifth upper pin GC and the sixth upper pin EC through a binding wire; the switch tube and the return diode of each single-phase PFC circuit are connected to the upper switch tube through a binding wire; the temperature detection unit T is connected to the seventh upper pin T1 and the eighth upper pin T2 through a binding wire.

[0083] It can be understood that in this embodiment, there are no cross-bonding wires between the single-phase PFC circuits, the third area 403 is arranged on the lower side of the substrate 400 to be close to the lower pins, and the binding wires of the upper diode are short; the first switch tube Q1, the second switch tube Q2 and the third switch tube Q3 are arranged close to the corresponding upper pins, and the binding wires of the switch tubes are short; the fourth lower pin n is connected to an independent grounding copper foil, the anode of the thirteenth diode D13 is connected to the grounding copper foil through a bonding wire, the bonding wires of the freewheeling diode and the lower diode are short, and the two groups of bonding wires of the thirteenth diode D13 are welded to the two fourth lower pins n, thereby enhancing the overcurrent capacity of the three-phase PFC module.

[0084] In one embodiment, the device layout of the three-phase PFC module is as follows: Figure 8 The layout area of ​​each single-phase PFC circuit includes a first area 401, a second area 402, and a third area 403. The second area 402 is arranged above the corresponding first area 401, and the third area 403 is arranged below the corresponding first area 401. The fourth area 404 is arranged at the lower left corner of the substrate 400, and the fifth area 405 is arranged at the upper right corner of the substrate 400.

[0085] based on Figure 8 In the layout area shown, the upper diode in each single-phase PFC circuit is arranged on the upper side of the voltage regulating circuit, and the return diode is arranged on the lower side of the voltage regulating circuit; the freewheeling diode is arranged at the lower left corner of the substrate 400, and the temperature detection unit T is arranged at the upper right corner of the substrate 400.

[0086] based on Figure 8 In the layout area shown, the seventh upper pin T1 and the eighth upper pin T2 are arranged close to the fifth area 405, and the arrangement positions of the upper pins are, from left to right, the first upper pin GA, the second upper pin EA, the third upper pin GB, the fourth upper pin EB, the fifth upper pin GC, the sixth upper pin EC, the seventh upper pin T1 and the eighth upper pin T2; the fourth lower pin n and the fifth lower pin p are arranged close to the fourth area 404, and the arrangement positions of the lower pins are, from left to right, the fourth lower pin n, the fifth lower pin p, the first lower pin a, the second lower pin b and the third lower pin c.

[0087] Here, the positional relationship between the switch tube, input diode and lower switch tube arranged on each first area 401 is determined based on the arrangement position of the upper pin corresponding to the switch tube. The switch tube is arranged close to the corresponding upper pin to facilitate wiring of the driving end and input end of the switch tube.

[0088] based on Figure 8 The specific structural diagram of the three-phase PFC module packaging structure is shown in the layout area shown in FIG. Figure 9As shown. The devices arranged in the same layout area are connected to the same potential through copper wiring, and the devices are connected to the devices or copper foils in other layout areas by setting binding wires on the top layer. Specifically, a grounding copper foil is set on the substrate 400 (shown in the shaded area). The second diode D2, the fourth diode D4, the sixth diode D6 and the thirteenth diode D13 are connected to the grounding copper foil through binding wires, and the fourth lower pin n is connected to the thirteenth diode D13 through a binding wire to achieve connection with the second diode D2, the fourth diode D4 and the sixth diode D6; multiple second areas are connected to the fourth area, and the fifth lower pin p is connected to the copper foils of multiple second areas and the fourth area; the first lower pin a, the second lower pin b and the third lower pin c are connected to the copper foils of the corresponding third areas, and the eighth diode D8, the tenth diode D10 and the twelfth diode D12 are connected to the copper foils of the corresponding third areas through binding wires. , to achieve connection with the corresponding lower pins; the first switch tube Q1 is arranged on the upper side of the second diode D2 and the eighth diode D8, and is connected to the first upper pin GA and the second upper pin EA through a bonding wire; the second switch tube Q2 is arranged on the upper side of the fourth diode D4 and the tenth diode D10, and is connected to the third upper pin GB and the fourth upper pin EB through a bonding wire; the third switch tube Q3 is arranged on the upper side of the sixth diode D6 and the twelfth diode D12, and is connected to the fifth upper pin GC and the sixth upper pin EC through a bonding wire; the upper switch tube and the return diode of each single-phase PFC circuit are connected to the switch tube through a bonding wire; the temperature detection unit T is connected to the seventh upper pin T1 and the eighth upper pin T2 through a bonding wire.

[0089] It can be understood that in this embodiment, there are no cross-bonding wires between the single-phase PFC circuits, the third area 403 is arranged on the lower side of the substrate 400 to be close to the lower pins, and the binding wires of the upper diode are short; the first switch tube Q1, the second switch tube Q2 and the third switch tube Q3 are arranged close to the corresponding upper pins, and the binding wires of the switch tubes are short; an independent grounding copper foil is provided on the substrate 400, and the anode of the thirteenth diode D13 is respectively connected to the grounding copper foil and the fourth lower pin n through bonding wires, and the bonding wires of the freewheeling diode and the lower diode are short.

[0090] In one embodiment, the device layout of the three-phase PFC module is as follows: Figure 10 The layout area of ​​each single-phase PFC circuit includes a first area 401, a second area 402, and a third area 403. The second area 402 is located at the upper left corner of the corresponding first area 401, and the third area 403 is located at the lower right corner of the corresponding first area 401. The fourth area 404 is located at the lower left corner of the substrate 400, and the fifth area 405 is located at the upper right corner of the substrate 400.

[0091] based on Figure 10 In the layout area shown, the upper diode in each single-phase PFC circuit is arranged at the upper left corner of the voltage regulating circuit, and the return diode is arranged at the lower right corner of the voltage regulating circuit; the opening tube, input diode and lower diode of the voltage regulating circuit are arranged in sequence from top to bottom; the freewheeling diode is arranged at the lower left corner of the substrate 400, and the temperature detection unit T is arranged at the upper right corner of the substrate 400.

[0092] based on Figure 10 In the layout area shown, the seventh upper pin T1 and the eighth upper pin T2 are arranged close to the fifth area 405, and the arrangement positions of the upper pins are, from left to right, the first upper pin GA, the second upper pin EA, the third upper pin GB, the fourth upper pin EB, the fifth upper pin GC, the sixth upper pin EC, the seventh upper pin T1 and the eighth upper pin T2; the fourth lower pin n and the fifth lower pin p are arranged close to the fourth area 404, and the arrangement positions of the lower pins are, from left to right, the fourth lower pin n, the fifth lower pin p, the first lower pin a, the second lower pin b and the third lower pin c.

[0093] based on Figure 10 The specific structural diagram of the three-phase PFC module packaging structure is shown in the layout area shown in FIG. Figure 11As shown. The devices arranged in the same layout area are connected to the same potential through copper wiring, and the devices are connected to the devices or copper foils in other layout areas by setting binding wires on the top layer. Specifically, the fourth lower pin n is connected to the thirteenth diode D13 through a binding wire, the second diode D2, the fourth diode D4 and the sixth diode D6 are arranged on the lower side of each first area, the thirteenth diode D13 is connected to the second diode D2 through a binding wire, the second diode D2 is connected to the fourth diode D4 through a binding wire, and the fourth diode D4 is connected to the sixth diode D6 through a binding wire, so that the second diode D2, the fourth diode D4, the sixth diode D6 and the thirteenth diode D13 are connected to the fourth lower pin n; multiple second areas are connected to the fourth area, the fifth lower pin p is connected to the copper foils of multiple second areas and the fourth area; the first lower pin a, the second lower pin b and the third lower pin c are connected to the copper foils of the corresponding third areas, the eighth diode D8 The tenth diode D10 and the twelfth diode D12 are connected to the copper foil of the corresponding third area through bonding wires to achieve connection with the corresponding lower pins; the first switch tube Q1 is arranged on the upper side of the corresponding first area, and is connected to the first upper pin GA and the second upper pin EA through bonding wires; the second switch tube Q2 is arranged on the upper side of the corresponding first area, and is connected to the third upper pin GB and the fourth upper pin EB through bonding wires; the third switch tube Q3 is arranged on the upper side of the corresponding first area, and is connected to the fifth upper pin GC and the sixth upper pin EC through bonding wires; the return diode is arranged in the middle of the corresponding first area, and is respectively connected to the corresponding switch tube and the upper switch tube through bonding wires; the temperature detection unit T is connected to the seventh upper pin T1 and the eighth upper pin T2 through bonding wires.

[0094] It can be understood that in this embodiment, there are no cross-bonding wires between the single-phase PFC circuits. The third area 403 is arranged on the lower side of the substrate 400 to be close to the lower pins, and the bonding wires of the upper diode are short. The single-phase PFC circuits are symmetrically distributed, the strong power loop is excellent, and the electromagnetic compatibility capability of the three-phase PFC module is strong.

[0095] In one embodiment, the device layout of the three-phase PFC module is as follows: Figure 12 The layout area of ​​each single-phase PFC circuit includes a first area 401, a second area 402, and a third area 403. The second area 402 is located at the upper right corner of the corresponding first area 401, and the third area 403 is located at the lower left corner of the corresponding first area 401. The fourth area 404 is located at the lower right corner of the substrate 400, and the fifth area 405 is located at the upper left corner of the substrate 400.

[0096] based on Figure 10In the layout area shown, the upper diode in each single-phase PFC circuit is arranged at the upper right corner of the voltage regulating circuit, and the return diode is arranged at the lower left corner of the voltage regulating circuit; the opening tube, input diode and lower diode of the voltage regulating circuit are arranged in sequence from top to bottom; the freewheeling diode is arranged at the upper left corner of the substrate 400, and the temperature detection unit T is arranged at the lower right corner of the substrate 400.

[0097] based on Figure 10 In the layout area shown, the seventh upper pin T1 and the eighth upper pin T2 are arranged close to the fifth area 405, and the arrangement positions of the upper pins are, from left to right, the seventh upper pin T1, the eighth upper pin T2, the first upper pin GA, the second upper pin EA, the third upper pin GB, the fourth upper pin EB, the fifth upper pin GC and the sixth upper pin EC; the fourth lower pin n and the fifth lower pin p are arranged close to the fourth area 404, and the arrangement positions of the lower pins are, from left to right, the first lower pin a, the second lower pin b, the third lower pin c, the fifth lower pin p and the fourth lower pin n.

[0098] based on Figure 10 The specific structural diagram of the three-phase PFC module packaging structure is shown in the layout area shown in FIG. Figure 11As shown. The devices arranged in the same layout area are connected to the same potential through copper wiring, and the devices are connected to the devices or copper foils in other layout areas by setting binding wires on the top layer. Specifically, the fourth lower pin n is connected to the thirteenth diode D13 through a binding wire, the second diode D2, the fourth diode D4 and the sixth diode D6 are arranged on the lower side of each first area, the thirteenth diode D13 is connected to the second diode D2 through a binding wire, the second diode D2 is connected to the fourth diode D4 through a binding wire, and the fourth diode D4 is connected to the sixth diode D6 through a binding wire, so that the second diode D2, the fourth diode D4, the sixth diode D6 and the thirteenth diode D13 are connected to the fourth lower pin n; multiple second areas are connected to the fourth area, the fifth lower pin p is connected to the copper foils of multiple second areas and the fourth area; the first lower pin a, the second lower pin b and the third lower pin c are connected to the copper foils of the corresponding third areas, the eighth diode D8 The tenth diode D10 and the twelfth diode D12 are connected to the copper foil of the corresponding third area through bonding wires to achieve connection with the corresponding lower pins; the first switch tube Q1 is arranged on the upper side of the corresponding first area, and is connected to the first upper pin GA and the second upper pin EA through bonding wires; the second switch tube Q2 is arranged on the upper side of the corresponding first area, and is connected to the third upper pin GB and the fourth upper pin EB through bonding wires; the third switch tube Q3 is arranged on the upper side of the corresponding first area, and is connected to the fifth upper pin GC and the sixth upper pin EC through bonding wires; the return diode is arranged in the middle of the corresponding first area, and is respectively connected to the corresponding switch tube and the upper switch tube through bonding wires; the temperature detection unit T is connected to the seventh upper pin T1 and the eighth upper pin T2 through bonding wires.

[0099] It can be understood that in this embodiment, there are no cross-bonding wires between the single-phase PFC circuits. The third area 403 is arranged on the lower side of the substrate 400 to be close to the lower pins, and the bonding wires of the upper diode are short. The single-phase PFC circuits are symmetrically distributed, the strong power loop is excellent, and the electromagnetic compatibility capability of the three-phase PFC module is strong.

[0100] It should be noted that, since the components and connection relationships of each single-phase PFC circuit are the same, in some application examples, the layout position relationship of each single-phase PFC circuit is not limited to the following. Figure 3 The relationship shown in FIG1 is a diagram illustrating a configuration in which the single-phase PFC circuits are arranged from left to right in multiple layout areas based on other arrangement methods, and the arrangement positions of the upper pins and the lower pins corresponding to the single-phase PFC circuits are adjusted accordingly based on the layout position relationship of the single-phase PFC circuits. These also fall within the scope of protection of the present application.

[0101] For example, in one application example, the third single-phase PFC circuit 300, the second single-phase PFC circuit 200, and the first single-phase PFC circuit 100 are arranged sequentially from left to right in multiple layout areas. The top pins are arranged, from left to right, as follows: the fifth top pin GC, the sixth top pin EC, the third top pin GB, the fourth top pin EB, the first top pin GA, and the second top pin EA. The bottom pins are arranged, from left to right, as follows: the third bottom pin c, the second bottom pin b, and the first bottom pin a. In some application examples, the top pins connecting the output terminal and the driver terminal of the same switching transistor are interchanged, which also shares the same technical concept as the aforementioned embodiments of the present application.

[0102] In some embodiments of the present application, a three-phase PFC module packaged based on the aforementioned three-phase PFC module packaging structure can be applied to an air conditioner. After the three-phase AC power supply is connected to the three-phase Buck PFC circuit in which the aforementioned three-phase PFC module is set, it is used to power loads such as the compressor and fan of the air conditioner.

[0103] It should be noted that: "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0104] In addition, the technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.

[0105] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A three-phase PFC module packaging structure, characterized in that: The package structure is a dual in-line package (DIP), and a substrate of the package structure is provided with multiple layout areas. A first single-phase PFC circuit, a second single-phase PFC circuit, and a third single-phase PFC circuit are arranged in sequence from left to right on the multiple layout areas. In the layout areas corresponding to the single-phase PFC circuits, the voltage regulating circuit, the return diode, and the upper diode in each single-phase PFC circuit are arranged in the same layout position relationship. The packaging structure further includes upper pins and lower pins arranged in parallel, the low-voltage contacts of each single-phase PFC circuit are connected to the upper pins, and the high-voltage contacts of each single-phase PFC circuit are connected to the lower pins.

2. The packaging structure according to claim 1, wherein: The plurality of layout areas include a plurality of first areas for arranging the voltage regulating circuits, a plurality of second areas for arranging the upper diodes, and a plurality of third areas for arranging the return diodes. Among them, the voltage regulating circuit includes a switching tube, an input diode, and a lower diode. In each of the single-phase PFC circuits, the input end of the switching tube is respectively connected to the cathodes of the input diode and the lower diode, and the output end of the switching tube is connected to the anode of the return diode.

3. The packaging structure according to claim 2, wherein: The upper pins include a first upper pin, a second upper pin, a third upper pin, a fourth upper pin, a fifth upper pin and a sixth upper pin arranged in sequence from left to right; Among them, the low-voltage contact includes the driving end and the output end of each switching tube, and the driving end of each switching tube is connected to the first upper pin, the third upper pin and the fifth upper pin in sequence; the output end of each switching tube is connected to the second upper pin, the fourth upper pin and the sixth upper pin in sequence from left to right.

4. The packaging structure according to claim 3, wherein: The lower pins include a first lower pin, a second lower pin, and a third lower pin arranged in sequence from left to right, and the first lower pin, the second lower pin, and the third lower pin are AC power input terminals of the three-phase PFC module package structure; the high-voltage contact includes a cathode of each of the return diodes and an anode of the input diode, and the cathode of each of the return diodes is correspondingly connected to the first lower pin, the second lower pin, and the third lower pin in sequence from left to right; the anode of each of the input diodes is correspondingly connected to the first lower pin, the second lower pin, and the third lower pin in sequence from left to right; Among them, the lower side pins also include a fourth lower side pin and a fifth lower side pin, the fourth lower side pin is the ground terminal, and the fifth lower side pin is the output terminal of the three-phase PFC module packaging structure; the high-voltage contact also includes the anode of each of the lower diodes and the cathode of each of the upper diodes; the anode of each of the lower diodes is connected to the fourth lower side pin, and the cathode of each of the upper diodes is connected to the fifth lower side pin.

5. The packaging structure according to claim 4, wherein: The packaging structure further includes a freewheeling diode and a temperature detection unit, and the plurality of layout areas further include a fourth area for arranging the freewheeling diode and a fifth area for arranging the temperature detection unit; Among them, the upper pin also includes a seventh upper pin and an eighth upper pin, and the low-voltage contact also includes the two ends of the temperature detection unit; the first end of the temperature detection unit is connected to the seventh upper pin, and the second end of the temperature detection unit is connected to the eighth upper pin; the high-voltage contact also includes the anode and cathode of the freewheeling diode, the anode of the freewheeling diode is connected to the fourth lower pin, and the cathode of the freewheeling diode is connected to the fifth lower pin.

6. The packaging structure according to claim 5, wherein: The voltage regulating circuit in each of the single-phase PFC circuits is arranged on the upper side of the upper diode, and the return diode is arranged on the lower side of the upper diode; the freewheeling diode is arranged at the lower left corner of the substrate, and the temperature detection unit is arranged at the upper right corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the right side of the sixth upper pin; the fifth lower pin is arranged on the left side of the first lower pin, and the fourth lower pin is arranged on the left side of the fifth lower pin.

7. The packaging structure according to claim 5, wherein: The upper diode in each of the single-phase PFC circuits is arranged on the upper side of the voltage regulating circuit, and the return diode is arranged on the lower side of the voltage regulating circuit; the freewheeling diode is arranged at the lower left corner of the substrate, and the temperature detection unit is arranged at the upper right corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the right side of the sixth upper pin; the fifth lower pin is arranged on the left side of the first lower pin, and the fourth lower pin is arranged on the left side of the fifth lower pin.

8. The packaging structure according to claim 5, wherein: The upper diode in each of the single-phase PFC circuits is arranged at the upper left corner of the voltage regulating circuit, and the return diode is arranged at the lower right corner of the voltage regulating circuit; the freewheeling diode is arranged at the lower left corner of the substrate, and the temperature detection unit is arranged at the upper right corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the right side of the sixth upper pin; the fourth lower pin is arranged on the left side of the first lower pin, and the fifth lower pin is arranged on the left side of the fourth lower pin.

9. The packaging structure according to claim 5, wherein: The upper diode in each of the single-phase PFC circuits is arranged at the upper right corner of the voltage regulating circuit, and the return diode is arranged at the lower left corner of the voltage regulating circuit; the freewheeling diode is arranged at the lower right corner of the substrate, and the temperature detection unit is arranged at the upper left corner of the substrate; the seventh upper pin and the eighth upper pin are arranged on the left side of the first upper pin; the fifth lower pin is arranged on the right side of the third lower pin, and the fourth lower pin is arranged on the right side of the fifth lower pin.

10. The packaging structure according to any one of claims 5 to 9, characterized in that: The switch tube, the input diode, the return diode, the upper diode, the lower diode and the freewheeling diode are packaged in the form of bare chips.

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