Display device

Abstract

The utility model relates to a display device. The display device includes: a display panel including a display area and a non-display area; a circuit component in the non-display area of the display panel; the first alignment mark part is located on the display panel; and a second alignment mark portion located on the circuit member corresponding to the first alignment mark portion. Wherein the first alignment mark part comprises a first center alignment mark and first left and right alignment marks which are separated from each other and are positioned on two sides of the first center alignment mark; and the second alignment mark part comprises a second center alignment mark corresponding to the first center alignment mark and second left and right alignment marks respectively corresponding to the first left and right alignment marks.

Description

Technical Field

[0001] The utility model relates to a display device and a manufacturing method thereof. Background Art

[0002] With the development of the information society, the demand for display devices for displaying images in various forms is increasing. For example, display devices are being applied to various electronic devices such as smartphones, digital cameras, notebook computers, navigation systems, and smart TVs.

[0003] Various types of display devices are being used, such as liquid crystal displays (LCDs) and organic light emitting displays (OLEDs). Organic light emitting displays (OLEDs) display images using organic light emitting elements (OLEDs) that generate light through the recombination of electrons and holes. These devices include multiple transistors that supply drive current to the organic light emitting elements.

[0004] In addition, the display device includes a driver circuit, and the driver circuit supplies signals to the thin film transistors and multiple signal lines of the display panel. The driver circuit can be implemented as an integrated circuit (IC) chip. The driver circuit can be mounted on a substrate or printed circuit board of the electronic device using various packaging methods.

[0005] For example, there are methods such as COG (Chip On Glass) mounted directly on a substrate of a display device and COF (Chip On Film) mounted on a film such as a flexible printed circuit film.

[0006] Here, the process of electrically connecting the substrate of the display device and the output terminals of the driver integrated circuit chip is called the OLB process, namely Outer Lead Bonding. In the OLB process, alignment between the two terminals is very important. Utility Model Content

[0007] The technical problem to be solved by the present invention is to provide a display device and a manufacturing method thereof, which can accurately align and bond a display panel and a circuit component in an OLB process for bonding the display panel and the circuit component, thereby preventing bonding position errors and poor contact and thereby ensuring contact reliability.

[0008] The technical problems of the present invention are not limited to the technical problems mentioned above, and those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0009] According to an embodiment for solving the above-mentioned problem, a display device includes: a display panel including a display area and a non-display area; a circuit component located in the non-display area of ​​the display panel; a first alignment mark portion located on the display panel; and a second alignment mark portion located on the circuit component corresponding to the first alignment mark portion, wherein the first alignment mark portion includes a first center alignment mark and first left and right alignment marks spaced apart and located on both sides of the first center alignment mark, and the second alignment mark portion includes a second center alignment mark corresponding to the first center alignment mark and second left and right alignment marks corresponding to the first left and right alignment marks respectively.

[0010] The first center alignment mark may be provided at a center of the first alignment mark portion, and the second center alignment mark may be provided at a center of the second alignment mark portion.

[0011] A planar shape of the first center alignment mark may be the same as a planar shape of the second center alignment mark.

[0012] A planar shape of the first left-right alignment mark may be the same as a planar shape of the second left-right alignment mark.

[0013] A planar shape of the first center alignment mark may be different from a planar shape of the first left-right alignment mark, and a planar shape of the second center alignment mark may be different from a planar shape of the second left-right alignment mark.

[0014] The display panel may include a first pin portion including a plurality of first pins, and the first pin portion may be located between the first left and right alignment marks, and the first center alignment mark may be located at a center of the first pin portion.

[0015] The circuit component may include a second pin portion including a plurality of second pins, and the second pin portion may be located between the second left and right alignment marks, and the second center alignment mark may be located at a center of the second pin portion.

[0016] A size of the first center alignment mark may be smaller than or equal to a size of the first lead, and a size of the second center alignment mark may be smaller than or equal to a size of the second lead.

[0017] A size of the first left-right alignment mark may be larger than a size of the first lead, and a size of the second left-right alignment mark may be larger than a size of the second lead.

[0018] The number of the first pins disposed between the first center alignment mark and the first left alignment mark may be the same as the number of the first pins disposed between the first center alignment mark and the first right alignment mark.

[0019] A distance between the first center alignment mark and the first lead adjacent to the first center alignment mark may be smaller than a distance between the first left-right alignment mark and the first lead adjacent to the first left-right alignment mark.

[0020] A distance between the first center alignment mark and the first lead adjacent to the first center alignment mark may be smaller than a distance between the first lead portions disposed at an edge of the first lead portion centered around the first center alignment mark.

[0021] The first pin portion can be maintained at a certain interval on the display panel and be set to at least one or more, the circuit component can be set to at least one or more corresponding to the first pin portion, and the second pin portion of the circuit component can be joined to the first pin portion of the display panel.

[0022] The first alignment mark portion may be formed on a first surface of the display panel that contacts a first surface of the circuit component, and the second alignment mark portion may be formed on a second surface of the circuit component that is an opposite surface to the first surface of the circuit component.

[0023] The first and second alignment mark portions may be photographed by a camera positioned to be spaced apart from a second surface of the display panel, which is an opposite surface to the first surface, and the first surface of the circuit component.

[0024] The circuit component may include a flexible printed circuit board (FPCB) or a printed circuit film (COF).

[0025] Details of other embodiments are included in the detailed description and drawings.

[0026] According to a display device according to one embodiment, a display device and a manufacturing method thereof are provided, which can prevent bonding position errors and poor contact and ensure contact reliability by accurately aligning and bonding the display panel and the circuit components in the OLB process of bonding the display panel and the circuit components.

[0027] Furthermore, during the alignment process using the alignment marks located at the centers of the display panel and the circuit component, a bonding process can be performed to eliminate errors and accurately align the centers. With the centers of the display panel and the circuit component accurately aligned, they can be bonded to each other.

[0028] Furthermore, since the display panel and circuit component can be joined together by photographing the alignment marks located at the center of their pins, the effects of left-right misalignment can be reduced, and the number of camera shots can be reduced. This reduces camera-induced errors and improves X-direction attachment misalignment between the display panel and circuit component.

[0029] The effects according to the embodiments are not limited to the contents of the above-described examples, and more various effects are also included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 FIG. 1 is a plan view of a display panel of a display device according to an embodiment.

[0031] Figure 2 yes Figure 1 An enlarged view of the bonding area where the display panel and the flexible circuit board FPCB are bonded.

[0032] Figure 3 yes Figure 2 An enlarged view of the exploded state of the display panel and flexible circuit board FPCB.

[0033] Figure 4 yes Figure 3 An enlarged view of the first and second lead portions and the first and second alignment mark portions.

[0034] Figure 5 yes Figure 4 An enlarged view of the first pin portion and the first alignment mark portion.

[0035] Figure 6 yes Figure 4 An enlarged view of the second lead portion and the second alignment mark portion.

[0036] Figure 7 is shown with Figure 3 FIG. 1 is a diagram showing another example of a first alignment mark and a second alignment mark having different shapes of the first alignment mark portion and the second alignment mark portion.

[0037] Figure 8 It shows Figure 3 FIG. 1 is a diagram showing another embodiment in which a display panel is formed with a plurality of first pin portions.

[0038] Figure 9 is a flowchart of a method for manufacturing a display device according to one embodiment.

[0039] Figures 10 to 18 The diagrams are used to explain the steps of bonding a flexible circuit board (FPCB) to a display panel in a method for manufacturing a display device.

[0040] Description of Reference Signs

[0041] 1: Display device

[0042] 100: Display panel

[0043] 110: First pin portion

[0044] 120, 121: first alignment mark portion

[0045] 210: Second pin portion

[0046] 220, 221: Second alignment mark portion

[0047] 320: Center camera

[0048] 321: Left and right cameras

[0049] IC: driver chip

[0050] FPCB: Flexible Printed Circuit Board

[0051] MP: Main circuit board DETAILED DESCRIPTION

[0052] The advantages and features of the present invention and the methods for achieving these advantages and features will be described in detail below and in the accompanying drawings. Figure 1 However, the present invention is not limited to the embodiments disclosed below, but can be implemented in a variety of different forms. These embodiments are provided only to complete the disclosure of the present invention and to fully inform those skilled in the art of the present invention of the scope of the present invention. The present invention is limited only by the scope of the claims.

[0053] When an element or layer is referred to as being "on" another element or layer, it includes both the case where it is directly on the other element or other layers or other elements are interposed therebetween. Similarly, when referred to as being "below," "left," and "right," it includes both the case where it is directly adjacent to another element or other layers or other elements are interposed therebetween. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0054] Although the terms "first," "second," and so on are used to describe various components, these components are clearly not limited by these terms. These terms are only used to distinguish one component from another. Therefore, within the technical concept of the present invention, the first component mentioned below can also be the second component.

[0055] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0056] Figure 1 FIG. 1 is a plan view of a display panel of a display device according to an embodiment.

[0057] The display device 1 can be applied to portable terminals, etc. Portable terminals may include tablet PCs, smartphones, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), game consoles, watch-type electronic devices, etc. However, the present invention is not limited to a specific type of display device 1. For example, in another embodiment of the present invention, the display device 1 can also be applied to large electronic equipment such as televisions or external advertising boards, as well as small and medium-sized electronic equipment such as personal computers, notebook computers, car navigation devices, and cameras.

[0058] refer to Figure 1 The display device 1 may include a display panel 100, a driving chip IC, a flexible circuit board FPCB, and a main circuit board MP.

[0059] The display panel 100 may include a self-luminous element. In an exemplary embodiment, the self-luminous element may include at least one of an organic light emitting diode (OLED), a quantum dot light emitting diode (QD), an inorganic micro-LED (e.g., micro-LED), and an inorganic nano-LED (e.g., nano-LED).

[0060] Although the display panel 100 is shown as a rectangular shape in a plan view, it is not limited thereto, and the corners of the display panel 100 may form a curved surface. In addition, various shapes such as a square, other polygons, and a circle may be used.

[0061] When the display panel 100 is divided according to whether to display an image, the display panel 100 may include a display area DA that displays an image and a non-display area NDA that does not display an image. The non-display area NDA may be located around the display area DA and may surround the display area DA.

[0062] When the display panel 100 is divided based on the bendable area, the display panel 100 may be divided into a first area A1 including the display area DA, a second area A2 spaced apart from the first area A1, and a bendable third area A3.

[0063] A driving chip IC may be disposed on the upper surface 101 , which is the first surface of the display panel 100 , in the second area A2 , and may be provided with a pad that contacts the driving chip IC.

[0064] The driver IC may include at least one of a data driver unit that applies a data signal to a data line, a gate driver unit that applies a gate signal to a gate line, and a signal control unit that controls the operation of the data driver unit and the gate driver unit. The number of driver ICs is not limited to the example shown in the figure.

[0065] One end portion of the flexible circuit board FPCB may be located at an edge of the display panel 100 in the second area A2 .

[0066] The flexible circuit board FPCB may contact pads disposed on the display panel 100 via an anisotropic conductive film, etc. The process of bringing the flexible circuit board FPCB into contact with the display panel 100 may include a pressurizing process of applying pressure to the flexible circuit board FPCB.

[0067] The main circuit board MP can be electrically connected to the display panel 100 via the flexible circuit board FPCB and exchange signals with the driver chip IC. The main circuit board MP can provide image data, control signals, power supply voltage, etc. to the display panel 100 or the flexible circuit board FPCB. The main circuit board MP may include active components and passive components.

[0068] Figure 2 yes Figure 1 An enlarged view of the bonding area between the display panel and the flexible circuit board FPCB, and Figure 3 yes Figure 2 An enlarged view of the exploded state of the display panel and flexible circuit board FPCB.

[0069] refer to Figure 2 The flexible circuit board FPCB may be located in the second area A2 of the display panel 100 and may be attached to a portion of the upper surface 101 of the display panel 100. Here, the flexible circuit board FPCB has been used as a circuit component, but COF, COG, FOG and this process may obviously be applied.

[0070] refer to Figure 3 , the display panel 100 may include a first pin portion 110 and first alignment mark portions 120 and 121 provided at a position where the flexible circuit board FPCB is attached.

[0071] The flexible circuit board FPCB may include a second pin portion 210 and second alignment mark portions 220 and 221 provided at a position coupled with the upper surface 101 of the display panel 100 .

[0072] Figure 4 yes Figure 3 an enlarged view of the first lead portion and the second lead portion and the first alignment mark portion and the second alignment mark portion, Figure 5 yes Figure 4 an enlarged view of the first pin portion and the first alignment mark portion, and Figure 6 yes Figure 4 An enlarged view of the second lead portion and the second alignment mark portion.

[0073] refer to Figure 4 The first pin portion 110 may be formed on the upper surface 101 of the display panel 100 , include a plurality of first pins 111 , and be engaged with the second pin portion 210 of the flexible circuit board FPCB.

[0074] The second pin portion 210 may be formed on the lower surface 202 serving as the first surface, include a plurality of second pins 211, and be bonded to the first pin portion 110 of the display panel 100, wherein the lower surface 202 serving as the first surface will be described later as the opposite surface of the upper surface 201 serving as the second surface of the flexible circuit board FPCB.

[0075] The first alignment mark parts 120 and 121 may be formed on the upper surface 101 of the display panel 100 and may include a first center alignment mark 120 and first left and right alignment marks 121 on both sides of the first center alignment mark 120 .

[0076] The first center alignment mark 120 may be located at both the center of the display panel 100 and the center of the first lead portion 110 , with the X direction, which is the short side direction of the display panel 100 , as a reference.

[0077] The first left-right alignment mark 121 may be formed as a pair including the first left alignment mark 121 on the left and the first right alignment mark 121 on the right, and may be spaced apart from each other in the X direction, which is the short side direction of the display panel 100 .

[0078] The pair of first left-right alignment marks 121 are symmetrically arranged on the left and right sides of the first lead portion 110 with the first lead portion 110 as the center. Therefore, the first center alignment mark 120 located at the center of the first lead portion 110 is positioned at the center between the pair of first left-right alignment marks 121 .

[0079] The second alignment marks 220 and 221 may be formed on the upper surface 201 of the flexible circuit board FPCB and may include a second center alignment mark 220 and second left and right alignment marks 221 on both sides of the second center alignment mark 220 .

[0080] The second center alignment mark 220 may be located at the center of the flexible circuit board FPCB and the center of the second pin portion 210 based on the X direction, which is the short side direction of the display panel 100 .

[0081] The second left-right alignment mark 221 may be formed as a pair including a second left alignment mark 221 on the left and a second right alignment mark 221 on the right, and may be spaced apart from each other in the left and right directions relative to the X direction, which is the short side direction of the display panel 100 .

[0082] The pair of second left-right alignment marks 221 are symmetrically arranged on the left and right sides of the second lead portion 210 with the second lead portion 210 as the center. Therefore, the second center alignment mark 220 located in the center of the second lead portion 210 is positioned at the center between the pair of second left-right alignment marks 221.

[0083] refer to Figure 5 , the size W1 of the first center alignment mark 120 may be the same as the size W2 of the first lead 111. In addition, the size W1 of the first center alignment mark 120 may be formed smaller than the size W2 of the first lead 111.

[0084] A size W3 of the first left-right alignment mark 121 may be greater than a size W2 of the first pin 111 .

[0085] A distance P1 between the first center alignment mark 120 and the first lead 111 adjacent to the first center alignment mark 120 may be smaller than a distance P2 between the first left-right alignment mark 121 and the first lead 111 adjacent to the first left-right alignment mark 121 .

[0086] Furthermore, a distance P1 between the first center alignment mark 120 and the first leads 111 adjacent to the first center alignment mark 120 may be smaller than a distance between the first leads 111 disposed at an edge of the first lead portion 110 centered around the first center alignment mark 120 .

[0087] For example, the first pin 111 adjacent to the first center alignment mark 120 with the first center alignment mark 120 as the center, that is, the first pin 111 located in the central area of ​​the first pin portion 110 can be formed very densely with a fine pitch interval, and the first pins 111 located in the left and right areas of the first pin portion 110 with the first center alignment mark 120 as the center can be formed with a relatively wide pitch.

[0088] Here, the first pins 111 located in the central area of ​​the first pin portion 110 are formed very densely with a fine pitch interval, wherein the interval between the first pins 111 located in the fine pitch interval may be equal to the distance P1 between the first pins 111 adjacent to the first center alignment mark 120 and the first center alignment mark 120 and may also be as follows: Figure 5 As shown, the distance P1 between the first lead 111 adjacent to the first center alignment mark 120 and the first center alignment mark 120 is less than that.

[0089] When first leads 111 located in the center region of first lead section 110 are densely packed with fine-pitch sections, centering can be difficult during bonding between first lead section 110 and second lead section 210, potentially leading to bonding failures. However, the presence of first and second center alignment marks 120 and 220 allows for precise centering between first and second lead sections 110, 210. Consequently, conventional bonding methods, which align left and right before bonding first and second lead sections 110, 210, using a randomly selected half-point as the center, can result in frequent contact failures. However, the presence of first and second center alignment marks 120 and 220 ensures reliable bonding.

[0090] The number of first pins 111 disposed between the first center alignment mark 120 and the first left alignment mark 121 may be the same as the number of first pins 111 disposed between the first center alignment mark 120 and the first right alignment mark 121. That is, the left and right sections B formed by the first pins 111 may have the same area, and the number of first pins 111 within each of the left and right sections B may be the same.

[0091] refer to Figure 6 , the size W11 of the second center alignment mark 220 may be the same as the size W22 of the second lead 211. In addition, the size W11 of the second center alignment mark 220 may be formed smaller than the size W22 of the second lead 211.

[0092] A size W33 of the second left-right alignment mark 221 may be greater than a size W22 of the second pin 211 .

[0093] A distance P11 between the second center alignment mark 220 and the second lead 211 adjacent to the second center alignment mark 220 may be smaller than a distance P22 between the second left-right alignment mark 221 and the second lead 211 adjacent to the second left-right alignment mark 221 .

[0094] In addition, a distance P11 between the second center alignment mark 220 and the second leads 211 adjacent to the second center alignment mark 220 may be smaller than a distance between the second leads 211 disposed at an edge of the second lead portion 210 centered around the second center alignment mark 220 .

[0095] For example, the second pin 211 adjacent to the second center alignment mark 220 with the second center alignment mark 220 as the center, that is, the second pin 211 located in the central area of ​​the second pin portion 210 can be formed very densely within a fine pitch interval, and the second pins 211 located in the left and right areas of the second pin portion 210 with the second center alignment mark 220 as the center can be formed with a relatively wide pitch.

[0096] Here, the second pins 211 located in the central area of ​​the second pin portion 210 are formed very closely with a fine pitch interval, wherein the interval between the second pins 211 located in the fine pitch interval may also be equal to the distance P11 between the second pins 211 adjacent to the second center alignment mark 220 and the second center alignment mark 220, and may also be as shown in FIG. Figure 6 As shown, the distance P11 between the second lead 211 adjacent to the second center alignment mark 220 and the second center alignment mark 220 is less than that.

[0097] The number of second pins 211 disposed between the second center alignment mark 220 and the second left alignment mark 221 may be the same as the number of second pins 211 disposed between the second center alignment mark 220 and the second right alignment mark 221. That is, the left and right sections B1 formed by the second pins 211 may have the same area, and the number of second pins 211 within each of the left and right sections B1 may be the same.

[0098] Figure 7 is shown with Figure 3 FIG. 1 is a diagram showing another example of the first alignment mark portion and the second alignment mark portion having different shapes.

[0099] The shapes of the first center alignment mark 120 and the second center alignment mark 220 can also be as follows: Figure 4 The first pin portion 110 and the second pin portion 210 are similar to the shape, but as another example, refer to Figure 7 , the shapes of the first center alignment mark 120a and the second center alignment mark 220a can also be formed as “:”.

[0100] The first left-right alignment mark 121 and the second left-right alignment mark 221 may also be as shown in FIG. Figure 4 Shown with a "+" shape, but as another example, refer to Figure 7 The shapes of the first left-right alignment mark 121a and the second left-right alignment mark 221a can be formed as Shape. Of course, the shape is not limited to Figure 4 as well as Figure 7 The shapes shown can also be formed into etc. in various forms.

[0101] Here, the first center alignment mark 120a and the second center alignment mark 220a are formed in the same shape corresponding to each other, the first left and right alignment mark 121a and the second left and right alignment mark 221a are formed in the same shape corresponding to each other, and the first left and right alignment mark 121a and the second left and right alignment mark 221a are formed in a pattern different from the first center alignment mark 120a and the second center alignment mark 220a, but are not limited to this.

[0102] Figure 8 It shows Figure 3 FIG. 1 is a diagram showing another embodiment in which a display panel is formed with a plurality of first pin portions.

[0103] A first center alignment mark 120 and a pair of first left and right alignment marks 121 can also be used as a set. Figure 3 As shown, it is positioned to correspond to a first pin portion 110, and can also be as shown Figure 8 As shown, when a plurality of first pin portions 110 are formed (for example, three), they are formed to correspond to three first center alignment marks 120 and three pairs of first left-right alignment marks 121. In this case, multiple flexible circuit boards (FPCBs) (for example, three flexible circuit boards) can be coupled to the display panel 100 corresponding to the respective first pin portions 110. Of course, the number of flexible circuit boards (FPCBs) that can be coupled is not limited to this.

[0104] In the following, reference will be made to Figures 9 to 18 A method for manufacturing the display device 1 according to an embodiment will be described.

[0105] Figure 9 is a flowchart of a method for manufacturing a display device according to an embodiment, and Figures 10 to 18 The diagrams are used to explain the steps of bonding a flexible circuit board (FPCB) to a display panel in a method for manufacturing a display device.

[0106] Hereinafter, in a method for manufacturing the display device 1 according to an embodiment, the method for manufacturing the display device 1 will be described with a focus on a process of bonding the flexible circuit board FPCB to the display panel 100 (referred to as an OLB (outer lead bonding) process).

[0107] First, Figure 9 Step S110 may include a camera calibration step.

[0108] refer to Figure 10, three cameras (a central camera 320 and left and right cameras 321) can be prepared, the central camera 320 is located in the center, and the left and right cameras 321 can be located side by side on the left and right sides of the central camera 320. The distance from the central camera 320 to the left and right cameras 321 can be the same.

[0109] As described above, in the center camera 320 set in the center and the left and right cameras 321 set on the left and right, camera calibration is used to eliminate camera distortion. In the camera calibration step, the XY orthogonal coordinate system and the rotation T center can be calculated. The calculated values ​​calculated by the camera calibration can become the reference values ​​in subsequent steps.

[0110] What we actually see with our eyes is three-dimensional, but when captured by a camera, it's converted into a two-dimensional image. From a geometric perspective, the position of a three-dimensional point on the image is determined by the position and orientation of the camera when the image was captured. However, the actual image is also significantly affected by the camera's internal mechanical components, such as the lens used, the distance between the lens and the image sensor, and the angle between the lens and the image sensor.

[0111] Therefore, when trying to find the position of a three-dimensional point projected onto a two-dimensional image or vice versa, when trying to find the three-dimensional space coordinates from the two-dimensional image coordinates, it is necessary to remove these internal factors, that is, the interfering factors, in order to perform accurate calculations. The process of finding the parameter values ​​of these internal factors is called camera calibration.

[0112] second, Figure 9 Step S120 may include a step of preparing the display panel 100 .

[0113] refer to Figure 11 A display panel including a first center alignment mark 120 and first left-right alignment marks 121 positioned at both sides of the first center alignment mark 120 may be prepared.

[0114] The display panel 100 may include a plurality of first pin portions 110 , for example, three first pin portions 110 . When a plurality of first pin portions 110 are formed, a plurality of first center alignment marks 120 and a plurality of first left-right alignment marks 121 may be formed corresponding to the first pin portions 110 .

[0115] For example, one first center alignment mark 120 may be located at the center of one first pin portion 110 , and one first pin portion 110 may be located between a pair of first left-right alignment marks 121 .

[0116] third, Figure 9 Step S130 may include a step of preparing a flexible circuit board FPCB.

[0117] refer to Figure 11 , a flexible circuit board FPCB including a second center alignment mark 220 corresponding to the first center alignment mark 120 and second left and right alignment marks 221 corresponding to the first left and right alignment marks 121 , respectively, may be prepared.

[0118] When the display panel 100 is formed with a plurality of first pin parts 110 , for example, three first pin parts 110 , the flexible circuit board FPCB may be prepared as a plurality (for example, three) of flexible circuit boards FPCB corresponding to the number of the first pin parts 110 .

[0119] One flexible circuit board FPCB may be formed with one second pin portion 210 . In this case, one second center alignment mark 220 may be located at the center of one second pin portion 210 , and one second pin portion 210 may be located between a pair of second left-right alignment marks 221 .

[0120] fourth, Figure 9 Step S140 may include placing the display panel 100 and the flexible circuit board FPCB adjacent to each other.

[0121] refer to Figure 11 In order to position the center camera 320 and the left and right cameras 321, the flexible circuit board FPCB may be positioned adjacent to the display panel 100. In this case, the first pin portion 110 and the second pin portion 210 may be positioned adjacent to each other. The flexible circuit board FPCB and the display panel 100 may be transferred by a transfer robot (not shown) and aligned in a subsequent step, and then moved to a position for mutual engagement.

[0122] The center camera 320 and the left and right cameras 321 may be located between the first pin portion 110 of the display panel 100 and the second pin portion 210 of the flexible circuit board FPCB.

[0123] The center camera 320 and the left and right cameras 321 are used to transmit images captured at the center and left and right positions (ie, at three positions in total) to a control unit (not shown).

[0124] The center camera 320 may be located between the display panel 100 and the flexible circuit board FPCB, on the same line as the first and second center alignment marks 120 and 220 , and used to photograph the first and second center alignment marks 120 and 220 .

[0125] The left and right cameras 321 can be arranged side by side on the left and right sides with the center camera 320 as the center, and can be located in a straight line with the first left-right alignment mark 121 and the second left-right alignment mark 221 between the display panel 100 and the flexible circuit board FPCB. Thus, the left and right cameras 321 are used to capture the first left-right alignment mark 121 and the second left-right alignment mark 221.

[0126] Figure 12 is a rear view showing a state in which a center camera and left and right cameras are provided on the lower side of a display panel and a flexible circuit board FPCB, and Figure 13 is a side sectional view schematically illustrating a state in which a center camera is provided on lower sides of a display panel and a flexible circuit board FPCB.

[0127] refer to Figure 12 and Figure 13 The center camera 320 and the left and right cameras 321 may be disposed on the lower side of the display panel 100 and the flexible circuit board FPCB and may be disposed at positions spaced apart from the lower surface 102 of the display panel 100 and the lower surface 202 of the flexible circuit board FPCB.

[0128] Therefore, the center camera 320 and the left and right cameras 321 may face the lower surface 102 of the display panel 100 and may be disposed to face the second pin part 210 formed on the lower surface 202 of the flexible circuit board FPCB.

[0129] fifth, Figure 9 Step S150 may include a step of obtaining an alignment position of the display panel 100 .

[0130] refer to Figure 14 The center camera 320 and the left and right cameras 321 can obtain the alignment position of the display panel 100 by photographing the first center alignment mark 120 and the first left and right alignment marks 121 .

[0131] The step of obtaining the alignment position of the display panel 100 may include the step of recognizing the first center alignment mark 120 and the first left-right alignment mark 121 .

[0132] The center camera 320 and the left and right cameras 321 may respectively recognize the first center alignment mark 120 and the first left and right alignment marks 121 at corresponding positions.

[0133] The step of obtaining the alignment position of the display panel 100 may include the step of obtaining measurement coordinates.

[0134] The step of obtaining the first center measurement coordinates of the first center alignment mark 120 and the first left-right measurement coordinates of the first left-right alignment mark 121 as the center camera 320 and the left-right cameras 321 recognize the first center alignment mark 120 and the first left-right alignment mark 121 may be included.

[0135] sixth, Figure 9 Step S160 may include the step of obtaining an alignment position of the flexible circuit board FPCB.

[0136] refer to Figure 15 The center camera 320 and the left and right cameras 321 can obtain the alignment position of the flexible circuit board FPCB by photographing the second center alignment mark 220 and the second left and right alignment marks 221.

[0137] The step of obtaining the alignment position of the flexible circuit board FPCB may include the step of recognizing the second center alignment mark 220 and the second left-right alignment mark 221 .

[0138] In the step of the center camera 320 and the left and right cameras 321 recognizing the second center alignment mark 220 and the second left and right alignment mark 221, it is possible to recognize Figure 15 The second center alignment mark 220 and the second left-right alignment mark 221 are shown by dotted lines.

[0139] The step of obtaining the aligned position of the flexible circuit board FPCB may include the step of obtaining measurement coordinates.

[0140] The step of obtaining the second center measurement coordinates of the second center alignment mark 220 and the second left-right measurement coordinates of the second left-right alignment mark 221 may be included as the center camera 320 and the left-right cameras 321 recognize the second center alignment mark 220 and the second left-right alignment mark 221 .

[0141] The step of obtaining the alignment position of the flexible circuit board FPCB may include the step of calculating the correction value. This may include calculating the correction value (i.e., the second center measurement coordinate of the second center alignment mark 220 and the second left-right measurement coordinate of the second left-right alignment mark 221) based on the first center measurement coordinate of the first center alignment mark 120 and the first left-right measurement coordinate of the first left-right alignment mark 121. Figure 15 X, Y and T) steps.

[0142] Here, the correction value ( Figure 15 Y direction and T direction) steps.

[0143] The Y direction refers to a direction in which the second pin portion 210 of the flexible circuit board FPCB moves toward the first pin portion 110 along the board direction of the upper surface 101 in order to join the second pin portion 210 of the flexible circuit board FPCB to the first pin portion 110 of the display panel 100, for example.

[0144] The T direction refers to the rotation T direction of the flexible circuit board FPCB along the board surface direction as the Y direction. In order to explain the rotation T direction, as an example, Figure 15 FIG. 1 shows a state where the flexible circuit board FPCB is partially rotated in the T direction. If the position is calculated based on the state of rotation in the T direction, the second pin portion 210 of the flexible circuit board FPCB can be advanced toward the first pin portion 110 by correcting the position in the T direction to engage with the first pin portion 110.

[0145] Furthermore, the method may include calculating a correction value ( ) of the second center measurement coordinate of the second center alignment mark 220 based on the first center measurement coordinate of the first center alignment mark 120. Figure 15 The X direction refers to the direction of movement toward the left or toward the right based on the first center alignment mark 120 and the second center alignment mark 220 when the flexible circuit board FPCB is bonded to the first pin portion 110 of the display panel 100.

[0146] The step of obtaining the aligned position of the flexible circuit board FPCB may include an additional correction step after the step of calculating the correction value.

[0147] A step of additionally correcting the alignment position of the flexible circuit board FPCB using the calculated value calculated in the camera calibration step S110 as a reference value may be included.

[0148] The angle θ of the flexible circuit board FPCB may be calibrated based on the XY orthogonal coordinate system of the central camera 320 and the left and right cameras 321 extracted in the camera calibration step S110 .

[0149] For example, reference Figure 13 As described above, when the flexible circuit board FPCB is advanced in the Y direction to bond the second pin portion 210 of the flexible circuit board FPCB to the first pin portion 110 formed on the upper surface 101 of the display panel 100, the position can be corrected when the lower surface 202 of the flexible circuit board FPCB forms an inclination angle θ in the upward direction (Z direction) or the downward direction (the opposite direction of the Z direction) relative to the lower surface 102 of the display panel 100. The inclination angle θ of the second left-right alignment mark 221 of the flexible circuit board FPCB can be corrected.

[0150] Furthermore, with the XY orthogonal coordinate system of the center camera 320 and the left and right cameras 321 extracted in the camera calibration step S110 as a reference, when the flexible circuit board FPCB is advanced in the Y direction to bond the second pin portion 210 of the flexible circuit board FPCB to the first pin portion 110 formed on the upper surface 101 of the display panel 100, the position of the flexible circuit board FPCB in the X and Y directions can be corrected. The coordinates of the second left and right alignment marks 221 of the flexible circuit board FPCB in the X and Y directions can be corrected.

[0151] seventh, Figure 9 Step S170 may include bonding the flexible circuit board (FPCB) to the display panel 100 .

[0152] refer to Figure 16 , may include aligning the flexible circuit board FPCB to the alignment position based on the alignment position of the display panel 100, and as Figure 17 As shown, the flexible circuit board FPCB is moved forward to bond the flexible circuit board FPCB to the display panel 100. Here, this step may be a pre-bonding step.

[0153] refer to Figure 17 , the flexible circuit board FPCB may be bonded to the upper surface 101 of the display panel 100 , and the second pin portion 210 of the flexible circuit board FPCB may be joined to the first pin portion 110 formed on the upper surface 101 of the display panel 100 .

[0154] Finally, if Figure 18 As shown, as the first lead portion 110 and the second lead portion 210 are correspondingly joined, the first center alignment mark 120 and the second center alignment mark 220 can be matched with each other and then overlapped, and the first left-right alignment mark 121 and the second left-right alignment mark 221 can be matched with each other and then overlapped. In this way, when the first center alignment mark 120 and the second center alignment mark 220 overlap and the centers of the first lead portion 110 and the second lead portion 210 are aligned, the first lead portion 110 and the second lead portion 210 can be precisely joined.

[0155] eighth, Figure 9 Step S180 may include bonding the flexible circuit board FPCB to the display panel 100.

[0156] After the flexible circuit board FPCB is pre-bonded to the display panel 100 in the seventh step, main bonding may be performed in the next step.

[0157] When the pre-bonded flexible circuit board (FPCB) is subjected to main bonding, the main bonding is performed by thermo-compression of the flexible circuit board (FPCB), which can also be called main compression. The main bonding can be performed using a heating tool called a hot bar.

[0158] In all steps, a series of processes of photographing, calculating coordinates, correcting, and moving the flexible circuit board FPCB and the display panel 100 are controlled by a control unit (not shown), and the photographing order, mark recognition order, coordinate calculation, and correction steps are not limited to the states shown in the accompanying drawings.

[0159] As described above, according to the method of manufacturing the display device 1 according to an embodiment, attachment deviation can be improved in the OLB process, and the display panel 100 and the flexible circuit board FPCB can be accurately aligned and bonded, thereby preventing bonding position errors and poor contact.

[0160] Furthermore, since the center of the first lead portion 110 and the center of the second lead portion 210 can be precisely aligned with each other during bonding, a fine pitch can be achieved in the center regions of the first lead portion 110 and the second lead portion 210. The fine pitch in the center regions of the first lead portion 110 and the second lead portion 210 can prevent bonding position errors and poor contact.

[0161] The above description focuses on the embodiments of the present invention, but this is merely an example and does not limit the present invention. A person skilled in the art will understand that various modifications and applications not illustrated above can be made without departing from the essential characteristics of the embodiments of the present invention. For example, the various components specifically presented in the embodiments of the present invention can be implemented in a modified manner. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the present invention as defined in the appended claims.

Claims

1. A display device, characterized in that: include: A display panel including a display area and a non-display area; a circuit component located in the non-display area of ​​the display panel; a first alignment mark portion, located on the display panel; and a second alignment mark portion, located on the circuit component corresponding to the first alignment mark portion; The first alignment mark portion includes a first center alignment mark and first left and right alignment marks spaced apart and located on both sides of the first center alignment mark. The second alignment mark portion includes a second center alignment mark corresponding to the first center alignment mark and second left and right alignment marks corresponding to the first left and right alignment marks respectively.

2. The display device according to claim 1, wherein The first center alignment mark is provided at the center of the first alignment mark portion, and The second center alignment mark is provided at the center of the second alignment mark portion.

3. The display device according to claim 1, wherein A planar shape of the first center alignment mark is the same as a planar shape of the second center alignment mark.

4. The display device according to claim 1, wherein A planar shape of the first left-right alignment mark is the same as a planar shape of the second left-right alignment mark.

5. The display device according to claim 1, wherein The planar shape of the first center alignment mark is different from the planar shape of the first left-right alignment marks, and A planar shape of the second center alignment mark is different from a planar shape of the second left-right alignment mark.

6. The display device according to claim 1, wherein The display panel includes a first pin portion, wherein the first pin portion includes a plurality of first pins, and The first lead portion is located between the first left and right alignment marks, and the first center alignment mark is located at the center of the first lead portion.

7. The display device according to claim 6, wherein The circuit component includes a second pin portion, wherein the second pin portion includes a plurality of second pins, and The second lead portion is located between the second left-right alignment marks, and the second center alignment mark is located at the center of the second lead portion.

8. The display device according to claim 7, wherein The size of the first center alignment mark is smaller than or equal to the size of the first pin, and The size of the second center alignment mark is smaller than or equal to the size of the second pin.

9. The display device according to claim 7, wherein The size of the first left-right alignment mark is larger than the size of the first pin, and The size of the second left-right alignment mark is larger than that of the second pin.

10. The display device according to claim 7, wherein: The number of the first pins disposed between the first center alignment mark and a first left alignment mark of the first left-right alignment mark is the same as the number of the first pins disposed between the first center alignment mark and a first right alignment mark of the first left-right alignment mark.

11. The display device according to claim 7, wherein A distance between the first center alignment mark and the first lead adjacent to the first center alignment mark is smaller than a distance between the first left-right alignment mark and the first lead adjacent to the first left-right alignment mark.

12. The display device according to claim 7, wherein A distance between the first center alignment mark and the first lead adjacent to the first center alignment mark is smaller than a distance between the first lead portions disposed at an edge of the first lead portion centered around the first center alignment mark.

13. The display device according to claim 7, wherein: The first pin portion is provided on the display panel with a certain interval and at least one pin portion is provided. The circuit component is provided in such a manner that at least one or more components are provided corresponding to the first pin portion, and The second pin portion of the circuit component is joined to the first pin portion of the display panel.

14. The display device according to claim 1, wherein The first alignment mark portion is formed on a first surface of the display panel that contacts a first surface of the circuit component, and The second alignment mark portion is formed on a second surface of the circuit component which is an opposite surface of the first surface of the circuit component.

15. The display device according to claim 14, wherein: The first and second alignment mark portions are photographed by a camera positioned to be spaced apart from a second surface of the display panel, which is an opposite surface to the first surface, and the first surface of the circuit component.

16. The display device according to claim 1, wherein The circuit component includes a flexible circuit board or a printed circuit film.

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