Bluetooth intelligent voice interaction chip and application circuit

Abstract

The utility model discloses a Bluetooth intelligent voice interaction chip and an application circuit, and relates to the technical field of voice recognition, the Bluetooth intelligent voice interaction chip comprises a substrate, an MCU-SOC main control bare chip and a storage bare chip, the MCU-SOC main control bare chip and the storage bare chip are arranged on the substrate, the substrate, the MCU-SOC main control bare chip and the storage bare chip are packaged to form a packaging body, and the packaging body is provided with a Bluetooth module. The storage bare chip is connected with the MCU-SOC main control bare chip; the MCU-SOC master control bare chip supplies power to the storage bare chip, and data interaction is carried out between the storage bare chip and the MCU-SOC master control bare chip through an SPI (Serial Peripheral Interface); the MCU-SOC main control bare chip is at least used for Bluetooth communication and voice recognition; and a plurality of pins connected with the MCU-SOC master control bare chip are arranged on the packaging body. The utility model aims to solve the problem that a plurality of functional modules are integrated on the same circuit board, so that the whole volume of the existing voice recognition equipment is large and the existing voice recognition equipment cannot be used for miniaturized equipment or highly integrated equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of voice recognition, and in particular to a Bluetooth intelligent voice interaction chip and an application circuit. Background Art

[0002] A wireless voice recognition device is a device that can both conduct wireless communication and convert the acquired sound into corresponding electrical signals. Wireless voice recognition devices can be used on Bluetooth headsets. When users wear wireless headsets, they can use voice commands to answer or make calls, adjust the volume, switch songs, etc.; they can also be used in smart homes. Users can use voice commands to control smart home devices, such as adjusting the air conditioning temperature, turning on and off lights, playing music, etc.

[0003] Existing wireless voice recognition devices typically include a main control module, a voice recognition module, a storage module or amplifier module, and a communication module. These multiple functional modules are integrated onto a single circuit board. While integrating these functional modules onto a circuit board achieves a certain level of integration, the overall size and volume remain relatively large, limiting the miniaturization and portability of voice recognition devices. This makes them unsuitable for applications where space is limited or where a high degree of integration is required, such as wearable devices and smart home control systems. Furthermore, integrating multiple functional modules onto a circuit board can introduce numerous interfaces and connection lines, increasing signal transmission complexity and potential interference, potentially degrading the performance of the voice recognition device. Furthermore, these complex interfaces and connection lines can reduce device stability and increase failure rates. Utility Model Content

[0004] The main purpose of this utility model is to propose a Bluetooth intelligent voice interaction chip and application circuit, aiming to solve the problem that existing voice recognition devices integrate multiple functional modules on the same circuit board, resulting in a large overall volume and cannot be used for miniaturized devices or highly integrated devices.

[0005] To achieve the above-mentioned purpose, the present invention proposes a Bluetooth intelligent voice interaction chip, comprising a substrate and an MCU-SOC main control die and a storage die arranged on the substrate;

[0006] The substrate, the MCU-SOC main control die and the memory die are packaged to form a package body;

[0007] The storage die is connected to the MCU-SOC master die; the MCU-SOC master die supplies power to the storage die, and the storage die and the MCU-SOC master die exchange data via an SPI interface;

[0008] The MCU-SOC main control chip is used for at least Bluetooth communication and voice recognition;

[0009] The package body is provided with a plurality of pins connected to the MCU-SOC main control bare chip;

[0010] The plurality of pins provided on the package body include:

[0011] The first microphone pin and the second microphone pin are both used for the MCU-SOC main control die to connect to a microphone.

[0012] In one embodiment, the substrate, the MCU-SOC main control die and the memory die are packaged in a SiP manner to form the package body.

[0013] In one embodiment, the Bluetooth smart voice interaction chip is packaged into a QFN32 package chip through SiP packaging, with a size of 4*4mm.

[0014] In one embodiment, the memory die comprises a NOR-FLASH memory die, and the capacity of the NOR-FLASH memory die is greater than or equal to 1 MB;

[0015] The MCU-SOC main control chip has built-in SRAM and a 32-bit CPU;

[0016] The maximum main frequency of the CPU during operation is greater than or equal to 100 MHz;

[0017] The SRAM capacity is greater than or equal to 80KB.

[0018] In one embodiment, the MCU-SOC main control chip is also used for speech synthesis and playback.

[0019] In one embodiment, the storage die is used to store preset codes and voice recognition resources for reading by the MCU-SOC main control die;

[0020] When the MCU-SOC master control chip is powered on, the MCU-SOC master control chip reads and runs the preset code stored in the storage chip;

[0021] When the MCU-SOC main control chip performs a speech recognition action, the MCU-SOC main control chip reads the speech recognition resources stored in the storage chip.

[0022] In one embodiment, the MCU-SOC master control die further includes:

[0023] The audio processing module, the first microphone pin and the second microphone pin are both connected to the audio processing module, for allowing the audio processing module to access a microphone; the audio processing module is used to process the electrical signal output by the microphone and output corresponding speech recognition text.

[0024] In one embodiment, the MCU-SOC master control die further includes:

[0025] A parameter management module is connected to the plurality of pins provided on the package body, and the parameter management module is connected to the storage die via an SPI interface.

[0026] In one embodiment, the MCU-SOC master control die further includes:

[0027] A power management module connected to the plurality of pins provided on the package body;

[0028] A plurality of pins connected to the power management module include:

[0029] Power-on pin (VCC), analog ground pin (AGND), and reset pin (RESET);

[0030] The power-on pin is used for connecting the power management module to a power supply;

[0031] The ground pin is used for grounding the power management module;

[0032] The reset pin is used to receive a reset signal.

[0033] In one embodiment, the MCU-SOC master control die further includes:

[0034] A Bluetooth RF modulation module connected to a plurality of pins provided on the package body;

[0035] A plurality of pins connected to the Bluetooth RF modulation module include:

[0036] Bluetooth antenna pin and power pin;

[0037] The Bluetooth antenna pin is used for connecting the Bluetooth RF modulation module to the Bluetooth antenna and establishing a communication connection with the user application end through the Bluetooth antenna;

[0038] The power pin is used for connecting the Bluetooth RF modulation module to a power supply.

[0039] In one embodiment, the pins provided on the package further include:

[0040] A crystal oscillator input pin and a crystal oscillator output pin, both of which are connected to the MCU-SOC bare chip, and are used for connecting the MCU-SOC bare chip to the crystal oscillator.

[0041] In one embodiment, only the MCU-SOC master chip among the MCU-SOC master chip and the storage chip can be connected and interacted with the host computer;

[0042] The pins on the package body used for the interaction between the MCU-SOC main control die and the host computer include:

[0043] The signal sending pin and the signal receiving pin are used for communication between the MCU-SOC main control chip and the host computer.

[0044] In one embodiment, the pins on the package body for the interaction between the MCU-SOC main control die and the host computer further include:

[0045] A busy / idle status pin and a wake-up pin, wherein the busy / idle status pin is used for the host computer to obtain the working status of the MCU-SOC main control die, and the wake-up pin is used for the host computer to control the wake-up of the MCU-SOC main control die;

[0046] The first baud rate configuration pin and the second baud rate configuration pin are used for the MCU-SOC main control bare chip to implement initial rate configuration when the MCU-SOC main control bare chip is powered on.

[0047] In one embodiment, the plurality of pins provided on the package body include:

[0048] The external pins are used for connecting the MCU-SOC main control die to the external NOR FLASH. The MCU-SOC main control die is connected to the external NOR FLASH via the external pins.

[0049] In one embodiment, the audio processing module is connected to a plurality of pins provided on the package body;

[0050] A plurality of pins connected to the audio processing module include audio output pins;

[0051] The audio output pin is used for connecting the audio processing module to the power amplifier module;

[0052] The audio processing module supports at least one or more audio decoding of MP3, G729, ADPCM, WAV, and PCM formats;

[0053] The audio processing module supports single-channel / dual-channel 16-bit DAC audio output;

[0054] The pins provided on the package body further include:

[0055] The power amplifier adapts to the POPEN pin and the MUTE pin. The MUTE pin is used to connect the MCU-SOC main control chip to the enable end of the power amplifier module, and the POPEN pin is used to connect the MCU-SOC main control chip to the corresponding control signal.

[0056] The utility model also provides an application circuit, comprising a host computer and any one of the above-mentioned Bluetooth intelligent voice interaction chips;

[0057] The application circuit also includes a microphone and a ninth capacitor. The first microphone pin (MIC) of the Bluetooth smart voice interaction chip is electrically connected to the first end of the ninth capacitor, the second end of the ninth capacitor and the second microphone pin (MIC_BIAS) are both connected to the positive pin of the microphone, and the negative pin of the microphone is connected to the analog ground pin (AGND) of the Bluetooth smart voice interaction chip.

[0058] In one embodiment, the application circuit includes a first resistor, a first capacitor, and a power amplifier module;

[0059] The audio output pin (AO) of the Bluetooth smart voice interaction chip is connected to one end of the first capacitor, the other end of the first capacitor is connected to one end of the first resistor, and the other end of the first resistor is connected to the positive input pin (+IN) of the power amplifier module;

[0060] The application circuit further includes a speaker, and the positive output pin (VO+) and the negative output pin (VO-) of the power amplifier module are both connected to the speaker;

[0061] The application circuit further includes a second resistor and a second capacitor, the negative input pin (-IN) of the power amplifier module is connected to one end of the second resistor, the other end of the second resistor is connected to one end of the second capacitor, and the other end of the second capacitor is grounded;

[0062] The application circuit further includes a third resistor, the analog ground pin (AGND) of the Bluetooth smart voice interaction chip is connected to a first end of the third resistor, and a second end of the third resistor is grounded;

[0063] The application circuit includes: a first inductor and a second inductor;

[0064] The Bluetooth antenna pin (BT_RF) of the Bluetooth smart voice interaction chip is connected to one end of the first inductor, the other end of the first inductor is respectively connected to one end of the second inductor and the Bluetooth antenna, and the other end of the second inductor is grounded;

[0065] The crystal oscillator input pin and the crystal oscillator output pin of the Bluetooth intelligent voice interaction chip are both connected to the crystal oscillator;

[0066] The application circuit further includes: a fourth capacitor and a fifth capacitor;

[0067] The crystal oscillator input pin (XTAL24MI) and the crystal oscillator output pin (XTAL24MO) of the Bluetooth smart voice interaction chip are also connected to one end of the fourth capacitor and one end of the fifth capacitor, respectively, and the other end of the fourth capacitor and the other end of the fifth capacitor are both grounded;

[0068] The application circuit further includes: a sixth capacitor, a power-on pin (VCC) of the Bluetooth smart voice interaction chip is used to connect to a power supply and one end of the sixth capacitor, and the other end of the sixth capacitor is grounded;

[0069] The signal sending pin (TXD) and the signal receiving pin (RXD) of the Bluetooth intelligent voice interaction chip are both connected to the serial port of the host computer;

[0070] The first baud rate configuration pin (BAUD0) and the second baud rate configuration pin (BAUD1) of the Bluetooth smart voice interaction chip are used to receive corresponding signals for the Bluetooth smart voice interaction chip to implement initial rate configuration;

[0071] The wake-up pin (WAKEUP) of the Bluetooth intelligent voice interaction chip is used to receive a corresponding wake-up signal;

[0072] The reset pin (RESET) of the Bluetooth intelligent voice interaction chip is used to receive a corresponding reset signal;

[0073] The Bluetooth indicator light pin (BT_LED) of the Bluetooth intelligent voice interaction chip is used to connect to an LED light;

[0074] The busy / idle status pin (R / B) of the Bluetooth intelligent voice interaction chip is used for the host computer to obtain the working status of the Bluetooth intelligent voice interaction chip.

[0075] In one embodiment, the application circuit includes:

[0076] An external NOR FLASH is connected to an external pin of the Bluetooth intelligent voice interaction chip.

[0077] The technical solution of the present utility model includes a substrate and an MCU-SOC main control chip and a storage chip arranged on the substrate. The MCU-SOC main control chip is used for at least Bluetooth communication and voice recognition, that is, the Bluetooth communication function and the voice recognition function are integrated in the same chip. The first microphone pin and the second microphone pin are both used for the MCU-SOC main control chip to connect to a microphone. The microphone is used to receive the user's voice and convert the sound into a corresponding electrical signal, and output it to the MCU-SOC main control chip. The MCU-SOC main control chip converts the electrical signal into a corresponding voice recognition text, and compares the voice recognition text with multiple function generalization words stored in the storage chip, and outputs a corresponding confidence level. If at least one function generalization word is similar to the voice recognition text, or if they are exactly the same, a corresponding smaller function generalization word is found, and the confidence level reaches a preset confidence level, the MCU-SOC main control chip transmits the voice recognition command corresponding to the function generalization word to the user application end via Bluetooth communication, or transmits it to the host computer through multiple pins set on the package body.

[0078] The present invention includes a substrate and an MCU-SOC main control chip and a storage chip arranged on the substrate. The substrate, the MCU-SOC main control chip and the storage chip are packaged to form a package body. The MCU-SOC main control chip is at least used for Bluetooth communication and voice recognition, that is, the Bluetooth communication function and the voice recognition function are integrated in the same chip. Compared with traditional voice recognition devices that integrate multiple functional modules on the same circuit board, which requires the introduction of more lines or interfaces for connection, the present invention integrates the Bluetooth communication function and the voice recognition function on the same chip. The integrated design eliminates the physical boundaries between the functional modules, greatly shortens the data transmission path between the various functional modules in the chip, thereby reducing the delay and loss of signal transmission and improving the speed of data transmission.

[0079] With such a configuration, in actual application, the Bluetooth intelligent voice interaction chip of the utility model can be applied to Bluetooth headsets. When the user speaks a voice command such as "turn up the volume", the MCU-SOC main control chip compares it with the functional generalization words such as "turn up the volume" stored in the storage chip. Since "turn up the volume" and "turn up the volume" are similar, the MCU-SOC main control chip transmits the language command of "turn up the volume" to the user application end such as a mobile phone through the Bluetooth communication function to increase the volume of the mobile phone. For the user, the user does not need to manually operate the buttons on the Bluetooth headset, but only needs to use simple voice commands. The volume can be controlled by voice commands, which greatly improves the convenience of use. The Bluetooth intelligent voice interaction chip of the utility model can also be used in car computers. When the user says "play the next song", the MCU-SOC main control chip compares it with the functional generalization words stored in the storage chip, such as "next song". Since "play the next song" is similar to "next song", the utility model can transmit the corresponding voice command to the main control chip of the car computer through multiple pins set on the package body, so that the car computer executes the action of playing the next song. For users, there is no need to be distracted by operating the car screen or buttons, which improves driving safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0081] Figure 1 This is a schematic structural diagram of an embodiment of a Bluetooth intelligent voice interaction chip and application circuit provided by the present invention;

[0082] Figure 2 This is a structural diagram of another embodiment of a Bluetooth intelligent voice interaction chip and application circuit provided by the utility model;

[0083] Figure 3 This is a structural diagram of another embodiment of a Bluetooth intelligent voice interaction chip and application circuit provided by the utility model.

[0084] Description of Figure Numbers:

[0085] 10. MCU-SOC main control chip; 11. Audio processing module; 12. Parameter management module; 13. Power management module; 14. Bluetooth RF modulation module; 20. Storage chip; 30. Package; 40. External NOR FLASH; 50. Host computer; 60. Power amplifier module; 70. Speaker; 80. Microphone.

[0086] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0087] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0088] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0089] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in this field can implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0090] A wireless voice recognition device is a device that can both conduct wireless communication and convert the acquired sound into corresponding electrical signals. Wireless voice recognition devices can be used on Bluetooth headsets. When users wear wireless headsets, they can use voice commands to answer or make calls, adjust the volume, switch songs, etc.; they can also be used in smart homes. Users can use voice commands to control smart home devices, such as adjusting the air conditioning temperature, turning on and off lights, playing music, etc.

[0091] Existing wireless voice recognition devices typically include a main control module, a voice recognition module, a storage module or amplifier module, and a communication module. These multiple functional modules are integrated onto a single circuit board. While integrating these functional modules onto a circuit board achieves a certain level of integration, the overall size and volume remain relatively large, limiting the miniaturization and portability of voice recognition devices. This makes them unsuitable for applications where space is limited or where a high degree of integration is required, such as wearable devices and smart home control systems. Furthermore, integrating multiple functional modules onto a circuit board can introduce numerous interfaces and connection lines, increasing signal transmission complexity and potential interference, potentially degrading the performance of the voice recognition device. Furthermore, these complex interfaces and connection lines can reduce device stability and increase failure rates.

[0092] To this end, the utility model proposes a Bluetooth intelligent voice interaction chip and application circuit, aiming to solve the problem that existing voice recognition devices integrate multiple functional modules on the same circuit board, resulting in a large overall size and cannot be used for miniaturized devices or highly integrated devices.

[0093] refer to Figures 1 to 3 In one embodiment of the present invention, a Bluetooth smart voice interaction chip includes a substrate and an MCU-SOC main control die 10 and a storage die 20 provided on the substrate;

[0094] The substrate, the MCU-SOC main control die 10 and the memory die 20 are packaged to form a package body 30;

[0095] The storage die 20 is connected to the MCU-SOC main control die 10; the MCU-SOC main control die 10 supplies power to the storage die 20, and data is exchanged between the storage die 20 and the MCU-SOC main control die 10 via an SPI interface;

[0096] The MCU-SOC main control chip 10 is used for at least Bluetooth communication and voice recognition;

[0097] The package body 30 is provided with a plurality of pins connected to the MCU-SOC main control die 10;

[0098] The package body 30 is provided with a plurality of pins including:

[0099] The first microphone pin (MIC) and the second microphone pin (MIC_BIAS) are both used for the MCU-SOC main control die to connect to the microphone 80 .

[0100] In this embodiment, the substrate, MCU-SOC main control die 10, and memory die 20 are packaged in a SiP manner to form the package body 30. This configuration isolates the internal die, substrate, or other components from the outside world, preventing corrosion from impurities, dust, or other contaminants in the air, thereby protecting the internal portion of the package body 30 from damage, thereby protecting its electrical performance.

[0101] In this embodiment, the Bluetooth smart voice interaction chip is packaged into a QFN32 package chip through SiP packaging, with a size of 4*4mm.

[0102] In this embodiment, the storage die 20 is connected to the MCU-SOC main control die 10 so that the MCU-SOC main control die 10 supplies power to the storage die 20, and the storage die 20 also exchanges data with the MCU-SOC main control die 10 through the SPI interface so that the MCU-SOC main control die 10 reads or writes data stored in the storage die 20, such as configuration parameters. Users can set corresponding configuration parameters such as Bluetooth parameters (Bluetooth name, MAC address, Bluetooth transmission parameters, service UUID, enable UUID) according to actual needs. The Bluetooth configuration instructions (more than 10 Bluetooth configuration instructions, such as UID, broadcast data packet, scan response data packet, etc.) are transmitted to the MCU-SOC main control chip 10 via Bluetooth communication via the host computer or user application end to configure the Bluetooth function in the MCU-SOC main control chip 10, and the Bluetooth parameters are stored in the storage chip 20; when the configuration parameters input into the MCU-SOC main control chip 10 are the same as the configuration parameters stored in the storage chip 20, the MCU-SOC main control chip 10 will not write the configuration parameters into the storage chip 20, thereby extending the life of the storage chip 20.

[0103] In this embodiment, the content stored in the storage die 20 further includes one or more of a speech synthesis resource area, an audio resource area, a speech recognition resource area, a speech wake-up resource area, and a configuration parameter storage area.

[0104] In this embodiment, the voice recognition of the MCU-SOC main control chip 10 includes one or more of general voice recognition, command word voice recognition (SCR, Speech Command Recognition), and voice wake-up (KWS, KeyWord Spotting).

[0105] In this embodiment, the storage die 20 is also used to store the code required for the operation of the MCU-SOC main control die 10. When the Bluetooth smart voice interaction chip is working, the MCU-SOC main control die 10 reads the code stored in the storage die 20 and performs work; the storage die 20 is also used to store resources such as voice recognition resources and voice wake-up resources. When the Bluetooth smart voice interaction chip is working, the MCU-SOC main control die 10 will call the voice recognition resources or voice wake-up resources to analyze the received voice text signal, thereby outputting the corresponding voice command.

[0106] In this embodiment, the user application end includes a mobile phone, a tablet or other Bluetooth terminal, and the host computer includes a main control chip end.

[0107] In this embodiment, the parameter storage area of ​​memory die 20 is sized at 4KB or another 4KB integer. The memory die 20 is configured to divide the parameter storage area into N blocks. Initially, all parameters are stored in block 1. When a parameter change occurs, all parameters are sequentially assembled into the latest version and written to block 2, block 3, and so on, until the Nth block is reached. When another parameter change occurs, memory die 20 erases the entire parameter storage area, assembles all parameters into the latest version, and writes them to block 1. This process is repeated. This configuration can extend the lifespan of memory die 20 by N times.

[0108] In this embodiment, the MCU-SOC main control chip 10 can use an audio decoding module to process the electrical signal (analog signal) received by the microphone 80 and output a corresponding voice text signal (digital signal). The CPU module can be used to process the voice text signal to output a corresponding voice recognition command; Bluetooth / BLE can be used to communicate with the user application end to receive signals from the user application end. The MCU-SOC main control chip 10 can transmit the processing results of the received signal back to the host computer or the user application end.

[0109] In this embodiment, the pins on the package body 30 may include pins for charging the memory die 20 , and the memory die 20 is connected to an external power source through the pins, so that the external power source can independently power the memory die 20 .

[0110] Specifically, the technical solution of the present invention includes a substrate and an MCU-SOC main control die 10 and a storage die arranged on the substrate. The MCU-SOC main control die 10 is used for at least Bluetooth communication and voice recognition, that is, the Bluetooth communication function and the voice recognition function are integrated into the same die. The first microphone pin and the second microphone pin are both used for the MCU-SOC main control die 10 to connect to a microphone 80. The microphone 80 is used to receive the user's voice and convert the sound into a corresponding electrical signal, and output it to the MCU-SOC main control die 10. The MCU-SOC main control die 10 converts the electrical signal into a corresponding voice recognition text, and compares the voice recognition text with multiple function generalization words stored in the storage die 20, and outputs a corresponding confidence level. If at least one function generalization word is similar to the voice recognition text, or is exactly the same as the voice recognition text, a corresponding smaller function generalization word is found, and the confidence level reaches a preset confidence level. The MCU-SOC main control die 10 transmits the voice recognition command corresponding to the function generalization word to the user application end via Bluetooth communication, or transmits it to the host computer via multiple pins set on the package body.

[0111] The present invention includes a substrate and an MCU-SOC main control die 10 and a storage die 20 arranged on the substrate. The substrate, the MCU-SOC main control die 10 and the storage die 20 are packaged to form a package body 30. The MCU-SOC main control die 10 is at least used for Bluetooth communication and voice recognition, that is, the Bluetooth communication function and the voice recognition function are integrated in the same die. Compared with traditional voice recognition devices that integrate multiple functional modules on the same circuit board, which requires the introduction of more lines or interfaces for connection, the present invention integrates the Bluetooth communication function and the voice recognition function in the same die. The integrated design eliminates the physical boundaries between the functional modules, greatly shortens the data transmission path between the various functional modules in the die, thereby reducing the delay and loss of signal transmission and improving the speed of data transmission.

[0112] With such a configuration, in actual application, the Bluetooth intelligent voice interaction chip of the present invention can be applied to Bluetooth headsets. When the user speaks a voice command such as "turn up the volume", the MCU-SOC main control chip 10 compares it with the function generalization words such as "turn up the volume" stored in the storage chip 20. Since "turn up the volume" and "turn up the volume" are similar, the MCU-SOC main control chip 10 transmits the language command of "turn up the volume" to the user application end such as a mobile phone through the Bluetooth communication function to increase the volume of the mobile phone. For the user, the user does not need to manually operate the button on the Bluetooth headset, but only needs to do it through a simple The volume can be controlled by voice commands, which greatly improves the convenience of use. The Bluetooth intelligent voice interaction chip of the present invention can also be used in car computers. When the user says "play the next song", the MCU-SOC main control chip 10 compares it with the functional generalization words stored in the storage chip 20, such as "next song". Since "play the next song" is similar to "next song", the present invention can transmit the corresponding voice command to the main control chip of the car computer through multiple pins set on the package body, so that the car computer executes the action of playing the next song. For users, there is no need to be distracted by operating the car screen or buttons, which improves driving safety.

[0113] In this embodiment, the MCU-SOC main control chip 10 is also used for voice wake-up. When the user says the corresponding wake-up word, the MCU-SOC main control chip 10 compares the voice recognition text corresponding to the wake-up word with the command entry in the storage chip 20. If they are the same, it outputs the control signal corresponding to the command entry, thereby waking up the corresponding device (such as a car computer, Bluetooth speaker or smart home device).

[0114] It is understandable that since the Bluetooth smart voice interaction chip of the present invention can be in an awake state after power-on, if the user speaks the corresponding wake-up voice, the chip is awakened and ready to perform voice recognition actions at any time. After completing the voice recognition action, it will return to the awake state and continue to wait for awakening. Therefore, the Bluetooth smart voice interaction chip of the present invention can quickly perform voice recognition actions after power-on. In addition, the Bluetooth smart voice interaction chip of the present invention can also be in an idle state after power-on. If the user speaks a voice when the chip is in the idle state, the chip cannot perform voice wake-up or voice recognition actions. Only after the chip receives a command from the host computer (for example, pressing a button) can it perform voice wake-up and voice recognition actions, and after completing one, it will return to the idle state, thereby achieving energy saving.

[0115] refer to Figure 2 In one embodiment of the present invention, the memory die 20 includes a NOR-FLASH memory die 20 (non-volatile memory), and the capacity of the NOR-FLASH memory die 20 is greater than or equal to 1MB;

[0116] The MCU-SOC main control die 10 has built-in SRAM (static random access memory) and a 32-bit CPU;

[0117] The maximum main frequency of the CPU during operation is greater than or equal to 100 MHz;

[0118] The SRAM capacity is greater than or equal to 80KB.

[0119] The CPU has a built-in FPU (hard floating point) and / or FFT (Fast Fourier Transform) computing unit to further speed up the data operation of the TTS (Telephone to Speech) algorithm model.

[0120] In this embodiment, compared with other storage bare chips 20, the NOR-FLASH storage bare chip 20 supports the MCU-SOC main control bare chip 10 to directly read the running code stored therein, thereby reducing the startup time and processing delay of the MCU-SOC main control bare chip 10, and the content stored in the NOR-FLASH storage bare chip 20 before power failure will not disappear after power failure, so that the Bluetooth smart voice interaction chip can also protect the previously stored data when the power is cut off (for example, the host computer is powered off, the power fails or the system is restarted), thereby ensuring the stability and reliability of the system to which it is applied, and being able to support Bluetooth smart voice interaction The chip is frequently powered on and off. With this setting, in actual applications, if the user uses a device that uses the Bluetooth smart voice interaction chip of the utility model, since the Bluetooth smart voice interaction chip can save the data stored before power failure when the power is off, when the user does not need the Bluetooth smart voice interaction chip to work, the user can control the device to power off the Bluetooth smart voice interaction chip; when the Bluetooth smart voice interaction chip is needed to work, it will be powered on again. The Bluetooth smart voice interaction chip reads parameters from the NOR-FLASH storage chip, thereby achieving the effect of fast operation and power saving, and there is no need for the host computer to process the logic of parameter preservation.

[0121] In this embodiment, the boot program that the MCU-SOC main control die 10 uses to read data stored in the NOR-FLASH storage die 20 is loaded into the SRAM for execution, allowing the MCU-SOC main control die 10 to quickly access and execute code. During operation of the Bluetooth smart voice interaction chip, the SRAM can serve as a high-speed cache to store frequently accessed data and instructions, thereby improving the response speed of the MCU-SOC main control die 10.

[0122] In this embodiment, in addition to the built-in FPU (hard floating point) and / or FFT (fast Fourier transform) computing unit, the MCU-SOC main control chip 10 also has a built-in MATH (mathematical operation unit) and / or AES (encryption algorithm unit) and / or INERRUPTCONTROLLER (interrupt controller). The CPU implements the voice recognition function and further accelerates the data calculation of voice recognition by calling the FPU and FFT.

[0123] In this embodiment, the MCU-SOC main control die 10 is also used for speech synthesis playback (TTS, Text-to-Speech, text to speech) and audio playback (wav, MP3 format). The MCU-SOC main control chip 10 can receive signals transmitted from the host computer through multiple pins set on the package body 30, or receive signals (text signals) transmitted from the user application end through Bluetooth / BLE. The MCU-SOC main control chip 10 processes the received signals, such as text signals, and converts them into corresponding audio signals. Finally, the audio signals can be transmitted to the corresponding playback device, such as a speaker or a sound system, through the power amplifier module (power amplifier module), so that the playback device plays the corresponding voice. With such a configuration, in actual applications, the Bluetooth smart voice interaction chip of the present invention can be applied in the field of AI. When the user asks a question in a speaking manner, the MCU-SOC main control chip 10 processes the received sound signal, generates a corresponding voice text signal and outputs it to the AI ​​processor. The text signal of the answer formed by the AI ​​processor based on the question is transmitted to the MCU-SOC main control chip 10 via the pins on the package body 30, so that the MCU-SOC main control chip 10 generates a corresponding audio signal and outputs it to the speaker. The user can know the corresponding answer through the playback of the speaker.

[0124] In this embodiment, the MCU-SOC main control chip 10 can sequentially execute voice wake-up + voice synthesis (or audio playback) + voice recognition + voice synthesis (or audio playback) to complete the user's needs. For example, when the user says the wake-up voice of "wavelet wavelet", the MCU-SOC main control chip 10 receives the wake-up command, synthesizes the corresponding voice synthesis text or audio content corresponding to the audio playback, or reads the corresponding audio resource stored in the storage chip 20, such as "in", and transmits the voice synthesis text to the playback device via the pin or Bluetooth communication so that the playback device plays the corresponding voice. After that, if the user says the required voice, such as "turn on the light", the MCU-SOC main control chip 10 will perform the required voice synthesis. After the corresponding control signal is recognized and output, and the voice recognition action is completed after the control signal is output, the corresponding completed voice text can be synthesized through the voice synthesis function, or the corresponding audio resource stored in the storage die 20 can be read, such as "the light is on", thereby reminding the user that the task corresponding to the voice has been completed. It should be noted that this process is the longest path for executing the "turn on the light" task; voice wake-up + voice recognition + voice synthesis (audio playback) can also be performed in sequence, that is, the first voice synthesis process mentioned above is skipped; voice recognition + voice synthesis (audio playback) can also be performed in sequence; voice wake-up + voice recognition (voice playback) can also be performed in sequence, that is, the first voice synthesis and second voice synthesis processes mentioned above are skipped;

[0125] Among them, in the above process, the chip can choose to be in the awake state after power-on, that is, as the voice wake-up action is ready to be performed, the user can wake up the chip by speaking the wake-up voice, so that the chip is ready to perform the voice recognition action at any time, and will return to the awake state after performing the voice recognition action; the chip can also choose to be in the idle state after power-on. If the user speaks a voice when the chip is in the idle state, the chip cannot perform voice wake-up or voice recognition actions. Only after the chip receives a command from the upper computer (such as pressing a button), can it perform voice wake-up and voice recognition actions, and it will return to the idle state after completing once, thereby saving energy.

[0126] Alternatively, only voice wake-up or voice recognition can be performed. For example, the user only needs to say "wavelet wavelet" or "turn on the light." The MCU-SOC main control chip 10 directly outputs the corresponding control signal after receiving the wake-up text or voice recognition text. When the MCU-SOC main control chip 10 only performs voice recognition, the chip is in an idle state after power-on. Users can select different execution processes according to actual needs.

[0127] It should be noted that, in the above processes, after the voice recognition function is executed once, the voice recognition function may be continued within a preset time (eg, 10 seconds).

[0128] refer to Figure 2In one embodiment of the present invention, the MCU-SOC main control die 10 further includes:

[0129] An audio processing module 11, which supports at least one or more audio decoding formats of MP3, G729, ADPCM, WAV, and PCM;

[0130] The first microphone pin and the second microphone pin are both connected to the audio processing module 11, and are used for the audio processing module 11 to connect to the microphone 80;

[0131] The audio processing module 11 supports single-channel / dual-channel 16-bit DAC audio output.

[0132] In this embodiment, the audio processing module 11 is connected to a plurality of pins provided on the package body 30;

[0133] A plurality of pins connected to the audio processing module 11 include audio output pins;

[0134] The audio output pin is used for the audio processing module 11 to connect to the power amplifier module;

[0135] The pins provided on the package body 30 further include:

[0136] The power amplifier adapts to the POPEN pin and the MUTE pin. The MUTE pin is used to connect the MCU-SOC main control chip 10 to the enable end of the power amplifier module, and the POPEN pin is used to connect the MCU-SOC main control chip to the corresponding control signal.

[0137] In this embodiment, the audio processing module 11 is used to process the analog signal input by the microphone 80, and output the corresponding digital signal (speech recognition text), and transmit the speech recognition text to the MCU-SOC main control bare chip 20 for processing by a module for performing speech recognition, such as a microprocessor.

[0138] In this embodiment, the audio processing module 11 is also used to decode and process the audio resources (prompt sound, MP3 or other audio) input by the host computer or stored in the storage die 20, and output the processed audio signal to the speaker through the audio output pin. With such a setting, in actual application, the utility model can be applied to smart home devices, such as in a sweeping machine. When the user says "start sweeping", the MCU-SOC main control die 10 is used to execute the voice recognition module to convert the sound into a corresponding voice recognition command, and output it to the main control chip in the sweeping machine to drive the sweeping machine to start sweeping, and read the audio resources in the storage die, such as "received", "how long to sweep" or "insufficient power, unable to work" and other voice resources, and output them to the audio processing module 11. After processing, the audio processing module 11 outputs the corresponding audio signal to the speaker to prompt the user of the working status of the sweeping machine.

[0139] The audio signal output by the Bluetooth intelligent voice interaction chip of this utility model can be amplified by the power amplifier module and then transmitted to the speaker, thereby realizing the voice playback function. However, the performance of different power amplifier modules is different. For example, the startup time is different. When the startup time of the power amplifier module is slow, the power amplifier module may not be successfully started when the Bluetooth intelligent voice interaction chip has output the audio signal, resulting in incomplete audio playback or loss of part of the audio at the front; and some power amplifier modules may also have the problem of POP noise when power is turned on and POP sound when power is turned off.

[0140] To better match a wider range of amplifier models, allowing users greater freedom in selecting amplifier chips, and to meet the needs of some users for the fastest possible broadcast response time, the Bluetooth smart voice interaction chip provides three amplifier adaptation connection schemes for users to choose from: the POPEN pin and the MUTE pin. Users can adjust the "special amplifier adaptation delay parameters" (removing power-on POP sound delay, removing sentence start dropout delay, and removing sentence end POP sound delay) based on the configuration to achieve the ideal effect of complete broadcast without POP noise while minimizing delay time for fast sound output.

[0141] When the POPEN pin of the power amplifier adapter is connected to a low level and the MUTE pin of the power amplifier adapter is connected to the enable end of the power amplifier module, the Bluetooth smart voice interaction chip defines this as the first power amplifier adaptation solution. When the power amplifier module used by the user has no power-on POP noise but has audio dropout and power-off POP noise problems, this solution can be used to solve them. The user can adjust the delay time by setting the corresponding delay parameters to make the Bluetooth smart voice interaction chip startup time and broadcast sound response time as short as possible, thereby achieving the effect of complete broadcasting without POP noise;

[0142] When the POPEN pin of the power amplifier adapter is connected to a low level and the MUTE pin of the power amplifier adapter is left floating, the Bluetooth smart voice interaction chip defines this as the second power amplifier adaptation solution. When the power amplifier module used by the user has one or more problems of audio dropout, power-on POP noise, and power-off POP noise, this solution can be used to solve them. The user can control the enable end of the power amplifier module through the IO port of the host computer, thereby eliminating POP noise and ensuring the complete broadcast effect;

[0143] When the POPEN pin of the power amplifier adapter is connected to a high level and the MUTE pin of the power amplifier adapter is connected to the enable end of the power amplifier module, the Bluetooth smart voice interaction chip defines this as the third power amplifier adaptation scheme; after internal processing by the Bluetooth smart voice interaction chip, the corresponding connected power amplifier modules all broadcast completely without power-on POP noise or power-off POP sound, but the user cannot set the corresponding delay parameters to adjust the delay time, resulting in the Bluetooth smart voice interaction chip having a long broadcast sound response time problem.

[0144] refer to Figure 2 In one embodiment of the present invention, the MCU-SOC main control die 10 further includes:

[0145] The parameter management module 12 is connected to the plurality of pins provided on the package body 30 , and the parameter management module 12 is connected to the storage die 20 via an SPI interface.

[0146] In this embodiment, the parameter management module 12 is used to manage and operate the data stored in the storage die 20, and to exchange data with the host computer via multiple pins provided on the package body 30. With such a configuration, in actual applications, the user can control the parameter management module 12 through the host computer to read, write, erase, and other operations on the data of the storage die 20 according to actual needs. By managing the storage die 20 through the parameter management module 12, the storage efficiency and reliability of the data can be improved.

[0147] refer to Figure 2 In one embodiment of the present invention, the MCU-SOC main control die 10 further includes:

[0148] a power management module 13 connected to the plurality of pins provided on the package body 30;

[0149] The plurality of pins connected to the power management module 13 include:

[0150] Power-on pin (VCC), analog ground pin (AGND), and reset pin (RESET);

[0151] The power-on pin is used for connecting the power management module 13 to a power supply;

[0152] The ground pin is used for grounding the power management module 13;

[0153] The reset pin is used to receive a reset signal.

[0154] In this embodiment, the power management module 13 is used to power the memory die 20 and other modules within the MCU-SOC main control die 10. The power management module 13 receives a reset signal, such as a high or low level, via the reset pin to re-power the Bluetooth smart voice interaction chip. This configuration allows the Bluetooth smart voice interaction chip to resume normal function by re-powering it if it stops functioning due to a power problem or other reasons.

[0155] refer to Figure 2 In one embodiment of the present invention, the MCU-SOC main control die 10 further includes:

[0156] A Bluetooth RF modulation module 14 connected to a plurality of pins provided on the package body 30;

[0157] The plurality of pins connected to the Bluetooth RF modulation module 14 include:

[0158] Bluetooth antenna pin (BT_RF), power pin (AVDD), Bluetooth indicator pin (BT_LED);

[0159] The Bluetooth antenna pin is used for connecting the Bluetooth RF modulation module 14 to the Bluetooth antenna and establishing a communication connection with the user application end through the Bluetooth antenna;

[0160] The power pin is used for connecting the Bluetooth RF modulation module 14 to a power supply.

[0161] In this embodiment, the Bluetooth RF modulation module 14 communicates with the user application via the Bluetooth antenna. Depending on the signal type, for example, if the signal is a configuration parameter, the CPU in the MCU-SOC main control die 10 can directly process it. If the signal is in a specific format, it is parsed and transmitted back to the host computer. If the signal is not in a specific format, it is transparently transmitted back to the host computer. With this configuration, in actual applications, users can transmit corresponding Bluetooth parameters to the Bluetooth smart voice interaction chip based on their personalized needs through the user application, such as the WeChat applet on their mobile phone, thereby changing the Bluetooth parameters of the Bluetooth smart voice interaction chip, such as the Bluetooth name. The Bluetooth RF modulation module 14 is also connected to an LED light via the Bluetooth indicator pin to indicate the user's operating status of the Bluetooth RF modulation module 14.

[0162] refer to Figure 2In one embodiment of the present invention, the pins provided on the package body further include:

[0163] A crystal oscillator input pin (XTALO) and a crystal oscillator output pin (XTALI), both of which are connected to the MCU-SOC bare chip, and the crystal oscillator input pin and the crystal oscillator output pin are used for connecting the MCU-SOC bare chip to the crystal oscillator.

[0164] In this embodiment, the MCU-SOC main control die 10 obtains a stable frequency signal through the crystal oscillator input pin and the crystal oscillator output pin to ensure the correct operation of the internal circuits and functions.

[0165] It is understandable that the above-mentioned multiple functional modules each have multiple welding points PAD, and the functional modules are connected one by one to the corresponding multiple pins PIN on the package body 30 via the multiple welding points PAD.

[0166] refer to Figure 2 In one embodiment of the present invention, only the MCU-SOC master die 10 and the storage die 20 interact with the host computer;

[0167] The pins on the package 30 for the MCU-SOC main control die 10 to interact with the host computer include:

[0168] The signal transmission pin (TXD) and the signal receiving pin (RXD) are used for the MCU-SOC main control die 10 to communicate with the host computer;

[0169] A busy / idle status pin (R / B) and a wake-up pin (WAKEUP), wherein the busy / idle status pin is used for the host computer to obtain the working status of the MCU-SOC main control die 10, and the wake-up pin is used for the host computer to control the MCU-SOC main control die 10 to wake up;

[0170] The first baud rate configuration pin (BAUD0) and the second baud rate configuration pin (BAUD1) are used for the MCU-SOC main control die 10 to implement initial baud rate configuration when the MCU-SOC main control die 10 is powered on.

[0171] In this embodiment, the signal sending pin and the signal receiving pin are both UART serial communication signal lines, and the MCU-SOC main control bare chip 10 exchanges data with the host computer through UART serial communication.

[0172] In this embodiment, the MCU-SOC main control die 10 also has multiple serial communication interface modules and lead groups, which include: IIC, SPI and USB. IIC, SPI and USB are all connected one by one to multiple corresponding pins on the package body 30 through welding points PAD. With this arrangement, the MCU-SOC main control die 10 can select any communication method according to actual needs to receive signals transmitted from the host computer; among them, UART, IIC, SPI and USB are all peripheral interfaces.

[0173] In this embodiment, when the Bluetooth smart voice interaction chip completes the Bluetooth communication task or voice recognition task, it will immediately enter a sleep state or be powered off, thereby reducing the power consumption of the chip. When the host computer is ready to transmit a signal to the Bluetooth smart voice interaction chip to enable the Bluetooth smart voice interaction chip to perform the task, the host computer transmits a corresponding control signal via the wake-up pin or the host computer sends a wake-up instruction to wake up the Bluetooth smart voice interaction chip, so that the Bluetooth smart voice interaction chip can quickly enter the working state.

[0174] refer to Figure 2 In one embodiment of the present invention, the plurality of pins provided on the package body 30 include:

[0175] The external pins are used for connecting the MCU-SOC main control die 10 to the external NOR FLASH. The MCU-SOC main control die 10 is connected to the external NOR FLASH via the external pins.

[0176] In this embodiment, the external pin can use the SPI bus, and the MCU-SOC main control die 10 is connected to the external NOR FLASH through the SPI bus. The SPI bus includes a clock line (SPI_CLK), a data output line (SPI_D1), a data input line (SPI_D0) and a chip select line (SPI_CS). When the storage space of the storage die 20 is full, the user can connect the external NOR FLASH to the SPI bus so that the MCU-SOC main control die 10 can read, write or erase data on the external NOR FLASH. This setting provides the user with a flexible expansion solution when the space on the storage die 20 is insufficient.

[0177] refer to Figure 3The present invention also proposes an application circuit, including a host computer and the Bluetooth smart voice interaction chip as described above; wherein, in one embodiment of the present invention, the application circuit also includes a microphone 80 and a ninth capacitor C9, the first microphone pin (MIC) of the Bluetooth smart voice interaction chip is electrically connected to the first end of the ninth capacitor C9, the second end of the ninth capacitor C9 and the second microphone pin (MIC_SIAS) are both connected to the positive pin (MIC+) of the microphone 80, and the negative pin (MIC-) of the microphone 80 is connected to the analog ground pin (AGND) of the Bluetooth smart voice interaction chip.

[0178] refer to Figure 3 , in one embodiment of the present utility model, the application circuit includes a first resistor R1, a first capacitor C1 and a power amplifier module;

[0179] The audio output pin (AO) of the Bluetooth smart voice interaction chip is connected to one end of the first capacitor C1, the other end of the first capacitor C1 is connected to one end of the first resistor R1, and the other end of the first resistor R1 is connected to the positive input pin (+IN) of the power amplifier module;

[0180] The application circuit further includes a speaker SPK, and the positive output pin (VO+) and the negative output pin (VO-) of the power amplifier module are both connected to the speaker;

[0181] The application circuit further includes a second resistor R2 and a second capacitor C2, the negative input pin (-IN) of the power amplifier module is connected to one end of the second resistor R2, the other end of the second resistor R2 is connected to one end of the second capacitor C2, and the other end of the second capacitor C2 is grounded;

[0182] An analog ground pin (AGND) of the Bluetooth smart voice interaction chip is grounded via a third resistor;

[0183] The application circuit further includes a third capacitor C3, the VCOM pin of the Bluetooth smart voice interaction chip is connected to one end of the third capacitor C3, and the other end of the third capacitor C3 is grounded via a third resistor;

[0184] The application circuit includes: a first inductor L1 and a second inductor L2;

[0185] The Bluetooth antenna pin (BT_RF) of the Bluetooth smart voice interaction chip is connected to one end of the first inductor L1, the other end of the first inductor L1 is respectively connected to one end of the second inductor L2 and the Bluetooth antenna BT_ANT, and the other end of the second inductor L2 is grounded;

[0186] The crystal oscillator input pin (XTAL24MI) and the crystal oscillator output pin (XTAL24MO) of the Bluetooth intelligent voice interaction chip are both connected to the crystal oscillator;

[0187] The application circuit further includes: a fourth capacitor C4 and a fifth capacitor C5;

[0188] The crystal oscillator input pin (XTAL24MI) and the crystal oscillator output pin (XTAL24MO) of the Bluetooth smart voice interaction chip are also connected to one end of the fourth capacitor C4 and one end of the fifth capacitor C5, respectively, and the other end of the fourth capacitor C4 and the other end of the fifth capacitor C5 are both grounded;

[0189] The application circuit further includes: a sixth capacitor C6, a power-on pin (VCC) of the Bluetooth smart voice interaction chip is used to connect to a power supply DC and one end of the sixth capacitor C6, and the other end of the sixth capacitor C6 is grounded;

[0190] The signal sending pin (TXD) and the signal receiving pin (RXD) of the Bluetooth intelligent voice interaction chip are both connected to the serial port of the host computer;

[0191] The application circuit includes a seventh capacitor C7, the AVDD pin of the Bluetooth smart voice interaction chip is connected to one end of the seventh capacitor C7, and the other end of the seventh capacitor C7 is grounded;

[0192] The application circuit includes an eighth capacitor, the VDDIO pin of the Bluetooth smart voice interaction chip is connected to the first end of the eighth capacitor C8, and the second end of the eighth capacitor C8 is grounded;

[0193] The first baud rate configuration pin (BAUD0) and the second baud rate configuration pin (BAUD1) of the Bluetooth smart voice interaction chip are used to receive corresponding signals for the Bluetooth smart voice interaction chip to implement initial rate configuration;

[0194] The wake-up pin (WAKEUP) of the Bluetooth intelligent voice interaction chip is used to receive a corresponding wake-up signal;

[0195] The reset pin (RESET) of the Bluetooth intelligent voice interaction chip is used to receive a corresponding reset signal;

[0196] The Bluetooth indicator light pin (BT_LED) of the Bluetooth intelligent voice interaction chip is used to connect to an LED light;

[0197] The busy / idle status pin (R / B) of the Bluetooth intelligent voice interaction chip is used for the host computer to obtain the working status of the Bluetooth intelligent voice interaction chip.

[0198] It is worth noting that since the application circuit of the present invention is based on the above-mentioned Bluetooth smart voice interaction chip, the embodiments of the application circuit of the present invention include all technical solutions of all embodiments of the above-mentioned Bluetooth smart voice interaction chip, and the technical effects achieved are also exactly the same, which will not be repeated here.

[0199] In one embodiment of the present invention, the application circuit further includes:

[0200] An external NOR FLASH is connected to the external pin of the Bluetooth smart voice interaction chip. When the Bluetooth smart voice interaction chip determines that the storage capacity of the storage die 20 is lower than the preset storage capacity, the Bluetooth smart voice interaction chip performs pre-storage of audio data and audio data addition and deletion management on the external NOR FLASH.

[0201] In this embodiment, the Bluetooth smart voice interaction chip can be connected to the external NOR FLASH through the SPI bus. The SPI bus includes a clock line, a data output line, a data input line and a chip select line. When the Bluetooth smart voice interaction chip determines that the storage capacity of the storage die 20 is lower than the preset storage capacity, it performs pre-storage of audio data and audio data addition and deletion management on the external NOR FLASH. This setting provides users with a flexible expansion solution when the storage die 20 has insufficient space.

[0202] refer to Figure 3 In one embodiment of the present invention, the power amplifier adapter POPEN pin of the Bluetooth smart voice interaction chip is used to receive the corresponding control signal, and the power amplifier adapter MUTE pin of the Bluetooth smart voice interaction chip is connected to the enable end (CTRL) of the power amplifier module.

[0203] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A Bluetooth intelligent voice interaction chip, characterized in that: It includes a substrate and an MCU-SOC main control die and a storage die arranged on the substrate; The substrate, the MCU-SOC main control die and the memory die are packaged to form a package body; The storage die is connected to the MCU-SOC master die; the MCU-SOC master die supplies power to the storage die, and the storage die and the MCU-SOC master die exchange data via an SPI interface; The MCU-SOC main control chip is used for at least Bluetooth communication and voice recognition; The package body is provided with a plurality of pins connected to the MCU-SOC main control bare chip; The plurality of pins provided on the package body include: The first microphone pin and the second microphone pin are both used for the MCU-SOC main control die to connect to a microphone.

2. The Bluetooth intelligent voice interaction chip according to claim 1, wherein: The substrate, the MCU-SOC main control die and the storage die are packaged in a SiP manner to form the package body.

3. The Bluetooth intelligent voice interaction chip according to claim 2, wherein: The Bluetooth intelligent voice interaction chip is packaged into a QFN32 package chip through SiP packaging, with a size of 4*4mm.

4. The Bluetooth intelligent voice interaction chip according to claim 1, wherein: The storage die includes a NOR-FLASH storage die, and the capacity of the NOR-FLASH storage die is greater than or equal to 1MB; The MCU-SOC main control chip has built-in SRAM and a 32-bit CPU; The maximum main frequency of the CPU during operation is greater than or equal to 100 MHz; The SRAM capacity is greater than or equal to 80KB.

5. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The MCU-SOC main control chip is also used for speech synthesis and playback.

6. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The MCU-SOC master control die also includes: The audio processing module, the first microphone pin and the second microphone pin are both connected to the audio processing module, for allowing the audio processing module to access a microphone; the audio processing module is used to process the electrical signal output by the microphone and output corresponding speech recognition text.

7. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The MCU-SOC master control die also includes: A parameter management module is connected to the plurality of pins provided on the package body, and the parameter management module is connected to the storage die via an SPI interface.

8. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The MCU-SOC master control die also includes: A power management module connected to the plurality of pins provided on the package body; A plurality of pins connected to the power management module include: Power-on pin (VCC), analog ground pin (AGND), and reset pin (RESET); The power-on pin is used for connecting the power management module to a power supply; The ground pin is used for grounding the power management module; The reset pin is used to receive a reset signal.

9. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The MCU-SOC master control die also includes: A Bluetooth RF modulation module connected to a plurality of pins provided on the package body; A plurality of pins connected to the Bluetooth RF modulation module include: Bluetooth antenna pin and power pin; The Bluetooth antenna pin is used for connecting the Bluetooth RF modulation module to the Bluetooth antenna and establishing a communication connection with the user application end through the Bluetooth antenna; The power pin is used for connecting the Bluetooth RF modulation module to a power supply.

10. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The pins provided on the package body further include: A crystal oscillator input pin and a crystal oscillator output pin, both of which are connected to the MCU-SOC bare chip, and are used for connecting the MCU-SOC bare chip to the crystal oscillator.

11. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: Of the MCU-SOC master chip and the storage chip, only the MCU-SOC master chip can be connected and interacted with the host computer; The pins on the package body used for the interaction between the MCU-SOC main control die and the host computer include: The signal sending pin and the signal receiving pin are used for communication between the MCU-SOC main control chip and the host computer.

12. The Bluetooth intelligent voice interaction chip according to claim 11, wherein: The pins on the package body for the interaction between the MCU-SOC main control die and the host computer also include: A busy / idle status pin and a wake-up pin, wherein the busy / idle status pin is used for the host computer to obtain the working status of the MCU-SOC main control die, and the wake-up pin is used for the host computer to control the wake-up of the MCU-SOC main control die; The first baud rate configuration pin and the second baud rate configuration pin are used for the MCU-SOC main control bare chip to implement initial rate configuration when the chip is powered on.

13. The Bluetooth intelligent voice interaction chip according to any one of claims 1 to 4, characterized in that: The plurality of pins provided on the package body include: The external pins are used for connecting the MCU-SOC main control die to the external NOR FLASH. The MCU-SOC main control die is connected to the external NOR FLASH via the external pins.

14. The Bluetooth intelligent voice interaction chip according to claim 6, wherein: The audio processing module is connected to a plurality of pins provided on the package body; A plurality of pins connected to the audio processing module include audio output pins; The audio output pin is used for connecting the audio processing module to the power amplifier module; The audio processing module supports at least one or more audio decoding of MP3, G729, ADPCM, WAV, and PCM formats; The audio processing module supports single-channel / dual-channel 16-bit DAC audio output; The pins provided on the package body further include: The power amplifier adapts to the POPEN pin and the MUTE pin. The MUTE pin is used to connect the MCU-SOC main control chip to the enable end of the power amplifier module, and the POPEN pin is used to connect the MCU-SOC main control chip to the corresponding control signal.

15. An application circuit, characterized in that: It comprises a host computer and a Bluetooth intelligent voice interaction chip according to any one of claims 1 to 14; The application circuit also includes a microphone and a ninth capacitor. The first microphone pin (MIC) of the Bluetooth smart voice interaction chip is electrically connected to the first end of the ninth capacitor, the second end of the ninth capacitor and the second microphone pin (MIC_BIAS) are both connected to the positive pin of the microphone, and the negative pin of the microphone is connected to the analog ground pin (AGND) of the Bluetooth smart voice interaction chip.

16. The application circuit according to claim 15, wherein: The application circuit further includes: A first resistor, a first capacitor and a power amplifier module; The audio output pin (AO) of the Bluetooth smart voice interaction chip is connected to one end of the first capacitor, the other end of the first capacitor is connected to one end of the first resistor, and the other end of the first resistor is connected to the positive input pin (+IN) of the power amplifier module; The application circuit further includes a speaker, and the positive output pin (VO+) and the negative output pin (VO-) of the power amplifier module are both connected to the speaker; The application circuit further includes a second resistor and a second capacitor, the negative input pin (-IN) of the power amplifier module is connected to one end of the second resistor, the other end of the second resistor is connected to one end of the second capacitor, and the other end of the second capacitor is grounded; The application circuit further includes a third resistor, the analog ground pin (AGND) of the Bluetooth smart voice interaction chip is connected to a first end of the third resistor, and a second end of the third resistor is grounded; The application circuit includes: a first inductor and a second inductor; The Bluetooth antenna pin (BT_RF) of the Bluetooth smart voice interaction chip is connected to one end of the first inductor, the other end of the first inductor is respectively connected to one end of the second inductor and the Bluetooth antenna, and the other end of the second inductor is grounded; The crystal oscillator input pin and the crystal oscillator output pin of the Bluetooth intelligent voice interaction chip are both connected to the crystal oscillator; The application circuit further includes: a fourth capacitor and a fifth capacitor; The crystal oscillator input pin (XTAL24MI) and the crystal oscillator output pin (XTAL24MO) of the Bluetooth smart voice interaction chip are also connected to one end of the fourth capacitor and one end of the fifth capacitor, respectively, and the other end of the fourth capacitor and the other end of the fifth capacitor are both grounded; The application circuit further includes: a sixth capacitor, a power-on pin (VCC) of the Bluetooth smart voice interaction chip is used to connect to a power supply and one end of the sixth capacitor, and the other end of the sixth capacitor is grounded; The signal sending pin (TXD) and the signal receiving pin (RXD) of the Bluetooth intelligent voice interaction chip are both connected to the serial port of the host computer; The first baud rate configuration pin (BAUD0) and the second baud rate configuration pin (BAUD1) of the Bluetooth smart voice interaction chip are used to receive corresponding signals for the Bluetooth smart voice interaction chip to implement initial rate configuration; The wake-up pin (WAKEUP) of the Bluetooth intelligent voice interaction chip is used to receive a corresponding wake-up signal; The reset pin (RESET) of the Bluetooth intelligent voice interaction chip is used to receive a corresponding reset signal; The Bluetooth indicator light pin (BT_LED) of the Bluetooth intelligent voice interaction chip is used to connect to an LED light; The busy / idle status pin (R / B) of the Bluetooth intelligent voice interaction chip is used for the host computer to obtain the working status of the Bluetooth intelligent voice interaction chip.

17. The application circuit according to claim 15, wherein: The application circuit includes: An external NOR FLASH is connected to an external pin of the Bluetooth intelligent voice interaction chip.

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