Inverter assembly and frequency converter

Abstract

The utility model provides an inversion assembly and a frequency converter, the inversion assembly comprises a power device, a heat dissipation piece and an adhesive layer, the power device is adhered to the heat dissipation piece by using the adhesive layer, and meanwhile, the heat conduction and heat transfer effects are realized. One end of the heat dissipation piece is provided with an installation face, and the other end of the heat dissipation piece is a heat dissipation end. One side of the adhesive layer is adhered to the mounting surface, and the other side of the adhesive layer is adhered to the power device, so that the power device is connected to the heat dissipation piece, the heat conduction path of the power device and the heat dissipation piece is simplified, and the heat resistance source is reduced. According to the power device, more power devices can be arranged on the heat dissipation piece under the condition that the power device is not limited by auxiliary media such as a ceramic substrate or an insulating silicon adhesive tape, so that the space utilization rate is improved, and the power density is improved. The power device comprises a body part and a pin part, the body part is firmly adhered to the heat dissipation piece through an adhesive layer, and the pin part is arranged on one side deviating from the heat dissipation piece, so that subsequent electrical connection and signal transmission are facilitated.

Description

Technical Field

[0001] The present application belongs to the technical field of electrical equipment, and more specifically, relates to an inverter component and a frequency converter. Background Art

[0002] In the field of power electronics, inverters are key devices for matching motor speed to load. The power devices within them generate significant heat during operation. If this heat cannot be effectively dissipated, it will directly impact the performance stability and lifespan of the power devices, as well as the reliability of the overall system. Traditionally, to address the heat dissipation requirements of power devices, a widely used installation method has been to fasten the power devices to a heat sink using structural components and screws.

[0003] The need for structural components, screws, ceramic substrates, or insulating silicone cloth not only increases system complexity but also increases the thermal resistance between the power devices and the heat sink, limiting their effective heat dissipation. While effective in ensuring electrical and thermal isolation, ceramic substrates or insulating silicone cloth also occupy valuable space, forcing increased spacing between power devices and directly reducing the inverter's overall power density. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide an inverter assembly and a frequency converter to solve the technical problems of poor heat dissipation and low power density of the power device mounting structure in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this application is:

[0006] Provided is an inverter assembly, comprising a power device, a heat sink, and an adhesive layer, wherein one end of the heat sink has a mounting surface, and the other end of the heat sink is a heat dissipation end; one side of the adhesive layer is bonded to the mounting surface, and the other side of the adhesive layer is bonded to the power device; the power device comprises a body portion and a pin portion, the body portion is bonded to the adhesive layer, and the pin portion is provided on a side facing away from the heat sink.

[0007] As a further improvement of the above technical solution:

[0008] Optionally, the heat sink includes a substrate portion and a fin portion, the mounting surface is located on one side of the substrate portion, the fin portion is provided on the other side of the substrate portion, and the fin portion includes a plurality of heat dissipation fins arranged at intervals from each other.

[0009] Optionally, there are multiple power devices, and the power devices are arranged in an array and spaced apart from each other.

[0010] Optionally, it includes a first power device group and a second power device group, the first power device group and the second power device group are arranged at intervals from each other, the first power device group includes a plurality of first power devices arranged in sequence along a straight line direction, the second power device group includes a plurality of second power devices arranged in sequence along a straight line direction, and the pin portion of the first power device and the pin portion of the second power device are arranged facing each other.

[0011] Optionally, the projections of the power devices on the substrate portion are all within the plane projection range of the substrate portion.

[0012] Optionally, the pin portion is arranged perpendicular to the adhesive layer.

[0013] Optionally, the adhesive layer is an epoxy adhesive layer.

[0014] Optionally, a circuit board is further included, and the pin portion of the power device is electrically connected to the circuit board.

[0015] The present application also provides a frequency converter, comprising a housing and the above-mentioned inverter assembly.

[0016] As a further improvement of the above technical solution:

[0017] Optionally, the housing includes a mounting plate having a mounting through-hole, and the inverter assembly is mounted on the mounting through-hole.

[0018] The beneficial effects of the inverter assembly and the frequency converter provided by this application are:

[0019] The inverter assembly provided in the present application includes a power device, a heat sink, and an adhesive layer. The adhesive layer is used to bond the power device to the heat sink, while also achieving heat conduction and heat transfer. One end of the heat sink has a mounting surface, and the other end of the heat sink is a heat sink. One side of the adhesive layer is bonded to the mounting surface, and the other side of the adhesive layer is bonded to the power device, thereby connecting the power device to the heat sink. This simplifies the heat conduction path between the power device and the heat sink, eliminates the reliance on structural parts and screws in traditional connection structures, simplifies the assembly process, and reduces the source of thermal resistance. In addition, without the restriction of auxiliary media such as ceramic substrates or insulating silicone cloth, more power devices can be arranged on the heat sink, thereby improving space utilization and increasing power density. The power device includes a body and a pin portion, wherein the body portion is firmly bonded to the heat sink by the adhesive layer, and the pin portion is arranged on the side facing away from the heat sink to facilitate subsequent electrical connection and signal transmission.

[0020] The present application also provides a frequency converter, comprising a housing and the inverter assembly described above. The inverter assembly is mounted inside the housing. Since the frequency converter includes the inverter assembly described in the above embodiment, it also has the advantages of the inverter assembly described in the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 A schematic diagram of the three-dimensional structure of the inverter assembly provided in this application;

[0023] Figure 2 A schematic diagram of the three-dimensional structure of the inverter assembly and mounting plate provided in this application;

[0024] Figure 3 Schematic diagram of the decomposed structure of the inverter provided in this application;

[0025] Figure 4 A schematic diagram of the three-dimensional structure of a traditional inverter component.

[0026] Among them, the reference numerals in the figures are:

[0027] 1. Power device; 11. Main body;

[0028] 12. Pin portion; 2. Heat sink;

[0029] 21. Base plate; 22. Fin portion;

[0030] 3. Adhesive layer; 4. Circuit board;

[0031] 5. Housing; 6. Mounting plate;

[0032] 7. Bus capacitor. DETAILED DESCRIPTION

[0033] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0036] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0037] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0038] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of the disclosure of this utility model.

[0039] In the following description, suffixes such as "circuit", "component", "assembly" or "unit" are used only to facilitate the description of the present invention and have no specific meaning. Therefore, they can be used interchangeably.

[0040] The present invention will be further described in detail below through specific implementations in conjunction with the accompanying drawings.

[0041] like Figure 4 As shown, traditional inverter assemblies fasten power devices to heat sinks using structural components and screws. The need for structural components, screws, and materials like ceramic substrates or insulating silicone sheeting not only increases system complexity but also increases the thermal resistance between the power devices and the heat sink, limiting their effective heat dissipation. While effective in ensuring electrical and thermal isolation, ceramic substrates or insulating silicone sheeting also occupy valuable space, forcing increased spacing between power devices and directly reducing the inverter's overall power density.

[0042] like Figure 1 As shown, the present application provides an inverter assembly, which includes a power device 1, a heat sink 2 and an adhesive layer 3. The power device 1 is bonded to the heat sink 2 by the adhesive layer 3, and the heat conduction and heat transfer are achieved at the same time. Specifically, one end of the heat sink 2 has a mounting surface, and the other end of the heat sink 2 is a heat dissipation end. One side of the adhesive layer 3 is bonded to the mounting surface, and the other side of the adhesive layer 3 is bonded to the power device 1, thereby connecting the power device 1 to the heat sink 2, simplifying the heat conduction path between the power device 1 and the heat sink 2, abandoning the reliance on structural parts and screws in the traditional connection structure, simplifying the assembly process, and reducing the source of thermal resistance. In addition, without the restriction of auxiliary media such as ceramic substrates or insulating silicone cloth, the power device 1 can arrange more power devices 1 on the heat sink 2, thereby improving space utilization and increasing power density. The power device 1 includes a body portion 11 and a pin portion 12 , wherein the body portion 11 is firmly bonded to the heat sink 2 via the adhesive layer 3 , and the pin portion 12 is arranged on a side away from the heat sink 2 to facilitate subsequent electrical connection and signal transmission.

[0043] In one embodiment of the present application, the adhesive layer 3 is specifically an epoxy adhesive layer. As a high-performance adhesive material, the primary feature of epoxy adhesive is its excellent bonding stability, which can ensure a lasting and firm connection between the power device 1 and the heat sink 2, effectively resist loosening or falling off caused by external environmental factors such as vibration and temperature changes, and ensure the long-term stable operation of the inverter component. Epoxy adhesive also has good insulation properties and can form a reliable electrical barrier between the power device 1 and the heat sink 2 to prevent current leakage or short circuit phenomena and ensure the electrical safety of the inverter component. In addition, epoxy adhesive also has the characteristic of low thermal resistance. Low thermal resistance means that heat can be conducted more smoothly from the power device 1 to the heat sink 2, and then quickly dissipated to the surrounding environment through the heat sink 2, effectively reducing the operating temperature of the power device and extending its service life.

[0044] In one embodiment of the present application, the thickness of the adhesive layer 3 is in the range of 70 μm to 150 μm. Within this thickness range, the power device 1 can be stably bonded to the heat sink 2 without increasing thermal resistance due to excessive thickness of the adhesive layer 3, thereby preventing effective heat transfer from the power device 1 to the heat sink 2.

[0045] like Figure 1 As shown, in one embodiment of the present application, the heat sink 2 includes a base portion 21 and a fin portion 22. The mounting surface is located on one side of the base portion 21, and the fin portion 22 is provided on the other side of the base portion 21. The fin portion 22 includes a plurality of heat dissipation fins arranged at intervals from each other. These heat dissipation fins can increase the heat exchange area between the heat sink 2 and the external environment, thereby achieving a better heat dissipation effect.

[0046] like Figure 1 As shown, in one embodiment of the present application, there are multiple power devices 1, each of which is arranged in an array. This makes heat distribution more uniform, which is beneficial for heat dissipation by the heat sink 2. It also facilitates the neat arrangement of electrical circuits and reduces unnecessary circuit crossing and interference. It is also necessary to ensure that the power devices 1 are arranged at intervals from each other so that they do not interfere with each other, which also improves the utilization rate of the internal space of the inverter assembly.

[0047] like Figure 1 As shown, in one embodiment of the present application, an inverter assembly includes a first power device group and a second power device group. The first power device group and the second power device group are arranged spaced apart from each other. The first power device group includes a plurality of first power devices arranged sequentially along a straight line, and the second power device group includes a plurality of second power devices arranged sequentially along a straight line. The pins of the first power devices and the pins of the second power devices are arranged facing each other to reduce the distance between the pins of the first power devices and the pins of the second power devices, thereby making the connection contacts on the circuit board more compact and saving space on the circuit board.

[0048] In other embodiments of the present application, the pins of the first power device and the pins of the second power device may be arranged back to back, thereby increasing the distance between the pins of the first power device and the pins of the second power device to avoid short circuit problems caused by too close a distance. The specific arrangement of each pin should be selected based on actual requirements.

[0049] In one embodiment of the present application, the projection of each power device 1 on the substrate portion 21 is within the plane projection range of the substrate portion 21 to ensure that each power device 1 is completely supported on the substrate portion 21 without protruding from the substrate portion 21, thereby preventing the power device 1 from being bumped.

[0050] like Figure 1 As shown, in one embodiment of the present application, the pin portion 12 is arranged perpendicular to the adhesive layer 3 to reduce the contact area between the pin portion 12 and the adhesive layer 3, thereby preventing the heat on the pin portion 12 from burning the adhesive layer 3 and causing a short circuit.

[0051] In one embodiment of the present application, the distance between a power device 1 and an adjacent power device 1 is greater than 4 mm to meet safety requirements such as heat dissipation and insulation.

[0052] In one embodiment of the present application, power device 1 is specifically a silicon carbide power device. Silicon power devices have the characteristics of extremely low turn-off tail current, fast switching speed, low loss, and high temperature resistance. Using silicon power devices in inverter development can increase power density and reduce device size; improve power converter efficiency; increase switching frequency and reduce filter size; ensure reliable operation in high-temperature environments; and facilitate high-voltage and high-power designs.

[0053] like Figure 1 and Figure 3 As shown, in one embodiment of the present application, the inverter assembly further includes a circuit board 4. The pin portion 12 of the power device 1 is electrically connected to the circuit board 4. The circuit board 4 integrates a drive circuit for the silicon carbide power device 41, as well as a power output circuit, to ensure that the busbar inductance of the inverter is minimized. The circuit board 4 is provided with silicon carbide power output conductive copper columns, signal terminals of the drive circuit, etc. In addition, a busbar capacitor 7 is welded on the circuit board 4. The busbar capacitor 7 is an important component in the power system for smoothing voltage, absorbing current, reducing inductance parameters and preventing voltage overcharge. It is often used to compensate for differences in power demand when the power supply frequency changes.

[0054] like Figure 2 and Figure 3As shown, the present application also provides a frequency converter, comprising a housing 5 and the inverter assembly of the above embodiment. The inverter assembly is installed inside the housing 5. Since the frequency converter comprises the inverter assembly of the above embodiment, it also has the advantages of the inverter assembly of the above embodiment.

[0055] like Figure 2 and Figure 3 As shown, in one embodiment of the present application, the housing 5 includes a mounting plate 6, which has a mounting through-hole, and the inverter assembly is mounted on the mounting through-hole. Specifically, the heat sink 2 of the inverter assembly is mounted on the through-hole, with the fin portion 22 of the heat sink 2 facing one side of the mounting plate 6, and the power device 1 facing the other side of the mounting plate 6. Under the physical isolation effect of the mounting plate 6, the heat dissipation end of the inverter assembly and the power device 1 are separated, reducing the impact of heat on the power device 1. In addition, the busbar capacitor 7 on the circuit board 4 also passes through the mounting through-hole on the mounting plate 6 and is arranged on the same side as the fin portion 22 of the heat sink 2, so as to facilitate centralized heat management of the inverter and improve heat dissipation efficiency. Other components that also use the same arrangement in the inverter include but are not limited to rectifier components, inductors and other devices.

[0056] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. An inverter assembly, characterized in that: The invention comprises a power device (1), a heat sink (2) and an adhesive layer (3), wherein one end of the heat sink (2) has a mounting surface, and the other end of the heat sink (2) is a heat dissipation end; one side of the adhesive layer (3) is bonded to the mounting surface, and the other side of the adhesive layer (3) is bonded to the power device (1); the power device (1) comprises a body portion (11) and a pin portion (12), wherein the body portion (11) is bonded to the adhesive layer (3), and the pin portion (12) is provided on a side facing away from the heat sink (2).

2. The inverter assembly according to claim 1, characterized in that: The heat sink (2) comprises a base plate portion (21) and a fin portion (22), the mounting surface is located on one side of the base plate portion (21), the fin portion (22) is located on the other side of the base plate portion (21), and the fin portion (22) comprises a plurality of heat dissipation fins spaced apart from each other.

3. The inverter assembly according to claim 2, characterized in that: There are a plurality of power devices (1), and each of the power devices (1) is arranged in an array and spaced apart from each other.

4. The inverter assembly according to claim 3, characterized in that: It includes a first power device group and a second power device group, the first power device group and the second power device group are arranged at intervals from each other, the first power device group includes a plurality of first power devices arranged in sequence along a straight line direction, the second power device group includes a plurality of second power devices arranged in sequence along a straight line direction, and the pin portion of the first power device and the pin portion of the second power device are arranged facing each other.

5. The inverter assembly according to claim 3, characterized in that: The projections of each power device (1) on the substrate portion (21) are all within the plane projection range of the substrate portion (21).

6. The inverter assembly according to any one of claims 1 to 5, characterized in that: The pin portion (12) is arranged perpendicular to the adhesive layer (3).

7. The inverter assembly according to any one of claims 1 to 5, characterized in that: The adhesive layer (3) is an epoxy adhesive layer.

8. The inverter assembly according to any one of claims 1 to 4, characterized in that: It also includes a circuit board (4), and the pin portion (12) of the power device (1) is electrically connected to the circuit board (4).

9. A frequency converter, characterized in that: It comprises a housing (5) and an inverter assembly according to any one of claims 1 to 8.

10. The frequency converter according to claim 9, characterized in that: The housing (5) comprises a mounting plate (6), the mounting plate (6) having a mounting through hole, and the inverter assembly is mounted on the mounting through hole.

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