Double-sided board structure

Abstract

The utility model discloses a double-sided board structure which comprises a bearing layer, a metal printing layer is arranged on the back face of the bearing layer, a metal etching layer is arranged on the front face of the bearing layer, guide holes are formed in the bearing layer, the guide holes are filled with metal materials, the guide holes are used for connecting the metal printing layer and the metal etching layer, and the metal printing layer is arranged on the bearing layer. The metal printing layer is a circuit structure formed by printing metal copper on the bearing layer, and the metal etching layer is a circuit structure formed by etching copper foil on the bearing layer; on the premise of ensuring that the double-sided board has better electrical property, the manufacturing cost of the double-sided board is reduced, so that the structure is suitable for the design of NFC, antennas and the like which require electrical property, and the application range is wider.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a double-sided board structure. Background Art

[0002] Double-sided boards are copper-clad circuit boards, consisting of a top and bottom layer. Common double-sided boards have an insulating layer in the middle, allowing wiring and soldering on both the top and bottom layers. This greatly simplifies wiring, making them widely adopted. These boards are suitable for complex circuits, offering improved conductivity and routing capabilities, as well as higher component density. However, compared to single-sided boards, double-sided boards are more expensive and complex to produce, resulting in a correspondingly higher cost.

[0003] There are two main methods for producing double-sided boards. One is to use double-sided copper foil material etching subtractive molding, and the other is to use printed metal paste additive molding. The details are as follows:

[0004] like Figure 2 The figure shows a double-sided board made by etching subtractive molding of double-sided copper foil. One or more layers of copper foil are coated on the upper and lower sides of the substrate, and then the unnecessary parts are removed by etching to form a circuit pattern. Guide holes are provided on the substrate to connect the circuits on both sides. This method of making a double-sided board has greater flexibility in circuit design because the etching process can create fine patterns on the copper foil. It is suitable for scenarios requiring complex circuit designs, but the cost is relatively high.

[0005] like Figure 3 As shown, a double-sided board is made using additive molding of printed metal paste. The circuit pattern is formed by directly printing conductive metal (usually copper) on the substrate. The materials commonly used in this process do not contain a separate copper foil layer, but are printed directly on the substrate. In comparison, metal-printed double-sided circuit boards may be subject to certain limitations in circuit design, especially in cases where high precision and complex circuits are required. Since the metal printing process can be performed directly on the substrate, eliminating the additional etching step, the production efficiency may be higher and the production cost is relatively low.

[0006] In summary, it is necessary to design a double-sided board structure that can ensure good electrical performance while reducing costs. Utility Model Content

[0007] The main purpose of this application is to propose a double-sided panel structure, aiming to solve the problem that existing double-sided panels cannot take into account both electrical performance and cost.

[0008] To achieve the above-mentioned purpose, the double-sided board structure proposed in the present application includes: a bearing layer, a metal printing layer is arranged on the back of the bearing layer, a metal etching layer is arranged on the front of the bearing layer, a guide hole is opened on the bearing layer, the guide hole is filled with metal material, and the guide hole is used to connect the metal printing layer and the metal etching layer.

[0009] Optionally, the metal printing layer is a circuit structure formed by printing metal copper on the carrier layer.

[0010] Optionally, the metal etching layer is a circuit structure formed by etching copper foil on the carrier layer.

[0011] Optionally, the bearing layer is a plate-like structure made of PI material.

[0012] Optionally, base material glue is further provided between the front surface of the carrier layer and the metal etching layer.

[0013] Optionally, the metal printing layer and the metal etching layer are both covered with an ink layer on a side away from the supporting layer.

[0014] Optionally, a back adhesive layer is further provided on a side of the metal printing layer away from the supporting layer, and the back adhesive layer is adhered to the corresponding surface of the ink layer.

[0015] Optionally, a hand-tearable adhesive structure is provided between the adhesive layer and the ink layer.

[0016] Optionally, the thickness of the carrier layer is 25 μm, the thickness of the metal printing layer is 18 μm, and the thickness of the metal etching layer is 18 μm.

[0017] Optionally, the thickness of the base adhesive 5 is 13 μm, the thickness of the ink layer 6 is 10 μm-20 μm, and the thickness of the back adhesive layer 7 is 30 μm.

[0018] The technical solution of the present application forms a circuit by etching a copper foil material on one side of the carrier layer, and forms a circuit by metal printing on the other side of the carrier layer, wherein the copper foil etched circuit is more complex than the metal printed circuit, thereby forming a double-sided board with a copper foil etched circuit on the front and a metal printed circuit on the back. Since this structure is a single-sided copper foil etched circuit, its cost is lower than the existing double-sided copper foil etched circuit. In addition, since the complex front circuit is formed by copper foil etching, the back circuit has a shorter line, and the electrical effect of metal printing can be ignored. Therefore, the production cost of the double-sided board can be reduced while ensuring that the double-sided board has better electrical properties, making this structure suitable for designs such as NFC and antennas that require electrical properties, and has a wider range of uses. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the layered structure of the double-sided board structure of this application;

[0021] Figure 2 A schematic diagram of the layered structure of a double-sided board manufactured by etching subtractive molding of double-sided copper foil materials;

[0022] Figure 3 Schematic diagram of the layered structure of a double-sided board manufactured by additive manufacturing using printed metal paste.

[0023] Description of Figure Numbers:

[0024] 1. Carrying layer; 2. Metal printing layer; 3. Metal etching layer; 4. Guide hole; 5. Base material glue; 6. Ink layer; 7. Back glue; 8. Back glue hand-tear structure.

[0025] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0027] It should be noted that when an element is referred to as being “fixed on” or “set on” another component, it can be directly on the other component or indirectly set on the other component; when a component is referred to as being “connected to” another component, it can be directly connected to the other component or indirectly connected to the other component.

[0028] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0029] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0030] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application.

[0031] There are two main methods for producing double-sided boards. One is to use double-sided copper foil material etching subtractive molding, and the other is to use printed metal paste additive molding. The details are as follows:

[0032] like Figure 2 The figure shows a double-sided board made by etching subtractive molding of double-sided copper foil. One or more layers of copper foil are coated on the upper and lower sides of the substrate, and then the unnecessary parts are removed by etching to form a circuit pattern. Guide holes are provided on the substrate to connect the circuits on both sides. This method of making a double-sided board has greater flexibility in circuit design because the etching process can create fine patterns on the copper foil. It is suitable for scenarios requiring complex circuit designs, but the cost is relatively high.

[0033] like Figure 3 As shown, a double-sided board is made using additive molding of printed metal paste. The circuit pattern is formed by directly printing conductive metal (usually copper) on the substrate. The materials commonly used in this process do not contain a separate copper foil layer, but are printed directly on the substrate. In comparison, metal-printed double-sided circuit boards may be subject to certain limitations in circuit design, especially in cases where high precision and complex circuits are required. Since the metal printing process can be performed directly on the substrate, eliminating the additional etching step, the production efficiency may be higher and the production cost is relatively low.

[0034] In summary, it is necessary to design a double-sided board structure that can ensure good electrical performance while reducing costs.

[0035] In view of this, the present application proposes a double-sided board structure, comprising: a carrier layer 1, a metal printing layer 2 is arranged on the back of the carrier layer 1, a metal etching layer 3 is arranged on the front of the carrier layer 1, a guide hole 4 is opened on the carrier layer 1, the guide hole 4 is filled with metal material, and the guide hole 4 is used to connect the metal printing layer 2 and the metal etching layer 3.

[0036] A circuit is formed by etching a copper foil material on one side of the carrier layer, and a circuit is formed by metal printing on the other side of the carrier layer. The copper foil etched circuit is more complex than the metal printed circuit, thereby forming a double-sided board with a copper foil etched circuit on the front and a metal printed circuit on the back. Since this structure is a single-sided copper foil etched circuit, its cost is lower than the existing double-sided copper foil etched circuit. In addition, since the complex front circuit is formed by copper foil etching, the back circuit has a shorter line, and the electrical effect of metal printing on the electrical properties can be ignored, thereby reducing the production cost of the double-sided board while ensuring that the double-sided board has better electrical properties.

[0037] In the examples of this application, refer to Figure 1 The above-mentioned double-sided board structure includes a bearing layer 1. The bearing layer 1 is a plate-shaped structure made of PI material, which has excellent high-temperature stability, electrical insulation, mechanical strength, chemical stability, low friction coefficient and certain flexibility. The bearing layer 1 is used to support and carry the circuit.

[0038] refer to Figure 1 A metal printing layer 2 is provided on the back (top surface) of the carrier layer 1. The metal printing layer 2 is a circuit structure formed by printing a metal copper material on the carrier layer 1. Since the circuit on the back is shorter, the electrical impact of the double-sided board produced by metal printing can be ignored, and the circuit structure can be directly formed on the carrier layer 1 by metal printing. The manufacturing process is relatively simple, the production efficiency is high, and the production cost is low.

[0039] refer to Figure 1 A metal etching layer 3 is provided on the front (bottom) of the carrier layer 1. The metal etching layer 3 is a circuit structure formed by etching copper foil on the carrier layer 1. The circuit of the metal etching layer 3 is more complex than that of the metal printing layer 2. Since the circuit structure on the front is relatively complex, a finer circuit can be formed by etching the copper foil, ensuring that the circuit can ensure that the double-sided board has good electrical properties, while also improving the utilization rate of the copper foil, reducing the waste of copper foil materials, and reducing manufacturing costs.

[0040] refer to Figure 1 A circular guide hole 4 is opened on the carrier layer 1. When printing the metal printing layer 2, the metal material is simultaneously filled into the guide hole 4. The guide hole 4 is used to connect the circuit of the metal printing layer 2 with the circuit of the metal etching layer 3, so that the circuits on both sides of the carrier board form a complete circuit.

[0041] refer to Figure 1 A base material adhesive 5 is also provided between the front side of the carrier layer 1 and the metal etching layer 3. The base material adhesive 5 can ensure the dimensional stability of the double-sided board, make the double-sided board easier to perform die-cutting operations, give the double-sided board better mechanical strength, make the tape easier to remove from the double-sided board, and also can adjust the thickness of the double-sided board.

[0042] refer to Figure 1 The metal printing layer 2 and the metal etching layer 3 are covered with an ink layer 6 on the side away from the carrier layer 1. The ink layer 6 can isolate the circuit from the outside world, prevent the circuit from being damaged during transportation and production, and avoid short circuits caused by conductive foreign objects falling on the circuit, which can play the role of protection and insulation for the circuit.

[0043] refer to Figure 1 A back adhesive layer 7 is also provided on the side of the metal printing layer 2 away from the carrier layer 1. The back adhesive layer 7 is bonded to the surface of the corresponding ink layer 6. The back adhesive layer 7 is used to firmly bond the double-sided board with other materials or components. A back adhesive hand-tear structure 8 is provided between the back adhesive layer 7 and the ink layer 6, which is used to remove the back adhesive layer 7 without damaging the circuit, thereby facilitating the repair of the double-sided board.

[0044] Preferably, the thickness of the above-mentioned bearing layer 1 is 25μm, the thickness of the metal printing layer 2 is 18μm, and the thickness of the metal etching layer 3 is 18μm, so that the double-sided board has a thinner thickness while ensuring electrical properties, making the double-sided board have a wider range of uses. In addition, it helps to improve the heat dissipation performance at the circuit board level. This thickness design takes into account the characteristic limitations of the dielectric layer, ensuring that the circuit board does not exceed the safe temperature during normal operation, thereby protecting the long-term stable operation of the circuit board; the thickness of the base material glue 5 is 13μm, so that the double-sided board has better mechanical strength, the thickness of the ink layer 6 is 10μm-20μm, so that the double-sided board has better conductivity, insulation and reliability, and the thickness of the back glue layer 7 is 30μm, so that the double-sided board has better installation stability and convenience; at the same time, the thickness size of the above structure can save costs while ensuring the use effect.

[0045] The technical solution of the present application forms a circuit by etching a copper foil material on one side of the carrier layer, and forms a circuit by metal printing on the other side of the carrier layer, wherein the copper foil etched circuit is more complex than the metal printed circuit, thereby forming a double-sided board with a copper foil etched circuit on the front and a metal printed circuit on the back. Since this structure is a single-sided copper foil etched circuit, its cost is lower than the existing double-sided copper foil etched circuit. In addition, since the complex front circuit is formed by copper foil etching, the back circuit has a shorter line, and the electrical effect of metal printing can be ignored. Therefore, the production cost of the double-sided board can be reduced while ensuring that the double-sided board has better electrical properties, making this structure suitable for designs such as NFC and antennas that require electrical properties, and has a wider range of uses.

[0046] The above description is merely an optional embodiment of the present application and does not limit the patent scope of the present application. All equivalent structural transformations made using the contents of the present application specification and drawings under the inventive concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A double-sided board structure, characterized in that: include: A carrying layer, a metal printing layer is provided on the back of the carrying layer, a metal etching layer is provided on the front of the carrying layer, a guide hole is provided on the carrying layer, the guide hole is filled with metal material, and the guide hole is used to connect the metal printing layer and the metal etching layer.

2. The double-sided board structure according to claim 1, wherein: The metal printing layer is a circuit structure formed by printing metal copper on the carrier layer.

3. The double-sided board structure according to claim 1, wherein: The metal etching layer is a circuit structure formed by etching copper foil on the carrier layer.

4. The double-sided board structure according to claim 1, wherein: The bearing layer is a plate-like structure made of PI material.

5. The double-sided board structure according to claim 1, wherein: Base material glue is also provided between the front surface of the bearing layer and the metal etching layer.

6. The double-sided board structure according to claim 5, wherein: The metal printing layer and the metal etching layer are both covered with an ink layer on a side away from the supporting layer.

7. The double-sided board structure according to claim 6, wherein: A back adhesive layer is further provided on a side of the metal printing layer away from the supporting layer, and the back adhesive layer is adhered to the corresponding surface of the ink layer.

8. The double-sided board structure according to claim 7, wherein: A back glue hand-tear structure is provided between the back glue layer and the ink layer.

9. The double-sided board structure according to any one of claims 1 to 8, wherein: The thickness of the bearing layer is 25 μm, the thickness of the metal printing layer is 18 μm, and the thickness of the metal etching layer is 18 μm.

10. The double-sided board structure according to claim 7 or 8, wherein: The thickness of the base adhesive (5) is 13 μm, the thickness of the ink layer (6) is 10 μm-20 μm, and the thickness of the back adhesive layer (7) is 30 μm.

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