Adhesive vacuum defoaming machine for semiconductor processing

Abstract

The utility model relates to an adhesive vacuum defoaming machine for semiconductor processing, and relates to the technical field of vacuum defoaming. The control panel is fixedly arranged on the rack and is used for inputting a starting signal; the ultrasonic transducer is fixedly mounted on the sealing cover, extends into the container on the rack, is in signal connection with the signal output end of the control panel and is used for receiving the starting signal and operating; the air extracting pump is fixedly mounted on the sealing cover, is in signal connection with the signal input end of the control panel and is used for receiving the starting signal and operating; the detection module is fixedly mounted on the rack, is in signal connection with the signal output end of the control panel and is used for outputting a stop signal when defoaming of the adhesive is completed; and the buzzer is fixedly mounted on the rack, is in signal connection with the signal output end of the detection module, and is used for receiving the stop signal and sending out a prompt sound. According to the vacuum defoaming machine, the convenience of using the vacuum defoaming machine by an operator can be improved.

Description

Technical Field

[0001] The present application relates to the field of vacuum degassing technology, and in particular to a vacuum degassing machine for adhesives used in semiconductor processing. Background Art

[0002] Vacuum degassing machine is mainly used in dispensing operations of LED lamps, LED epoxy resin, plastic toys, transformer glue filling, resin crafts, AB glue, silicone rubber, etc. Since air can easily enter the colloid during dispensing and produce bubbles, which in turn affects the quality of the colloid, a vacuum degassing machine is needed to degas the bubbles inside the colloid.

[0003] In the prior art, a common vacuum degassing machine for adhesives mainly includes a frame with a sealing cover hinged on the frame, a container for containing a colloid is installed on the frame, the sealing cover covers the top of the container, a stirring mechanism is installed at the bottom of the container, and an air pump is installed on the frame. The air pump consists of an exhaust pipe and an air pump, the air inlet end of the exhaust pipe is connected to the container, and the air outlet end of the exhaust pipe is connected to the outside air, and the air pump is installed on the exhaust pipe.

[0004] When degassing the adhesive, the operator puts the adhesive to be degassed into a container and starts the stirring mechanism and the vacuum pump through the control panel on the frame. The stirring mechanism continuously stirs the adhesive and the vacuum pump extracts the exhausted gas.

[0005] However, common vacuum degassing machines require operators to control the degassing time through a control panel. When the degassing time is reached, the operator needs to open the sealing cover to observe the state of the adhesive to determine whether the adhesive needs to continue to be degassed. This is inconvenient to use and there is room for improvement. Utility Model Content

[0006] In order to improve the convenience for operators to use a degassing machine to degas adhesives, the present application provides a vacuum degassing machine for adhesives used in semiconductor processing.

[0007] The present application provides a semiconductor processing adhesive vacuum degassing machine that adopts the following technical solutions:

[0008] A vacuum degassing machine for adhesives used in semiconductor processing, comprising a frame; and:

[0009] A control panel, fixedly mounted on the frame, for inputting a start signal;

[0010] An ultrasonic transducer is fixedly mounted on the sealing cover, extends into the container on the frame, and is connected to the signal output terminal of the control panel for receiving the start signal and operating;

[0011] An air pump is fixedly mounted on the sealing cover and is connected to the signal input terminal of the control panel for receiving the start signal and operating;

[0012] A detection module, fixedly mounted on the frame and connected to the signal output terminal of the control panel, for outputting a stop signal when degassing of the adhesive is completed;

[0013] A buzzer, fixedly mounted on the rack and connected to the signal output terminal of the detection module, for receiving the stop signal and issuing a prompt sound;

[0014] The signal input ends of the ultrasonic transducer and the air pump are signal-connected to the signal output end of the detection module. The ultrasonic transducer and the air pump stop running upon receiving the stop signal.

[0015] By adopting the above technical solution, when processing the adhesive, the operator puts the adhesive into the container. After the operator seals the container with the sealing cover, the operator inputs a start signal through the control panel; the ultrasonic transducer and the vacuum pump start to operate after receiving the start signal, and the ultrasonic transducer converts the input electrical power into mechanical power (ultrasonic wave) and transmits it to the adhesive in the container, causing the adhesive to vibrate and expel the bubbles in the adhesive. At the same time, the vacuum pump extracts the air in the container to achieve degassing of the adhesive; during the degassing process of the adhesive, the detection module provides real-time feedback on the internal condition of the container. When the adhesive is degassed, the detection module outputs a stop signal, the ultrasonic transducer and the vacuum pump stop running, and the buzzer sounds a prompt to remind the operator that the adhesive is degassed, which can effectively improve the convenience of using the degassing machine.

[0016] Preferably, the detection module includes a connecting pipe, a piston and a position detection unit, wherein the connecting pipe is fixedly mounted on the frame, one end of the connecting pipe is connected to the container, and the other end of the connecting pipe is connected to the atmosphere outside the frame;

[0017] A limiting ring is fixedly installed on the inner wall of the connecting pipe, a circular hole is opened through the middle of the limiting ring, a spring is fixedly installed on the limiting ring, the piston is slidably installed in the connecting pipe, and the bottom of the piston is fixedly connected to the top of the spring;

[0018] The position detection unit is fixedly mounted on the frame and is mounted above the piston. The position detection unit is used to output the stop signal when the piston slides down to a set position.

[0019] By adopting this technical solution, as the air inside the container is gradually expelled and the vacuum level inside the container increases, the piston moves downward under the influence of external atmospheric pressure. When the piston slides down to a set height, the position detection unit determines that bubbles inside the adhesive and the air inside the container have been expelled, effectively detecting the degassing status. By setting a spring, when the operator opens the sealing cover and the air pressure at both ends of the connecting pipe is balanced, the compressed spring extends, causing the piston to return to its original position.

[0020] Preferably, the position detection unit includes:

[0021] an ultrasonic distance measuring sensor, fixedly mounted on the frame, with its sensing end facing the piston and connected to the signal output end of the control panel, for detecting the distance between the ultrasonic distance measuring sensor and the piston and outputting a sensing distance signal;

[0022] The single chip microcomputer is connected to the signal output terminal of the ultrasonic ranging sensor and is used to output the stop signal when the sensing distance is greater than a set value.

[0023] By adopting the above technical solution, the position of the piston can be detected in real time through the ultrasonic ranging sensor, thereby achieving the technical effect of automatically detecting the piston position; the sensing distance can be compared through the single-chip microcomputer. When the piston slides down to the set height, the single-chip microcomputer determines that the adhesive in the container meets the degassing requirements, and can automatically control the vacuum pump and the ultrasonic transducer to stop running, and at the same time control the buzzer to emit a prompt sound to remind the operator that the degassing machine has completed the degassing operation.

[0024] Preferably, a through hole is provided on the frame for exposing the port of the connecting pipe, and one end of the connecting pipe away from the container extends into the through hole;

[0025] A mounting base is fixedly mounted on the frame, a mounting plate is fixedly mounted on the mounting base via a plurality of columns, and the ultrasonic distance measuring sensor is fixedly mounted on the bottom of the mounting plate.

[0026] By adopting the above technical solution, the ultrasonic distance measuring sensor can be installed through the mounting plate.

[0027] Preferably, a dust cover is threadedly connected to the mounting seat, and a plurality of ventilation holes are provided on the dust cover.

[0028] By adopting the above technical solution, the dust cover can ensure that air enters the end of the connecting pipe while reducing the occurrence of external dust entering and accumulating in the connecting pipe.

[0029] In summary, the present application provides a vacuum degassing machine for semiconductor processing adhesives, which has at least one of the following beneficial technical effects:

[0030] 1. When processing the adhesive, the operator puts the adhesive into the container. After the operator seals the container with the sealing cover, the operator inputs a start signal through the control panel; the ultrasonic transducer and the vacuum pump start to operate after receiving the start signal, and the ultrasonic transducer converts the input electrical power into mechanical power (ultrasonic wave) and transmits it to the adhesive in the container, causing the adhesive to vibrate and expel the bubbles in the adhesive. At the same time, the vacuum pump extracts the air in the container to achieve degassing of the adhesive; during the degassing process of the adhesive, the ultrasonic ranging sensor, the piston and the single-chip microcomputer provide real-time feedback on the internal conditions of the container. When the adhesive is degassed, the detection module outputs a stop signal, the ultrasonic transducer and the vacuum pump stop running, and the buzzer sounds a prompt sound to remind the operator that the adhesive degassing is complete, which can effectively improve the convenience of using the degassing machine;

[0031] 2. Through the setting of the spring, when the operator opens the sealing cover and the air pressure at both ends of the connecting pipe is balanced, the compressed spring extends to reset the piston. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of an embodiment of the present application used to illustrate the overall structure of the degassing machine.

[0033] Figure 2 It is a schematic diagram used to illustrate the overall structure of the detection module in an embodiment of the present application.

[0034] Explanation of the accompanying drawings: 1. Frame; 11. Through hole; 12. Mounting seat; 13. Mounting plate; 14. Dust cover; 2. Container; 3. Sealing cover; 31. Ultrasonic transducer; 32. Air pump; 4. Detection module; 41. Connecting pipe; 42. Piston; 43. Ultrasonic ranging sensor; 44. Limiting ring; 45. Spring; 5. Buzzer; 6. Control panel. DETAILED DESCRIPTION

[0035] The following is combined with Figure 1-2 This application is described in further detail.

[0036] Example

[0037] The present application discloses a vacuum degassing machine for adhesives used in semiconductor processing. Figure 1 and Figure 2, which mainly includes a frame 1; and: a control panel 6, fixedly mounted on the frame 1, for inputting a start signal; an ultrasonic transducer 31, fixedly mounted on the sealing cover 3, extending into the container 2 on the frame 1, and signal-connected to the signal output end of the control panel 6, for receiving a start signal and operating; an air pump 32, fixedly mounted on the sealing cover 3, signal-connected to the signal input end of the control panel 6, for receiving a start signal and operating; a detection module 4, fixedly mounted on the frame 1, signal-connected to the signal output end of the control panel 6, for outputting a stop signal when the degassing of the adhesive is completed; a buzzer 5, fixedly mounted on the frame 1, signal-connected to the signal output end of the detection module 4, for receiving a stop signal and issuing a prompt sound; the signal input ends of the ultrasonic transducer 31 and the air pump 32 are signal-connected to the signal output end of the detection module 4, and the ultrasonic transducer 31 and the air pump 32 receive the stop signal and stop operating.

[0038] When processing the adhesive, the operator puts the adhesive into the container 2. After the operator seals the container 2 with the sealing cover 3, the operator inputs a start signal through the control panel 6; the ultrasonic transducer 31 and the vacuum pump 32 start to operate after receiving the start signal. The ultrasonic transducer 31 converts the input electrical power into mechanical power (ultrasonic wave) and transmits it to the adhesive in the container 2, causing the adhesive to vibrate and expel the bubbles in the adhesive. At the same time, the vacuum pump 32 extracts the air in the container 2 to achieve degassing of the adhesive; during the degassing process of the adhesive, the detection module 4 provides real-time feedback on the internal condition of the container 2. When the degassing of the adhesive is completed, the detection module 4 outputs a stop signal, the ultrasonic transducer 31 and the vacuum pump 32 stop running, and the buzzer 5 emits a prompt sound to remind the operator that the degassing of the adhesive is complete, which can effectively improve the convenience of using the degassing machine.

[0039] It should be noted that the ultrasonic transducer 31 used in the embodiment of the present application is a prior art device, and its model is YP-3820-4BZ, which is not limited or elaborated here.

[0040] Reference Figure 1 and Figure 2The detection module 4 includes a connecting pipe 41, a piston 42 and a position detection unit. The connecting pipe 41 is fixedly mounted on the frame 1, one end of the connecting pipe 41 is connected to the container 2, and the other end of the connecting pipe 41 is connected to the atmosphere outside the frame 1; a limit ring 44 is fixedly mounted on the inner wall of the connecting pipe 41, a circular hole is penetrated in the middle of the limit ring 44, a spring 45 is fixedly mounted on the limit ring 44, the piston 42 is slidably mounted in the connecting pipe 41, and the bottom of the piston 42 is fixedly connected to the top of the spring 45; the position detection unit is fixedly mounted on the frame 1, and the position detection unit is mounted above the piston 42, and the position detection unit is used to output a stop signal when the piston 42 slides down to the set position.

[0041] As the air inside container 2 is gradually expelled and the vacuum level within container 2 increases, piston 42 moves downward under the influence of external atmospheric pressure. When piston 42 slides down to a set height, the position detection unit determines that the bubbles inside the adhesive and the air inside container 2 have been expelled, effectively detecting the degassing state. Due to the provision of spring 45, when the operator opens sealing cap 3 and the air pressure at both ends of connecting tube 41 is balanced, the compressed spring 45 extends, causing piston 42 to return to its original position.

[0042] Reference Figure 2 The position detection unit includes: an ultrasonic ranging sensor 43, which is fixedly installed on the frame 1, with the sensing end facing the piston 42, and is connected to the signal output end of the control panel 6 for detecting the distance between the piston 42 and outputting a sensing distance signal; a single chip microcomputer, which is connected to the signal output end of the ultrasonic ranging sensor 43 for outputting a stop signal when the sensing distance is greater than a set value.

[0043] The position of the piston 42 can be detected in real time through the ultrasonic ranging sensor 43, achieving the technical effect of automatically detecting the position of the piston 42; the sensing distance can be compared through the single-chip microcomputer. When the piston 42 slides down to the set height, the single-chip microcomputer determines that the adhesive in the container 2 meets the degassing requirements, and can automatically control the vacuum pump 32 and the ultrasonic transducer 31 to stop running, and at the same time control the buzzer 5 to emit a prompt sound to remind the operator that the degassing machine has completed the degassing operation.

[0044] Reference Figure 2 The frame 1 is provided with a through hole 11 for exposing the end of the connecting pipe 41. The end of the connecting pipe 41 away from the container 2 extends into the through hole 11. A mounting base 12 is fixedly mounted on the frame 1. A mounting plate 13 is fixedly mounted on the mounting base 12 via a plurality of columns. The ultrasonic distance sensor 43 is fixedly mounted on the bottom of the mounting plate 13. The mounting plate 13 allows the ultrasonic distance sensor 43 to be installed.

[0045] Reference Figure 2The mounting base 12 is threadedly connected with a dust cover 14, which has a plurality of air holes. The dust cover 14 can ensure that air enters the end of the connecting pipe 41 while reducing the risk of external dust entering and accumulating in the connecting pipe 41.

[0046] The implementation principle of the adhesive vacuum degassing machine for semiconductor processing in the embodiment of the present application is as follows: when processing the adhesive, the operator puts the adhesive into the container 2. After the operator seals the container 2 with the sealing cover 3, the operator inputs a start signal through the control panel 6; the ultrasonic transducer 31 and the air pump 32 start to operate after receiving the start signal. The ultrasonic transducer 31 converts the input electrical power into mechanical power (ultrasonic wave) and transmits it to the adhesive in the container 2, causing the adhesive to vibrate and expel the bubbles in the adhesive. At the same time, the air pump 32 extracts the air in the container 2 to achieve degassing of the adhesive; during the degassing process of the adhesive, the ultrasonic ranging sensor 43, the piston 42 and the single-chip microcomputer provide real-time feedback on the internal condition of the container 2. When the adhesive is degassed, the detection module 4 outputs a stop signal, the ultrasonic transducer 31 and the air pump 32 stop running, and the buzzer 5 emits a prompt sound to remind the operator that the adhesive degassing is complete, which can effectively improve the convenience of using the degassing machine.

[0047] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A vacuum degassing machine for adhesives used in semiconductor processing, characterized in that: including a frame (1); as well as: A control panel (6) is fixedly mounted on the frame (1) and is used to input a start signal; An ultrasonic transducer (31) is fixedly mounted on the sealing cover (3), extends into the container (2) on the frame (1), and is connected to the signal output terminal of the control panel (6) for receiving the start signal and operating; An air extraction pump (32) is fixedly mounted on the sealing cover (3) and is connected to the signal input terminal of the control panel (6) for receiving the start signal and operating; A detection module (4) is fixedly mounted on the frame (1) and is connected to a signal output terminal of the control panel (6) for outputting a stop signal when degassing of the adhesive is completed; A buzzer (5) is fixedly mounted on the frame (1) and is connected to the signal output terminal of the detection module (4) for receiving the stop signal and emitting a prompt sound; The signal input ends of the ultrasonic transducer (31) and the air pump (32) are signal-connected to the signal output end of the detection module (4); the ultrasonic transducer (31) and the air pump (32) receive the stop signal and stop running.

2. A semiconductor processing adhesive vacuum degassing machine according to claim 1, characterized in that: The detection module (4) comprises a connecting pipe (41), a piston (42) and a position detection unit, wherein the connecting pipe (41) is fixedly mounted on the frame (1), one end of the connecting pipe (41) is in communication with the container (2), and the other end of the connecting pipe (41) is in communication with the atmosphere outside the frame (1); A limiting ring (44) is fixedly installed on the inner wall of the connecting tube (41), a circular hole is opened through the middle of the limiting ring (44), a spring (45) is fixedly installed on the limiting ring (44), the piston (42) is slidably installed in the connecting tube (41), and the bottom of the piston (42) is fixedly connected to the top of the spring (45); The position detection unit is fixedly mounted on the frame (1) and is mounted above the piston (42). The position detection unit is used to output the stop signal when the piston (42) slides down to a set position.

3. A semiconductor processing adhesive vacuum degassing machine according to claim 2, characterized in that: The position detection unit includes: An ultrasonic distance measuring sensor (43) is fixedly mounted on the frame (1), with its sensing end facing the piston (42) and connected to a signal output end of the control panel (6) for detecting the distance between the ultrasonic distance measuring sensor and the piston (42) and outputting a sensing distance signal; The single chip microcomputer is connected to the signal output terminal of the ultrasonic distance measuring sensor (43) and is used to output the stop signal when the sensing distance is greater than a set value.

4. A semiconductor processing adhesive vacuum degassing machine according to claim 3, characterized in that: The frame (1) is provided with a through hole (11) for exposing the port of the connecting pipe (41), and one end of the connecting pipe (41) away from the container (2) extends into the through hole (11); A mounting seat (12) is fixedly mounted on the frame (1), a mounting plate (13) is fixedly mounted on the mounting seat (12) via a plurality of columns, and the ultrasonic distance sensor (43) is fixedly mounted on the bottom of the mounting plate (13).

5. A semiconductor processing adhesive vacuum degassing machine according to claim 4, characterized in that: A dust cover (14) is threadedly connected to the mounting seat (12), and a plurality of air holes are provided on the dust cover (14).

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