Thinning equipment for coarse grinding and fine grinding

Abstract

The utility model discloses coarse and fine grinding thinning equipment which comprises a mounting seat, a storage assembly, a grinding assembly, a cleaning assembly, a positioning unit and a transmission mechanism, and the mounting seat comprises a top plate located at the top of the mounting seat; the storage assembly is arranged on the top plate; the grinding assembly is arranged on the top plate and comprises a fine grinding mechanism, a coarse grinding mechanism, a first chuck located below the coarse grinding mechanism and a second chuck located below the fine grinding mechanism. The cleaning assembly is arranged on the top plate and comprises a first cleaning unit used for cleaning a wafer before grinding, a second cleaning unit used for cleaning the wafer after grinding and a silicon wafer drying unit. The positioning unit is arranged on the top plate; the transmission mechanism is arranged on the top plate and comprises a first manipulator and a second manipulator, the fine grinding mechanism and the coarse grinding mechanism are independently arranged, and different wafers with the same specification can be driven by the first manipulator and the second manipulator to be subjected to coarse grinding and fine grinding at the same time, so that at least two wafers can be subjected to coarse grinding and / or fine grinding at the same time, and the machining efficiency of products is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a rough and fine grinding thinning device. Background Art

[0002] Thinning is a commonly used process in the production and processing of semiconductor wafers. Silicon is one of the manifestations of semiconductor wafers. During the thinning process, corresponding cleaning, drying and other processes are also required to ensure the quality of the thinned silicon.

[0003] The existing wafer thinning process tends to ignore the consumption of grinding wheels, resulting in untimely replacement of grinding wheels, which affects the efficiency of the wafer thinning process. At the same time, the existing wafer thinning equipment can only perform serial wafer flow during the wafer processing process and cannot perform parallel processing, which limits the wafer processing efficiency and prevents further improvement.

[0004] Therefore, how to perform rough grinding and / or fine grinding on at least two wafers simultaneously to improve the processing efficiency of the product is a technical problem that those skilled in the art currently need to solve. Utility Model Content

[0005] The purpose of the utility model is to provide a rough and fine grinding thinning device, which can realize rough grinding and / or fine grinding of at least two wafers at the same time, so as to improve the processing efficiency of the product.

[0006] To achieve the above-mentioned purpose, the present invention provides a rough and fine grinding thinning device, comprising:

[0007] a mounting base, including a top plate located on top of the mounting base;

[0008] A storage component is provided on the top plate and is used to store wafers;

[0009] A grinding assembly is provided on the top plate, comprising a fine grinding mechanism, a coarse grinding mechanism, a first chuck located below the coarse grinding mechanism, and a second chuck located below the fine grinding mechanism;

[0010] A cleaning assembly is provided on the top plate, comprising a first cleaning unit for cleaning wafers before grinding, a second cleaning unit for cleaning wafers after grinding, and a silicon wafer drying unit;

[0011] A positioning unit, provided on the top plate, for positioning the wafer;

[0012] The transmission mechanism is arranged on the top plate and includes a first robot and a second robot. The first robot is used to move the wafer from the storage assembly to the positioning unit, and to transfer the wafer from the silicon wafer drying unit to the storage assembly. The second robot is used to transfer the wafer along the positioning unit, the first cleaning unit, the first chuck, the second chuck, the second cleaning unit, and the silicon wafer drying unit in sequence.

[0013] Preferably, the cleaning assembly further includes a chuck cleaning assembly, and the chuck cleaning assembly includes a brush that can be moved above the first chuck and the second chuck to clean the first chuck and the second chuck.

[0014] Preferably, two detection devices for detecting the thickness of the wafer are also included. The detection devices each include a lifting shaft and a measuring head located at the top of the lifting shaft. The lifting shaft can drive the measuring head downward to contact the corresponding wafer located above the first chuck and / or the second chuck.

[0015] Preferably, the first chuck and the second chuck both include a carrier capable of carrying the wafer, a vacuum component connected to the carrier to adsorb the wafer, a water spray component that sprays cooling water for cooling during the grinding process, and a two-fluid device for cleaning the carrier after the wafer is ground.

[0016] Preferably, the rough grinding mechanism includes a first spindle located above the first chuck, a first sanding disc provided at the bottom of the first spindle for grinding the wafer, and a first lifting assembly capable of driving the first spindle to rise and fall;

[0017] The fine grinding mechanism includes a second main shaft located above the second chuck, a second sanding disc arranged at the bottom of the second main shaft for grinding the wafer, and a second lifting component capable of driving the second main shaft to rise and fall.

[0018] Preferably, the invention further comprises a grinding wheel detection device which is arranged on the mounting seat and is used to detect the consumption of the first sand disc and the second sand disc.

[0019] Preferably, the storage assembly includes a first material box for placing unpolished wafers and a second material box for placing polished wafers. The first material box and the second material box are arranged at intervals, and the first material box and the first cleaning unit are arranged on one side of the first robot, and the second material box and the silicon wafer drying unit are arranged on the other side of the first robot.

[0020] Preferably, the first robot and the second robot each include a connecting base connected to the top plate, a robot arm with one end connected to the connecting base, and a fixing member provided at the other end of the robot arm and capable of fixing the wafer.

[0021] Preferably, the first material box and the second material box are provided with openings for wafer entry and exit, and both openings face the connecting seat of the first robot.

[0022] Preferably, the first robot is further provided with a detector for detecting wafers.

[0023] Compared with the above-mentioned background technology, the thinning equipment for rough and fine grinding provided by the present invention includes a mounting seat, a storage assembly, a grinding assembly, a cleaning assembly, a positioning unit and a transmission mechanism, the mounting seat includes a top plate located on the top of the mounting seat; the storage assembly is arranged on the top plate for storing wafers; the grinding assembly is arranged on the top plate, including a fine grinding mechanism, a rough grinding mechanism, a first chuck located below the rough grinding mechanism and a second chuck located below the fine grinding mechanism; the cleaning assembly is arranged on the top plate, including a first cleaning unit for cleaning the wafer before grinding, a second cleaning unit for cleaning the wafer after grinding, and a silicon wafer drying unit; the positioning unit is arranged on the top plate for positioning the wafer; the transmission mechanism is arranged on the top plate, including a first manipulator and a second manipulator, the first manipulator is used to move the wafer from the storage assembly to the positioning unit, and transfer the wafer from the silicon wafer drying unit to the storage assembly, and the second manipulator is used to transfer the wafer along the positioning unit, the first cleaning unit, the first chuck, the second chuck, the second cleaning unit and the silicon wafer drying unit in sequence.

[0024] Specifically, the first robot transfers the unthinned wafer in the storage assembly to the positioning unit for positioning, and then the second robot transfers the wafer in the positioning unit to the first chuck for rough grinding after cleaning it in the first cleaning unit. After the rough grinding of the wafer is completed, it is transferred to the second chuck for fine grinding. At this time, the first robot and the second robot can repeat the above process, so that while the wafer on the second chuck is being fine-ground, there is a wafer undergoing rough grinding on the first chuck. The finely ground wafer is cleaned by the second cleaning unit under the drive of the second robot and transferred to the silicon wafer drying unit for cleaning and drying, and then returned to the storage assembly under the drive of the first robot. This enables at least two wafers to be rough-ground and / or fine-ground at the same time to improve the processing efficiency of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0026] Figure 1 A schematic structural diagram of a thinning device for rough and fine grinding provided by an embodiment of the present utility model;

[0027] Figure 2 A simplified structural diagram of the rough and fine grinding thinning equipment provided by an embodiment of the present utility model;

[0028] Figure 3 A schematic structural diagram of a grinding assembly provided in an embodiment of the present utility model;

[0029] Figure 4 This is a schematic structural diagram of the first chuck and the second chuck provided in an embodiment of the present utility model.

[0030] in:

[0031] 100-mounting seat;

[0032] 210-first material box, 220-second material box;

[0033] 310-fine grinding mechanism, 311-second main shaft, 320-rough grinding mechanism, 321-first main shaft, 330-first chuck, 340-second chuck;

[0034] 410 - first cleaning unit, 420 - second cleaning unit, 430 - silicon wafer drying unit, 440 - chuck cleaning assembly;

[0035] 500-positioning unit;

[0036] 610-first manipulator, 620-second manipulator;

[0037] 710-Measuring head. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0040] In the description of the present invention, it should be understood that the terms "upper" and "lower" etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the position or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation of the present invention.

[0041] The purpose of the utility model is to provide a rough and fine grinding thinning device, which can realize rough grinding and / or fine grinding of at least two wafers at the same time, so as to improve the processing efficiency of the product.

[0042] See also Figures 1 to 4To achieve the above-mentioned purpose, the present invention provides a thinning device for coarse and fine grinding, including a mounting seat 100, a receiving assembly, a grinding assembly, a cleaning assembly, a positioning unit 500 and a transmission mechanism.

[0043] The mount 100 includes a top plate located on top of the mount 100 .

[0044] The storage assembly is set on the top plate for storing wafers. The top plate is provided with a preset position for installing the storage assembly to ensure that the first robot 610 described below can transfer the unthinned wafers out of the storage assembly and transfer the thinned wafers into the storage assembly.

[0045] The grinding assembly is disposed on the top plate, and includes a fine grinding mechanism 310 , a coarse grinding mechanism 320 , a first chuck 330 located below the coarse grinding mechanism 320 , and a second chuck 340 located below the fine grinding mechanism 310 .

[0046] By independently setting up the first chuck 330 and the second chuck 340, it is possible for the rough grinding mechanism 320 to operate alone to rough grind the wafer located on the first chuck 330, and the fine grinding mechanism 310 to operate alone to fine grind the wafer above the second chuck 340, so as to realize the fine grinding and rough grinding processes of the two wafers at the same time.

[0047] The cleaning assembly is disposed on the top plate, and includes a first cleaning unit 410 for cleaning the wafer before grinding, a second cleaning unit 420 for cleaning the wafer after grinding, and a silicon wafer drying unit 430 .

[0048] The first cleaning unit 410 generates water and air, and the wafer is cleaned by friction through the roller of the cleaning device. After the wafer is ground, it is brushed by the second cleaning unit 420, and then the wafer moves to the silicon wafer drying unit 430 to further clean and dry the surface of the wafer.

[0049] The positioning unit 500 is provided on the top plate and is used to position the wafers. The positioning unit 500 is provided with an edge-finding component so that all wafers transferred to the positioning unit 500 can be rotated to a fixed angle.

[0050] The transmission mechanism is arranged on the top plate and includes a first robot 610 and a second robot 620. The first robot 610 is used to move the wafer from the storage assembly to the positioning unit 500, and to transfer the wafer from the silicon wafer drying unit 430 to the storage assembly. The second robot 620 is used to transfer the wafer along the positioning unit 500, the first cleaning unit 410, the first chuck 330, the second chuck 340, the second cleaning unit 420, and the silicon wafer drying unit 430 in sequence. Through the first cleaning unit 410, the second cleaning unit 420, and the silicon wafer drying unit 430, the pressure on the back-end product cleaning is greatly reduced.

[0051] The first robot 610 transfers the unthinned wafer in the storage assembly to the positioning unit 500 for positioning, and then the second robot 620 transfers the wafer in the positioning unit 500 to the first chuck 330 for rough grinding after cleaning it in the first cleaning unit 410. After the rough grinding of the wafer is completed, it is transferred to the second chuck 340 for fine grinding. At this time, the first robot 610 and the second robot 620 can repeat the above process, so that while the wafer on the second chuck 340 is finely ground, there is a wafer undergoing rough grinding on the first chuck 330. The finely ground wafer is cleaned by the second cleaning unit 420 under the drive of the second robot 620 and moved to the silicon wafer drying unit 430 for cleaning and drying, and then returned to the storage assembly under the drive of the first robot 610. At least two wafers of the same specification can be rough ground and / or fine ground at the same time to improve the processing efficiency of the product.

[0052] In this embodiment, the rough grinding mechanism 320 includes a first spindle 321 located above the first chuck 330, a first sanding disc arranged at the bottom of the first spindle 321 to grind the wafer, and a first lifting assembly capable of driving the first spindle 321 to rise and fall; the fine grinding mechanism 310 includes a second spindle 311 located above the second chuck 340, a second sanding disc arranged at the bottom of the second spindle 311 to grind the wafer, and a second lifting assembly capable of driving the second spindle 311 to rise and fall.

[0053] The first chuck 330 and the second chuck 340 both include a carrier capable of carrying a wafer, a vacuum assembly connected to the carrier to adsorb the wafer, a water spray assembly that sprays cooling water for cooling during the grinding process, and a two-fluid device for cleaning the carrier after the wafer is ground.

[0054] The thinning equipment for rough and fine grinding also includes two detection devices for detecting the thickness of the wafer. One detection device is set corresponding to the first chuck 330, and the other detection device is set corresponding to the second chuck 340. The detection devices both include a lifting shaft and a measuring head 710 located at the top of the lifting shaft. The lifting shaft can drive the measuring head 710 to move downward to contact the corresponding wafer located above the first chuck 330 and / or the second chuck 340.

[0055] The first robot 610 moves the wafer to the positioning unit 500 for positioning, and then moves the cleaned wafer to the carrier of the first chuck 330, and adsorbs the wafer through the vacuum component. At the same time, the first chuck 330 is provided with a rotating shaft that can drive the carrier to rotate, which can adjust the angle of the wafer during the grinding process. After the wafer is adsorbed, the first lifting component drives the first main shaft 321 to descend to the first sand disc to contact the wafer, and the first sand disc is rotated for rough grinding under the drive of the first main shaft 321. At the same time as the first main shaft 321 descends, the lifting shaft drives the measuring head 710 to descend above the first chuck 330 and contact the wafer to detect the product thickness in real time. At the same time, the water spray component will turn on the spray cooling water for cooling during the rough grinding process.

[0056] Among them, the grinding is stopped in time according to the detection result of the contact detection head to complete the rough grinding process, which greatly improves the processing accuracy and speed of the product. It should be noted that the wafer after rough grinding is moved to the carrier of the second chuck 340 under the drive of the second robot 620, and the wafer is adsorbed by the vacuum component. At the same time, the second chuck 340 is provided with a rotating shaft that can drive the carrier to rotate, which can adjust the angle of the wafer during the grinding process. After the wafer is adsorbed, the second lifting component drives the second main shaft 311 to descend to the second sand disc to contact the wafer, and the second sand disc is rotated for rough grinding under the drive of the second main shaft 311. At the same time as the second main shaft 311 descends, the lifting shaft drives the measuring head 710 to descend above the second chuck 340 and contact the wafer to detect the product thickness in real time. At the same time, the water spray component will turn on the spray cooling water for cooling during the fine grinding process.

[0057] The cleaning assembly further includes a chuck cleaning assembly 440 . The chuck cleaning assembly 440 includes a brush that can be moved above the first chuck 330 and the second chuck 340 to clean the first chuck 330 and the second chuck 340 .

[0058] When the wafer leaves the first chuck 330 and / or the second chuck 340, the two-fluid device in the chuck without the wafer begins to swing out water and air to clean the chuck, and then the brush in the chuck cleaning assembly 440 moves to the top of the corresponding chuck to clean the carrier for subsequent wafer placement and grinding processes.

[0059] In addition, after the first sand disc completes a rough grinding, it will move up with the first spindle 321; after the second sand disc completes a fine grinding, it will move up with the second spindle 311. This embodiment also includes a grinding wheel detection device provided on the mounting seat 100 and used to detect the consumption of the first sand disc and the second sand disc. By calculating the wafer thickness difference and the spindle descent height difference, it provides the air cutting distance data for the next processing, and can also promptly inform the operator to replace the grinding wheel in time.

[0060] The storage assembly includes a first material box 210 for placing unpolished wafers and a second material box 220 for placing polished wafers. The first material box 210 and the second material box 220 are arranged at intervals, and the first material box 210 and the first cleaning unit 410 are arranged on one side of the first robot 610, and the second material box 220 and the silicon wafer drying unit 430 are arranged on the other side of the first robot 610, so as to improve the efficiency of the first robot 610 in transferring wafers before polishing and wafers after polishing. The first material box 210 and the second material box 220 are provided with openings for the wafers to enter and exit, and the openings are both facing the connecting seat of the first robot 610, thereby improving the efficiency of the wafers to enter and exit.

[0061] Among them, the first robot 610 and the second robot 620 both include a connecting base connected to the top plate, a robot arm connected to the connecting base at one end, and a fixing part arranged at the other end of the robot arm and capable of fixing the wafer. The fixing part can be a suction cup, which is connected to the vacuum component through the suction cup, so that the suction cup generates a negative pressure environment for the adsorption and transfer of the wafer.

[0062] In addition, the first robot 610 is also provided with a detector for detecting wafers, an identifier for identifying barcodes on the first material box 210 and / or the second material box 220, and an early warning device. When the detector detects that there are no wafers in the first material box 210, and / or that the second material box 220 is full of wafers, the early warning device will emit sound and light to remind the staff to replace the first material box 210 and / or the second material box 220.

[0063] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0064] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0065] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A thinning device for rough and fine grinding, characterized in that: include: A mounting base, comprising a top plate located on top of the mounting base; A storage component, disposed on the top plate, for storing wafers; a grinding assembly, disposed on the top plate, comprising a fine grinding mechanism, a coarse grinding mechanism, a first chuck located below the coarse grinding mechanism, and a second chuck located below the fine grinding mechanism; A cleaning assembly is provided on the top plate, comprising a first cleaning unit for cleaning wafers before grinding, a second cleaning unit for cleaning wafers after grinding, and a silicon wafer drying unit; A positioning unit, provided on the top plate, for positioning the wafer; The transmission mechanism is arranged on the top plate and includes a first robot and a second robot. The first robot is used to move the wafer from the storage assembly to the positioning unit, and to transfer the wafer from the silicon wafer drying unit to the storage assembly. The second robot is used to transfer the wafer along the positioning unit, the first cleaning unit, the first chuck, the second chuck, the second cleaning unit, and the silicon wafer drying unit in sequence.

2. The thinning equipment for rough and fine grinding according to claim 1, characterized in that: The cleaning assembly further includes a chuck cleaning assembly, and the chuck cleaning assembly includes a brush that can be moved above the first chuck and the second chuck to clean the first chuck and the second chuck.

3. The thinning equipment for rough and fine grinding according to claim 1, characterized in that: It also includes two detection devices for detecting the thickness of the wafer, each of which includes a lifting shaft and a measuring head located on the top of the lifting shaft. The lifting shaft can drive the measuring head to move downward to contact the corresponding wafer located above the first chuck and / or the second chuck.

4. The thinning equipment for rough and fine grinding according to claim 1, characterized in that: The first chuck and the second chuck both include a carrier capable of carrying a wafer, a vacuum component connected to the carrier to adsorb the wafer, a water spray component that sprays cooling water for cooling during the grinding process, and a two-fluid device for cleaning the carrier after the wafer is ground.

5. The thinning equipment for rough and fine grinding according to claim 1, characterized in that: The rough grinding mechanism includes a first spindle located above the first chuck, a first sanding disc provided at the bottom of the first spindle for grinding the wafer, and a first lifting assembly capable of driving the first spindle to rise and fall; The fine grinding mechanism includes a second spindle located above the second chuck, a second sanding disc arranged at the bottom of the second spindle for grinding the wafer, and a second lifting assembly capable of driving the second spindle to rise and fall.

6. The thinning equipment for rough and fine grinding according to claim 5, characterized in that: The invention also includes a grinding wheel detection device which is arranged on the mounting seat and is used to detect the consumption of the first sand disc and the second sand disc.

7. The thinning equipment for rough and fine grinding according to claim 1, characterized in that: The storage assembly includes a first material box for placing unpolished wafers and a second material box for placing polished wafers. The first material box and the second material box are arranged at intervals, and the first material box and the first cleaning unit are arranged on one side of the first robot, and the second material box and the silicon wafer drying unit are arranged on the other side of the first robot.

8. The thinning equipment for rough and fine grinding according to claim 7, characterized in that: The first robot and the second robot each include a connection base connected to the top plate, a robot arm with one end connected to the connection base, and a fixing member provided at the other end of the robot arm and capable of fixing a wafer.

9. The thinning equipment for rough and fine grinding according to claim 8, characterized in that: The first material box and the second material box are provided with openings for wafer entry and exit, and the openings are both facing the connecting seat of the first robot.

10. The thinning equipment for rough and fine grinding according to claim 1, characterized in that: The first robot is also provided with a detector for detecting wafers.

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