Electroplating experiment device for ultrathin electrolytic copper foil

Abstract

The electroplating experiment device for the ultrathin electrolytic copper foil comprises a heating liquid storage tank and an electroplating tank, a cathode and an anode are arranged in the electroplating bath, the anode is connected with an anode of a high-frequency rectifier power supply, and the cathode is connected with a cathode of the high-frequency rectifier power supply; a heating liquid storage tank liquid outlet is formed in the bottom of the heating liquid storage tank, the heating liquid storage tank liquid outlet is communicated with a pump liquid inlet of a magnetic circulating pump, a pump liquid outlet of the magnetic circulating pump is communicated with a first branch and a second branch, the other end of the magnetic circulating pump is communicated with a flow meter, and the flow meter is communicated with an electroplating tank liquid inlet; a filtering device is arranged on the first branch, and a flow control valve B is arranged on the second branch; the ultra-thin copper foil preparation device is used for preparing ultra-thin copper foils with the thickness ranging from 3 micrometers to 6 micrometers, the stability of the mass transfer direction and the size of plating liquid is improved by optimizing the device, the reliability of laboratory data can be improved, and the research and development cost of a laboratory can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrolytic copper foil, in particular to an electroplating experimental device for extremely thin electrolytic copper foil. Background Art

[0002] Electrolytic copper foil is a high-purity, highly conductive metal copper foil manufactured through electrochemical deposition technology. It is an indispensable material in the modern electronic information industry, especially in the production of copper clad laminates (CCLs), printed circuit boards (PCBs), and lithium-ion batteries. Due to its core role in the transmission of electronic signals and power, electrolytic copper foil is often likened to the "neural network" of electronic products. With the rapid development of electronic information technology, the demand for highly conductive, thin, and high-precision copper foil is increasing. The electrolytic copper foil experimental device aims to explore and optimize the preparation process of electrolytic copper foil through experimental means, and better provide a solid technical foundation for mass production. In order to ensure the reliability and stability of laboratory research results and effectively guide actual large-scale production, it is particularly critical to configure an electrolytic copper foil experimental device that meets mass production process standards and is used to prepare extremely thin copper foil. Summary of the Invention

[0003] The purpose of this utility model is to provide an electroplating experimental device for ultra-thin electrolytic copper foil, aiming to optimize the experimental device, make the device simple to operate while ensuring stable properties and uniform current distribution, and add a filtering device to absorb and filter impurities and decomposition products of additives in the raw materials, so as to provide reference data for the failure consumption test of additives. This utility model is achieved through the following technical solutions:

[0004] A plating experimental device for ultra-thin electrolytic copper foil comprises a heating reservoir, an electroplating tank, a filtering device and a high-frequency rectifier power supply, wherein the electroplating tank is arranged on the upper part of the heating reservoir; the device is characterized in that a cathode and an anode are provided in the electroplating tank, the anode is connected to the positive pole of the high-frequency rectifier power supply, and the cathode is connected to the negative pole of the high-frequency rectifier power supply; a heating reservoir outlet is provided at the bottom of the heating reservoir, the heating reservoir outlet is connected to the pump inlet of a magnetic circulation pump, the pump outlet of the magnetic circulation pump is connected to both a first branch and a second branch, the other ends of the first branch and the second branch are connected to the flowmeter inlet of a flowmeter, and the flowmeter outlet of the flowmeter is connected to the electroplating tank inlet; a filtering device, a flow control valve A and an exhaust valve are provided on the first branch, and the filtering device is provided between the flow control valve A and the exhaust valve; a flow control valve B is provided on the second branch.

[0005] Preferably, a heating rod and a liquid level gauge are provided in the heating liquid storage tank, a plating liquid buffer tank is provided on the upper side of the heating liquid storage tank, and the heating rod and the liquid level gauge are both provided on the plating liquid buffer tank; a drain port is provided at the bottom of the heating liquid storage tank, a defoaming baffle is provided above the position of the liquid outlet of the heating liquid storage tank, and the defoaming baffle is provided on the side wall of the heating liquid storage tank, and is used to buffer bubbles formed when the plating liquid flows downward from a high position or gas is precipitated during electroplating.

[0006] Preferably, a plating solution buffer tank and two symmetrical groups of overflow plates are provided in the electroplating tank, a jet pipe and an overflow guide port are provided in the plating solution buffer tank, the overflow guide port is connected to the heating liquid storage tank on the lower side, and the overflow guide port is provided at both ends of the jet pipe; the overflow plate is provided on the upper side of the plating solution buffer tank, a concave slide is provided on the overflow plate, an adjustment slide is provided on the concave slide which is slidably provided with the anode, the cathode is provided on the adjustment slide, and the cathode is fixed in the cathode slot at the end of the overflow plate; a threaded hole for fixing the position is also provided on the adjustment slide, the jet pipe is connected to the liquid inlet of the electroplating tank, and a jet port is provided on the jet pipe.

[0007] Preferably, a filter device liquid inlet and a filter device liquid outlet are provided at the bottom of the filter device, the filter device liquid inlet is connected to one end of the flow control valve A, and the other end of the flow control valve A is connected to the pump liquid outlet; the filter device liquid outlet is connected to one end of the exhaust valve, and the other end of the exhaust valve is connected to the flow meter liquid inlet; a filter element is provided inside the filter device, and the filter device liquid inlet is connected to the filter element.

[0008] Preferably, one end of the flow control valve B is connected to the liquid outlet of the pump, and the other end is connected to the liquid inlet of the flow meter.

[0009] Preferably, the anode is configured as an irregular L-shape to avoid short circuit problems caused by too small a distance between the cathode and the anode.

[0010] Preferably, the plating solution buffer tank is arranged at the bottom of the electroplating tank, and the jet pipe is arranged at the lower side of the plating solution buffer tank, which is used to buffer the flow rate difference of each injection port in the jet pipe.

[0011] Preferably, the adjustment slide includes a first adjustment slide, a second adjustment slide, a third adjustment slide and a fourth adjustment slide, the first adjustment slide and the second adjustment slide are arranged on the concave groove of the overflow plate on one side, and the third adjustment slide and the fourth adjustment slide are arranged on the concave groove of the overflow plate on the other side; the first adjustment slide and the third adjustment slide are arranged on the same side of the anode, and the second adjustment slide and the fourth adjustment slide are arranged on the other side of the anode.

[0012] Preferably, the liquid inlet of the filter device is designed to be L-shaped, and the filter element is designed to be a sleeve-type filter element. The filter element is nested on the liquid inlet of the filter device, so that the plating solution can flow into the filter element from the L-shaped liquid inlet of the filter device, thereby increasing the filtration rate of the plating solution.

[0013] Preferably, the thickness of the ultra-thin copper foil prepared by the electroplating experimental device is 3-6 μm.

[0014] Beneficial effects of the utility model:

[0015] 1. The utility model can be used to prepare ultra-thin copper foil with a thickness of 3-6 μm. It is suitable for research and development work in a laboratory environment. It is convenient for exploring and optimizing the production process parameters of ultra-thin copper foil with a thickness of 3-6 μm. It further simulates on-site production equipment and adds a filtering device. The optimization device improves the stability of the mass transfer direction and size of the plating solution. It is conducive to laboratory research on electroplating process parameters and electroplating additive formulas, improves the reliability of laboratory data, and reduces laboratory R&D costs.

[0016] 2. The utility model adjusts the anode position by setting a slide plate inside the electroplating tank, and then fixes it by inserting screws into the threaded holes on the adjustment slide plate, which can effectively prevent the anode from deforming or moving during the rapid mass transfer process. At the same time, the use of the adjustment slide plate can effectively block the horizontal flow and mass transfer of part of the plating solution, ensuring that more plating solution flows vertically, concentrating the mass transfer direction of the plating solution and increasing the mass transfer speed of the plating solution.

[0017] 3. The utility model is provided with an adsorption device, which can not only absorb and filter impurities brought from the raw materials, but also absorb the decomposition products of the additives, thereby increasing the service life of the plating solution. By adding the adsorption device, the consumption simulation test of the additives can be effectively carried out, making the laboratory-use and flat-plate vertical copper foil electroplating small device closer to the production site conditions;

[0018] 4. The utility model sets two branches at the outlet of the magnetic circulation pump, so that the plating solution can be selected for adsorption filtration. And by setting the filter element as a sleeve filter element and the water inlet of the filter device as an L-shaped pipe, it is ensured that more plating solution flows into the middle of the filter element, penetrates through the filter element and flows out, thereby effectively improving the filtration rate of the plating solution.

[0019] 5. The utility model increases the distance between the cathode and anode at the connection point by setting the anode shape to be V-shaped, thereby avoiding short circuit caused by too small a distance between the cathode and anode. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the connection structure of the device of the utility model;

[0021] Figure 2 This is a front cross-sectional view of the heating liquid storage tank of the present invention;

[0022] Figure 3 This is a front cross-sectional view of the electroplating tank of the utility model;

[0023] Figure 4 This is a top sectional view of the electroplating tank of the utility model;

[0024] Figure 5 It is a left side sectional view of the electroplating tank of the utility model;

[0025] Figure 6 This is a front cross-sectional view of the filter device of the present invention;

[0026] Figure 7 This is a top sectional view of the filter device of the present invention.

[0027] In the figure: 1, heating liquid storage tank; 11, heating rod; 12, liquid level gauge; 13, drain port; 14, heating liquid storage tank outlet; 15, defoaming baffle;

[0028] 2. Plating tank; 21. Overflow plate; 22. Adjustment slide; 23. Plating solution buffer tank; 24. Jet pipe; 25. Overflow guide port; 26. Cathode slot; 27. Plating tank inlet; 211. Concave chute; 221. First adjustment slide; 222. Second adjustment slide; 223. Third adjustment slide; 224. Fourth adjustment slide; 225. Threaded hole;

[0029] 3. Magnetic circulation pump; 31. Pump inlet; 32. Pump outlet; 33. First branch; 34. Second branch;

[0030] 4. Filter device; 41. Flow control valve A; 42. Exhaust valve; 43. Flow control valve B; 44. Liquid inlet of filter device; 45. Filter element; 46. Liquid outlet of filter device;

[0031] 5. Flow meter; 51. Flow meter liquid inlet; 52. Flow meter liquid outlet;

[0032] 6. Anode; 7. Cathode; 8. High-frequency rectifier power supply. DETAILED DESCRIPTION

[0033] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0034] Below, the present invention is further described with reference to the accompanying drawings and specific embodiments:

[0035] Example 1:

[0036] like Figure 1 As shown, an electroplating experimental device for ultra-thin electrolytic copper foil includes a heating reservoir 1, an electroplating tank 2, a filtering device 4, and a high-frequency rectifier power supply 8. The electroplating tank 2 is arranged on the upper part of the heating reservoir 1; wherein, a cathode 7 and an anode 6 are arranged in the electroplating tank 2, the anode 6 is connected to the positive electrode of the high-frequency rectifier power supply 8, and the cathode 7 is connected to the negative electrode of the high-frequency rectifier power supply 8; a heating reservoir outlet 14 is arranged at the bottom of the heating reservoir 1, and the heating reservoir outlet 14 is further The first branch 33 is connected to the pump inlet 31 of the magnetic circulation pump 3. The pump outlet 32 ​​of the magnetic circulation pump 3 is further connected to the first branch 33 and the second branch 34. The other ends of the first branch 33 and the second branch 34 are connected to the flow meter inlet 51 of the flow meter 5. The first branch 33 is provided with a filter device 4, a flow control valve A41, and an exhaust valve 42. The filter device 4 is arranged between the flow control valve A41 and the exhaust valve 42. The second branch 34 is provided with a flow control valve B43. Finally, the flow meter outlet 52 of the flow meter 5 is connected to the electroplating tank inlet 27. The thickness of the ultra-thin copper foil prepared by this practical electroplating experimental device is 3-6μm.

[0037] Specifically, such as Figure 2 As shown, a serpentine-shaped heating rod 11 and a liquid level gauge 12 are provided in the heating liquid storage tank 1 of the present invention, wherein a plating liquid buffer tank 23 is provided on the upper side of the heating liquid storage tank 1, a drain port 13 is provided at the bottom thereof, and the heating rod 11 and the liquid level gauge 12 are both provided on the plating liquid buffer tank 23, and a defoaming baffle 15 is further provided above the position of the liquid outlet 14 of the heating liquid storage tank, and the defoaming baffle 15 is provided on the side wall of the heating liquid storage tank 1, for buffering bubbles formed when the plating liquid flows downward from a high position or when gas is precipitated during electroplating.

[0038] Specifically, such as Figures 3 to 5As shown, a plating solution buffer tank 23 and two symmetrical groups of overflow plates 21 are set in the electroplating tank 2, a jet pipe 24 and an overflow guide port 25 are set in the plating solution buffer tank 23, and the overflow guide port 25 is connected to the heating liquid storage tank 1 on the lower side; the overflow guide port 25 is set at both ends of the jet pipe 24, the overflow plate 21 is set on the upper side of the plating solution buffer tank 23, a concave chute 211 is set on the overflow plate 21, an adjusting slide 22 is set on the concave chute 211 and slidably arranged with the concave chute 211, and a threaded hole 225 is also set on the adjusting slide 22 for fixing the position, the jet pipe 24 is connected to the liquid inlet 27 of the electroplating tank, and a jet port is set on the jet pipe 24, the anode 6 is set on the adjusting slide 22, and the cathode 7 is fixed in the cathode slot 26 at the end of the overflow plate 21; further, the adjusting slide 22 includes a first adjusting slide 221 , a second adjusting slide 222, a third adjusting slide 223 and a fourth adjusting slide 224, the first adjusting slide 221 and the second adjusting slide 222 are arranged on the concave groove 211 of the overflow plate 21 on one side, and the third adjusting slide 223 and the fourth adjusting slide 224 are arranged on the concave groove 211 of the overflow plate 21 on the other side; and the first adjusting slide 221 and the third adjusting slide 223 are arranged on the same side of the anode 6, and the second adjusting slide 222 and the fourth adjusting slide 224 are arranged on the other side of the anode 6, that is, the position of the anode 6 is fixed and adjusted by the adjusting slide 22, and since each adjusting slide 22 is provided with a threaded hole 225 to fix the position of the adjusting slide 22, the anode 6 is further prevented from swinging and deforming during the electroplating process; and the anode 6 can be set to an irregular L-shape to avoid short circuit problems caused by the small distance between the cathode 7 and the anode 6.

[0039] Specifically, the plating solution buffer tank 23 is arranged at the bottom of the electroplating tank 2 , and the jet pipe 24 is arranged at the lower side of the plating solution buffer tank 23 , thereby playing the role of buffering the flow rate difference of each injection port in the jet pipe 24 .

[0040] Specifically, such as Figure 6 and Figure 7 As shown, a filter device liquid inlet 44 and a filter device liquid outlet 46 are provided at the bottom of the practical filter device 4, the filter device liquid inlet 44 is connected to one end of the flow control valve A41, the other end of the flow control valve A41 is connected to the pump liquid outlet 32, the filter device liquid outlet 46 is connected to one end of the exhaust valve 42, the other end of the exhaust valve 42 is connected to the flow meter liquid inlet 51, one end of the flow control valve B 43 is connected to the pump liquid outlet 32, and the other end is connected to the flow meter liquid inlet 51, finally realizing a loop in which the first branch 33 and the second branch 34 are connected in parallel to the flow meter 5; that is, the magnetic circulation pump 3 is divided into two branches after the liquid is discharged, one branch flows directly from the magnetic circulation pump 3 to the flow meter 5, and the other branch flows from the magnetic circulation pump 3 to the filter device 4 and then to the flow meter 5.

[0041] Specifically, a filter element 45 is further provided inside the filter device 4, and the liquid inlet 44 of the filter device is connected to the filter element 45; the liquid inlet 44 of the filter device is designed to be L-shaped, and the filter element 45 is designed to be a sleeve-type filter element, and the filter element 45 is nested on the liquid inlet 44 of the filter device, so that the plating solution can flow into the filter element 45 from the L-shaped liquid inlet 44 of the filter device, thereby increasing the filtration rate of the plating solution.

[0042] The working process of the practical ultra-thin electrolytic copper foil electroplating experimental device is as follows: the cathode 7 that has completed pretreatment is fixed in the cathode slot 26, the slide plate 22 is slid and adjusted to fix the position of the anode 7 to control the distance between the cathode and the cathode; a fixed amount of plating solution is added to the heating liquid storage tank 1, and the heating rod 11 and the liquid level meter 12 are turned on; the magnetic circulation pump 3 is turned on to start the plating solution circulation, and the plating solution passes through the defoaming baffle 15 to defoam and enter the liquid outlet 14 of the heating liquid storage tank, and flows into the pump inlet 31 through the pipeline; after flowing out from the pump outlet 32, it can choose to flow to two branches, the second branch 34 flows to the flow meter inlet 51 through the flow control valve B43, and the first branch 33 flows to the filter device through the flow control valve A41. The plating solution is placed at the liquid inlet 44 and enters the filter element 45. The plating solution passes through the filter element 45 and flows to the liquid outlet 46 of the filter device, and finally flows to the liquid inlet 51 of the flow meter; the plating solution flows from the liquid outlet 52 of the flow meter to the liquid inlet 27 of the electroplating tank, enters the jet pipe 24, flows out vertically upward from the jet outlet 241, and flows upward from the bottom of the electroplating tank 2. After the water level reaches the overflow plate 21, the plating solution overflows and flows downward to the overflow guide port 25 and returns to the heating liquid storage tank 1 to realize the circulation of the plating solution; after the plating solution temperature and mass transfer reach certain parameters and stabilize, the anode 6 and the positive pole of the high-frequency rectifier power supply 8, as well as the cathode 7 and the negative pole of the high-frequency rectifier power supply 8 are connected through the electroplating clamp, and the high-frequency rectifier power supply 8 is turned on to start the foil production work.

[0043] The experimental device provided by the present invention is sophisticated in design and easy to operate, effectively enhancing the directional transmission efficiency and mass transfer stability of the plating solution, and can be used to prepare ultra-thin copper foil with a thickness of 3-6μm. More importantly, the built-in filtering device expands the function, and while exploring the combination of additive formulas, the adsorption and consumption performance test of the additives can be implemented, thereby deeply enabling the formulation optimization of additives and the research and development of production process parameters for ultra-thin electrolytic copper foil with a thickness of 3-6μm, promoting the efficiency and depth of the testing and development of the formulation and process parameters of electrolytic copper foil additives, and effectively improving the performance of electrolytic copper foil products.

[0044] Those skilled in the art can make various other corresponding changes and deformations based on the technical solutions and concepts described above, and all of these changes and deformations should fall within the scope of protection of the claims of the present utility model.

Claims

1. An electroplating experimental device for ultra-thin electrolytic copper foil, comprising a heating reservoir, an electroplating tank, a filtering device, and a high-frequency rectifier power supply, wherein the electroplating tank is arranged above the heating reservoir; characterized in that: A cathode and an anode are provided in the electroplating tank, the anode is connected to the positive pole of the high-frequency rectifier power supply, and the cathode is connected to the negative pole of the high-frequency rectifier power supply; a heating liquid reservoir outlet is provided at the bottom of the heating liquid reservoir, the heating liquid reservoir outlet is connected to the pump inlet of the magnetic circulation pump, the pump outlet of the magnetic circulation pump is connected to both the first branch and the second branch, the other end of the first branch and the second branch is connected to the flowmeter inlet of the flowmeter, and the flowmeter outlet of the flowmeter is connected to the electroplating tank inlet; a filtering device, a flow control valve A and an exhaust valve are provided on the first branch, and the filtering device is provided between the flow control valve A and the exhaust valve; a flow control valve B is provided on the second branch.

2. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 1, characterized in that: A heating rod and a liquid level gauge are provided in the heating liquid storage tank, a plating liquid buffer tank is provided on the upper side of the heating liquid storage tank, and the heating rod and the liquid level gauge are both provided on the plating liquid buffer tank; a drain port is provided at the bottom of the heating liquid storage tank, and a defoaming baffle is provided above the position of the liquid outlet of the heating liquid storage tank, and the defoaming baffle is provided on the side wall of the heating liquid storage tank, and is used to buffer bubbles formed when the plating liquid flows downward from a high position or gas is precipitated during electroplating.

3. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 1, characterized in that: The electroplating tank is provided with a plating solution buffer tank and two symmetrical groups of overflow plates. The plating solution buffer tank is provided with a jet pipe and an overflow guide port. The overflow guide port is connected to the heating liquid storage tank on the lower side. The overflow guide port is arranged at both ends of the jet pipe; the overflow plate is arranged on the upper side of the plating solution buffer tank, and a concave slide is provided on the overflow plate. An adjustment slide is provided on the concave slide that is slidably arranged with the concave slide, the anode is arranged on the adjustment slide, and the cathode is fixed in the cathode slot at the end of the overflow plate; the adjustment slide is also provided with a threaded hole for fixing the position, and the jet pipe is connected to the liquid inlet of the electroplating tank.

4. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 1, characterized in that: A filter inlet and a filter outlet are provided at the bottom of the filter device, the filter inlet is connected to one end of the flow control valve A, and the other end of the flow control valve A is connected to the pump outlet; the filter outlet is connected to one end of the exhaust valve, and the other end of the exhaust valve is connected to the flow meter inlet; a filter element is provided inside the filter device, and the filter inlet is connected to the filter element.

5. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 1, characterized in that: One end of the flow control valve B is connected to the liquid outlet of the pump, and the other end is connected to the liquid inlet of the flow meter.

6. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 1, characterized in that: The anode is configured in an irregular L-shape to avoid a short circuit problem caused by a too small distance between the cathode and the anode.

7. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 3, characterized in that: The plating solution buffer tank is arranged at the bottom of the electroplating tank, and the jet pipe is arranged at the lower side of the plating solution buffer tank, and is used to buffer the flow rate difference of each injection port in the jet pipe.

8. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 3, characterized in that: The adjustment slide includes a first adjustment slide, a second adjustment slide, a third adjustment slide and a fourth adjustment slide. The first adjustment slide and the second adjustment slide are arranged on the concave groove of the overflow plate on one side, and the third adjustment slide and the fourth adjustment slide are arranged on the concave groove of the overflow plate on the other side; the first adjustment slide and the third adjustment slide are arranged on the same side of the anode, and the second adjustment slide and the fourth adjustment slide are arranged on the other side of the anode.

9. The electroplating experimental device for ultra-thin electrolytic copper foil according to claim 4, characterized in that: The liquid inlet of the filter device is designed to be L-shaped, and the filter element is designed to be a sleeve-type filter element. The filter element is nested on the liquid inlet of the filter device, so that the plating solution can flow into the filter element from the L-shaped liquid inlet of the filter device, thereby increasing the filtration rate of the plating solution.

10. An electroplating experimental device for ultra-thin electrolytic copper foil according to any one of claims 1 to 9, characterized in that: The thickness of the ultra-thin copper foil prepared by the electroplating experimental device is 3-6 μm.

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