Microprocessor integrated circuit test equipment
By introducing non-volatile storage devices into the integrated circuit tester on the same device, the transportation cost problem of module testing is solved, efficient module testing is achieved, and test coverage and production efficiency are improved.
Patent Information
- Application Number
- CN202421588798.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-29
- Filing Date
- 2024-07-05
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-07-05
AI Technical Summary
In the traditional microprocessor integrated circuit manufacturing process, module testing requires the chips to be sent elsewhere for testing, resulting in additional transportation and test equipment maintenance costs, and the final test may not be able to fully detect all potential defects.
Introducing a non-volatile storage device into the integrated circuit tester on the same device to load working firmware after final test, enabling module testing, including functional and performance testing, reducing shipping costs and improving test coverage.
By testing modules on the same device, delivery time and related costs are reduced, test coverage is improved, and customer complaints are reduced.
Smart Images
Figure CN223377436U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to a technology for testing an integrated circuit, and in particular to a microprocessor integrated circuit testing device. Background Art
[0002] In the traditional microprocessor integrated circuit (MPU) manufacturing process, testing is a crucial step in ensuring product quality and performance. In addition to final testing (FT) after chip packaging, module testing is also an essential step to ensure that insufficient test error coverage occurs throughout the production process, thereby avoiding potential customer complaints. However, module testing requires the chips to be shipped elsewhere, which also incurs additional costs.
[0003] The production process for microprocessor integrated circuits encompasses multiple stages, including design, manufacturing, packaging, and testing. Final testing, performed after chip packaging, primarily aims to ensure the proper operation and performance of the entire microprocessor. However, relying solely on final testing may not fully detect all potential defects, hence the introduction of module testing. Module testing, performed at various stages of microprocessor manufacturing, aims to ensure that each functional module operates correctly and interfaces correctly with other modules. This helps improve test coverage, detecting more potential defects and reducing the likelihood of problems during final testing.
[0004] However, module testing requires shipping the chips elsewhere, which incurs additional costs. This can include transportation, test equipment setup, and maintenance costs. To minimize costs, some manufacturers may conduct module testing within the same production facility, but this requires additional investment and space. Utility Model Content
[0005] The present application provides a microprocessor integrated circuit testing device that is used to perform not only final test (FT) of chip packaging but also module test on the same machine, thereby increasing test fault coverage and reducing the occurrence of customer complaints.
[0006] An embodiment of the present application provides a microprocessor integrated circuit testing device. The microprocessor integrated circuit testing device includes an integrated circuit tester, an integrated circuit common carrier, and a non-volatile storage device. The integrated circuit common carrier is coupled to the integrated circuit tester and is used to carry a microprocessor integrated circuit to be tested. The non-volatile storage device is coupled to the integrated circuit common carrier and the integrated circuit tester. When the microprocessor integrated circuit to be tested is set on the integrated circuit common carrier, the integrated circuit tester inputs and reads signals from different pins of the microprocessor integrated circuit to perform a final test (FT) on the chip packaging. After the final test on the chip packaging is completed, the microprocessor integrated circuit is loaded with a working firmware from the non-volatile storage device, and the integrated circuit tester performs an integrated circuit module test on the microprocessor integrated circuit.
[0007] Another embodiment of the present application provides a microprocessor integrated circuit testing method, which includes the following steps: providing a non-volatile storage device coupled to an integrated circuit common carrier; when the microprocessor integrated circuit under test is set on the integrated circuit common carrier, a final test (FT) of the chip packaging is performed by inputting and reading signals from different pins of the microprocessor integrated circuit; after the final test of the chip packaging is completed, a working firmware is loaded from the non-volatile storage device to the microprocessor integrated circuit under test, and an integrated circuit module test is performed on the microprocessor integrated circuit under test.
[0008] According to the microprocessor integrated circuit testing method and microprocessor integrated circuit testing equipment using the method described in a specific embodiment of the present application, the final test after the chip packaging is completed includes the integrated circuit tester performing a digital IP test on multiple pins of the microprocessor integrated circuit. In another specific embodiment, the final test after the chip packaging is completed includes the integrated circuit tester performing an analog IP test on multiple pins of the microprocessor integrated circuit. In another specific embodiment, the final test after the chip packaging is completed includes the integrated circuit tester performing a DC power supply test on multiple pins of the microprocessor integrated circuit.
[0009] According to a microprocessor integrated circuit testing method and a microprocessor integrated circuit testing device using the method described in a specific embodiment of the present application, the integrated circuit module testing includes: an integrated circuit tester performing a functional test on the microprocessor integrated circuit to verify whether the microprocessor integrated circuit can properly perform its intended functions. In another specific embodiment, the integrated circuit module testing further includes the integrated circuit tester performing a performance test on the microprocessor integrated circuit to verify whether the performance of the microprocessor integrated circuit meets design requirements.
[0010] According to a microprocessor integrated circuit testing method and a microprocessor integrated circuit testing device using the method described in a specific embodiment of the present application, before performing an integrated circuit module test on a microprocessor integrated circuit, the integrated circuit tester first checks a part number (PN code) of the microprocessor integrated circuit and checks whether the operating firmware stored in a non-volatile storage device corresponds to the PN code. If the integrated circuit tester determines that the operating firmware stored in the non-volatile storage device does not match the PN code, the integrated circuit tester writes a second operating firmware that matches the PN code into the non-volatile storage device. The integrated circuit tester then performs an integrated circuit module test on the microprocessor integrated circuit.
[0011] In summary, the embodiments of the present application install a non-volatile storage device on the machine that originally performs the final test (FT) after chip packaging. Therefore, after the final test is completed, the firmware required for the module test can be loaded into the non-volatile storage device. In this way, the microprocessor integrated circuit to be tested can load the firmware from the non-volatile storage device and perform module tests such as functional testing and performance testing without the need for shipping costs, thereby increasing test fault coverage and reducing the occurrence of customer complaints.
[0012] To further understand the technology, means, and effects of the present application, reference may be made to the following detailed description and accompanying drawings, which provide a thorough and specific understanding of the purpose, features, and concepts of the present application. However, the following detailed description and accompanying drawings are intended only to provide a reference and illustration of the implementation of the present application and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] The accompanying drawings are provided to enable those skilled in the art to further understand the present application and are incorporated into and constitute part of the specification of the present application. The accompanying drawings illustrate exemplary embodiments of the present application and are used together with the specification of the present application to explain the principles of the present application.
[0014] Figure 1 This is a circuit block diagram of a microprocessor integrated circuit testing device according to a specific embodiment of the present application.
[0015] Figure 2 This is a flow chart of a method for dynamically adjusting a first-in-first-out buffer operation mechanism according to a specific embodiment of the present application. DETAILED DESCRIPTION
[0016] Reference will now be made in detail to exemplary embodiments of the present application, which are illustrated in the accompanying drawings. Wherever possible, identical reference numerals will be used throughout the drawings and the specification to designate identical or similar components. The exemplary embodiments are merely one example of how the present invention may be implemented, and the following examples are not intended to limit the present invention.
[0017] Figure 1 This is a circuit block diagram of a microprocessor integrated circuit test device according to a specific embodiment of the present application. Figure 1 The microprocessor integrated circuit test apparatus includes an integrated circuit tester 101, an integrated circuit common carrier 102, and a non-volatile storage device 103. The integrated circuit common carrier 102 is coupled to the integrated circuit tester 101 and is used to carry a microprocessor integrated circuit (DUT) under test. The non-volatile storage device 103 is coupled to the integrated circuit common carrier 102 and the integrated circuit tester 101.
[0018] After the chip is packaged, it is placed on the integrated circuit common carrier 102 for final testing (FT). This FT typically involves testing the DC power supply, also known as the DC test, the analog IP test (analog testing of the microprocessor's I / O), and the digital IP test (digital testing of the microprocessor's I / O). This provides a preliminary assessment of the chip's quality.
[0019] In the prior art, after the final test is completed, the microprocessor will be packaged and sent to other packaging and testing manufacturers for module testing (IC module testing) of the microprocessor. However, in this embodiment, module testing will be performed directly. Module testing refers to the process of testing the entire module of the microprocessor integrated circuit. A module refers to a circuit module, which is usually used to complete a specific function. Its purpose is to check whether the module meets the design requirements and ensure that it can work properly. Module testing usually includes the following steps: appearance inspection, checking whether the appearance of the microprocessor integrated circuit is damaged or defective; functional testing, checking whether the microprocessor integrated circuit can perform its intended function normally; performance testing, checking whether the performance of the microprocessor integrated circuit meets the design requirements; and reliability testing, checking the working reliability of the microprocessor integrated circuit in a specific environment, such as temperature and humidity.
[0020] However, the microprocessor integrated circuit (DUT) generally does not have a working firmware. Therefore, in this embodiment, a working firmware is stored in the non-volatile storage device. After the final test is completed, the module test can be continued. At this time, the microprocessor integrated circuit (DUT) is loaded with a working firmware from the non-volatile storage device 103, and the integrated circuit tester can start to perform an integrated circuit module test on the microprocessor integrated circuit (DUT), such as the above-mentioned functional test, performance test, etc. Therefore, the present application can save the transportation time between the final test and the module test, and the time (index time) required by the test sorting machine in the operation process of taking and placing the integrated circuit is also reduced due to the removal of the module test. In terms of cost, because the module test is actually done on the same machine, the related parts, plates, and related testing costs can be saved, so the goal of shortening the test process, saving test time and increasing production (throughput) can be achieved.
[0021] The microprocessor integrated circuit testing device of the above embodiment can be summarized into a microprocessor integrated circuit testing method. Figure 2 This is a flowchart of a microprocessor integrated circuit testing method according to a specific embodiment of the present application. Figure 2 , the microprocessor integrated circuit testing method comprises the following steps:
[0022] Step S201: Start.
[0023] Step S202: Provide a non-volatile storage device coupled to an integrated circuit common carrier.
[0024] Step S203: Start the final test (FT). As described in the above embodiment, the final test includes a DC test, an analog IP test, and a digital IP test.
[0025] Step S204: Determine the part number (PN code) of the microprocessor integrated circuit (DUT) under test and check whether the operating firmware stored in the non-volatile storage device corresponds to the part number. In the above embodiment, although the non-volatile storage device 103 should be configured with corresponding operating firmware, in reality, the machine is not specifically designed for testing a single microprocessor. Therefore, in this embodiment, it is necessary to first check whether the part number (PN code) of the microprocessor integrated circuit (DUT) corresponds to the operating firmware stored in the non-volatile storage device 103. If the operating firmware corresponds, proceed to step S205. If not, proceed to step S206.
[0026] Step S205: Start module testing, such as the function test and performance test in the above embodiment.
[0027] Step S206 : Erase the non-volatile storage device 103 .
[0028] Step S207: Burn the working firmware corresponding to the part number (PN code).
[0029] Step S208: Verify the burned working firmware. Then proceed to step S205.
[0030] In summary, the embodiments of the present application install a non-volatile storage device on the machine that originally performs the final test (FT) after chip packaging. Therefore, after the final test is completed, the firmware required for module testing can be loaded into the non-volatile storage device. In this way, the microprocessor integrated circuit to be tested can load the firmware from the non-volatile storage device and perform module testing content such as functional testing and performance testing without the need for shipping costs, thereby increasing test fault coverage and reducing the occurrence of customer complaints.
[0031] It should be understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to those skilled in the art and are to be included within the spirit and purview of this application and the scope of the appended claims.
Claims
1. A microprocessor integrated circuit testing device, characterized in that: include: an integrated circuit tester; an integrated circuit common carrier, coupled to the integrated circuit tester and used for carrying a microprocessor integrated circuit to be tested; as well as a non-volatile storage device coupled to the integrated circuit common carrier and the integrated circuit tester; When the microprocessor integrated circuit to be tested is placed on the integrated circuit common carrier, the integrated circuit tester inputs and reads signals from different pins of the microprocessor integrated circuit to perform a final test on the chip package. After the final test of the chip package is completed, the microprocessor integrated circuit is loaded with a working firmware from the non-volatile storage device, and the integrated circuit tester performs an integrated circuit module test on the microprocessor integrated circuit.
2. The microprocessor integrated circuit testing device according to claim 1, wherein: The final tests completed by the chip package include: The integrated circuit tester performs digital IP testing on multiple inputs and outputs of the microprocessor integrated circuit.
3. The microprocessor integrated circuit testing device according to claim 1, wherein: The final tests completed by the chip package include: The integrated circuit tester performs analog IP testing on multiple inputs and outputs of the microprocessor integrated circuit.
4. The microprocessor integrated circuit testing device according to claim 1, wherein: The final tests completed by the chip package include: The integrated circuit tester performs a direct current power supply test on the microprocessor integrated circuit.
5. The microprocessor integrated circuit testing device according to claim 1, wherein: The integrated circuit module test includes: The integrated circuit tester performs a functional test on the microprocessor integrated circuit to check whether the microprocessor integrated circuit can normally perform its expected function.
6. The microprocessor integrated circuit testing device according to claim 1, characterized in that: The integrated circuit module testing further includes: The integrated circuit tester performs a performance test on the microprocessor integrated circuit to check whether the performance of the microprocessor integrated circuit meets the design requirements.