Electronic package

Abstract

An electronic package is mainly characterized in that a bearing plate is connected to a bearing structure, a first photoelectric device is arranged on the bearing plate, a groove is formed in the bearing structure, a second photoelectric device is arranged in the groove, and the information transmission amount per second is increased by increasing the number of the photoelectric devices.

Description

Technical Field

[0001] The present application relates to a semiconductor device, and more particularly to an electronic package having an optoelectronic device. Background Art

[0002] With the booming electronics industry, electronic products are increasingly becoming more multifunctional and high-performance. The application of fifth-generation (5G) communication technology has expanded to various fields, including the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and healthcare. This expansion in applications is generating vast amounts of data that requires efficient transmission, computation, and storage. The surge in demand for data transmission is driving the industry to replace electricity with light as the data transmission medium, increasing transmission capacity, efficiency, and distance while reducing energy consumption. Against this backdrop, co-packaged optics has become a future trend in semiconductor and packaging technology.

[0003] Figure 1 The figure is a cross-sectional schematic diagram of a conventional co-packaged optical semiconductor package 1. The semiconductor package 1 has a substrate 10 on which are mounted an electronic component 11, an electronic integrated circuit (EIC) component 12, and a photonic integrated circuit (PIC) component 13 bonded to the EIC component 12. One end of the PIC component 13 is connected to an optical fiber 14, and a shelf 15 is located below the junction of the PIC component 13 and the optical fiber 14.

[0004] However, due to limitations in packaging technology and structure, existing semiconductor packages used for optical communications can mostly only connect to a single optical fiber. As a result, the transmission speed of existing optical fiber communications (i.e., the amount of data transmitted per unit time) has reached a bottleneck and is gradually becoming insufficient, let alone meeting the rapid and substantial growth in data transmission demands of future technologies and products.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Utility Model Content

[0006] In view of the various deficiencies of the above-mentioned prior art, the present application provides an electronic package, comprising: a supporting structure having a first surface and a second surface relative to each other, and a groove formed on the first surface; a supporting plate, disposed on the first surface of the supporting structure and electrically connected to the supporting structure; a first optoelectronic device, disposed on the supporting plate and electrically connected to the supporting plate; and a second optoelectronic device, disposed in the groove and electrically connected to the supporting structure.

[0007] The present application also provides a method for manufacturing an electronic package, comprising: setting a carrier plate on a carrier structure, wherein the carrier structure has a first surface and a second surface relative to each other, and a groove is formed on the first surface, the carrier plate is set on the first surface of the carrier structure and electrically connected to the carrier structure; setting and electrically connecting a first optoelectronic device on the carrier plate; and setting and electrically connecting a second optoelectronic device in the groove.

[0008] The aforementioned electronic package and its manufacturing method further include an electronic component disposed on the carrier board and electrically connected to the carrier board.

[0009] The aforementioned electronic package and its manufacturing method further include a heat sink disposed on the first optoelectronic device and / or the second optoelectronic device.

[0010] In the aforementioned electronic package and its manufacturing method, the first optoelectronic device and the second optoelectronic device are each connected to an optical fiber.

[0011] In the aforementioned electronic package and its manufacturing method, the carrier board is a core substrate with a circuit layer, a coreless substrate with a circuit layer, or an intermediate board with conductive through holes.

[0012] In the aforementioned electronic package and its manufacturing method, the first optoelectronic device and the second optoelectronic device respectively include a packaging structure, a semiconductor element disposed in the packaging structure, and an optical element connected to the packaging structure.

[0013] In the aforementioned electronic package and its manufacturing method, the optical element includes a coupler, an optical chip, a total reflection mirror and an optical fiber array unit. The optical element can also be an optical chip.

[0014] In the aforementioned electronic package and its manufacturing method, the package structure is a fan-out stacked package structure, and the semiconductor element is an electronic integrated circuit.

[0015] From the above, it can be seen that the electronic package and its manufacturing method of the present application mainly provide an additional supporting plate on the supporting structure for receiving the first optoelectronic device, and at the same time form a groove in the supporting structure for receiving the second optoelectronic device, thereby increasing the number of optoelectronic devices to improve the information transmission capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The figure is a cross-sectional view of a conventional co-packaged optical semiconductor package.

[0017] Figures 2A to 2C It is a cross-sectional schematic diagram of a manufacturing method of the first embodiment of the electronic package of the present application.

[0018] Figures 3A to 3C It is a cross-sectional schematic diagram of a manufacturing method of the second embodiment of the electronic package of the present application.

[0019] Figure 4 FIG. 1 is a cross-sectional schematic diagram of a third embodiment of the electronic package of the present application.

[0020] Description of Reference Numerals

[0021] 1 Semiconductor Package

[0022] 10 substrate

[0023] 11 Electronic components

[0024] 12 Electronic integrated circuit components

[0025] 13 Photonic integrated circuit components

[0026] 14 Fiber Optic

[0027] 15 bracket

[0028] 2,3,4 Electronic packaging

[0029] 20 load-bearing structure

[0030] 20a First surface

[0031] 20b Second surface

[0032] 200 grooves

[0033] 201 insulation layer

[0034] 202 circuit layer

[0035] 21 Loading plate

[0036] 22 Electronic components

[0037] 23 First Photoelectric Device

[0038] 230,240 package structure

[0039] 231,241 Semiconductor components

[0040] 232,242 optical components

[0041] 24 Second optoelectronic device

[0042] 25 heat sink

[0043] 26 optical fibers. DETAILED DESCRIPTION

[0044] The following describes the implementation of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification.

[0045] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of this application. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in this application without affecting the efficacy and purpose that can be achieved by this application. At the same time, terms such as "upper", "first", "second", "third", "one", etc. quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of this application. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of this application without substantially changing the technical content.

[0046] See also Figures 2A to 2C , which is a schematic cross-sectional view of the manufacturing method of the first embodiment of the electronic package 2 of the present application.

[0047] like Figure 2A As shown, first, a supporting structure 20 having a relative first surface 20a and a second surface 20b is provided. The supporting structure 20 is, for example, a redistribution layer (RDL) structure or a semiconductor package substrate. The supporting structure 20 in this embodiment is a semiconductor package substrate, for example, a package substrate with a core layer or a coreless circuit structure, and the circuit structure includes an insulating layer 201 and a circuit layer 202 combined with the insulating layer 201. The material of the insulating layer 201 is, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. The circuit layer 202 is, for example, a fan-out redistribution circuit layer.

[0048] Then, a carrier board 21 , an electronic component 22 and a first optoelectronic device 23 are arranged on the first surface 20 a of the carrier structure 20 , wherein the electronic component 22 and the first optoelectronic device 23 are electrically connected to the carrier board 21 , and the carrier board 21 is electrically connected to the carrier structure 20 .

[0049] The carrier board 21 is, for example, a core substrate with a circuit layer, a coreless substrate with a circuit layer, or an interposer with conductive vias, and can be connected to the first surface 20 a of the carrier structure 20 via a plurality of conductive elements.

[0050] The electronic component 22 may be an active component such as a switch chip, a system-on-chip (SOC), a high-bandwidth memory (HBM) chip, or other functional chip, or may be a passive component such as a resistor, capacitor, or inductor. The electronic component 22 may be electrically connected to the carrier board 21 in a flip-chip manner via a plurality of conductive bumps such as solder bumps, copper bumps, or other conductive bumps.

[0051] The first optoelectronic device 23 includes a package structure 230, a semiconductor device 231 disposed within the package structure 230, and an optical component 232 mounted on the package structure 230. The package structure 230 is, for example, a fan-out package-on-package (FO-PoP) structure. The semiconductor device 231 is, for example, an electronic integrated circuit (EIC). The optical component is an optical module 232 (PIC module), which includes, for example, a coupler, an optical chip, a total reflection mirror, a fiber array unit (FAU), etc. The optical component may also be an optical chip.

[0052] In addition, in the aforementioned process, the carrier plate 21 can be first placed on the carrier structure 20, and then the electronic component 22 and the first optoelectronic device 23 can be placed on the carrier plate 21. Alternatively, the electronic component 22 and the first optoelectronic device 23 can be first placed on the carrier plate 21, and then the carrier plate 21 can be placed on the carrier structure 20.

[0053] like Figure 2B As shown, a groove 200 is formed on the first surface 20 a of the supporting structure 20 by laser, grinding or etching, so as to expose the circuit layer 202 .

[0054] like Figure 2C As shown, a second optoelectronic device 24 is provided in the groove 200 of the supporting structure 20. The second optoelectronic device 24 includes a packaging structure 240, a semiconductor element 241 provided in the packaging structure 240, and an optical element 242 connected to the packaging structure 240 to obtain the electronic package 2 of the present application.

[0055] See also Figures 3A to 3C , is a cross-sectional schematic diagram of a manufacturing method of a second embodiment of the electronic package 3 of the present application. This embodiment is substantially the same as the aforementioned embodiment, with the main difference being the setting time of the groove of the supporting structure.

[0056] like Figure 3A As shown, a supporting structure 20 is first provided, which has a circuit layer 202 and a first surface 20 a and a second surface 20 b opposite to each other. A groove 200 is formed on the first surface 20 a to expose the circuit layer 202 .

[0057] like Figure 3B As shown, a carrier plate 21, an electronic component 22 and a first optoelectronic device 23 are arranged on the carrier structure 20, wherein the electronic component 22 and the first optoelectronic device 23 are placed on the carrier plate 21 and electrically connected to the carrier plate 21, and the carrier plate 21 is placed on the carrier structure 20 and electrically connected to the carrier structure 20.

[0058] like Figure 3C As shown, a second optoelectronic device 24 is disposed in the groove 200 of the supporting structure 20 .

[0059] In addition, in the aforementioned manufacturing process, the second optoelectronic device 24 is first installed, and then the first optoelectronic device 23 is installed, so as to manufacture the electronic package 3 of the present application.

[0060] See also Figure 4 , is a cross-sectional schematic diagram of the manufacturing method of the third embodiment of the electronic package 4 of the present application. This embodiment is substantially the same as the aforementioned embodiment, with the main difference being that a heat sink 25 can be optionally placed above the first optoelectronic device 23 and / or the second optoelectronic device 24, and the heat sink 25 is disposed on the carrier plate 21 or the carrier structure 20.

[0061] Through the aforementioned manufacturing process, the present application further provides an electronic package 2, 3, or 4, comprising: a carrier structure 20 having a circuit layer 202 and opposing first and second surfaces 20a, 20b, with a recess 200 formed on the first surface 20a; a carrier plate 21 disposed on the first surface 20a of the carrier structure 20; a first optoelectronic device 23 disposed on the carrier plate 21; and a second optoelectronic device 24 disposed in the recess 200 of the carrier structure 20. An optical fiber 26 is then connected to the optical fiber array unit of the first and second optoelectronic devices 23, 24 to transmit optical signals to the first and second optoelectronic devices 23, 24.

[0062] In addition, the electronic packages 2 , 3 , 4 further include electronic components 22 disposed on the carrier board 21 .

[0063] The electronic package 4 further includes a heat sink 25 , which can be optionally disposed on the first optoelectronic device 23 and / or the second optoelectronic device 24 .

[0064] In summary, the electronic package and its manufacturing method of the present application mainly provide an additional carrier plate on the supporting structure for receiving the first optoelectronic device, and at the same time form a groove in the supporting structure for receiving the second optoelectronic device, thereby increasing the number of optoelectronic devices to increase the amount of information transmission. At the same time, the electronic package can be manufactured using the existing semiconductor packaging process without the need to develop special processes or purchase special equipment, thereby reducing product production costs.

[0065] The above embodiments are provided to illustrate the principles and effects of this application and are not intended to limit this application. Persons skilled in the art may modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application shall be as set forth in the claims.

Claims

1. An electronic package, characterized in that: include: The supporting structure has a first surface and a second surface opposite to each other, and a groove is formed on the first surface; A supporting plate, disposed on the first surface of the supporting structure and electrically connected to the supporting structure; A first optoelectronic device is disposed on the carrier board and electrically connected to the carrier board; as well as The second optoelectronic device is disposed in the groove and electrically connected to the supporting structure.

2. The electronic package according to claim 1, wherein The electronic package also includes an electronic component which is arranged on the carrier board and electrically connected to the carrier board.

3. The electronic package according to claim 1, wherein: The electronic package further includes a heat sink disposed on the first optoelectronic device and / or the second optoelectronic device.

4. The electronic package according to claim 1, wherein: The first optoelectronic device and the second optoelectronic device are respectively connected to at least one optical fiber.

5. The electronic package according to claim 1, wherein: The carrier board is a core substrate with a circuit layer, a coreless substrate with a circuit layer, or an intermediate board with conductive through holes.

6. The electronic package according to claim 1, wherein: The first optoelectronic device and the second optoelectronic device respectively include a packaging structure, a semiconductor element arranged in the packaging structure, and an optical element connected to the packaging structure.

7. The electronic package according to claim 6, wherein: The optical element is an optical module, which includes a coupler, an optical chip, a total reflection mirror and an optical fiber array unit.

8. The electronic package according to claim 6, wherein: The optical element is an optical chip.

9. The electronic package according to claim 6, wherein: The packaging structure is a fan-out stacked packaging structure, and the semiconductor element is an electronic integrated circuit.

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