Ultra-wideband microstrip isolation circulator

Abstract

The utility model relates to the technical field of microwave devices, in particular to an ultra-wideband microstrip isolation circulator, a high-precision magnetron sputtering microstrip circuit of the ultra-wideband microstrip isolation circulator has stability and consistency, and the magnetization uniformity is effectively improved by adopting a ceramic substrate mode; the overall bandwidth of the device is effectively improved through the multiple ferrite nesting mode, the performance of the device capable of meeting quadruplicated frequency is achieved, and the working bandwidth is expanded by three times; according to the full-ferrite microstrip isolation circulator, the thinned permanent magnet piece and the thinned ceramic piece are arranged on the upper portion of the full-ferrite microstrip isolation circulator, the weight of the device is reduced, the overall height of the device is effectively reduced, it is guaranteed that the telecommunication performance is not affected, and compared with a traditional full-ferrite microstrip isolation circulator of the same size, the adopted high-dielectric ceramic substrate and high-power gyromagnetic ferrite piece materials have the advantages that the cost is low; the power capacity is improved by at least three times, the size is reduced by half, and the working bandwidth is doubled.

Description

Technical Field

[0001] The utility model relates to the technical field of microwave devices, in particular to an ultra-wideband microstrip isolation circulator. Background Art

[0002] Microwave ferrite isolation circulators are essential components in phased array radar systems, with a history of over 50 years. As the connection between the receiver, transmitter, and antenna, isolation circulators isolate the transmitter and receiver, ensuring system stability and reliability.

[0003] Emerging all-solid-state active phased array radars offer significant advantages over passive radars in terms of size, weight, and electrical performance, representing the future of radar technology. This patent application aims to develop ultra-wideband microstrip isolators that meet the requirements of shipborne and airborne applications, for use in my country's next-generation all-solid-state active phased array radars, which are in high demand.

[0004] With the demand of new radars for miniaturization, ultra-wideband and high power of TR components, it is very important and urgent to realize a microstrip isolation circulator with the characteristics of miniaturization, ultra-wideband and high power in response to the above development trends. Utility Model Content

[0005] The purpose of the present invention is to provide an ultra-wideband microstrip isolation circulator to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: an ultra-wideband microstrip isolation circulator, comprising an iron carrier, a ceramic substrate, a ceramic sheet, a permanent magnet, a resistor and a microstrip circuit, wherein the surface of the iron carrier is provided with a ceramic substrate and a resistor, a spin-magnetic ferrite sheet is nested in the ceramic substrate, a microstrip circuit is sputtered and electroplated on the surface of the ceramic substrate, one end of the microstrip circuit is connected to the resistor by metal overlapping, a circular ceramic sheet is bonded to the surface of the ceramic substrate, and a circular permanent magnet is provided on the surface of the ceramic sheet.

[0007] Preferably, the iron carrier plate and the ceramic substrate are square sheets, and are concentrically welded and stacked, wherein the iron carrier plate is smaller than the ceramic substrate.

[0008] Preferably, the ceramic substrate and the gyromagnetic ferrite sheet are nested in a manner that glass paste is used as a filling component between the ceramic and the ferrite, and the ceramic substrate and the gyromagnetic ferrite sheet are sintered to form a substrate for preparing a thin film circuit.

[0009] Preferably, the resistor is welded to the iron carrier board, and one end of the resistor is connected to one end of the microstrip circuit on the ceramic substrate by metal lap joint.

[0010] Preferably, the upper surface of the ceramic substrate is electroplated and sputtered with a copper-nickel-gold microstrip circuit.

[0011] Preferably, the ceramic sheet is bonded to the corresponding position of the ferrite sheet, and the permanent magnet is bonded with the center of the ceramic sheet as the reference to form a closed magnetic circuit.

[0012] Compared with the existing technology, the beneficial effects of the present invention are: the high-precision magnetron sputtering microstrip circuit of the present invention has stability and consistency, and the ceramic substrate mode adopted effectively improves the uniformity of magnetization; the multiple ferrite nesting method effectively improves the overall bandwidth of the device, realizes the device performance that can meet 4 times the frequency, and the working bandwidth is expanded by 3 times; the thinned permanent magnet and ceramic sheet on the top not only reduce the weight of the device itself, but also effectively reduce the overall height of the device, while ensuring that the telecommunications performance is not affected. The high dielectric ceramic substrate and high-power gyromagnetic ferrite sheet materials used, compared with traditional all-ferrite microstrip isolation circulators of the same size, have increased the power capacity by at least 3 times, reduced the volume by half, and doubled the working bandwidth. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a side structural diagram of the present utility model;

[0014] Figure 2 This is a front view perspective structural diagram of the present invention.

[0015] In the figure: 1. Iron carrier; 2. Ceramic substrate; 3. Ceramic sheet; 4. Permanent magnet; 5. Resistor; 6. Microstrip circuit. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] In the description of the present invention, it should be noted that the terms "vertical", "up", "down", "horizontal", etc. indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0018] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0019] See also Figure 1-2 The utility model provides a technical solution: an ultra-wideband microstrip isolation circulator, including an iron carrier 1, a ceramic substrate 2, a ceramic sheet 3, a permanent magnet 4, a resistor 5 and a microstrip circuit 6. The ceramic substrate 2 and the resistor 5 are arranged on the surface of the iron carrier 1, a rotating magnetic ferrite sheet is nested in the ceramic substrate 2, the microstrip circuit 6 is sputtered and electroplated on the surface of the ceramic substrate 2, one end of the microstrip circuit 6 is connected to the resistor 5 by metal overlapping, a circular ceramic sheet 3 is bonded to the surface of the ceramic substrate 2, and a circular permanent magnet 4 is arranged on the surface of the ceramic sheet 3.

[0020] Furthermore, the iron carrier plate 1 and the ceramic substrate 2 are square thin sheets, and the iron carrier plate 1 and the ceramic substrate 2 are concentrically welded and stacked, wherein the iron carrier plate 1 is smaller than the ceramic substrate 2 .

[0021] Furthermore, the ceramic substrate 2 and the gyromagnetic ferrite sheet are nested in a manner that glass paste is used as a filling component between the ceramic and the ferrite, and the ceramic substrate 2 and the gyromagnetic ferrite sheet are sintered to form a substrate for preparing a thin film circuit.

[0022] Furthermore, the resistor 5 is welded to the iron carrier board 1 , and one end of the resistor 5 is connected to one end of the microstrip circuit 6 on the ceramic substrate 2 by metal lap joint.

[0023] Furthermore, the upper surface of the ceramic substrate 2 is electroplated and sputtered with a copper-nickel-gold microstrip circuit 6 .

[0024] Furthermore, the ceramic sheet 3 is bonded to the corresponding position of the gyromagnetic ferrite sheet, and the permanent magnet 4 is bonded with the center of the ceramic sheet 3 as a reference, thereby forming a closed magnetic circuit.

[0025] The high-precision magnetron sputtering microstrip circuit of the utility model has stability and consistency, and the ceramic substrate 2 mode adopted effectively improves the uniformity of magnetization; the multiple ferrite nesting method effectively improves the overall bandwidth of the device, realizes the device performance that can meet 4 times the frequency, and expands the working bandwidth by 3 times; the thinned permanent magnet 4 and ceramic sheet 3 on the top not only reduce the weight of the device itself, but also effectively reduce the overall height of the device, while ensuring that the telecommunications performance is not affected. The high dielectric ceramic substrate 2 and high-power gyromagnetic ferrite sheet materials used, compared with traditional all-ferrite microstrip isolation circulators of the same size, have increased the power capacity by at least 3 times, reduced the volume by half, and doubled the working bandwidth.

[0026] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ultra-wideband microstrip isolation circulator, comprising an iron carrier (1), a ceramic substrate (2), a ceramic sheet (3), a permanent magnet (4), a resistor (5) and a microstrip circuit (6), characterized in that: A ceramic substrate (2) and a resistor (5) are provided on the surface of the iron carrier (1); a rotating magnetic ferrite sheet is nested in the ceramic substrate (2); a microstrip circuit (6) is sputtered and electroplated on the surface of the ceramic substrate (2); one end of the microstrip circuit (6) is connected to the resistor (5) by metal lap joint; a circular ceramic sheet (3) is bonded to the surface of the ceramic substrate (2); and a circular permanent magnet (4) is provided on the surface of the ceramic sheet (3).

2. The ultra-wideband microstrip isolated circulator according to claim 1, characterized in that: The iron carrier plate (1) and the ceramic substrate (2) are square thin sheets, and the iron carrier plate (1) and the ceramic substrate (2) are concentrically welded and superimposed, wherein the iron carrier plate (1) is smaller than the ceramic substrate (2).

3. The ultra-wideband microstrip isolated circulator according to claim 1, characterized in that: The ceramic substrate (2) and the gyromagnetic ferrite sheet are nested in a manner that glass paste is used as a filling component between the ceramic and the ferrite, and the ceramic substrate (2) and the gyromagnetic ferrite sheet are sintered to form a substrate for preparing a thin film circuit.

4. The ultra-wideband microstrip isolated circulator according to claim 1, characterized in that: The resistor (5) is welded to the iron carrier plate (1), and one end of the resistor (5) is connected to one end of the microstrip circuit (6) on the ceramic substrate (2) by metal lap joint.

5. The ultra-wideband microstrip isolated circulator according to claim 1, characterized in that: The upper surface of the ceramic substrate (2) is electroplated and sputtered to form a copper-nickel-gold microstrip circuit (6).

6. The ultra-wideband microstrip isolated circulator according to claim 1, characterized in that: The ceramic sheet (3) is bonded to the corresponding position of the gyromagnetic ferrite sheet, and the permanent magnet (4) is bonded with the center of the ceramic sheet (3) as a reference, thereby forming a closed magnetic circuit.

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