Communication mechanism installed in shell

Abstract

The utility model belongs to the technical field of battery modules, and particularly discloses a communication mechanism installed in a shell, the shell has a height direction, a cavity is arranged in the shell, the shell comprises a first integrated circuit board and a second integrated circuit board, and the first integrated circuit board is flatly laid and installed in the cavity of the shell. According to the utility model, the crimping heads are arranged at the two end parts of one PIN needle and are respectively crimped with the two integrated circuit boards at different positions on the shell, specifically, the crimping head is crimped with the first crimping hole in the first integrated circuit board, and the other crimping head is crimped with the second crimping hole in the second integrated circuit board; the first integrated circuit board, the PINs and the second integrated circuit board are arranged in the first crimping hole and the second crimping hole, and the crimping head extrudes and pierces into the plating layer on the first crimping hole or the plating layer on the second crimping hole, so that the first integrated circuit board, the PINs and the second integrated circuit board are electrically connected, thereby replacing a welding connection mode of the PINs and the integrated circuit boards, realizing live-line communication connection, and having no safety risk.

Description

Technical Field

[0001] The utility model belongs to the technical field of battery modules, and particularly relates to a communication mechanism installed in a shell. Background Art

[0002] The battery module mainly uses the integrated circuit board in the housing to communicate with the communication connector, which extends out of the housing to achieve communication with the outside world;

[0003] However, the current communication connection method between the integrated circuit board and the outside world mainly uses external PIN pins to replace the communication connector, directly allowing the external PIN pins to communicate with the integrated circuit board to achieve communication with the outside world; and the external PIN pins and the integrated circuit board mainly use welding to achieve communication, but welding cannot be carried out with power on, or welding with power on poses safety risks. Utility Model Content

[0004] The utility model provides a communication mechanism installed in a housing, which is aimed at the automotive industry with high safety requirements, especially the connection between an integrated circuit board on a battery module of an electric vehicle and an external PIN pin, and can realize communication connection under power without safety risks.

[0005] The technical problem to be solved by the present invention is achieved by adopting the following technical solutions:

[0006] A communication mechanism installed in a housing, the housing having a height direction, a chamber provided in the housing, and comprising a first integrated circuit board and a second integrated circuit board, wherein the first integrated circuit board is installed flat in the chamber of the housing, and the second integrated circuit board is installed on a side wall of the housing and extends along the height direction of the housing;

[0007] The PIN pin described above is mounted on the housing. The first integrated circuit board and the second integrated circuit board are provided with a plating layer. The crimping heads at both ends of the PIN pin are respectively crimped onto the first integrated circuit board and the second integrated circuit board and contact the plating layer, thereby achieving electrical connection between the first integrated circuit board, the PIN pin, and the second integrated circuit board.

[0008] Preferably, the housing has a length direction, the first integrated circuit board has a length direction, and the length direction of the first integrated circuit board is parallel to the length direction of the housing.

[0009] Preferably, the PIN needle is embedded in the housing.

[0010] Preferably, a first positioning post is provided at the bottom of the housing, and the first positioning post extends along the height direction of the housing. A first positioning hole corresponding to the first positioning post is provided on the first integrated circuit board, and the first positioning post is sleeved on the first positioning hole, so that the first integrated circuit board is installed in the cavity of the housing.

[0011] A second positioning post is provided on the side wall of the shell, and the second positioning post extends along the width direction of the shell. A second positioning hole corresponding to the second positioning post is opened on the second integrated circuit board. The second positioning post is sleeved on the second positioning hole, so that the second integrated circuit board is installed on the side wall of the shell.

[0012] Preferably, the first positioning column and the first positioning hole are in transition fit, and the second positioning column and the second positioning hole are in transition fit.

[0013] The above solution is adopted so that when the first integrated circuit board is installed in the housing, the first positioning hole will be resisted by the first positioning column; when the second integrated circuit board is installed in the housing, the second positioning hole will be resisted by the second positioning column.

[0014] Preferably, the first integrated circuit board and the second integrated circuit board both have crimping holes that match the crimping heads, the crimping holes on the first integrated circuit board are defined as first crimping holes, and the crimping holes on the second integrated circuit board are defined as second crimping holes, the inner side walls of the first crimping holes and the inner side walls of the second crimping holes are both provided with plating, and the crimping heads are respectively crimped with the first crimping holes and the second crimping holes and contact the plating in the two crimping holes.

[0015] Preferably, the material of the crimping joint is metal, and further, the material of the crimping joint is copper alloy.

[0016] Preferably, the circumscribed circle diameter of the crimping head is larger than the diameter of the first crimping hole and the second crimping hole, and the crimping head is pressed into the first crimping hole or the second crimping hole respectively, and the crimping head squeezes and penetrates into the plating in the first crimping hole or the plating in the second crimping hole.

[0017] The above solution is adopted to ensure reliable electrical connection between the crimping head and the plating in the first crimping hole or the second crimping hole.

[0018] Preferably, the plating layers are copper plating layers, nickel plating layers, and gold plating layers, and are sequentially arranged from the inside to the outside in the first crimping hole and the second crimping hole.

[0019] Preferably, two groups of limit platforms are provided on the shell, and one group of limit platforms is provided in the cavity of the shell and extends in the height direction, and the other group of limit platforms is provided on the side wall of the shell and extends in the width direction. When the first integrated circuit board is laid flat in the cavity in the shell, the first integrated circuit board contacts the limit platforms located in the cavity; when the second integrated circuit board is installed on the side wall of the shell, the second integrated circuit board contacts the limit platforms located on the side wall of the shell.

[0020] The purpose of adopting the above scheme is that when the first integrated circuit board is moved on the shell through the first positioning column to contact a set of limit platforms located in the chamber, the first integrated circuit board is installed; when the second integrated circuit board is moved on the shell through the second positioning column to contact another set of limit platforms located on the side wall of the shell, the second integrated circuit board is installed.

[0021] The beneficial effects of the utility model are:

[0022] (1) The present invention utilizes crimping joints at both ends of a PIN needle to crimp two integrated circuit boards located at different positions on the housing. Specifically, the crimping joint is crimped to a first crimping hole on the first integrated circuit board, and the other crimping joint is crimped to a second crimping hole on the second integrated circuit board. The crimping joint squeezes and penetrates the plating on the first crimping hole or the plating on the second crimping hole, so that the first integrated circuit board, the PIN needle, and the second integrated circuit board are electrically connected, thereby replacing the welding connection method between the PIN needle and the integrated circuit board, thereby realizing live communication connection without safety risks.

[0023] (2) The utility model transitionally fits the first positioning hole on the first integrated circuit board onto the first positioning column of the shell to achieve positioning of the first integrated circuit board on the shell; and transitionally fits the second positioning hole on the second integrated circuit board onto the second positioning column of the shell to achieve positioning of the second integrated circuit board on the shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure of a PIN needle with two crimping joints in the present invention;

[0025] Figure 2 This is a schematic diagram of the structure of the PIN needle on the housing in the present utility model;

[0026] Figure 3 This is a schematic diagram of the structure in which the first integrated circuit board and the second integrated circuit board are installed on the housing in the present invention;

[0027] Figure 4 This is a schematic structural diagram of the second integrated circuit board in the present utility model;

[0028] Figure 5 This is a schematic structural diagram of the first integrated circuit board in the present utility model;

[0029] Figure 6 This is a top view of the first integrated circuit board and the second integrated circuit board installed on the housing in the present invention;

[0030] Figure 7 This is a side view of the first integrated circuit board and the second integrated circuit board installed on the housing in the present invention;

[0031] Figure 8 This is a schematic diagram of the structure of the PIN needle after passing through the first positioning hole in the present invention;

[0032] Figure 9 This is a schematic diagram of the structure of the PIN needle after passing through the second positioning hole in the present invention;

[0033] Figure 10 This is a schematic structural diagram of the limit platform in the housing of the utility model;

[0034] Figure 11 This is a schematic diagram of the positions of the limiting platform and the first integrated circuit board in the present invention, and is also a schematic diagram of the structure of the crimping head crimped onto the first integrated circuit board;

[0035] Figure 12 This is a schematic diagram of the positions of the limiting platform and the second integrated circuit board in the present invention, and is also a schematic diagram of the structure of the crimping head being crimped onto the second integrated circuit board;

[0036] In the figure: PIN needle 10, crimping head 11, housing 20, first positioning column 21, second positioning column 22, limit platform 23, first integrated circuit board 30, first crimping hole 31, first positioning hole 32, second integrated circuit board 40, second crimping hole 41, second positioning hole 42. DETAILED DESCRIPTION

[0037] In order to make the technical means, creative features, objectives and effects of the present invention easier to understand, the present invention is further described below with reference to specific illustrations.

[0038] Example 1

[0039] like Figure 1-12As shown, a communication mechanism installed in a shell, the shell 20 made of plastic has a height direction, a cavity is provided in the shell 20, including a first integrated circuit board 30 and a second integrated circuit board 40, and the first integrated circuit board 30 is installed flat in the cavity of the shell 20, specifically: the shell 20 has a length direction, the first integrated circuit board 30 has a length direction, and the length direction of the first integrated circuit board 30 is parallel to the length direction of the shell 20; more specifically, a first positioning column 21 is provided at the bottom of the shell 20, and the first positioning column 21 extends along the height direction of the shell 20, and a first positioning hole 32 corresponding to the first positioning column 21 is opened on the first integrated circuit board 30, and the first positioning column 21 and the first positioning hole 32 are transitionally matched to position the first integrated circuit board 30 in the cavity of the shell 20; the first positioning column 21 and the first positioning hole 32 transitionally match to enable the first integrated circuit board 30 to be installed in the shell 20, and the first positioning hole 32 will be resisted by the first positioning column 21;

[0040] The second integrated circuit board 40 is mounted on the side wall of the housing 20 and extends in the height direction of the housing 20. Specifically, a second positioning post 22 is provided on the side wall of the housing 20 and extends in the width direction of the housing 20. A second positioning hole 42 corresponding to the second positioning post 22 is provided on the second integrated circuit board 40. The second positioning post 22 and the second positioning hole 42 are transitionally matched to position the second integrated circuit board 40 on the side wall of the housing 20. The second positioning post 22 and the second positioning hole 42 are transitionally matched to enable the second integrated circuit board 40 to be installed in the housing 20. The second positioning hole 42 will be resisted by the second positioning post 22.

[0041] The housing 20 is provided with a PIN pin 10 (specifically, the PIN pin 10 is embedded in the housing 20). The two ends of the PIN pin 10 are provided with a copper alloy crimping head 11. The first integrated circuit board 30 and the second integrated circuit board 40 are provided with a plating layer. The crimping heads 11 at the two ends of the PIN pin 10 are respectively crimped onto the first integrated circuit board 30 and the second integrated circuit board 40 and contact the plating layer, thereby achieving electrical connection between the first integrated circuit board 30, the PIN pin 10 and the second integrated circuit board 40. Specifically, the first integrated circuit board 30 and the second integrated circuit board 10 are provided with crimping holes that match the crimping heads 11. The crimping hole on the circuit board 30 is defined as the first crimping hole 31, and the crimping hole on the second integrated circuit board 40 is defined as the second crimping hole 41. The inner side wall of the first crimping hole 31 and the inner side wall of the second crimping hole 41 are both provided with a plating, and the crimping head 11 is crimped with the first crimping hole 31 and the second crimping hole 41 respectively and contacts the plating in the two crimping holes 11; more specifically: the circumscribed circle diameter of the crimping head 11 is larger than the diameter of the first crimping hole 31 and the second crimping hole 41, and the crimping head 11 is pressed into the first crimping hole 31 or the second crimping hole 41 respectively, and the crimping head 11 squeezes and penetrates into the plating in the first crimping hole 31 or the plating in the second crimping hole 41.

[0042] The above solution is adopted to ensure reliable electrical connection between the crimping head 11 and the plating layer in the first crimping hole 31 or the second crimping hole 41 .

[0043] The plating layers are a copper plating layer, a nickel plating layer, and a gold plating layer, and are sequentially arranged from the inside to the outside in the first crimping hole 31 and the second crimping hole 41 .

[0044] Two groups of limit platforms 23 are provided on the shell 20, and one group of limit platforms 23 is provided in the cavity of the shell 20 and extends in the height direction, and the other group of limit platforms 23 is provided on the side wall of the shell 20 and extends in the width direction. When the first integrated circuit board 30 is laid flat in the cavity in the shell 20, the first integrated circuit board 30 contacts the limit platforms 23 located in the cavity; when the second integrated circuit board 40 is installed on the side wall of the shell 20, the second integrated circuit board 40 contacts the limit platforms 23 located on the side wall of the shell 20.

[0045] The purpose of adopting the above scheme is that when the first integrated circuit board 30 is moved on the shell 20 by the first positioning column 21 to contact a set of limit platforms 23 located in the chamber, the first integrated circuit board 30 is installed; when the second integrated circuit board 40 is moved on the shell 20 by the second positioning column 22 to contact another set of limit platforms 23 located on the side wall of the shell 20, the second integrated circuit board 40 is installed.

[0046] It should be noted that there are several PIN pins 10 connected between the first integrated circuit board 30 and the second integrated circuit board 40, and several PIN pins 10 also pass through the limit platform 23 (such as Figure 10 ) as shown.

[0047] The first integrated circuit board 30 and the second integrated circuit board 40 in the present invention are mounted on the housing in the following manner:

[0048] The first integrated circuit board 30 and the second integrated circuit board 40 are respectively mounted on the housing 20, that is, the first positioning hole 32 on the first integrated circuit board 30 is sleeved on the first positioning post 21 of the housing, and the second positioning hole 42 on the second integrated circuit board 40 is sleeved on the second positioning post 22 of the housing;

[0049] The first positioning post 21 of the housing 20 and the first positioning hole 32 on the first integrated circuit board 30 are matched in a transition fit manner. The second positioning post 22 of the housing 20 and the second positioning hole 42 on the second integrated circuit board 40 are matched in a transition fit manner. During the installation of the first integrated circuit board 30 and the second integrated circuit board 40 into the housing 20, the first positioning hole 32 is resisted by the first positioning post 21, and the second positioning hole 42 is resisted by the second positioning post 22.

[0050] Because the circumscribed diameter of the crimping head 11 is larger than the diameter of the first crimping hole 31 and the diameter of the second crimping hole 41, the crimping head 11 is pressed into the first crimping hole 31 of the first integrated circuit board 30 and the second crimping hole 41 of the second integrated circuit board 40, respectively. During the process of pressing the crimping head 11 into the first crimping hole 31 or the second crimping hole 41, the crimping head 11 squeezes and penetrates the plating on the first crimping hole 31 or the plating on the second crimping hole 41, thereby achieving electrical connection between the integrated circuit board and the external PIN 10. During this process, the first crimping hole 31 or the second crimping hole 41 is resisted by the crimping head 11.

[0051] During the installation of the first integrated circuit board 30 into the housing 20, the first crimping hole 31 is subject to resistance from the crimping head 11, and the first positioning hole 32 is subject to resistance from the first positioning post 21. Thus, during the process of using the tool to press the first integrated circuit board 30 into the housing 20, the first integrated circuit board 30 is subject to different resistances, causing the first integrated circuit board 30 to move downward horizontally in the height direction, thereby preventing the first integrated circuit board 30 from tilting due to uneven force, and thus preventing damage to the crimping head 11 and the first crimping hole 31. When the first integrated circuit board 30 is pressed down to contact a set of limit platforms 23 of the housing 20, the installation of the first integrated circuit board 30 is completed.

[0052] During the process of installing the second integrated circuit board 40 into the shell 20, the second crimping hole 41 will be subject to resistance from the crimping head 11, and the second positioning hole 42 will be subject to resistance from the second positioning column 41; thus, during the process of using the tool to press the second integrated circuit board 40 into the shell 20, the second integrated circuit board 40 will be subject to different resistances, causing the second integrated circuit board 40 to move along the width direction, thereby preventing the second integrated circuit board 40 from tilting due to uneven force, and further preventing damage to the crimping head 11 and the second crimping hole 41; when the second integrated circuit board 40 is pressed down to contact a set of limit platforms 23 of the shell 20, the installation of the second integrated circuit board 40 is completed.

[0053] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments and that various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A communication mechanism installed in a housing, the housing having a height direction and a chamber provided therein, characterized in that: The first integrated circuit board is installed flat in the cavity of the housing, and the second integrated circuit board is installed on the side wall of the housing, and the second integrated circuit board extends along the height direction of the housing; A PIN pin is mounted on the housing. Both ends of the PIN pin have crimping joints. The first integrated circuit board and the second integrated circuit board are provided with a plating layer. The crimping joints at both ends of the PIN pin are respectively crimped onto the first integrated circuit board and the second integrated circuit board and contact the plating layer, thereby achieving electrical connection between the first integrated circuit board, the PIN pin, and the second integrated circuit board.

2. A communication mechanism installed in a housing according to claim 1, characterized in that: The housing has a length direction, the first integrated circuit board has a length direction, and the length direction of the first integrated circuit board is parallel to the length direction of the housing.

3. A communication mechanism installed in a housing according to claim 2, characterized in that: A first positioning post is provided at the bottom of the housing and extends in the height direction of the housing. A first positioning hole corresponding to the first positioning post is provided on the first integrated circuit board. The first positioning post is sleeved on the first positioning hole to position the first integrated circuit board in the cavity of the housing. A second positioning post is provided on the side wall of the shell, and the second positioning post extends along the width direction of the shell. A second positioning hole corresponding to the second positioning post is provided on the second integrated circuit board. The second positioning post is sleeved on the second positioning hole to position the second integrated circuit board on the side wall of the shell.

4. A communication mechanism installed in a housing according to claim 3, characterized in that: The first positioning column and the first positioning hole are in transition fit, and the second positioning column and the second positioning hole are in transition fit.

5. The communication mechanism installed in a housing according to claim 1, characterized in that: The first integrated circuit board and the second integrated circuit board both have crimping holes that match the crimping heads. The crimping hole on the first integrated circuit board is defined as a first crimping hole, and the crimping hole on the second integrated circuit board is defined as a second crimping hole. The inner side walls of the first crimping hole and the inner side walls of the second crimping hole are both provided with a plating layer. The crimping heads are respectively crimped to the first crimping hole and the second crimping hole and contact the plating layers in the two crimping holes.

6. The communication mechanism installed in a housing according to claim 5, characterized in that: The circumscribed circle diameter of the crimping head is larger than the diameter of the first crimping hole and the second crimping hole. The crimping head is pressed into the first crimping hole or the second crimping hole respectively, and the crimping head squeezes and penetrates into the plating in the first crimping hole or the plating in the second crimping hole.

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