Wireless voice explainer

Abstract

The utility model relates to a wireless explaining device, in particular to a wireless voice explaining device, which comprises a transmitting part and a receiving part, and each of the transmitting part and the receiving part comprises an MCU (Microprogrammed Control Unit), a wireless module, an MIC (Microphone) voice processing module, a Bluetooth module, an audio power amplifier, a key input module and a battery charging module, the transmitting part further comprises an audio coding and decoding module and an LCD display screen. According to the utility model, the 433MHz wireless module is integrated, so that long-distance wireless voice transmission is realized, excellent anti-interference performance is achieved, battery endurance is remarkably improved, the size of the explainer is smaller, the explainer is convenient to carry, meanwhile, the limitation of a traditional explainer in the anti-interference aspect is overcome, the explaining range is expanded, and long-distance transmission is supported.

Description

Technical Field

[0001] The utility model relates to a wireless lecturer, in particular to a wireless voice lecturer. Background Art

[0002] A wireless guide is a device that transmits sound via wireless signals. It typically consists of two parts: a transmitter and a receiver. The transmitter converts the guide's voice into wireless signals and transmits them, while the receiver receives these signals and converts them into sound for the audience. This wireless transmission method allows the guide to move freely, free from the constraints of wires, while also providing a clearer and more comfortable listening experience for the audience.

[0003] For example, CN2481063Y discloses a wearable tour guide receiver. Its main technical solution includes a housing, a circuit board located within the housing, and a battery and earphones connected to the circuit board. The housing consists of a base plate and a cover plate, with the circuit board and a reinforcement plate placed between them. A battery tray for the batteries is inserted at one end of the housing. This device facilitates tourist tours. Existing wireless guides, such as the guide receiver described in this patent, suffer from issues such as bulkiness, making them difficult to carry around, weak anti-interference capabilities, limited range, and short battery life.

[0004] In order to solve the problems existing in the prior art, a wireless voice guide is proposed. Utility Model Content

[0005] The purpose of this utility model is to provide a wireless voice guide to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned object, the utility model provides a wireless voice guide, comprising a transmitting part and a receiving part, wherein the transmitting part and the receiving part both comprise an MCU control unit, a wireless module, a voice processing module, a Bluetooth module, an audio power amplifier, a key input module and a battery charging module, and the transmitting part also comprises an audio codec module and an LCD display screen;

[0007] The battery charging module supplies power to the MCU control unit, the MIC voice processing module is connected to the audio codec module or the MCU control unit, the audio codec module and the key input module are connected to the MCU control unit, the MCU control unit is connected to the Bluetooth module, the LCD display unit, and the audio power amplifier, and the MCU control unit is bidirectionally connected to the wireless module.

[0008] As a further improvement of this technical solution, the voice processing module includes a chip U13 and a microphone M1, wherein:

[0009] Pins 1, 5, 8, and 10 of the chip U13 are all grounded;

[0010] Pin 3 of the chip U13 is connected to the M+ pin of the microphone M1, and pin 4 of the chip U13 is connected to the M- pin of the microphone M1;

[0011] Pin 13 of the chip U13 is connected to the VBAT terminal;

[0012] Pin 16 of the chip U13 is connected to the MIC_O_P terminal, and pin 17 of the chip U13 is connected to the MIC_O_N terminal.

[0013] As a further improvement of the present technical solution, the audio codec module includes a chip U7, wherein pin 1 of the chip U7 is connected to the MIC2P terminal, and pin 2 of the chip U7 is connected to the MIC2N terminal;

[0014] Pin 4 of the chip U7 is connected to the N terminal of MIC1, and pin 5 of the chip U7 is connected to the N terminal of MIC3;

[0015] Pin 7 of the chip U7 is connected to the I2S_WS terminal, pin 8 of the chip U7 is connected to the I2S_CLK terminal, pin 9 of the chip U7 is connected to the resistor R35, pin 10 of the chip U7 is connected to the resistor R34, the resistor R34 is connected to the other end of the resistor R35 and to the I2S_SD terminal, and pin 11 of the chip U7 is connected to the I2S_MCK terminal;

[0016] Pin 13 of the chip U7 is connected to capacitor C33, which is grounded. Pins 14 and 31 of the chip U7 are both connected to VDD33V.

[0017] Pins 12, 15, 18, 24, 28, and 33 of the chip U7 are all grounded;

[0018] Pin 16 of the chip U7 is connected to resistor R37, and pin 17 of the chip U7 is connected to resistor R38. The resistor R38 is connected to the other end of the resistor R37 and to the VDD33V terminal.

[0019] Pin 23 of the chip U7 is connected to the SPK2N terminal, and pin 25 of the chip U7 is connected to the SPK2P terminal;

[0020] Pin 26 of the chip U7 is connected to capacitors C38 and C48 and to a diode D6, and the capacitors C38, C48 and the diode D6 are all grounded;

[0021] Pin 27 of the chip U7 is connected to capacitor C62, which is grounded; pin 32 of the chip U7 is connected to capacitor C61, which is grounded;

[0022] Pin 29 of the chip U7 is connected to capacitor C54, the capacitor C54 is connected to resistor R40, the resistor R40 is grounded, and pin 30 of the chip U7 is connected to capacitor C53, the capacitor C53 is connected to resistor R39, and the resistor R39 is grounded.

[0023] As a further improvement of this technical solution, the audio power amplifier includes a chip U8 and a terminal J6, wherein:

[0024] Pin 1 of the chip U8 is connected to the INN terminal, pin 3 of the chip U8 is connected to the INP terminal, and pin 4 of the chip U8 is connected to the SPK_SD terminal;

[0025] Pin 2 of the chip U8 is connected to capacitor C52, and the capacitor C52 is grounded;

[0026] Pin 5 of the chip U8 is connected to the inductor L4, the inductor L4 is connected to the capacitor C63 and to pin 1 of the terminal J6, and the capacitor C63 is grounded;

[0027] Pin 6 of the chip U8 is connected to capacitor C50 and capacitor C51, and pin 7 of the chip U8 is connected to the other end of the capacitor C50, the other end of the capacitor C51 and grounded;

[0028] Pin 8 of the chip U8 is connected to the inductor L2, the inductor L2 is connected to the capacitor C57 and to pin 2 of the terminal J6, the capacitor C57 is grounded, and pins 3 and 4 of the terminal J6 are both grounded.

[0029] As a further improvement of this technical solution, the wireless module includes a chip U1 and a terminal J1, wherein:

[0030] Pins 1 and 8 of the chip U1 are both grounded;

[0031] Pin 2 of the chip U1 is connected to the RF_MISO terminal, pin 3 of the chip U1 is connected to the RF_MOSI terminal, pin 4 of the chip U1 is connected to the RF_SCLK terminal, pin 5 of the chip U1 is connected to the RF_CS terminal, pin 6 of the chip U1 is connected to the RF_INT terminal, pin 7 of the chip U1 is connected to the RF_RST terminal, pin 11 of the chip U1 is connected to the RF_RX_EN terminal, pin 12 of the chip U1 is connected to the RF_TX_EN terminal, and pin 14 of the chip U1 is connected to the RF_BUSY terminal;

[0032] Pin 9 of the chip U1 is connected to pin 3 of the terminal J1, and pin 10 of the chip U1 is connected to pins 1 and 2 of the terminal J1;

[0033] The capacitors C7 and C8 at pin 13 of the chip U1 are connected in parallel to the VDD33V terminal, and the capacitor C7 is connected to the other end of the capacitor C8 and is grounded.

[0034] As a further improvement of the present technical solution, the Bluetooth module includes a chip U11, and pin 2 of the chip U11 is connected to the WIFI33V terminal;

[0035] Pins 3 and 11 of the chip U11 are both grounded;

[0036] Pin 4 of the chip U11 is connected to the BT_OSCI terminal, pin 5 of the chip U11 is connected to the BT_OSCO terminal, pin 8 of the chip U11 is connected to the BT_RXD terminal, pin 9 of the chip U11 is connected to the BT_TXD terminal, and pin 10 of the chip U11 is connected to the BT_AT terminal;

[0037] Pin 6 of the chip U11 is connected to capacitor C2 and capacitor C5, the capacitor C2 is connected to capacitor C1 and grounded, the capacitor C5 is connected to the other end of the capacitor C1 and connected to the Bluetooth antenna;

[0038] Pin 7 of the chip U11 is connected to capacitor C6, and the capacitor C6 is grounded.

[0039] As a further improvement of this technical solution, the battery power supply module includes a chip U3 and a terminal J2, wherein:

[0040] Pin 1 of the chip U3 is connected to the capacitor C10 and grounded, pin 5 of the chip U3 is connected to the other end of the capacitor C10 and pin 2 of the terminal J2 and connected to the VBAT terminal, and pins 1, 3, and 4 of the terminal J2 are all grounded;

[0041] Pin 2 of the chip U3 is connected to a resistor R19, and the resistor R19 is grounded;

[0042] Pin 3 of the chip U3 is grounded;

[0043] Pins 4 and 8 of the chip U3 are both connected to capacitor C9 and to the VUSB_5V terminal, and the capacitor C9 is grounded;

[0044] Pin 6 of the chip U3 is connected to a light-emitting diode D2, which is connected to a resistor R18. Pin 7 of the chip U3 is connected to a light-emitting diode D1, which is connected to a resistor R16. The resistor R16 is connected to the other end of the resistor R18 and to the VUSB_5V terminal.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] This wireless voice guide integrates a 433MHz wireless module to achieve long-distance wireless voice transmission, has excellent anti-interference performance, and significantly improves battery life. The guide is smaller and easier to carry. At the same time, it overcomes the limitations of traditional guides in anti-interference, expands the explanation range, and supports long-distance transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 This is the overall structural diagram of the utility model;

[0048] Figure 2 This is the circuit diagram of the voice processing module of the present utility model;

[0049] Figure 3 This is the circuit diagram of the audio codec module of the utility model;

[0050] Figure 4 This is the circuit diagram of the audio power amplifier of the utility model;

[0051] Figure 5 This is the circuit diagram of the wireless module of the present utility model;

[0052] Figure 6 This is the circuit diagram of the Bluetooth module of the present utility model;

[0053] Figure 7 This is the circuit diagram of the battery power supply module of the present utility model. DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0055] With the improvement of living standards, travel has become a common consumer phenomenon. People are free to choose between self-driving tours and group tours, but regardless of the choice, the role of a tour guide remains crucial. Even on self-driving tours, visitors seeking a deeper understanding of the history and culture of a particular destination often require a local tour guide to provide a detailed explanation. Tour guides not only share the unique charm of a destination, its historical stories, and legends, but also remind visitors of safety precautions, monitor group size and safety, and properly handle any emergencies.

[0056] Initially, tour guides used megaphones during their tours, often due to the large number of groups. However, the loud volume of megaphones, combined with their simultaneous use by multiple groups, often caused a flood of noise within scenic areas, disrupting the tranquil atmosphere. Furthermore, prolonged loud speaking by tour guides can damage their voices. Nowadays, some tourists are equipped with portable megaphones, which amplify microphones or pre-recorded audio. However, these devices have limited coverage, are significantly affected by distance, and experience significant sound attenuation, placing high demands on the interpreters. Currently available megaphones are large, difficult to carry, and have poor anti-interference capabilities. They also increase noise when held too close to the microphone, making them disruptive when used in public places. Furthermore, their range is limited, they lack long-distance transmission capabilities, and their sound transmission has significant limitations, making them unsuitable for outdoor use.

[0057] See also Figure 1-Figure 7 As shown, this embodiment provides a wireless voice guide, including a transmitting part and a receiving part. The transmitting part and the receiving part both include an MCU control unit, a wireless module, a MIC voice processing module, a Bluetooth module, an audio power amplifier, a key input module and a battery charging module. The transmitting part also includes an audio codec module and an LCD display.

[0058] The battery charging module supplies power to the MCU control unit. The MIC voice processing module is connected to the audio codec module or the MCU control unit. The audio codec module and the key input module are connected to the MCU control unit. The MCU control unit is connected to the Bluetooth module, the LCD display unit, and the audio power amplifier. The audio power amplifier is connected to the audio playback unit. The MCU control unit is bidirectionally connected to the wireless module.

[0059] The transmitting part is the host of the control system, and the receiving part is the extension of the control system. The host and the extension are wirelessly connected through the communication module. The host and the extension can be selected one-to-one or one-to-many. After the extension and the host are paired, the host and the extension communicate the communication channel, and the extension MCU main control unit sends a command to the communication module to put it into a low-power receiving state.

[0060] In this embodiment, the host's microphone MIC voice processing module is responsible for receiving and processing incoming sound signals. It converts the analog sound signal into a digital signal. After processing, these digital signals are output to the host's controller (MCU) main control unit. The host MCU main control unit then packages the voice data and transmits the data to the 433M wireless module via the I2S interface. After receiving the voice data, the 433M wireless module is responsible for sending it, thus realizing the voice transmission process.

[0061] When the extension detects data transmission from the host's 433M wireless module, it automatically activates the extension's MCU. The extension then passes the received voice data to the MCU via the I2S interface, which converts the digital signal into an analog signal. The converted analog signal is then sent to the audio power amplifier and ultimately played through the speaker, completing the entire voice reception process.

[0062] Furthermore, the voice processing module includes a chip U13 and a microphone M1, wherein:

[0063] Pins 1, 5, 8, and 10 of chip U13 are all grounded;

[0064] Pin 3 of chip U13 is connected to the M+ pin of microphone M1, and pin 4 of chip U13 is connected to the M- pin of microphone M1;

[0065] Pin 13 of chip U13 is connected to VBAT terminal;

[0066] Pin 16 of chip U13 is connected to the MIC_O_P terminal, and pin 17 of chip U13 is connected to the MIC_O_N terminal.

[0067] The audio codec module includes chip U7, pin 1 of chip U7 is connected to MIC2P, and pin 2 of chip U7 is connected to MIC2N.

[0068] Pin 4 of chip U7 is connected to the N terminal of MIC1, and pin 5 of chip U7 is connected to the N terminal of MIC3;

[0069] Pin 7 of chip U7 is connected to the I2S_WS terminal, pin 8 of chip U7 is connected to the I2S_CLK terminal, pin 9 of chip U7 is connected to resistor R35, pin 10 of chip U7 is connected to resistor R34, resistor R34 is connected to the other end of resistor R35 and connected to the I2S_SD terminal, and pin 11 of chip U7 is connected to the I2S_MCK terminal;

[0070] Pin 13 of chip U7 is connected to capacitor C33, capacitor C33 is grounded, and pins 14 and 31 of chip U7 are connected to VDD33V.

[0071] Pins 12, 15, 18, 24, 28, and 33 of chip U7 are all grounded;

[0072] Pin 16 of chip U7 is connected to resistor R37, pin 17 of chip U7 is connected to resistor R38, resistor R38 is connected to the other end of resistor R37 and connected to the VDD33V terminal;

[0073] Pin 23 of chip U7 is connected to SPK2N terminal, and pin 25 of chip U7 is connected to SPK2P terminal;

[0074] Pin 26 of chip U7 is connected to capacitors C38 and C48 and diode D6. Capacitors C38, C48 and diode D6 are all grounded.

[0075] Pin 27 of chip U7 is connected to capacitor C62, which is grounded; pin 32 of chip U7 is connected to capacitor C61, which is grounded;

[0076] Pin 29 of chip U7 is connected to capacitor C54, capacitor C54 is connected to resistor R40, resistor R40 is grounded, and pin 30 of chip U7 is connected to capacitor C53, capacitor C53 is connected to resistor R39, and resistor R39 is grounded.

[0077] The voice processing module works in conjunction with the audio codec module to emit sound waves with the opposite phase and the same amplitude as the noise through the working principle of active noise reduction. That is, the mutual interference of sound waves is used to eliminate noise, ensuring high-definition sound quality and preventing sound quality distortion caused by increased transmission distance.

[0078] The audio power amplifier includes chip U8 and terminal J6, where:

[0079] Pin 1 of chip U8 is connected to the INN terminal, pin 3 of chip U8 is connected to the INP terminal, and pin 4 of chip U8 is connected to the SPK_SD terminal;

[0080] Pin 2 of chip U8 is connected to capacitor C52, which is grounded.

[0081] Pin 5 of chip U8 is connected to inductor L4, inductor L4 is connected to capacitor C63 and to pin 1 of terminal J6, and capacitor C63 is grounded;

[0082] Pin 6 of chip U8 is connected to capacitor C50 and capacitor C51, and pin 7 of chip U8 is connected to the other end of capacitor C50, the other end of capacitor C51 and ground;

[0083] Pin 8 of chip U8 is connected to inductor L2, inductor L2 is connected to capacitor C57 and to pin 2 of terminal J6, capacitor C57 is grounded, and pins 3 and 4 of terminal J6 are both grounded.

[0084] The wireless module includes chip U1 and terminal J1, where:

[0085] Pins 1 and 8 of chip U1 are both grounded;

[0086] Pin 2 of chip U1 is connected to RF_MISO, pin 3 of chip U1 is connected to RF_MOSI, pin 4 of chip U1 is connected to RF_SCLK, pin 5 of chip U1 is connected to RF_CS, pin 6 of chip U1 is connected to RF_INT, pin 7 of chip U1 is connected to RF_RST, pin 11 of chip U1 is connected to RF_RX_EN, pin 12 of chip U1 is connected to RF_TX_EN, and pin 14 of chip U1 is connected to RF_BUSY.

[0087] Connect pin 9 of chip U1 to pin 3 of terminal J1, and pin 10 of chip U1 to pins 1 and 2 of terminal J1;

[0088] Capacitors C7 and C8 at pin 13 of chip U1 are connected in parallel to the VDD33V terminal, and capacitor C7 is connected to the other end of capacitor C8 and grounded.

[0089] Chip U1 is the SX1278 wireless chip.

[0090] In this embodiment, the 433MHz wireless module using the SX1278 wireless chip and the radio frequency power amplifier PA chip significantly improves the wireless transmission distance.

[0091] The Bluetooth module includes chip U11, and pin 2 of chip U11 is connected to the WIFI33V terminal;

[0092] Pins 3 and 11 of chip U11 are both grounded;

[0093] Pin 4 of chip U11 is connected to BT_OSCI, pin 5 of chip U11 is connected to BT_OSCO, pin 8 of chip U11 is connected to BT_RXD, pin 9 of chip U11 is connected to BT_TXD, and pin 10 of chip U11 is connected to BT_AT.

[0094] Pin 6 of chip U11 is connected to capacitor C2 and capacitor C5. Capacitor C2 is connected to capacitor C1 and grounded. Capacitor C5 is connected to the other end of capacitor C1 and connected to the Bluetooth antenna.

[0095] Pin 7 of chip U11 is connected to capacitor C6, and capacitor C6 is grounded.

[0096] Chip U11 is the CH9141 Bluetooth chip.

[0097] In this embodiment, a Bluetooth module is integrated to communicate with the host MCU via the UART serial port using the CH9141 Bluetooth chip, so that users can now use a mobile phone to configure the host via Bluetooth connection.

[0098] The battery-powered module includes chip U3 and terminal J2, where:

[0099] Pin 1 of chip U3 is connected to capacitor C10 and grounded. Pin 5 of chip U3 is connected to the other end of capacitor C10 and pin 2 of terminal J2 and connected to VBAT. Pins 1, 3, and 4 of terminal J2 are all grounded.

[0100] Pin 2 of chip U3 is connected to resistor R19, which is grounded.

[0101] Pin 3 of chip U3 is grounded;

[0102] Pins 4 and 8 of chip U3 are connected to capacitor C9 and VUSB_5V, and capacitor C9 is grounded.

[0103] Pin 6 of chip U3 is connected to light-emitting diode D2, which is connected to resistor R18. Pin 7 of chip U3 is connected to light-emitting diode D1, which is connected to resistor R16. Resistor R16 is connected to the other end of resistor R18 and to the VUSB_5V terminal.

[0104] In summary, the wireless audio guide in this embodiment utilizes an advanced low-power design, ensuring the device's battery life even under extended use. By optimizing the MCU control unit's operating mode, when the guide is not operating, the host MCU control unit (see the accompanying figure) will disable the Bluetooth module and audio power amplifier through the I / O port, and the program will automatically enter a sleep state, significantly reducing energy consumption.

[0105] Secondly, to enhance anti-interference capabilities, this wireless audio guide integrates the advanced LoRa algorithm into its 433MHz wireless module. This algorithm effectively identifies and filters out interference signals in the environment, ensuring clear voice signal transmission. Furthermore, the device utilizes dynamic frequency selection technology to automatically select the optimal communication frequency based on the current environment. This technology scans the fixed 440MHz-470MHz frequency band for interference-free frequencies and selects them for communication, further improving signal stability and reliability.

[0106] In terms of the range of the explanation, this wireless audio guide significantly improves the coverage of the wireless signal by optimizing the antenna design and adjusting the transmission power. This enables the guide to provide clear audio explanations in a larger area, meeting the needs of different occasions.

[0107] Finally, to facilitate user operation, this wireless audio guide features a user-friendly interface. An LCD display clearly displays the current operating status and battery level, while a keypad allows for easy configuration and operation. Furthermore, the device supports Bluetooth connectivity with devices such as smartphones, enabling remote control and updating of audio content.

[0108] In summary, this wireless voice guide has significant advantages in terms of size, anti-interference ability, explanation range and battery life, and can provide users with a more convenient, efficient and comfortable voice explanation experience.

[0109] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A wireless voice guide, characterized by: It includes a transmitting part and a receiving part, each of which includes an MCU control unit, a wireless module, a voice processing module, a Bluetooth module, an audio power amplifier, a key input module and a battery charging module. The transmitting part also includes an audio codec module and an LCD display; The battery charging module supplies power to the MCU control unit, the MIC voice processing module is connected to the audio codec module or the MCU control unit, the audio codec module and the key input module are connected to the MCU control unit, the MCU control unit is connected to the Bluetooth module, the LCD display unit, and the audio power amplifier, and the MCU control unit is bidirectionally connected to the wireless module.

2. The wireless audio guide according to claim 1, characterized in that: The voice processing module includes a chip U13 and a microphone M1, wherein: Pins 1, 5, 8, and 10 of the chip U13 are all grounded; Pin 3 of the chip U13 is connected to the M+ pin of the microphone M1, and pin 4 of the chip U13 is connected to the M- pin of the microphone M1; Pin 13 of the chip U13 is connected to the VBAT terminal; Pin 16 of the chip U13 is connected to the MIC_O_P terminal, and pin 17 of the chip U13 is connected to the MIC_O_N terminal.

3. The wireless audio guide according to claim 1, characterized in that: The audio codec module includes a chip U7, wherein pin 1 of the chip U7 is connected to the MIC2P terminal, and pin 2 of the chip U7 is connected to the MIC2N terminal; Pin 4 of the chip U7 is connected to the N terminal of MIC1, and pin 5 of the chip U7 is connected to the N terminal of MIC3; Pin 7 of the chip U7 is connected to the I2S_WS terminal, pin 8 of the chip U7 is connected to the I2S_CLK terminal, pin 9 of the chip U7 is connected to the resistor R35, pin 10 of the chip U7 is connected to the resistor R34, the resistor R34 is connected to the other end of the resistor R35 and to the I2S_SD terminal, and pin 11 of the chip U7 is connected to the I2S_MCK terminal; Pin 13 of the chip U7 is connected to capacitor C33, which is grounded. Pins 14 and 31 of the chip U7 are both connected to VDD33V. Pins 12, 15, 18, 24, 28, and 33 of the chip U7 are all grounded; Pin 16 of the chip U7 is connected to resistor R37, and pin 17 of the chip U7 is connected to resistor R38. The resistor R38 is connected to the other end of the resistor R37 and to the VDD33V terminal. Pin 23 of the chip U7 is connected to the SPK2N terminal, and pin 25 of the chip U7 is connected to the SPK2P terminal; Pin 26 of the chip U7 is connected to capacitors C38 and C48 and to a diode D6, and the capacitors C38, C48 and the diode D6 are all grounded; Pin 27 of the chip U7 is connected to capacitor C62, which is grounded; pin 32 of the chip U7 is connected to capacitor C61, which is grounded; Pin 29 of the chip U7 is connected to capacitor C54, the capacitor C54 is connected to resistor R40, the resistor R40 is grounded, and pin 30 of the chip U7 is connected to capacitor C53, the capacitor C53 is connected to resistor R39, and the resistor R39 is grounded.

4. The wireless audio guide according to claim 1, characterized in that: The audio power amplifier includes a chip U8 and a terminal J6, wherein: Pin 1 of the chip U8 is connected to the INN terminal, pin 3 of the chip U8 is connected to the INP terminal, and pin 4 of the chip U8 is connected to the SPK_SD terminal; Pin 2 of the chip U8 is connected to capacitor C52, and the capacitor C52 is grounded; Pin 5 of the chip U8 is connected to the inductor L4, the inductor L4 is connected to the capacitor C63 and to pin 1 of the terminal J6, and the capacitor C63 is grounded; Pin 6 of the chip U8 is connected to capacitor C50 and capacitor C51, and pin 7 of the chip U8 is connected to the other end of the capacitor C50, the other end of the capacitor C51 and grounded; Pin 8 of the chip U8 is connected to the inductor L2, the inductor L2 is connected to the capacitor C57 and to pin 2 of the terminal J6, the capacitor C57 is grounded, and pins 3 and 4 of the terminal J6 are both grounded.

5. The wireless audio guide according to claim 1, characterized in that: The wireless module includes a chip U1 and a terminal J1, wherein: Pins 1 and 8 of the chip U1 are both grounded; Pin 2 of the chip U1 is connected to the RF_MISO terminal, pin 3 of the chip U1 is connected to the RF_MOSI terminal, pin 4 of the chip U1 is connected to the RF_SCLK terminal, pin 5 of the chip U1 is connected to the RF_CS terminal, pin 6 of the chip U1 is connected to the RF_INT terminal, pin 7 of the chip U1 is connected to the RF_RST terminal, pin 11 of the chip U1 is connected to the RF_RX_EN terminal, pin 12 of the chip U1 is connected to the RF_TX_EN terminal, and pin 14 of the chip U1 is connected to the RF_BUSY terminal; Pin 9 of the chip U1 is connected to pin 3 of the terminal J1, and pin 10 of the chip U1 is connected to pins 1 and 2 of the terminal J1; The capacitors C7 and C8 at pin 13 of the chip U1 are connected in parallel to the VDD33V terminal, and the capacitor C7 is connected to the other end of the capacitor C8 and is grounded.

6. The wireless audio guide according to claim 1, characterized in that: The Bluetooth module includes a chip U11, and pin 2 of the chip U11 is connected to the WIFI33V terminal; Pins 3 and 11 of the chip U11 are both grounded; Pin 4 of the chip U11 is connected to the BT_OSCI terminal, pin 5 of the chip U11 is connected to the BT_OSCO terminal, pin 8 of the chip U11 is connected to the BT_RXD terminal, pin 9 of the chip U11 is connected to the BT_TXD terminal, and pin 10 of the chip U11 is connected to the BT_AT terminal; Pin 6 of the chip U11 is connected to capacitor C2 and capacitor C5, the capacitor C2 is connected to capacitor C1 and grounded, the capacitor C5 is connected to the other end of the capacitor C1 and connected to the Bluetooth antenna; Pin 7 of the chip U11 is connected to capacitor C6, and the capacitor C6 is grounded.

7. The wireless audio guide according to claim 1, characterized in that: The battery power supply module includes a chip U3 and a terminal J2, wherein: Pin 1 of the chip U3 is connected to the capacitor C10 and grounded, pin 5 of the chip U3 is connected to the other end of the capacitor C10 and pin 2 of the terminal J2 and connected to the VBAT terminal, and pins 1, 3, and 4 of the terminal J2 are all grounded; Pin 2 of the chip U3 is connected to a resistor R19, and the resistor R19 is grounded; Pin 3 of the chip U3 is grounded; Pins 4 and 8 of the chip U3 are both connected to capacitor C9 and to the VUSB_5V terminal, and the capacitor C9 is grounded; Pin 6 of the chip U3 is connected to a light-emitting diode D2, which is connected to a resistor R18. Pin 7 of the chip U3 is connected to a light-emitting diode D1, which is connected to a resistor R16. The resistor R16 is connected to the other end of the resistor R18 and to the VUSB_5V terminal.

Images