Polishing device

Abstract

The utility model provides a polishing device. The polishing device comprises a polishing disc, an offset adjusting assembly and a pressure adjusting assembly. The deviation adjusting assembly is arranged on one side of the polishing disc and comprises a first suspension magnetic part connected with the polishing disc. The inclination angle of the polishing disc is adjusted by adjusting the magnetic force of the first suspension magnetic part, and the inclination angle is the included angle between the polishing disc and the horizontal plane. The pressure adjusting assembly is arranged on one side of the polishing disc and comprises a second suspension magnetic part connected with the polishing disc. And the pressure of the polishing disc on the to-be-polished part is adjusted by adjusting the magnetic force of the second suspension magnetic part. According to the polishing device, the to-be-polished part is accurately polished by adopting the magnetic suspension offset adjusting assembly and the pressure adjusting device, the structure of the polishing device is simplified, and the manufacturing cost and the maintenance cost of the polishing device are reduced.

Description

Technical Field

[0001] The present application belongs to the field of polishing technology, and in particular relates to a polishing device. Background Art

[0002] In the field of polishing technology, commonly used polishing methods include flexible grinding and polishing methods based on flexible terminals, flexible grinding and polishing dies, CNC machine tool control, and robotic control. However, the polishing equipment used in these polishing methods typically requires a high degree of adaptability, precision, and complex control algorithms, resulting in complex polishing equipment structures and high R&D and maintenance costs. Utility Model Content

[0003] In view of this, the present application provides a polishing device, which includes:

[0004] Polishing disc, used for polishing the workpiece;

[0005] an offset adjustment assembly disposed on one side of the polishing plate, the offset adjustment assembly comprising a first suspension magnetic portion connected to the polishing plate; wherein the inclination angle of the polishing plate is adjusted by adjusting the magnetic force of the first suspension magnetic portion, the inclination angle being the angle between the polishing plate and a horizontal plane;

[0006] A pressure regulating assembly is provided on one side of the polishing disc, and the pressure regulating assembly includes a second suspended magnetic portion connected to the polishing disc; wherein, by adjusting the magnetic force of the second suspended magnetic portion, the pressure of the polishing disc on the workpiece to be polished is adjusted.

[0007] The polishing device provided by the present application is composed of a polishing disc, an offset adjustment component, and a pressure adjustment component. The offset adjustment component is used to control the inclination angle of the polishing disc, and the pressure adjustment device is used to control the pressure of the polishing disc on the workpiece to be polished. The two cooperate with each other to make the polishing disc fit the workpiece to be polished more closely and apply pressure to the workpiece to be polished more accurately, thereby improving the polishing effect of the workpiece to be polished. In addition, both the offset adjustment component and the pressure adjustment device can be controlled by adjusting the magnetic force. They have the advantages of magnetic suspension, and have lower energy consumption, longer service life, and greater bearing capacity during suspended operation, so that the polishing device can polish at high speed, has strong controllability, runs smoothly, has less vibration and noise, and has good adaptability, high precision, and high stability. In addition, the manufacturing cost and maintenance cost of the offset adjustment component and the pressure adjustment device are also relatively low.

[0008] In summary, the present application achieves precise polishing of the workpiece to be polished by adopting a magnetically suspended offset adjustment component and a pressure adjustment device, simplifies the structure of the polishing device, and reduces the manufacturing cost and maintenance cost of the polishing device.

[0009] In which, the offset adjustment component also includes a plurality of first electromagnetic components arranged on the side of the first suspended magnetic part away from the polishing disk, and the plurality of first electromagnetic components are arranged at intervals along the circumferential direction of the polishing disk; wherein, by adjusting the magnetic force between at least one of the first electromagnetic components and the first suspended magnetic part, the angle between the first suspended magnetic part and the horizontal plane is adjusted, thereby adjusting the inclination angle of the polishing disk.

[0010] The first suspended magnetic portion includes a first magnetic sub-portion and a second magnetic sub-portion stacked along an arrangement direction from the polishing disk to the first electromagnetic component, and the radial dimension of the first magnetic sub-portion is greater than that of the second magnetic sub-portion.

[0011] The offset adjustment assembly further includes a detection member and a controller electrically connected to each other, the detection member is used to obtain voltage values ​​of the plurality of first electromagnetic members, and the controller is used to adjust the first electromagnetic members;

[0012] Wherein, if the voltage value is outside the preset voltage range, the controller sends a reminder signal, and the reminder signal is used to start the reminder component; and / or the controller adjusts the first electromagnetic component.

[0013] Wherein, the pressure adjustment assembly also includes a second electromagnetic component arranged on the side of the second suspended magnetic part away from the polishing disk; wherein, by adjusting the magnetic force between the second electromagnetic component and the second suspended magnetic part, the pressure of the polishing disk on the workpiece to be polished is adjusted.

[0014] The second electromagnetic component includes an annular electromagnetic support and a plurality of electromagnetic parts, wherein the plurality of electromagnetic parts are arranged at intervals along the circumferential direction of the polishing plate, and the annular electromagnetic support is provided on a side of the plurality of electromagnetic parts facing the polishing plate;

[0015] The second suspension magnetic portion includes a plurality of suspension magnetic sub-portions, which are arranged at intervals along the circumferential direction of the polishing disk, and the suspension magnetic sub-portions are correspondingly arranged to the electromagnetic portion.

[0016] Wherein, the pressure regulating assembly further comprises a pressure sensor and a controller which are electrically connected, the pressure sensor is used to obtain the pressure value of the polishing disc on the workpiece to be polished, and the controller is used to regulate the second electromagnetic component;

[0017] The pressure sensor is used to send a pressure signal according to the obtained pressure value, and the controller is used to receive the pressure signal and adjust the second electromagnetic component.

[0018] The polishing device further comprises a first reinforcing plate connected to the polishing disc, the first levitation magnetic portion and the second levitation magnetic portion are provided on a side of the first reinforcing plate facing away from the polishing disc, and the second levitation magnetic portion is arranged around the first levitation magnetic portion;

[0019] The offset adjustment assembly also includes a plurality of first electromagnetic components arranged on the side of the first suspension magnetic part facing away from the polishing disk, and the pressure adjustment assembly also includes a second electromagnetic component arranged on the side of the second suspension magnetic part facing away from the polishing disk; the polishing device also includes a second reinforcement plate, and the first electromagnetic component and the second electromagnetic component are provided on the side of the second reinforcement plate facing the polishing disk, and the second electromagnetic component is arranged around the first electromagnetic component.

[0020] Among them, the polishing device also includes a limiting assembly, which includes an inner ring and an outer ring. The inner ring is used to fix the motor, and the motor is used to connect the polishing disk to drive the polishing disk to rotate. The outer ring is sleeved on the inner ring, and the outer ring is rotatably connected to the inner ring. The inner ring and the motor can swing relative to the outer ring.

[0021] Among them, the limiting assembly also includes a limiting shell mounted on the outer ring, and the limiting shell is used to support the peripheral side wall of the outer ring, thereby limiting the displacement of the outer ring in the horizontal direction, and the outer ring can slide in the vertical direction relative to the limiting shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0023] Figure 1 This is a three-dimensional structural diagram of a polishing device provided in one embodiment of the present application.

[0024] Figure 2 This is a schematic structural diagram of a polishing device provided in one embodiment of the present application.

[0025] Figure 3 A schematic structural diagram of an offset adjustment assembly provided in one embodiment of the present application.

[0026] Figure 4 This is a structural schematic diagram of the offset adjustment component provided in one embodiment of the present application from another perspective.

[0027] Figure 5 A schematic structural diagram of a pressure regulating assembly provided in one embodiment of the present application.

[0028] Figure 6 This is a schematic structural diagram of a polishing device portion provided in one embodiment of the present application.

[0029] Figure 7 This is a schematic structural diagram of another part of the polishing device provided in one embodiment of the present application.

[0030] Figure 8 This is a schematic cross-sectional view of a polishing device provided in one embodiment of the present application.

[0031] Explanation of reference numerals: polishing device 1, polishing disc 10, offset adjustment assembly 20, first suspended magnetic part 21, first magnetic sub-part 211, second magnetic sub-part 212, first electromagnetic component 22, detection component 23, pressure adjustment assembly 30, second suspended magnetic part 31, suspended magnetic sub-part 311, second electromagnetic component 32, annular electromagnetic bracket 321, electromagnetic part 322, annular magnetic part 323, pressure sensor 33, first reinforcement plate 41, second reinforcement plate 42, limit assembly 50, inner ring 51, outer ring 52, limit housing 53, fixed shaft 54, motor 60. DETAILED DESCRIPTION

[0032] The following are preferred implementations of the present application. It should be noted that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

[0033] Before introducing the technical solutions of the present application, the technical problems in the related technologies are introduced in detail.

[0034] In the field of polishing technology, commonly used polishing methods include: flexible terminal-based, flexible grinding and polishing die-based, CNC machine tool-based, and robot-based flexible grinding and polishing methods. The following is a detailed introduction to the airbag polishing method and the flexible floating polishing actuator polishing method:

[0035] Bonnet Tool Polishing (BTP): This method uses a flexible polishing head consisting of a spherical bladder filled with low-pressure gas and an external rotating working component. The outer surface of the bladder is covered with a specialized polishing film. This flexible bladder adaptively deforms based on the shape of the workpiece surface, ensuring a perfect fit. By adjusting the air pressure within the bladder, the contact flexibility between the polishing head and the workpiece surface and the size of the polishing area can be precisely controlled, thereby achieving fine-tuned material removal efficiency.

[0036] However, the airbag polishing method has the following drawbacks. First, the dynamic characteristics of the robotic airbag polishing system are poor. During the actual polishing process, it is susceptible to forced vibrations caused by the polishing force, which requires dynamic model analysis and optimization to reduce the impact of vibration. Second, due to the size limitations of the polishing airbag, it also produces the waviness characteristic inherent in small-head polishing tools. Third, while airbag polishing technology is widely used for a variety of materials, further research and improvement are still needed for the ultra-high precision and low roughness requirements of certain specialized materials.

[0037] Flexible floating grinding actuator polishing method: The core of this method lies in the provision of constant axial and radial floating forces through a floating structure design. This design allows the grinding head to adapt to irregularities in the workpiece surface during operation. Combined with high-precision sensors and advanced control algorithms, it achieves precise control and adaptive adjustment of the grinding process, thus meeting the grinding requirements in complex working conditions.

[0038] However, the flexible floating polishing actuator polishing method has the following drawbacks: First, the flexible floating polishing actuator technology is relatively complex, requiring the integration and coordination of software and hardware systems, high adaptability and precision, and complex control algorithms. Second, the equipment manufacturing cost is high, requiring a large initial capital investment, and high R&D and maintenance costs.

[0039] In view of this, in order to solve the above problems, please refer to Figure 1-Figure 5 , this embodiment provides a polishing device 1, which includes a polishing disc 10, an offset adjustment component 20, and a pressure adjustment component 30. The polishing disc 10 is used to polish the workpiece to be polished. The offset adjustment component 20 is provided on one side of the polishing disc 10, and the offset adjustment component 20 includes a first suspended magnetic portion 21 connected to the polishing disc 10; wherein, by adjusting the magnetic force of the first suspended magnetic portion 21, the inclination angle of the polishing disc 10 is adjusted, and the inclination angle is the angle between the polishing disc 10 and the horizontal plane. The pressure adjustment component 30 is provided on one side of the polishing disc 10, and the pressure adjustment component 30 includes a second suspended magnetic portion 31 connected to the polishing disc 10; wherein, by adjusting the magnetic force of the second suspended magnetic portion 31, the pressure of the polishing disc 10 on the workpiece to be polished is adjusted.

[0040] Polishing device 1 is used to polish workpieces. These workpieces can include metal parts, optical components, semiconductor wafers, and the like. Polishing device 1 is not only suitable for small-scale desktop grinding and polishing, but can also be integrated with industrial intelligent polishing systems for large-scale machining or precision machining. By combining a more sophisticated flexible control system and calibration, it achieves more precise control and achieves better grinding and polishing results.

[0041] The polishing pad 10 is used to contact a workpiece to be polished for polishing. The polishing pad 10 has a polishing surface for contacting the workpiece. Optionally, the polishing surface is positioned away from the offset adjustment assembly 20 and away from the pressure adjustment assembly 30. Optionally, the polishing pad 10 has an inclination angle of 0°-30°, specifically, for example, 0°, 5°, 10°, 15°, 20°, 25°, or 30°.

[0042] The offset adjustment assembly 20 is used to control the inclination angle of the polishing disc 10. The offset adjustment assembly 20 is provided on one side of the polishing disc 10 and is connected to the polishing disc 10. The offset adjustment assembly 20 includes a first suspension magnetic portion 21, which is connected to the side of the polishing disc 10 facing away from the polishing surface. The first suspension magnetic portion 21 can be directly connected to the polishing disc 10, or indirectly connected to the polishing disc 10 through other components. The first suspension magnetic portion 21 can be in a suspended state under the action of magnetic force, and the degree of inclination of the first suspension magnetic portion 21 relative to the horizontal plane can be changed, thereby changing the inclination angle of the polishing disc 10. Magnetic force includes attractive force and repulsive force. For example, when the first suspension magnetic portion 21 and the electromagnetic component attract each other, the distance between the two is reduced to change the position of the first suspension magnetic portion 21, thereby adjusting the degree of inclination of the first suspension magnetic portion 21 and adjusting the inclination angle of the polishing disc 10. For another example, when the first suspended magnetic portion 21 and the electromagnetic element repel each other, the distance between them increases, changing the position of the first suspended magnetic portion 21, thereby adjusting the tilt of the first suspended magnetic portion 21 and the tilt angle of the polishing platen 10. Optionally, the angle between the first suspended magnetic portion 21 and the horizontal plane is 0°-30°, with specific examples including 0°, 5°, 10°, 15°, 20°, 25°, or 30°. Optionally, the angle between the first suspended magnetic portion 21 and the horizontal plane is equal to the tilt angle of the polishing platen 10.

[0043] The pressure regulating device is used to control the pressure exerted by the polishing disk 10 on the workpiece to be polished. Pressure refers to the force applied by the polishing disk 10 to the workpiece to be polished in a direction perpendicular to the horizontal plane. The pressure regulating device is located on one side of the polishing disk 10 and is connected to the polishing disk 10. Optionally, the offset adjustment assembly 20 and the pressure regulating device are located on the same side of the polishing disk 10. Optionally, the offset adjustment assembly 20 is closer to the polishing disk 10 than the pressure regulating device. The pressure regulating device includes a second suspended magnetic portion 31, which is connected to the side of the polishing disk 10 facing away from the polishing surface. The second suspended magnetic portion 31 can be directly connected to the polishing disk 10 or indirectly connected to the polishing disk 10 through other components. The second suspended magnetic portion 31 can be suspended under the action of magnetic force and change the pressure exerted by the polishing disk 10 on the workpiece to be polished. Magnetic force includes attractive and repulsive forces. For example, when the second suspended magnetic portion 31 and the electromagnetic element attract each other, the distance between them decreases, thereby reducing the pressure exerted by the polishing disk 10 on the workpiece to be polished. For another example, when the second levitation magnetic portion 31 and the electromagnetic member repel each other, the distance between them increases, so that the pressure of the polishing disc 10 on the workpiece to be polished increases.

[0044] Specifically, the offset adjustment assembly 20 and the pressure adjustment device cooperate with each other to allow the polishing disc 10 to more closely conform to the workpiece to be polished and to apply pressure more accurately to the workpiece to be polished, thereby improving the polishing effect of the workpiece to be polished. Furthermore, both the offset adjustment assembly 20 and the pressure adjustment device can be controlled by adjusting the magnetic force, which provides the advantages of magnetic levitation. During suspended operation, the device has low energy consumption, a longer service life, and a greater load-bearing capacity. This enables the polishing device 1 to perform high-speed polishing, with strong controllability, smooth operation, low vibration and noise, and good adaptability, high precision, and high stability. Furthermore, the manufacturing and maintenance costs of the offset adjustment assembly 20 and the pressure adjustment device are relatively low.

[0045] In summary, this embodiment uses a magnetically suspended offset adjustment assembly 20 and a pressure adjustment device to achieve precise polishing of the workpiece, simplifies the structure of the polishing device 1, and reduces the manufacturing cost and maintenance cost of the polishing device 1.

[0046] Please refer to Figures 1-4 In one embodiment, the offset adjustment assembly 20 further includes a plurality of first electromagnetic components 22 provided on the side of the first suspended magnetic portion 21 facing away from the polishing disk 10, and the plurality of first electromagnetic components 22 are arranged at intervals along the circumferential direction of the polishing disk 10; wherein, by adjusting the magnetic force between at least one of the first electromagnetic components 22 and the first suspended magnetic portion 21, the angle between the first suspended magnetic portion 21 and the horizontal plane is adjusted, thereby adjusting the inclination angle of the polishing disk 10.

[0047] The first electromagnetic element 22 and the first suspended magnetic portion 21 can attract or repel each other. The first electromagnetic element 22 can be an electromagnetic coil. For example, the first electromagnetic element 22 is composed of 0.4 mm enameled wire, tightly wound in multiple layers in a spiral pattern, to improve the coil's current capacity and the uniformity of the electromagnetic field. The presence of an iron core within the coil enhances magnetism. By adjusting the current flowing through the first electromagnetic element 22, the magnetic force between the first electromagnetic element 22 and the first suspended magnetic portion 21 can be adjusted, thereby varying the inclination of the first suspended magnetic portion 21. The number of first electromagnetic elements 22 ranges from 2 to 10, with specific examples including 2, 3, 4, 5, 6, 7, 8, 9, or 10. Optionally, multiple first electromagnetic elements 22 are spaced apart along the circumferential direction of the first suspended magnetic portion 21. Optionally, the spacing between adjacent first electromagnetic elements 22 is equal.

[0048] Optionally, the number of the first electromagnetic components 22 is four, and the four first electromagnetic components 22 are arranged at intervals along the circumferential direction of the polishing disc 10. For example, by adjusting the current of a first electromagnetic component 22, the magnetic force between the first electromagnetic component 22 and the first suspended magnetic part 21 is changed, so that the first suspended magnetic part 21 is tilted toward one side. For another example, by adjusting the current of two adjacent first electromagnetic components 22, or the current of two opposite first electromagnetic components 22, the magnetic force between the two first electromagnetic components 22 and the first suspended magnetic part 21 is changed, so that the first suspended magnetic part 21 is tilted toward one side, or the degree of inclination of the first suspended magnetic part 21 is adjusted. In addition, the angle between the first suspended magnetic part 21 and the horizontal plane can be adjusted by adjusting the current of three or four first electromagnetic components 22. Specifically, the current of the first electromagnetic component 22 can be adjusted according to user needs and product requirements, thereby adjusting the inclination angle of the polishing disc 10 to achieve a better polishing effect.

[0049] Optionally, the polishing device 1 also includes a first reinforcing plate 41 connected to the polishing disk 10, and the first suspended magnetic part 21 is provided on the side of the first reinforcing plate 41 facing away from the polishing disk 10; the polishing device 1 also includes a second reinforcing plate 42, and the first electromagnetic part 22 is provided on the side of the second reinforcing plate 42 facing the polishing disk 10.

[0050] The first reinforcing plate 41 is used to enhance the magnetic force of the first levitation magnetic portion 21, and the second reinforcing plate 42 is used to enhance the magnetic force of the first electromagnetic component 22, thereby enhancing the magnetic force between the first levitation magnetic portion 21 and the first electromagnetic component 22. The first reinforcing plate 41 and the second reinforcing plate 42 may be galvanized plates. The connection between the first reinforcing plate 41 and the first levitation magnetic portion 21 may be by threaded connection, snap-fit ​​connection, adhesive connection, etc., which is not limited in this embodiment. The connection between the second reinforcing plate 42 and the first electromagnetic component 22 may be by threaded connection, snap-fit ​​connection, adhesive connection, etc., which is not limited in this embodiment.

[0051] In summary, in this embodiment, multiple first electromagnetic members 22 are provided to achieve fine adjustment of the tilt degree of the first suspended magnetic portion 21 , thereby achieving fine adjustment of the tilt angle of the polishing disc 10 , thereby improving the polishing effect of the polishing device 1 .

[0052] Please refer to Figures 1-4 In one embodiment, the first suspended magnetic portion 21 includes a first magnetic sub-portion 211 and a second magnetic sub-portion 212 stacked along the arrangement direction from the polishing disk 10 to the first electromagnetic component 22, and the radial dimension of the first magnetic sub-portion 211 is greater than the radial dimension of the second magnetic sub-portion 212.

[0053] The first magnetic sub-section 211 and the second magnetic sub-section 212 can be magnets. For example, the first magnetic sub-section 211 and the second magnetic sub-section 212 are both N52-grade circular strong magnets, the first magnetic sub-section 211 is a magnet with a diameter of 50 mm, and the second magnetic sub-section 212 is a magnet with a diameter of 20 mm. As shown in the figure, the first magnetic sub-section 211 and the second magnetic sub-section 212 are arranged in a top-to-bottom direction. The connection method between the first magnetic sub-section 211 and the second magnetic sub-section 212 can be a threaded connection, a snap connection, an adhesive connection, etc., which is not limited in this embodiment.

[0054] Optionally, the polishing device 1 further comprises a first reinforcing plate 41 connected to the polishing disc 10 , the first magnetic sub-portion 211 is provided on the first reinforcing plate 41 , and the second magnetic sub-portion 212 is provided on a side of the first magnetic field sub-portion away from the first reinforcing plate 41 .

[0055] In summary, this embodiment provides a first suspended magnetic part 21 composed of a first magnetic sub-part 211 and a second magnetic sub-part 212. The first magnetic sub-part 211 and the second magnetic sub-part 212 can cooperate with each other, thereby improving the magnetism of the first suspended magnetic part 21, reducing the operating difficulty of the offset adjustment component 20, and improving the polishing effect of the polishing device 1.

[0056] Please refer to Figures 1-4In one embodiment, the offset adjustment component 20 further includes a detection member 23 and a controller that are electrically connected to each other, wherein the detection member 23 is used to obtain the voltage values ​​of the plurality of first electromagnetic members 22 , and the controller is used to adjust the first electromagnetic members 22 .

[0057] If the voltage value is outside the preset voltage range, the controller sends a reminder signal, and the reminder signal is used to start the reminder component; and / or the controller adjusts the first electromagnetic component 22.

[0058] The detection member 23 is used to obtain the voltage value of the first electromagnetic member 22 and send out an electrical signal. The controller is used to receive the electrical signal, send out a reminder signal, and control and adjust the first electromagnetic member 22. The detection member 23 can be a Hall sensor. Optionally, the detection member 23 is arranged between multiple first electromagnetic members 22, and multiple first electromagnetic members 22 are arranged around the detection member 23. Optionally, the detection member 23 detects two relative first electromagnetic members 22 respectively, and the two relative first electromagnetic members 22 are connected in series through a welded circuit board. Optionally, the multiple first electromagnetic members only perform positive adjustment. Optionally, the offset adjustment component 20 cannot generate sufficient suspension repulsion to support the polishing disc 10, and the suspension repulsion supporting the polishing disc 10 is mainly generated by the pressure adjustment component 30.

[0059] If the voltage value is outside the preset voltage range, it indicates that the inclination angle of the polishing plate 10 is outside the preset inclination range, that is, the polishing plate 10 has an inclination deviation. The voltage value of the first electromagnetic member 22 is obtained by the detection member 23, and the voltage value is compared with the operational amplifier to confirm that the voltage value is outside the preset voltage range.

[0060] Specifically, if the voltage value is outside a preset voltage range, the controller can issue a warning signal to activate a reminder element. The reminder element can be a light-emitting element, a warning horn, or other component that can alert the user. If the reminder element is a light-emitting element, activating the reminder element means lighting the light-emitting element, which can be a diode. If the reminder element is a warning horn, activating the reminder element causes the horn to emit a warning sound.

[0061] If the voltage value is outside the preset voltage range, the first electromagnetic component 22 can also be adjusted to adjust the magnetic force between the first electromagnetic component 22 and the first suspended magnetic part 21, and then adjust the inclination angle of the polishing disk 10 so that the inclination angle of the polishing disk 10 is within the preset inclination range.

[0062] In summary, the present embodiment reduces the probability of the polishing disc 10 generating an inclination angle deviation by providing the detection element 23 and the control element, thereby improving the polishing effect of the polishing device 1 .

[0063] Please refer to Figure 1-Figure 5In one embodiment, the pressure adjustment assembly 30 further includes a second electromagnetic component 32 provided on the side of the second suspended magnetic portion 31 facing away from the polishing disc 10; wherein, by adjusting the magnetic force between the second electromagnetic component 32 and the second suspended magnetic portion 31, the pressure of the polishing disc 10 on the workpiece to be polished is adjusted.

[0064] The second electromagnetic element 32 and the second suspended magnetic portion 31 can attract or repel each other. The second electromagnetic element 32 can be an electromagnetic coil. For example, the second electromagnetic element 32 can be an electromagnetic coil assembly composed of multiple electromagnetic coils to improve the coil's current capacity and the uniformity of the electromagnetic field. By adjusting the current of the second electromagnetic element 32, the magnetic force between the second electromagnetic element 32 and the second suspended magnetic portion 31 can be adjusted, thereby varying the pressure of the polishing pad 10 on the workpiece to be polished.

[0065] For example, by adjusting the current of all second electromagnetic elements 32, the distance between the second electromagnetic elements 32 and the second suspended magnetic portion 31 is changed, thereby increasing or decreasing the pressure of the polishing disc 10 on the workpiece to be polished. Specifically, the current of the second electromagnetic elements 32 can be adjusted according to user needs and product requirements, thereby adjusting the pressure of the polishing disc 10 on the workpiece to be polished to achieve a better polishing effect.

[0066] Optionally, the polishing device 1 also includes a first reinforcing plate 41 connected to the polishing disk 10, and the second suspended magnetic part 31 is provided on the side of the first reinforcing plate 41 facing away from the polishing disk 10; the polishing device 1 also includes a second reinforcing plate 42, and the second electromagnetic part 32 is provided on the side of the second reinforcing plate 42 facing the polishing disk 10.

[0067] The first reinforcing plate 41 is used to enhance the magnetic force of the second levitation magnetic portion 31, and the second reinforcing plate 42 is used to enhance the magnetic force of the second electromagnetic component 32, thereby enhancing the magnetic force between the second levitation magnetic portion 31 and the second electromagnetic component 32. The first reinforcing plate 41 and the second reinforcing plate 42 may be galvanized plates. The connection between the first reinforcing plate 41 and the second levitation magnetic portion 31 may be by threaded connection, snap-fit ​​connection, adhesive connection, etc., which is not limited in this embodiment. The connection between the second reinforcing plate 42 and the second electromagnetic component 32 may be by threaded connection, snap-fit ​​connection, adhesive connection, etc., which is not limited in this embodiment.

[0068] In summary, in this embodiment, the second electromagnetic component 32 is provided to achieve fine adjustment of the pressure of the polishing disc 10 on the workpiece to be polished, thereby improving the polishing effect of the polishing device 1 .

[0069] Please refer to Figure 1-Figure 5In one embodiment, the second electromagnetic component 32 includes an annular electromagnetic bracket 321 and a plurality of electromagnetic parts 322. The plurality of electromagnetic parts 322 are arranged at intervals along the circumferential direction of the polishing disk 10. The annular electromagnetic bracket 321 is provided on the side of the plurality of electromagnetic parts 322 facing the polishing disk 10.

[0070] The second suspension magnetic portion 31 includes a plurality of suspension magnetic sub-portions 311 . The plurality of suspension magnetic sub-portions 311 are arranged at intervals along the circumferential direction of the polishing disk 10 , and the suspension magnetic sub-portions 311 are disposed correspondingly to the electromagnetic portion 322 .

[0071] The annular electromagnetic bracket 321 is used to fix the plurality of electromagnetic parts 322. The electromagnetic part 322 can be an electromagnetic coil. For example, the second electromagnetic component 32 is composed of 12 electromagnetic parts 322 through the annular electromagnetic bracket 321. Optionally, the plurality of electromagnetic parts 322 are arranged at intervals along the circumferential direction of the second suspended magnetic part 31. Optionally, the spacing between two adjacent electromagnetic parts 322 is equal. The number of electromagnetic parts 322 is 8-20, and specific examples include 8, or 9, or 10, or 11, or 12, or 13, or 14, or 15, or 16, or 17, or 18, or 19, or 20, etc.

[0072] Optionally, an annular magnetic portion 323 is further provided on the side of the multiple electromagnetic portions 322 facing away from the annular electromagnetic bracket 321. Optionally, the annular magnetic portion 323 is a neodymium iron boron magnet. Neodymium iron boron magnets have strong magnetic properties, high magnetic energy product, and large magnetic force. In addition, neodymium iron boron magnets have stable magnetic properties and are not easily demagnetized over a long period of time.

[0073] Optionally, the polishing device 1 also includes a second reinforcing plate 42, the annular magnetic part 323 is arranged on the second reinforcing plate 42, the multiple electromagnetic parts 322 are arranged on the side of the annular magnetic part 323 away from the second reinforcing plate 42, and the annular electromagnetic bracket 321 is arranged on the side of the multiple electromagnetic parts 322 away from the second reinforcing plate 42.

[0074] One suspended magnetic sub-section 311 is provided corresponding to one electromagnetic section 322. For example, the suspended magnetic sub-section 311 is composed of a N52 grade magnet with a diameter of 20 mm. Optionally, a plurality of suspended magnetic sub-sections 311 are spaced apart along the circumferential direction of the second electromagnetic component 32. Optionally, the spacing between two adjacent suspended magnetic sub-sections 311 is equal. Optionally, the number of suspended magnetic sub-sections 311 is equal to that of electromagnetic sections 322. The number of suspended magnetic sub-sections 311 is 8-20, and specifically, for example, 8, or 9, or 10, or 11, or 12, or 13, or 14, or 15, or 16, or 17, or 18, or 19, or 20, etc.

[0075] In summary, this embodiment provides a second electromagnetic member 32 comprised of an annular electromagnetic support 321 and multiple electromagnetic sections 322 to enhance the magnetic force of the second electromagnetic member 32, providing sufficient levitation repulsion for the second levitation magnetic section 31. This embodiment also provides a levitation magnetic subsection 311 corresponding to the electromagnetic section 322, thereby enhancing the magnetic force between the second electromagnetic member 32 and the second levitation magnetic section 31, reducing the difficulty of operating the pressure adjustment assembly 30 and improving the polishing effect of the polishing device 1.

[0076] Please refer to Figure 1-Figure 5 In one embodiment, the pressure regulating assembly 30 further includes a pressure sensor 33 and a controller which are electrically connected. The pressure sensor 33 is used to obtain the pressure value of the polishing disc 10 on the workpiece to be polished, and the controller is used to adjust the second electromagnetic component 32.

[0077] The pressure sensor 33 is used to send a pressure signal according to the obtained pressure value, and the controller is used to receive the pressure signal and adjust the second electromagnetic component 32 .

[0078] The pressure sensor 33 is used to obtain the pressure value of the polishing disc 10 on the workpiece to be polished and to send a pressure signal. The controller is used to receive the pressure signal and is also used to control and adjust the second electromagnetic component 32. Optionally, the polishing device 1 also includes a splint, which is arranged on the side of the second reinforcement plate 42 away from the second electromagnetic component 32, the splint is connected to the second reinforcement plate 42, and the pressure sensor 33 is arranged on the splint. Further optionally, the pressure sensor 33 is arranged at the center of the splint, and a plurality of electromagnetic parts 322 are arranged around the pressure sensor 33. Specifically, the pressure sensor 33 can directly read and display the real-time pressure value through the development board, and the detected pressure signal obtained at the same time enters the negative feedback regulation to automatically adjust the electromagnetic force of the second electromagnetic component 32 as needed, thereby adjusting the pressure of the polishing disc 10 on the workpiece to be polished.

[0079] For example, if the pressure value is outside the preset pressure range, the controller can receive the pressure signal and can also adjust the second electromagnetic component 32, thereby adjusting the magnetic force between the second electromagnetic component 32 and the second suspended magnetic part 31, and then adjusting the pressure of the polishing disk 10 on the workpiece to be polished, so that the pressure value of the polishing disk 10 on the workpiece to be polished is within the preset pressure range.

[0080] In summary, in this embodiment, the pressure sensor 33 and the control element are provided to achieve automatic control of the pressure of the polishing disc 10 on the workpiece to be polished, thereby improving the polishing effect of the polishing device 1 .

[0081] Optionally, in one embodiment, the pressure sensor 33 detects the pressure applied from above after calibration and converts it into a detection voltage. The detection pressure signal is transmitted to the Arduino development board and the AD conversion is performed by the program, and the real-time detected pressure value can be displayed on the computer. At the same time, by measuring the relationship between the calibration force and the detection voltage, the sensor target voltage of the set target force can be obtained. The detection voltage of the sensor is then filtered and stabilized, and the target voltage signal corresponding to the set force is input into the differential amplifier, and the amplified signal is then input into the PID regulation controller to obtain a feedback regulation voltage signal. Since the regulation voltage required by the second electromagnetic component 32 is relatively large, the feedback signal also needs to be amplified by the power amplifier and finally output to the second electromagnetic component 32 to generate a regulating magnetic force to regulate the pressure value of the polishing disk 10.

[0082] Please refer to Figure 1-Figure 7 In one embodiment, the polishing device 1 further includes a first reinforcing plate 41 connected to the polishing disc 10, and the first suspension magnetic portion 21 and the second suspension magnetic portion 31 are provided on the side of the first reinforcing plate 41 facing away from the polishing disc 10, and the second suspension magnetic portion 31 is arranged around the first suspension magnetic portion 21.

[0083] The offset adjustment assembly 20 also includes a plurality of first electromagnetic components 22 arranged on the side of the first suspension magnetic portion 21 away from the polishing disk 10, and the pressure adjustment assembly 30 also includes a second electromagnetic component 32 arranged on the side of the second suspension magnetic portion 31 away from the polishing disk 10; the polishing device 1 also includes a second reinforcement plate 42, and the first electromagnetic component 22 and the second electromagnetic component 32 are provided on the side of the second reinforcement plate 42 facing the polishing disk 10, and the second electromagnetic component 32 is arranged around the first electromagnetic component 22.

[0084] The first reinforcing plate 41 is used to enhance the magnetic force between the first levitation magnetic portion 21 and the second levitation magnetic portion 31, and the second reinforcing plate 42 is used to enhance the magnetic force between the first electromagnetic component 22 and the second electromagnetic component 32, thereby enhancing the magnetic force between the first levitation magnetic portion 21 and the first electromagnetic component 22, and enhancing the magnetic force between the second levitation magnetic portion 31 and the second electromagnetic component 32. The first reinforcing plate 41 and the second reinforcing plate 42 may be galvanized plates.

[0085] One side of the first reinforcing plate 41 is connected to the polishing plate 10, and the other side is provided with the first levitation magnetic portion 21 and the second levitation magnetic portion 31. The second levitation magnetic portion 31 includes multiple levitation magnetic sub-portions 311 arranged around the first levitation magnetic portion 21. Under the magnetic force of the first electromagnetic element 22 and the second electromagnetic element 32, the first reinforcing plate 41, the first levitation magnetic portion 21, and the second levitation magnetic portion 31 are able to remain in a suspended state.

[0086] The second reinforcing plate 42 is farther away from the polishing disk 10 than the first reinforcing plate 41. The first electromagnetic component 22 and the second electromagnetic component 32 are provided on the side of the second reinforcing plate 42 facing the first reinforcing plate 41. The multiple electromagnetic parts 322 of the second electromagnetic component 32 are arranged around the multiple first electromagnetic parts 22. The first electromagnetic component 22 is arranged in correspondence with the first suspension magnetic part 21, and the second electromagnetic component 32 is arranged in correspondence with the second suspension magnetic part 31.

[0087] In summary, this embodiment, by providing the first reinforcing plate 41 and the second reinforcing plate 42, enhances the magnetic force between the first suspended magnetic portion 21 and the first electromagnetic element 22, and between the second suspended magnetic portion 31 and the second electromagnetic element 32, thereby improving the operational accuracy of the polishing device 1 and thereby enhancing the polishing effect of the polishing device 1. Furthermore, this embodiment also defines the positions of the first suspended magnetic portion 21 and the second suspended magnetic portion 31 on the first reinforcing plate 41, and the positions of the first electromagnetic element 22 and the second electromagnetic element 32 on the second reinforcing plate 42, thereby optimizing the structure, reducing the overall size of the polishing device 1, and improving the integration of the polishing device 1.

[0088] Please refer to Figures 1-8 In one embodiment, the polishing device 1 further includes a limiting assembly 50, and the limiting assembly 50 includes an inner ring 51 and an outer ring 52. The inner ring 51 is used to fix the motor 60, and the motor 60 is used to connect the polishing disk 10 to drive the polishing disk 10 to rotate. The outer ring 52 is sleeved on the inner ring 51, and the outer ring 52 is rotatably connected to the inner ring 51. The inner ring 51 and the motor 60 can swing relative to the outer ring 52.

[0089] The limit assembly 50 is used to limit the tilt position of the polishing plate 10, allowing the polishing plate 10 to tilt within a specific range. The limit assembly 50 can also be understood as a gyroscope structure. The limit assembly 50 is disposed between the polishing plate 10 and the offset adjustment assembly 20, and between the polishing plate 10 and the pressure adjustment assembly 30. Specifically, the limit assembly 50 is disposed between the first reinforcement plate 41 and the polishing plate 10.

[0090] Optionally, the motor 60 is disposed between the first reinforcing plate 41 and the polishing plate 10, and the first reinforcing plate 41 and the motor 60 are connected via a fixed shaft 54. For example, the motor 60 is disposed above the first reinforcing plate 41, and a fixed shaft 54 ​​extends from the top of the first reinforcing plate 41 and is connected to a fixing seat of the motor 60. The stator of the motor 60 is directly fixed to the fixing seat of the motor 60 with bolts. To prevent the normal rotation of the rotor, the fixing seat of the motor 60 extends upward around the motor 60 to surround the motor 60, while leaving a certain gap between the motor 60 and the rotor.

[0091] The inner ring 51 is sleeved with the motor 60 , and the outer ring 52 is sleeved with the inner ring 51 . The inner ring 51 and the outer ring 52 are rotatably connected via micro bearings and pins, so that the outer ring 52 can rotate and swing freely within a certain range compared to the inner ring 51 .

[0092] In summary, this embodiment sets a limit assembly 50 so that the polishing disc 10 can be offset and tilted to a certain extent during normal operation without affecting the normal rotation of the motor 60, so that the motor 60 can increase the rotational freedom within a certain range without affecting the normal operation of the motor 60, thereby improving the reliability of the polishing device 1.

[0093] Please refer to Figures 1-8 In one embodiment, the limiting assembly further includes a limiting shell 53 mounted on the outer ring 52, and the limiting shell 53 is used to support the peripheral side wall of the outer ring 52, thereby limiting the displacement of the outer ring 52 in the horizontal direction, and the outer ring 52 can slide in the vertical direction relative to the limiting shell 53.

[0094] The inner sidewall of the limiting housing 53 and the outer sidewall of the outer ring 52 abut against each other, forming a sliding pair. This not only limits the horizontal displacement of the outer ring 52, but also allows the outer ring 52, inner ring 51, and motor 60 to float up and down relative to the limiting housing 53. In other words, the polishing plate 10 can float up and down relative to the limiting housing 53, and the limiting housing 53 does not interfere with the polishing plate 10 from shifting or tilting to a certain extent. Optionally, the limiting housing 53 also houses the offset adjustment assembly 20 and the pressure adjustment assembly 30.

[0095] In summary, this embodiment provides the limiting housing 53 to limit the outer ring 52 and further limit the displacement of the polishing disc 10 without interfering with the tilting of the polishing disc 10 , thereby further improving the reliability of the polishing device 1 .

[0096] The polishing device 1 provided in the present application adopts a floating flexible grinding and polishing disc 10 that relies on magnetic levitation control, and on the basis of magnetic levitation, through the designed offset adjustment component 20, pressure adjustment component 30, limit component 50, and the feedback adjustment control circuit designed using the detection part 23 and the pressure sensor 33, to achieve a certain range of inclination offset correction and force feedback control.

[0097] Unless otherwise specified or incompatible therewith, terms and phrases used in this application shall have the following meanings:

[0098] In this application, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of the features.

[0099] In this application, "one or several" refers to any one, any two, or any two or more of the listed items. Among them, "several" refers to any two or any two or more.

[0100] In the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0101] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to connection, detachable connection, or integration. They may refer to mechanical connection or electrical connection. They may refer to direct connection or indirect connection through an intermediary. They may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0102] Mentioning "embodiments" and "implementation methods" in this application means that the specific features, structures or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, unless there is a contradiction between them.

[0103] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A polishing device, characterized in that: The polishing device comprises: Polishing disc, used for polishing the workpiece; an offset adjustment assembly disposed on one side of the polishing plate, the offset adjustment assembly comprising a first suspension magnetic portion connected to the polishing plate; wherein the inclination angle of the polishing plate is adjusted by adjusting the magnetic force of the first suspension magnetic portion, the inclination angle being the angle between the polishing plate and a horizontal plane; A pressure regulating assembly is provided on one side of the polishing disc, and the pressure regulating assembly includes a second suspended magnetic portion connected to the polishing disc; wherein, by adjusting the magnetic force of the second suspended magnetic portion, the pressure of the polishing disc on the workpiece to be polished is adjusted.

2. The polishing device according to claim 1, wherein The offset adjustment assembly also includes a plurality of first electromagnetic components arranged on the side of the first suspended magnetic part away from the polishing disk, and the plurality of first electromagnetic components are arranged at intervals along the circumferential direction of the polishing disk; wherein, by adjusting the magnetic force between at least one of the first electromagnetic components and the first suspended magnetic part, the angle between the first suspended magnetic part and the horizontal plane is adjusted, thereby adjusting the inclination angle of the polishing disk.

3. The polishing device according to claim 2, wherein The first suspension magnetic portion includes a first magnetic sub-portion and a second magnetic sub-portion stacked along an arrangement direction from the polishing disk to the first electromagnetic component. The radial dimension of the first magnetic sub-portion is greater than that of the second magnetic sub-portion.

4. The polishing device according to claim 2, wherein: The offset adjustment assembly further includes a detection member and a controller electrically connected to each other, the detection member is used to obtain voltage values ​​of the plurality of first electromagnetic members, and the controller is used to adjust the first electromagnetic members; Wherein, if the voltage value is outside the preset voltage range, the controller sends a reminder signal, and the reminder signal is used to start the reminder component; and / or the controller adjusts the first electromagnetic component.

5. The polishing device according to claim 1, wherein The pressure regulating assembly further comprises a second electromagnetic component provided on the side of the second suspended magnetic portion facing away from the polishing disc; wherein, the pressure of the polishing disc on the workpiece to be polished is adjusted by adjusting the magnetic force between the second electromagnetic component and the second suspended magnetic portion.

6. The polishing device according to claim 5, characterized in that The second electromagnetic component includes an annular electromagnetic support and a plurality of electromagnetic parts, wherein the plurality of electromagnetic parts are arranged at intervals along the circumferential direction of the polishing plate, and the annular electromagnetic support is provided on a side of the plurality of electromagnetic parts facing the polishing plate; The second suspension magnetic portion includes a plurality of suspension magnetic sub-portions, which are arranged at intervals along the circumferential direction of the polishing disk, and the suspension magnetic sub-portions are correspondingly arranged to the electromagnetic portion.

7. The polishing device according to claim 5, characterized in that The pressure regulating assembly further includes a pressure sensor and a controller electrically connected to each other, wherein the pressure sensor is used to obtain the pressure value of the polishing disc on the workpiece to be polished, and the controller is used to regulate the second electromagnetic component; The pressure sensor is used to send a pressure signal according to the obtained pressure value, and the controller is used to receive the pressure signal and adjust the second electromagnetic component.

8. The polishing device according to claim 1, wherein The polishing device further includes a first reinforcing plate connected to the polishing disc, wherein the first levitation magnetic portion and the second levitation magnetic portion are provided on a side of the first reinforcing plate facing away from the polishing disc, and the second levitation magnetic portion is provided around the first levitation magnetic portion; The offset adjustment assembly also includes a plurality of first electromagnetic components arranged on the side of the first suspension magnetic part facing away from the polishing disk, and the pressure adjustment assembly also includes a second electromagnetic component arranged on the side of the second suspension magnetic part facing away from the polishing disk; the polishing device also includes a second reinforcement plate, and the first electromagnetic component and the second electromagnetic component are provided on the side of the second reinforcement plate facing the polishing disk, and the second electromagnetic component is arranged around the first electromagnetic component.

9. The polishing device according to claim 1, wherein The polishing device also includes a limiting assembly, which includes an inner ring and an outer ring. The inner ring is used to fix the motor, and the motor is used to connect the polishing disk to drive the polishing disk to rotate. The outer ring is sleeved on the inner ring, and the outer ring is rotatably connected to the inner ring. The inner ring and the motor can swing relative to the outer ring.

10. The polishing device according to claim 9, wherein The limiting assembly also includes a limiting shell sleeved on the outer ring, the limiting shell is used to abut the peripheral side wall of the outer ring, thereby limiting the displacement of the outer ring in the horizontal direction, and the outer ring can slide in the vertical direction relative to the limiting shell.

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