Dimension film
By setting a decreasing hardness and thickness structure of a hardening film, a first buffer film and a second buffer film in the sizing film, and using the buffer layer cutting technology, the burr and scratching problems caused by insufficient hardness of the existing sizing film are solved, the inventory cost is reduced and the needs of various mobile devices are adapted.
Patent Information
- Application Number
- CN202422744806.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-05
- Filing Date
- 2024-11-11
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-11
AI Technical Summary
The existing size films are not hard enough, which leads to burrs or scratches when cutting to form screen protectors, increasing inventory costs and making it difficult to meet the needs of small-brand mobile devices.
A size membrane structure is designed, in which the hardness and thickness of the hardening film, the first buffer film and the second buffer film decrease in sequence, and the buffer layer is cut into for cutting, so as to avoid burrs on the used layer and scratches on the cutting edges.
It effectively avoids burrs and scratches on the used layer during cutting, reduces inventory costs, and adapts to the needs of different mobile devices.
Smart Images
Figure CN223386073U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a size film, in particular to a size film with a hardness of at least 5H. Background Art
[0002] Existing sizing films include a base layer and a secondary layer disposed thereon. Due to their structural configuration, to avoid burrs or scratches when cut into screen protectors, the secondary layer of existing sizing films typically has a hardness of less than 3H. However, for mobile device screen protectors with a hardness of 5H or higher, manufacturers are forced to stock multiple designs to accommodate different mobile device models. This significantly increases inventory costs and makes it difficult to meet the screen protector needs of smaller mobile device manufacturers.
[0003] Therefore, the applicant believes that the above defects can be improved, and has conducted intensive research and applied scientific principles to finally propose a utility model that has a reasonable design and effectively improves the above defects. Utility Model Content
[0004] The purpose of the embodiment of the present utility model is to provide a size film, which can effectively improve the defects that may occur in the existing size film.
[0005] An embodiment of the present invention discloses a sizing film that can be cut into a screen protector, the sizing film comprising: a usage layer having a hardening film and a bonding film formed on the hardening film; wherein the hardening film has a hardness of at least 5H; a buffer layer comprising a first buffer film attached to the hardening film and a second buffer film attached to the first buffer film; wherein the hardness of the hardening film, the hardness of the first buffer film and the hardness of the second buffer film decrease in sequence; and a bottom layer attached to the bonding film; wherein the sizing film is used to be cut into by the second buffer film of the buffer layer.
[0006] Optionally, the thickness of the first buffer film and the thickness of the second buffer film decrease in sequence.
[0007] Optionally, the thickness of the second buffer film is 40% to 90% of the thickness of the first buffer film.
[0008] Optionally, the sum of the thickness of the first buffer film and the thickness of the second buffer film is 60% to 105% of the thickness of the laminating film.
[0009] Optionally, the thickness of the hardened film is 55% to 90% of the thickness of the laminating film.
[0010] Optionally, the thickness of the first buffer film is 60% to 75% of the thickness of the hardening film.
[0011] Optionally, the thickness of the second buffer film is between 40 micrometers and 90 micrometers, the thickness of the hardening film is between 130 micrometers and 190 micrometers, and the thickness of the laminating film is between 150 micrometers and 250 micrometers.
[0012] Optionally, the bottom layer is a plate, and the thickness of the plate is between 140 microns and 225 microns.
[0013] Optionally, the bottom layer includes a plate and a dust removal film connected between the plate and the laminating film, the thickness of the plate is between 140 microns and 225 microns, and the thickness of the dust removal film is between 100 microns and 150 microns.
[0014] Optionally, the size film has an identification code located on the second buffer film, and the area of the size film is larger than the screen area of any mobile device.
[0015] To sum up, the sizing film disclosed in the embodiment of the present invention is structurally configured (such as: the hardness of the hardened film, the hardness of the first buffer film and the hardness of the second buffer film are in decreasing order) to facilitate the sizing film (or the use layer) with a hardness of at least 5H to effectively avoid the generation of burrs (such as: the use layer produces white edge type glue damage) when being cut, and to make the cutting edge a smooth and non-scratching structure.
[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic diagram of a sizing film according to an embodiment of the present invention being applied to a cutting device.
[0018] Figure 2 This is a schematic diagram of cutting the size film along the hole cutting path according to an embodiment of the present invention.
[0019] Figure 3 This is a schematic diagram of cutting the size film along the screen cutting path according to an embodiment of the present invention.
[0020] Figure 4 for Figure 3 Schematic diagram of the cut-to-size film being attached to a mobile device.
[0021] Figure 5 for Figure 4 Schematic diagram of subsequent actions.
[0022] Figure 6 for Figure 5 Schematic diagram of subsequent actions. DETAILED DESCRIPTION
[0023] The following is an explanation of the implementation of the "size membrane" disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following implementation methods will further explain the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of protection of the present invention.
[0024] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.
[0025] See also Figures 1 to 6 , which is an embodiment of the present invention. This embodiment discloses a sizing film 200 that can be cut (by a film cutting device 100) into a screen protector 200S for attachment to a mobile device M. The sizing film 200 has an area larger than the screen area of any mobile device M.
[0026] In this embodiment, the sizing film 200 includes a base layer 201, a buffer layer 202, and a service layer 203 sandwiched between the base layer 201 and the buffer layer 202. The service layer 203 has a hardening film 2031 and a laminating film 2032 located on opposite sides thereof. The base layer 201 is attached to the laminating film 2032 of the service layer 203, while the buffer layer 202 is attached to the hardening film 2031 of the service layer 203.
[0027] Furthermore, in order to facilitate the size film 200 to not produce burrs after being cut and the cut edge to be a smooth and non-scratchy structure, the size film 200 preferably has at least some of the following features, but is not limited thereto. The bonding film 2032 is formed on the hardening film 2031, and the hardening film 2031 has a hardness of at least 5H. The buffer layer 202 includes a first buffer film 202a attached to the hardening film 2031 and a second buffer film 202b attached to the first buffer film 202a. In addition, the bottom layer 201 can be a plate 201a that is anti-cutting, or the bottom layer 201 can include the plate 201a and a dust removal film 201b connected between the plate 201a and the bonding film 2032, and the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of layers of the size film 200 can also be adjusted and changed according to actual needs (such as: omitting the dust removal film 201b).
[0028] The hardness of the hardening film 2031, the hardness of the first buffer film 202a, and the hardness of the second buffer film 202b decrease in sequence, and the thickness of the hardening film 2031, the thickness of the first buffer film 202a, and the thickness of the second buffer film 202b decrease in sequence. In this embodiment, the thickness of the second buffer film 202b is 40% to 90% (e.g., 75% to 90%) of the thickness of the first buffer film 202a, and the thickness of the first buffer film 202a is 60% to 75% of the thickness of the hardening film 2031. In other words, the sum of the thickness of the first buffer film 202a and the thickness of the second buffer film 202b is 60% to 105% (e.g., 95% to 105%) of the thickness of the bonding film 2032, and the thickness of the curing film 2031 is 55% to 90% (e.g., 75% to 90%) of the thickness of the bonding film 2032.
[0029] For example, the first buffer film 202a is made of a soft material (e.g., PET), and the second buffer film 202b is also made of a soft material (e.g., PE). Furthermore, the thickness of the first buffer film 202a can be between 95 microns (μm) and 110 μm, the thickness of the second buffer film 202b can be between 40 μm and 90 μm, the thickness of the hardening film 2031 can be between 130 μm and 190 μm, and the laminating film 2032 can be made of high-viscosity AB glue and have a thickness between 150 μm and 250 μm. The sheet material 201a can be white and have a thickness between 140 μm and 225 μm, and the dust removal film 201b can be transparent and have a thickness between 100 μm and 150 μm.
[0030] Specifically, the sizing film 200 (or the hardening film 2031 ) is limited to having a hardness of at least 5H (e.g., pencil hardness), and the area of the sizing film 200 is larger than the screen area of any commercially available mobile device. Furthermore, the material of the sizing film 200 can be adjusted and varied based on actual needs. For example, the sizing film 200 can be a flexible protective film made of polyethylene terephthalate (PET), recycled polyethylene terephthalate (RPET), or polymethyl methacrylate (PMMA), but this is not a limitation of the present invention.
[0031] In addition, in this embodiment, the sizing film 200 also has an identification code 2021 (e.g., a QR code) located on the buffer layer 202 (e.g., the second buffer film 202b). The identification code 2021 can be directly printed on the buffer layer 202 or separately attached to the buffer layer 202. The present invention is not limited to the above. Furthermore, the film cutting device 100 can scan the identification code 2021 of the sizing film 200 with a scanner 5 to generate a signal, and transmit the signal to a cloud server 300, so that the cloud server 300 can instruct the film cutting device 100 to select an appropriate drawing to identify the material of the sizing film 200 and cut the sizing film 200.
[0032] When the size film 200 is placed on the film cutting device 100 for cutting to form the screen protector 200S, the film cutting device 100 uses a film cutting tool 1 to first cut along a hole cutting path relative to the buffer layer 202 and the use layer 203 to form a positioning contour S2 with multiple positioning holes 2022, and then cut along a screen cutting path to form a screen contour S1 located inside the positioning contour S2.
[0033] Among them, since the film cutting equipment 100 cuts into the size film 200 by the buffer layer 202 (such as the second buffer film 202b) rather than by the bonding film 2032 of the use layer 203, it can effectively reduce the damage to the adhesive layer of the bonding film 2032, and avoid the generation of burrs on the use layer 203 (such as white edge type glue damage on the use layer 203), and make the cutting edge smooth and non-scratching.
[0034] Furthermore, after the sizing film 200 is cut to form the screen protector 200S, the user layer 203 and the buffer layer 202 together form a screen area 200S1 and a positioning area 200S2 surrounding the screen area 200S1 and having a plurality of positioning holes 2022. In other words, the portion 203' of the user layer 203 located within the screen outline S1 can be attached to the screen of the mobile device M using a film applicator 400.
[0035] The film applicator 400 is formed with a receiving cavity 401 and a plurality of positioning posts 402 located on opposite sides of the receiving cavity 401. The receiving cavity 401 is used to position the mobile device M. The relative positions of the plurality of positioning posts 402 are equivalent to the relative positions of the plurality of positioning holes 2022 of the screen outline S1, and the relative positions of the plurality of positioning posts 402 relative to the screen of the mobile device M are equivalent to the relative positions of the plurality of positioning holes 2022 relative to the positioning outline S2 (or the edge of the screen section 200S1). It should be noted that the relative positions of the plurality of positioning posts 402 of the film applicator 400 are preferably maintained unchanged, but the present invention is not limited to this.
[0036] Accordingly, when the mobile device M is positioned in the accommodating cavity 401 of the film applicator 400, and the multiple positioning holes 2022 of the positioning block 200S2 are respectively installed on the multiple positioning pillars 402, the screen block 200S1 (such as: the portion 203' of the usage layer 203) faces the screen of the mobile device M, so that it can be pressed and attached to the screen.
[0037] [Technical effects of the embodiment of the utility model]
[0038] To sum up, the sizing film disclosed in the embodiment of the present invention is structurally configured (such as: the hardness of the hardened film, the hardness of the first buffer film and the hardness of the second buffer film are in decreasing order) to facilitate the sizing film (or the use layer) with a hardness of at least 5H to effectively avoid the generation of burrs (such as: the use layer produces white edge type glue damage) when being cut, and to make the cutting edge a smooth and non-scratching structure.
[0039] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the patent scope of the present invention.
Claims
1. A size film that can be cut into a screen protector, characterized in that: The size film includes: a use layer having a hardened film and a laminating film formed on the hardened film; wherein the hardened film has a hardness of at least 5H; a buffer layer comprising a first buffer film attached to the hardened film and a second buffer film attached to the first buffer film; wherein the hardness of the hardened film, the hardness of the first buffer film, and the hardness of the second buffer film decrease in sequence; and A bottom layer is attached to the laminating film; wherein the size film is used to cut into the second buffer film of the buffer layer.
2. The size film according to claim 1, characterized in that The thickness of the first buffer film and the thickness of the second buffer film decrease in sequence.
3. The size film according to claim 2, characterized in that The thickness of the second buffer film is 40% to 90% of the thickness of the first buffer film.
4. The size film according to claim 2, characterized in that The sum of the thickness of the first buffer film and the thickness of the second buffer film is 60% to 105% of the thickness of the laminating film.
5. The size film according to claim 2, characterized in that The thickness of the curing film is 55% to 90% of the thickness of the laminating film.
6. The size film according to claim 1, characterized in that The thickness of the first buffer film is 60% to 75% of the thickness of the hardened film.
7. The size film according to claim 1, characterized in that The thickness of the second buffer film is between 40 micrometers and 90 micrometers, the thickness of the hardening film is between 130 micrometers and 190 micrometers, and the thickness of the laminating film is between 150 micrometers and 250 micrometers.
8. The size film according to claim 1, characterized in that The bottom layer is a plate, and the thickness of the plate is between 140 microns and 225 microns.
9. The size film according to claim 1, characterized in that The bottom layer includes a plate and a dust removal film connected between the plate and the laminating film. The thickness of the plate is between 140 microns and 225 microns, and the thickness of the dust removal film is between 100 microns and 150 microns.
10. The size film according to claim 1, characterized in that The size film has an identification code located on the second buffer film, and the area of the size film is larger than the screen area of any mobile device.