Wafer rapid heat treatment sealing mechanism

Abstract

The utility model discloses a wafer rapid heat treatment sealing mechanism, and particularly relates to the technical field of wafer heat treatment, the wafer rapid heat treatment sealing mechanism comprises an outer frame mechanism, an opening and closing mechanism is fixedly installed in the outer frame mechanism, a sealing door mechanism is arranged in the outer frame mechanism through an opening and closing mechanism movable rod, and the outer frame mechanism comprises an installation outer frame. A seam covering plate is fixedly mounted in the mounting outer frame, the sealing door mechanism comprises a sealing door leaf, and an air bag is fixedly mounted on the side, close to the seam covering plate, of the sealing door leaf. According to the wafer rapid heat treatment sealing mechanism, the sealing door leaf is fixed in the mounting outer frame through cooperation of the lock pin and the lock sleeve, the second gear drives the second rack to move, then the lock pin is driven to move in the lock sleeve, the locking state between the lock pin and the lock sleeve is adjusted, and the sealing effect is improved. And when the sealing door leaf is locked in the mounting outer frame, the high-temperature-resistant sealing strip is extruded to one side of the seam covering plate through the air bag to complete sealing.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer heat treatment, in particular to a wafer rapid heat treatment sealing mechanism. Background Art

[0002] Wafers are the fundamental material in semiconductor manufacturing. They are typically circular slices made of high-purity single-crystal silicon or other semiconductor materials (such as gallium arsenide or gallium nitride). Wafers are the foundation for the manufacture of integrated circuits (ICs), sensors, solar cells, and other electronic devices. Wafers are a core material in semiconductor manufacturing, and their quality and performance are directly related to the performance and reliability of the final product. With technological advancements, the size and purity of wafers have continued to increase, providing a solid foundation for the development of the semiconductor industry.

[0003] Rapid Thermal Processing (RTP) is a common technique used in semiconductor manufacturing to rapidly heat and cool wafers. This method enables precise temperature control and high-temperature processing within a short period of time, making it suitable for a variety of process steps such as oxidation, diffusion, and annealing. To ensure uniformity and controllability during thermal processing, the design of the sealing mechanism is crucial.

[0004] In the sealing mechanism for rapid thermal treatment of wafers in the prior art, the sealing door is usually sealed by rotating a screw to squeeze the sealing door into the door frame. However, the rotation and tightening of the screw takes a certain amount of time, and the opening and closing speed is slow, which prolongs the time of the entire thermal treatment process and leads to low production efficiency. Utility Model Content

[0005] The purpose of the present invention is to provide a wafer rapid thermal processing sealing mechanism to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer rapid thermal processing sealing mechanism, comprising an outer frame mechanism, an opening and closing mechanism fixedly installed inside the outer frame mechanism, a sealing door mechanism inside the outer frame mechanism is provided through a movable rod of the opening and closing mechanism, the outer frame mechanism comprises an installation outer frame, a cover seam plate is fixedly installed inside the installation outer frame, the sealing door mechanism comprises a sealing door leaf, an air bag is fixedly installed on the side of the sealing door leaf close to the cover seam plate, a high-temperature resistant sealing strip is fixedly installed on the side of the sealing door leaf close to the cover seam plate, the high-temperature resistant sealing strip is movably installed on the side of the sealing door leaf, a second limiting sleeve is fixedly installed on the side of the sealing door leaf away from the installation outer frame, a lock pin is slidably installed on one side of the sealing door leaf through the second limiting sleeve, a lock sleeve is fixedly installed on one side of the installation outer frame, a mounting bracket is fixedly installed on one side of the sealing door leaf, a second gear is rotatably installed on one side of the mounting bracket, a second rack is fixedly installed on the top of the lock pin, and the second gear is meshedly connected to the top of the second rack.

[0007] Preferably, a pressure gauge is fixedly installed on one side of the sealed door leaf, and a one-way connection valve is fixedly installed on one side of the sealed door leaf.

[0008] Preferably, a control switch is fixedly mounted on one side of the sealed door leaf, a motor is fixedly mounted on one side of the mounting frame, and an output shaft of the motor is fixedly connected to one side of the second gear via a coupling.

[0009] Preferably, a temperature gauge is fixedly mounted on one side of the sealed door leaf, and a temperature-resistant insulation frame is fixedly mounted on the side of the cover plate away from the sealed door leaf.

[0010] Preferably, the opening and closing mechanism includes a first rack, a first gear is rotatably installed on the top of the mounting outer frame, the first gear is meshed and connected to one side of the first rack, a first connecting rod is fixedly installed on the top of the first gear, one end of the first connecting rod is rotatably installed on the top of the sealed door leaf, a second connecting rod is rotatably installed on the bottom of the mounting outer frame, a third connecting rod is rotatably installed on the bottom of the mounting outer frame, and one end of the second connecting rod and the third connecting rod are both rotatably installed on the top of the sealed door leaf.

[0011] Preferably, a first limiting sleeve is fixedly mounted on the top of the mounting outer frame, and the first rack is slidably mounted inside the first limiting sleeve.

[0012] Preferably, a cylinder is fixedly mounted on the top of the mounting outer frame, and the first rack is fixedly connected to one side of the first rack.

[0013] Compared with the prior art, the beneficial effects of the present invention are: the wafer rapid thermal processing sealing mechanism;

[0014] 1. The sealed door leaf is fixed to the inside of the mounting frame by the cooperation between the provided lock pin and the lock sleeve. The second gear drives the second rack to move, which in turn drives the lock pin to move inside the lock sleeve. The locking state between the lock pin and the lock sleeve is adjusted. When the sealed door leaf is locked inside the mounting frame, the airbag squeezes the high-temperature resistant sealing strip to one side of the cover seam plate to complete the seal. The opening and closing mechanism drives the sealing door mechanism to move, thereby controlling the opening and closing of the entire device.

[0015] The air pressure of the airbag is displayed through a pressure gauge, and the one-way connection valve is used to inflate the airbag when the air pressure inside the airbag is insufficient. The real-time temperature of the heat treatment device inside the equipment is displayed through a thermometer. The operation of the opening and closing mechanism and the sealing door mechanism is controlled by a control switch. The heat-resistant insulation frame is used for insulation to reduce the impact of high temperature on the cover seam plate and high-temperature resistant sealing strip, thereby extending the service life of the cover seam plate and high-temperature resistant sealing strip;

[0016] 2. By cooperating with the first gear, the first connecting rod, the second connecting rod and the third connecting rod, the first rack drives the first gear to rotate, thereby controlling the opening and closing of the sealed door leaf. In the above process, the cylinder provides power for the displacement of the first rack, and the first limit sleeve limits the displacement direction of the first rack to ensure the smooth displacement of the first rack. In summary, this equipment has the advantage of automatic opening and closing of the sealed door leaf. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural diagram of the utility model;

[0018] Figure 2 It is a structural expansion diagram of the utility model;

[0019] Figure 3 This is a structural diagram of the sealing door mechanism of the utility model;

[0020] Figure 4 It is a structural diagram of the opening and closing mechanism of the utility model.

[0021] In the figure: 1. outer frame mechanism; 101. outer frame installation; 102. cover seam plate; 103. heat-resistant and heat-insulating frame; 2. opening and closing mechanism; 201. cylinder; 202. first limiting sleeve; 203. first rack; 204. first gear; 205. first connecting rod; 206. second connecting rod; 207. third connecting rod; 3. sealing door mechanism; 301. sealing door leaf; 302. airbag; 303. high-temperature resistant sealing strip; 304. second limiting sleeve; 305. locking pin; 306. locking sleeve; 307. mounting bracket; 308. second gear; 309. second rack; 310. motor; 311. pressure gauge; 312. one-way connecting valve; 313. control switch; 314. thermometer. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figure 1-3 The utility model provides a technical solution: a wafer rapid heat treatment sealing mechanism, comprising an outer frame mechanism 1, an opening and closing mechanism 2 is fixedly installed inside the outer frame mechanism 1, a sealing door mechanism 3 is provided inside the outer frame mechanism 1 through a movable rod of the opening and closing mechanism 2, the outer frame mechanism 1 comprises an installation outer frame 101, a cover seam plate 102 is fixedly installed inside the installation outer frame 101, the sealing door mechanism 3 comprises a sealing door leaf 301, an air bag 302 is fixedly installed on one side of the sealing door leaf 301 close to the cover seam plate 102, and the air bag 302 is fixedly installed on one side close to the cover seam plate 102 There is a high temperature resistant sealing strip 303, which is movably mounted on one side of the sealing door leaf 301, and a second limiting sleeve 304 is fixedly mounted on the side of the sealing door leaf 301 away from the mounting outer frame 101. A locking pin 305 is slidably mounted on one side of the sealing door leaf 301 through the second limiting sleeve 304, and a locking sleeve 306 is fixedly mounted on the side of the mounting outer frame 101. A mounting bracket 307 is fixedly mounted on one side of the sealing door leaf 301, and a second gear 308 is rotatably mounted on one side of the mounting bracket 307. A second rack 308 is fixedly mounted on the top of the locking pin 305. 9. The second gear 308 is meshed and connected to the top of the second rack 309. A control switch 313 is fixedly installed on one side of the sealed door leaf 301. A motor 310 is fixedly installed on one side of the mounting bracket 307. The output shaft of the motor 310 is fixedly connected to one side of the second gear 308 through a coupling. A one-way connection valve 312 is fixedly installed on one side of the sealed door leaf 301. The air pressure of the airbag 302 is displayed through the pressure gauge 311. When the air pressure inside the airbag 302 is insufficient, the airbag 302 is inflated through the one-way connection valve 312. A control switch 313 is fixedly installed, and the operation of the opening and closing mechanism 2 and the sealing door mechanism 3 is controlled by the control switch 313. A thermometer 314 is fixedly installed on one side of the sealing door leaf 301, and a temperature-resistant insulation frame 103 is fixedly installed on the side of the cover plate 102 away from the sealing door leaf 301. The real-time temperature of the heat treatment device inside the equipment is displayed by the thermometer 314, and heat insulation is performed by the temperature-resistant insulation frame 103 to reduce the impact of high temperature on the cover plate 102 and the high-temperature resistant sealing strip 303, thereby improving the service life of the cover plate 102 and the high-temperature resistant sealing strip 303.

[0024] The specific implementation method is as follows: the sealing door leaf 301 is fixed to the inside of the mounting outer frame 101 through the cooperation between the locking pin 305 and the locking sleeve 306, and the second rack 309 is driven to move by the second gear 308, thereby driving the locking pin 305 to move inside the locking sleeve 306, and adjusting the locking state between the locking pin 305 and the locking sleeve 306. When the sealing door leaf 301 is locked inside the mounting outer frame 101, the high-temperature resistant sealing strip 303 is squeezed to one side of the cover seam plate 102 through the airbag 302 to complete the sealing, and the sealing door mechanism 3 is driven to move through the opening and closing mechanism 2 to control the opening and closing of the entire device.

[0025] See also Figure 1-4 The utility model provides a technical solution: a wafer rapid heat treatment sealing mechanism, the opening and closing mechanism 2 includes a first rack 203, the top of the outer frame 101 is rotatably installed with a first gear 204, the first gear 204 is meshed and connected to one side of the first rack 203, the top of the first gear 204 is fixedly installed with a first connecting rod 205, one end of the first connecting rod 205 is rotatably installed on the top of the sealing door leaf 301, the bottom of the outer frame 101 is rotatably installed with a second connecting rod 206, the bottom of the outer frame 101 is rotatably installed with a third connecting rod 207, one end of the second connecting rod 206 and the third connecting rod 207 are both rotatably installed on the top of the sealing door leaf 301, the top of the outer frame 101 is fixedly installed with a first limiting sleeve 202, the first rack 203 is slidably installed in the inside of the first limiting sleeve 202, the top of the outer frame 101 is fixedly installed with a cylinder 201, and the first rack 203 is fixedly connected to one side of the first rack 203.

[0026] The specific implementation method is: when the first rack 203 drives the first gear 204 to rotate through the cooperation between the first gear 204, the first connecting rod 205, the second connecting rod 206, and the third connecting rod 207, the opening and closing of the sealing door leaf 301 can be controlled. In the above process, the cylinder 201 provides power for the displacement of the first rack 203, and the first limit sleeve 202 limits the displacement direction of the first rack 203 to ensure the smooth displacement of the first rack 203. In summary, this device has the advantages of automatic opening and closing of the sealing door leaf 301.

[0027] Working Principle: When using the wafer rapid thermal processing sealing mechanism, the sealing door leaf 301 is fixed to the inside of the mounting outer frame 101 through the cooperation between the locking pin 305 and the locking sleeve 306. The second gear 308 drives the second rack 309 to move, thereby driving the locking pin 305 to move inside the locking sleeve 306, and adjusting the locking state between the locking pin 305 and the locking sleeve 306. When the sealing door leaf 301 is locked inside the mounting outer frame 101, the airbag 302 squeezes the high-temperature resistant sealing strip 303 to one side of the cover seam plate 102 to complete the sealing. The opening and closing mechanism 2 drives the sealing door mechanism 3 to move, thereby controlling the opening and closing of the entire device.

[0028] The air pressure of the airbag 302 is displayed by the pressure gauge 311, and the one-way connection valve 312 is used to inflate the airbag 302 when the air pressure inside the airbag 302 is insufficient. The real-time temperature of the heat treatment device inside the equipment is displayed by the thermometer 314. The operation of the opening and closing mechanism 2 and the sealing door mechanism 3 is controlled by the control switch 313. The heat-resistant insulation frame 103 is used for heat insulation, thereby reducing the impact of high temperature on the cover plate 102 and the high-temperature resistant sealing strip 303, thereby extending the service life of the cover plate 102 and the high-temperature resistant sealing strip 303;

[0029] By cooperating among the first gear 204, the first connecting rod 205, the second connecting rod 206, and the third connecting rod 207, the first rack 203 drives the first gear 204 to rotate, thereby controlling the opening and closing of the sealing door leaf 301. In the above process, the cylinder 201 provides power for the displacement of the first rack 203, and the first limit sleeve 202 limits the displacement direction of the first rack 203 to ensure the smooth displacement of the first rack 203. In summary, this device has the advantage of automatically controlling the opening and closing of the sealing door leaf 301.

[0030] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer rapid thermal processing sealing mechanism, comprising an outer frame mechanism (1), an opening and closing mechanism (2) fixedly installed inside the outer frame mechanism (1), a sealing door mechanism (3) inside the outer frame mechanism (1) via a movable rod of the opening and closing mechanism (2), the outer frame mechanism (1) comprising an installation outer frame (101), a cover seam plate (102) fixedly installed inside the installation outer frame (101), characterized in that: The sealing door mechanism (3) comprises a sealing door leaf (301), an air bag (302) is fixedly mounted on the side of the sealing door leaf (301) close to the cover seam plate (102), a high temperature resistant sealing strip (303) is fixedly mounted on the side of the air bag (302) close to the cover seam plate (102), the high temperature resistant sealing strip (303) is movably mounted on one side of the sealing door leaf (301), a second limiting sleeve (304) is fixedly mounted on the side of the sealing door leaf (301) away from the mounting outer frame (101), and the sealing A lock pin (305) is slidably mounted on one side of the door leaf (301) via a second limiting sleeve (304); a lock sleeve (306) is fixedly mounted on one side of the mounting outer frame (101); a mounting frame (307) is fixedly mounted on one side of the sealed door leaf (301); a second gear (308) is rotatably mounted on one side of the mounting frame (307); a second rack (309) is fixedly mounted on the top of the lock pin (305); and the second gear (308) is meshedly connected to the top of the second rack (309).

2. A wafer rapid thermal processing sealing mechanism according to claim 1, characterized in that: A pressure gauge (311) is fixedly mounted on one side of the sealing door leaf (301), and a one-way connection valve (312) is fixedly mounted on one side of the sealing door leaf (301).

3. The wafer rapid thermal processing sealing mechanism according to claim 1, characterized in that: A control switch (313) is fixedly mounted on one side of the sealed door leaf (301), a motor (310) is fixedly mounted on one side of the mounting frame (307), and an output shaft of the motor (310) is fixedly connected to one side of the second gear (308) via a coupling.

4. The wafer rapid thermal processing sealing mechanism according to claim 1, characterized in that: A temperature gauge (314) is fixedly mounted on one side of the sealed door leaf (301), and a temperature-resistant heat-insulating frame (103) is fixedly mounted on the side of the cover plate (102) away from the sealed door leaf (301).

5. The wafer rapid thermal processing sealing mechanism according to claim 1, characterized in that: The opening and closing mechanism (2) comprises a first rack (203), a first gear (204) is rotatably mounted on the top of the mounting outer frame (101), the first gear (204) is meshedly connected to one side of the first rack (203), a first connecting rod (205) is fixedly mounted on the top of the first gear (204), one end of the first connecting rod (205) is rotatably mounted on the top of the sealed door leaf (301), a second connecting rod (206) is rotatably mounted on the bottom of the mounting outer frame (101), a third connecting rod (207) is rotatably mounted on the bottom of the mounting outer frame (101), and one end of each of the second connecting rod (206) and the third connecting rod (207) is rotatably mounted on the top of the sealed door leaf (301).

6. The wafer rapid thermal processing sealing mechanism according to claim 5, characterized in that: A first limiting sleeve (202) is fixedly mounted on the top of the mounting outer frame (101), and the first rack (203) is slidably mounted inside the first limiting sleeve (202).

7. The wafer rapid thermal processing sealing mechanism according to claim 5, characterized in that: A cylinder (201) is fixedly mounted on the top of the mounting outer frame (101), and the first rack (203) is fixedly connected to one side of the first rack (203).

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