Nitrogen-filled high-temperature drying oven for semiconductor

Abstract

The utility model relates to a semiconductor nitrogen charging high-temperature oven, which comprises an oven body, an oven door and a nitrogen blowing assembly, a flow guide assembly is arranged in the oven body, a groove is arranged at the top of the oven body, the nitrogen blowing assembly is arranged in the groove, and the nitrogen blowing assembly specifically comprises an air inlet pipe, a coiled pipe, an air blowing pipe and a support. One end of the gas inlet pipe is communicated with the gas inlet pipe, the other end of the gas inlet pipe is communicated with the coiled pipe, the plurality of groups of gas blowing pipes are uniformly distributed at the bottom of the coiled pipe, the coiled pipe is arranged on the bracket, the bracket is fixed in the groove, and the gas blowing pipes are aligned to the placing rack above. The original single-port entering mode of nitrogen is changed into a uniformly distributed multi-port entering mode, and a plurality of gas inlet pipes are additionally arranged in the nitrogen charging oven, so that the nitrogen enters from different positions, the mixing and uniform distribution of the gas can be better promoted, the flow resistance of the nitrogen in the oven is reduced, and the distribution uniformity of the nitrogen is improved.

Description

Technical Field

[0001] The utility model relates to the field of oven nitrogen filling devices, in particular to a semiconductor nitrogen-filled high-temperature oven. Background Art

[0002] In semiconductor manufacturing, nitrogen-filled ovens play a very important role. Nitrogen filling can prevent semiconductor devices and materials from reacting with oxygen in the air, thereby effectively reducing the occurrence of oxidation. Oxidation will reduce the performance and reliability of the device and help protect the quality of semiconductor devices and materials. In addition, during the manufacturing process, materials and devices may absorb moisture, which will have an adverse effect on performance. Placing the materials or devices in the oven and heating them can remove moisture, thereby ensuring the performance and reliability of the product.

[0003] However, existing semiconductor nitrogen-filled ovens have the problem of uneven nitrogen distribution. First, the position of the nitrogen inlet is not designed properly, resulting in excessively high or low nitrogen concentrations in some areas. Second, the nitrogen is not mixed enough in the oven, resulting in excessively high or low concentrations in some areas. The uneven distribution of nitrogen will cause semiconductors at different positions in the oven to be affected by different nitrogen environments, thereby increasing product quality variability and making it difficult to control product consistency. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a semiconductor nitrogen-filled high-temperature oven.

[0005] The utility model provides a semiconductor nitrogen-filled high-temperature oven that adopts the following technical solutions:

[0006] A semiconductor nitrogen-filled high-temperature oven comprises a box body, a box door and a nitrogen blowing assembly, wherein a flow guide assembly is provided in the box body, a groove is provided on the top of the box body, and the nitrogen blowing assembly is arranged in the groove, and the nitrogen blowing assembly specifically comprises an air inlet pipe, a serpentine pipe, an air blowing pipe and a bracket, one end of the air inlet pipe is externally connected to a nitrogen blower, the other end of the air inlet pipe is connected to the serpentine pipe, and the other end of the air inlet pipe is communicated with the serpentine pipe, the air blowing pipe is provided in several groups, and the several groups of air blowing pipes are evenly distributed at the bottom of the serpentine pipe, the serpentine pipe is arranged on the bracket, the bracket is fixed in the groove, and the air blowing pipe is aligned with the placement rack above.

[0007] Optionally, a mounting groove is provided in the box body, and the guide component is specifically a guide fan. The guide fan is arranged in the mounting groove, and the guide fan is aligned with the placement rack below.

[0008] Optionally, air flow channels are provided on both sides of the mounting groove, the mounting groove is communicated with the air flow channels, and a plurality of air outlet holes are provided on the surface of the air flow channels.

[0009] Optionally, a thermal compensation component is further provided in the box, and the thermal compensation component includes a fixing frame and a heating coil. The fixing frame is arranged below the placement frame, and the heating coil is arranged below the placement frame.

[0010] Optionally, the heating coil covers the entire guide fan.

[0011] In summary, the present invention has at least one of the following beneficial technical effects:

[0012] 1. By improving the nitrogen intake method, the original single-port nitrogen intake is changed to a multi-port intake method with uniform distribution. Multiple intake pipes are added to the nitrogen-filled oven to allow nitrogen to enter from different positions, which can better promote gas mixing and uniform distribution, reduce the flow resistance of nitrogen inside the oven, increase gas diffusion and mixing effects, and thus improve the uniformity of nitrogen distribution;

[0013] 2. The guide fan can play the role of returning air, creating better gas flow in the box, accelerating the downward flow of nitrogen in the vertical direction, and quickly and evenly filling the entire box with nitrogen, making the distribution of nitrogen in the box more uniform and avoiding uneven concentration in certain areas;

[0014] 3. The thermal compensation component includes a fixing frame and a heating coil. The fixing frame is set below the placement frame, and the heating coil is set below the placement frame. The thermal compensation component can help maintain a stable environment inside the box, offset the operation of the guide fan, and the impact of external nitrogen entering the box on the internal temperature of the box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of a semiconductor nitrogen-filled high-temperature oven.

[0016] Figure 2 It is a schematic diagram of the hidden top cover of a semiconductor nitrogen-filled high-temperature oven.

[0017] Figure 3 This is a schematic diagram of a hidden door of a semiconductor nitrogen-filled high-temperature oven.

[0018] Figure 4 This is a schematic diagram of the other side of the hidden door of a semiconductor nitrogen-filled high-temperature oven.

[0019] Figure 5 It is a schematic diagram used to illustrate the structure of the nitrogen blowing component.

[0020] Figure 6 It is a partial cross-sectional view used to show the location of the fan and air flow channel.

[0021] Explanation of the accompanying symbols: 1. Box body; 2. Box door; 3. Top cover; 4. Nitrogen blowing assembly; 41. Air inlet pipe; 42. Serpentine pipe; 43. Air blowing pipe; 44. Bracket; 5. Placement rack; 6. Groove; 7. Mounting slot; 8. Guide fan; 9. Air flow channel; 10. Air outlet; 11. Fixing bracket; 12. Heating coil;. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0024] In addition, “several” means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0025] The present invention discloses a semiconductor nitrogen-filled high-temperature oven. Figure 1-5A semiconductor nitrogen-filled high-temperature oven includes a box body 1, a box door 2, a top cover 3, and a nitrogen blowing assembly 4. At least two sets of spaced-apart placement racks 5 are provided in the box body 1. A flow guide assembly is provided in the box body 1. A groove 6 is provided on the top of the box body 1. The nitrogen blowing assembly 4 is arranged in the groove 6. The nitrogen blowing assembly 4 specifically includes an air inlet pipe 41, a serpentine pipe 42, an air blowing pipe 43, and a bracket 44. One end of the air inlet pipe 41 is externally connected to a nitrogen blowing machine, and the other end of the air inlet pipe 41 is connected to the serpentine pipe 42. The other end of the air inlet pipe 41 is in communication with the serpentine pipe 42. The air blowing pipe 43 is provided with several groups. Several groups of blowing pipes 43 are evenly distributed at the bottom of the serpentine pipe 42. The serpentine pipe 42 is set on a bracket 44, and the bracket 44 is fixed in the groove 6. The blowing pipe 43 is aligned with the placement rack 5 above. By improving the nitrogen intake method, the original single-port nitrogen entry is changed to a multi-port entry method with uniform distribution. By adding multiple air intake pipes 41 to the nitrogen-filled oven, nitrogen is allowed to enter from different positions, which can better promote gas mixing and uniform distribution, reduce the flow resistance of nitrogen inside the oven, increase the diffusion and mixing effect of the gas, and thus improve the uniformity of nitrogen distribution.

[0026] Reference Figure 3 and Figure 6 A mounting slot 7 is provided in the box body 1. The guide component is specifically a guide fan 8. The guide fan 8 is arranged in the mounting slot 7. The guide fan 8 is aligned with the placement rack 5 below. The guide fan 8 can play the role of returning air, generating better gas flow in the box body 1, accelerating the downward flow of nitrogen in the vertical direction, and quickly and evenly filling the entire box body 1 with nitrogen, so that the distribution of nitrogen in the box body 1 is more uniform, avoiding uneven concentration in certain areas.

[0027] Reference Figure 3-6 , air flow channels 9 are provided on both sides of the mounting groove 7, the mounting groove 7 is connected to the air flow channel 9, and a plurality of air outlet holes 10 are provided on the surface of the air flow channel 9. The air flow in the box 1 introduced by the guide fan 8 can return to the box 1 from the air flow channel 9 and the air outlet holes 10 on the surface. A thermal compensation component is also provided in the box 1, and the thermal compensation component includes a fixing frame 11 and a heating coil 12. The fixing frame 11 is arranged below the placement frame 5, and the heating coil 12 is arranged below the placement frame 5. The thermal compensation component can help maintain a stable environment inside the box 1, offset the operation of the guide fan 8, and the influence of external nitrogen on the internal temperature of the box 1 when it enters the box 1.

[0028] In summary, the present invention improves the way nitrogen enters and adds multiple air inlet pipes 41 to the nitrogen-filled oven, so that nitrogen enters from different positions, thereby better promoting gas mixing and uniform distribution. By setting a guide fan 8 to accelerate the downward flow of nitrogen in the vertical direction, the nitrogen can be quickly and evenly filled in the entire box 1, making the distribution of nitrogen in the box 1 more uniform. At the same time, a thermal compensation component is set to help maintain a stable environment inside the box 1, offsetting the effect of the guide fan 8 and the influence of external nitrogen on the internal temperature of the box 1 when it enters the box 1.

[0029] The above are all preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. Therefore, any equivalent changes made based on the structure, shape, and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A semiconductor nitrogen-filled high-temperature oven, comprising a box body (1), a box door (2), a top cover (3), and a nitrogen blowing assembly (4), wherein at least two sets of spaced-apart placement racks (5) are provided in the box body (1), characterized in that: A flow guide assembly is provided in the box body (1), a groove (6) is provided on the top of the box body (1), the top cover (3) is provided at the groove (6), the nitrogen blowing assembly (4) is provided in the groove (6), the nitrogen blowing assembly (4) specifically comprises an air inlet pipe (41), a serpentine pipe (42), an air blowing pipe (43) and a bracket (44), one end of the air inlet pipe (41) is externally connected to a nitrogen blowing machine, the other end of the air inlet pipe (41) is connected to the serpentine pipe (42), the other end of the air inlet pipe (41) is communicated with the serpentine pipe (42), the air blowing pipe (43) is provided with a plurality of groups, and the plurality of groups of air blowing pipes (43) are evenly distributed at the bottom of the serpentine pipe (42), the serpentine pipe (42) is provided on the bracket (44), the bracket (44) is fixed in the groove (6), and the air blowing pipe (43) is aligned with the placement rack (5) above.

2. A semiconductor nitrogen-filled high-temperature oven according to claim 1, characterized in that: A mounting groove (7) is provided in the box body (1); the guide assembly is specifically a guide fan (8); the guide fan (8) is arranged in the mounting groove (7); and the guide fan (8) is aligned with the placement rack (5) below.

3. A semiconductor nitrogen-filled high-temperature oven according to claim 2, characterized in that: Airflow channels (9) are provided on both sides of the installation groove (7), the installation groove (7) is communicated with the airflow channels (9), and a plurality of air outlet holes (10) are provided on the surface of the airflow channels (9).

4. The semiconductor nitrogen-filled high-temperature oven according to claim 2, characterized in that: A thermal compensation component is also provided in the box (1), and the thermal compensation component comprises a fixing frame (11) and a heating coil (12). The fixing frame (11) is provided below the placement frame (5), and the heating coil (12) is provided below the placement frame (5).

5. The semiconductor nitrogen-filled high-temperature oven according to claim 4, characterized in that: The heating coil (12) covers the entire guide fan (8).

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