BGA solder ball height detection device

Abstract

The utility model relates to the field of BGA solder ball production, and relates to a BGA solder ball height detection device, the BGA solder ball height detection device comprises a fixing assembly, a detection assembly and a positioning assembly, the fixing assembly comprises two groups of bottom plates, a pressing plate, a rack rod, a driving gear I, a driving gear II, a transverse rack and a driving wheel, the bottom plates are symmetrically arranged, the upper end of the rack rod is slidably arranged on the outer sides of the bottom plates, and the pressing plate is arranged on the detection assembly. The pressing plate is fixed to the upper end of the rack rod, the first driving gear is connected with the rack rod in an engaged mode, the second driving gear is connected with the first driving gear through a connecting shaft, the upper end of the transverse rack is connected with the second driving gear in an engaged mode, and the driving wheel is connected with the lower end of the transverse rack in an engaged mode. The positioning assembly comprises an upper infrared sensor, an upper receiver, a lower infrared sensor and a lower receiver, the upper infrared sensor and the upper receiver are symmetrically arranged on the upper end face of the BGA solder ball plate, and the lower infrared sensor and the lower receiver are symmetrically arranged on the lower end face of the BGA solder ball plate.

Description

Technical Field

[0001] The utility model relates to the field of BGA solder ball production, and particularly relates to a BGA solder ball height detection device. Background Art

[0002] BGA chips with multiple solder balls vary widely, and the uniformity of their size and height directly impacts their quality. Process errors in existing production processes can lead to inconsistent solder ball heights, potentially resulting in quality defects. Therefore, BGA ball height measurement is essential. The current measurement solution uses a 3D line spectrum confocal sensor, such as the SPEC1020, for non-contact measurement. The sensor scans the BGA chip perpendicular to the machine platform, capturing the three-dimensional surface topography and defects of the solder balls using post-processing measurement software. The sensor then calculates the solder ball height and coplanarity standard deviation. This sensor offers high measurement accuracy, wide angular adaptability, and robust environmental compatibility, making it suitable for a wide range of surface types. However, the height measurement process can be subject to errors caused by other factors that 3D line spectrum confocal sensors cannot address. For example, uneven chip placement during initial inspection can lead to measurement errors.

[0003] Therefore, in order to solve the deficiencies in the prior art, a BGA solder ball height detection device with a simple structure needs to be designed. Utility Model Content

[0004] In order to solve the problems of the prior art, the utility model provides a BGA solder ball height detection device.

[0005] The purpose of the utility model can be achieved through the following technical solutions: A BGA solder ball height detection device includes: a fixing component, a detection component and a positioning component, the fixing component includes a base plate, a pressure plate, a rack rod, a driving gear 1, a driving gear 2, a transverse rack, a driving wheel and a motor, the base plate is symmetrically arranged with two groups, the upper end of the rack rod is slidably arranged on the outside of the base plate, the pressure plate is fixed to the upper end of the rack rod, the driving gear 1 is meshed and connected to the rack rod, the driving gear 2 is connected to the driving gear 1 through a connecting shaft, the upper end of the transverse rack is meshed and connected to the driving gear 2, the driving wheel is meshed and connected to the lower end of the transverse rack, the motor is connected to the driving wheel, the detection component is arranged at the upper end of the fixing component, the detection component includes a D-line spectral confocal sensor, the positioning component includes an upper infrared sensor, an upper receiver, a lower infrared sensor and a lower receiver, the upper infrared sensor and the upper receiver are symmetrically arranged on the upper end surface of the BGA solder ball plate, and the lower infrared sensor and the lower receiver are symmetrically arranged on the lower end surface of the BGA solder ball plate.

[0006] As a further improvement, the detection component also includes a Z-direction moving component, an X-direction moving component and a Y-direction moving component, the D-line spectral confocal sensor is arranged on the Z-direction moving component, the Z-direction moving component is arranged on the X-direction moving component, and the X-direction moving component is arranged on the Y-direction moving component.

[0007] As a further improvement, a rubber pad is provided on the inner side of the pressing plate.

[0008] As a further improvement, a vertical sliding guide sleeve is provided on the outside of the rack rod, and a transverse guide sleeve is provided on the outside of the transverse rack.

[0009] As a further improvement, the middle portion of the transverse rack includes a smooth guide rod.

[0010] Compared with the existing technology, the beneficial effects of the BGA solder ball height detection device of the utility model are:

[0011] The BGA solder ball chip to be inspected is placed on the base plate, and the motor drives the active wheel to rotate, which in turn drives the horizontal rack to move and drive the driving gear 2 to rotate synchronously. The rotation of the driving gear 2 drives the driving gear 1 to rotate synchronously. Each driving gear 1 drives the rack rod to move downward synchronously, and drives the pressure plate to move downward synchronously to clamp the upper ends of the BGA solder ball chip, thereby clamping and fixing the chip and stabilizing its position. Then, two sets of upper infrared sensors are attached to the upper surface of the BGA solder ball chip to transmit infrared rays to the upper receiver, and two sets of lower infrared sensors are attached to the lower surface of the BGA solder ball chip to transmit infrared rays to the lower receiver. When both the upper and lower receivers receive the infrared signal, it can be ensured that the BGA solder ball chip does not tilt left and right and remains level, thereby improving the detection accuracy. The BGA chip is scanned by the D-line spectral confocal sensor in conjunction with the moving mechanism, and the three-dimensional surface morphology and defects of the solder ball are obtained through post-processing measurement software, and the solder ball height and coplanarity standard deviation are calculated. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of the utility model

[0013] Figure 2 This is a schematic diagram of the structure of a partial top view of the utility model

[0014] Figure 3 This is a schematic diagram of the internal transmission structure of the fixed component in this utility model.

[0015] In the figure, 1-fixed component, 11-base plate, 12-pressure plate, 121-rubber pad, 13-rack rod, 14-drive gear 1, 15-drive gear 2, 16-transverse rack, 161-smooth guide rod, 17-driving wheel, 18-motor, 2-detection component, 21-3D line spectrum confocal sensor, 22-Z-direction moving component, 23-X-direction moving component, 24-Y-direction moving component, 3-positioning component, 31-upper infrared sensor, 32-upper receiver, 33-lower infrared sensor, 34-lower receiver, 41-vertical sliding guide sleeve, 42-transverse guide sleeve. DETAILED DESCRIPTION

[0016] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0017] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

[0018] Below with reference to the embodiment and the attached Figures 1 to 3 , the technical solution of the utility model is further elaborated.

[0019] Example 1

[0020] A BGA solder ball height detection device includes: a fixing component 1, a detection component 2 and a positioning component 3, the fixing component 1 includes a base plate 11, a pressure plate 12, a rack rod 13, a drive gear 14, a drive gear 2 15, a transverse rack 16, a driving wheel 17 and a motor 18, the base plate 11 is symmetrically provided with two groups, the upper end of the rack rod 13 is slidably provided on the outside of the base plate 11, the pressure plate 12 is fixed to the upper end of the rack rod 13, the drive gear 14 is meshed and connected to the rack rod 13, the drive gear 2 15 is connected to the drive gear 14 through a connecting shaft, the transverse rack 1 6 is meshed with the driving gear 2 15, the driving wheel 17 is meshed with the lower end of the transverse rack 16, the motor 18 is connected to the driving wheel 17, the detection component 2 is arranged at the upper end of the fixed component 1, the detection component 2 includes a 3D line spectrum confocal sensor 21, the positioning component 3 includes an upper infrared sensor 31, an upper receiver 32, a lower infrared sensor 33 and a lower receiver 34, the upper infrared sensor 31 and the upper receiver 3 are symmetrically arranged on the upper end surface of the BGA solder ball plate, and the lower infrared sensor 33 and the lower receiver 34 are symmetrically arranged on the lower end surface of the BGA solder ball plate.

[0021] like Figures 1 to 3 As shown, the working principle of the present invention is as follows: the BGA solder ball chip to be detected is placed on the bottom plate 11, and the motor 18 drives the driving wheel 17 to rotate, thereby driving the horizontal rack 16 to move and drive the driving gear 2 15 to rotate synchronously, and the driving gear 2 15 rotates and drives the driving gear 1 14 to rotate synchronously, and each driving gear 14 drives the rack rod 13 to move downward synchronously, and drives the pressure plate 12 to move downward synchronously to clamp the upper ends of the BGA solder ball chip, so as to achieve the clamping and fixing of the chip and stabilize the position, and then the two sets of upper infrared sensors 31 are attached to the BGA solder ball. The upper surface of the chip emits infrared rays to the upper receiver 32, and two sets of lower infrared sensors 33 are attached to the lower surface of the BGA solder ball chip to emit infrared rays to the lower receiver 34. When both the upper receiver 32 and the lower receiver 34 receive infrared signals, it can ensure that the BGA solder ball chip does not tilt left or right and remains level, thereby improving the accuracy of detection; the BGA chip is scanned by the 3D line spectrum confocal sensor 21 in conjunction with the moving mechanism, and the three-dimensional surface morphology and defects of the solder ball are obtained through post-processing measurement software, and the solder ball height and coplanarity standard deviation are calculated.

[0022] As a further preferred embodiment, the detection component 2 also includes a Z-direction moving component 22, an X-direction moving component 23 and a Y-direction moving component 24. The D-line spectrum confocal sensor 21 is arranged on the Z-direction moving component 22, the Z-direction moving component 22 is arranged on the X-direction moving component 23, and the X-direction moving component 23 is arranged on the Y-direction moving component 24. By setting the Z-direction moving component 22, the X-direction moving component 23 and the Y-direction moving component 24, the 3D line spectrum confocal sensor 21 can be precisely moved in three-dimensional space so as to detect BGA solder ball chips from different angles and positions.

[0023] As a further preferred embodiment, a rubber pad 121 is provided on the inner side of the pressing plate 12. It can provide a soft contact surface when clamping the BGA solder ball chip to prevent damage to the chip.

[0024] As a further preferred embodiment, a vertical sliding guide sleeve 41 is provided on the outside of the rack bar 13, and a transverse guide sleeve 42 is provided on the outside of the transverse rack 16. These guide sleeves provide precise guidance and stable support for the movement of the rack bar and the transverse rack.

[0025] As a further preferred embodiment, the middle portion of the transverse rack 16 includes a smooth guide rod 161 .

[0026] The above describes in detail the preferred embodiments of the present invention. It should be understood that those skilled in the art can make numerous modifications and variations based on the concepts of the present invention without inventive effort. Therefore, any technical solutions that can be derived by those skilled in the art based on the concepts of the present invention through logical analysis, reasoning, or limited experimentation based on the existing technology should be within the scope of protection defined by the claims.

Claims

1. A BGA solder ball height detection device, characterized in that: include: The fixing component, the detection component and the positioning component, the fixing component includes a base plate, a pressure plate, a rack rod, a drive gear 1, a drive gear 2, a transverse rack, a driving wheel and a motor, the base plate is symmetrically arranged with two groups, the upper end of the rack rod is slidably arranged on the outside of the base plate, the pressure plate is fixed to the upper end of the rack rod, the drive gear 1 is meshed and connected to the rack rod, the drive gear 2 is connected to the drive gear 1 through a connecting shaft, the upper end of the transverse rack is meshed and connected to the drive gear 2, the driving wheel is meshed and connected to the lower end of the transverse rack, the motor is connected to the driving wheel, the detection component is arranged at the upper end of the fixed component, the detection component includes a D-line spectral confocal sensor, the positioning component includes an upper infrared sensor, an upper receiver, a lower infrared sensor and a lower receiver, the upper infrared sensor and the upper receiver are symmetrically arranged on the upper end surface of the BGA solder ball plate, and the lower infrared sensor and the lower receiver are symmetrically arranged on the lower end surface of the BGA solder ball plate.

2. A BGA solder ball height detection device according to claim 1, characterized in that: The detection component also includes a Z-direction moving component, an X-direction moving component and a Y-direction moving component. The D-line spectral confocal sensor is arranged on the Z-direction moving component, the Z-direction moving component is arranged on the X-direction moving component, and the X-direction moving component is arranged on the Y-direction moving component.

3. The BGA solder ball height detection device according to claim 1, characterized in that: A rubber pad is provided on the inner side of the pressing plate.

4. A BGA solder ball height detection device according to claim 1, characterized in that: A vertical sliding guide sleeve is provided on the outside of the rack rod, and a transverse guide sleeve is provided on the outside of the transverse rack.

5. The BGA solder ball height detection device according to claim 1, characterized in that: The middle portion of the transverse rack includes a smooth guide rod.

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