Camera module

By embedding electronic components at the bottom of the rigid circuit board and optimizing the infrared filter structure, the imaging problem caused by the excessive size of the camera module was solved, achieving module miniaturization and high-quality imaging.

CN223391404UActive Publication Date: 2025-09-26SHINE OPTICS TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422758861.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-12
Publication Date
2025-09-26
Estimated Expiration
2034-11-12

AI Technical Summary

Technical Problem

Existing mobile phone camera modules are larger in size due to the improvement of lens module performance, and cannot adapt to the thin and light body of mobile phones, resulting in imaging problems such as glare during shooting.

Method used

An embedding groove is opened at the bottom of the rigid circuit board, and electronic components are set in the embedding groove. The infrared filter and the filter bracket are designed as a stepped groove structure, combined with an annular light-shielding layer and exhaust holes to optimize the camera module structure.

Benefits of technology

The thickness of the camera module is reduced, the imaging quality is maintained, infrared light interference is avoided, the picture clarity and contrast are improved, and the module is miniaturized and fully functional.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223391404U_ABST
    Figure CN223391404U_ABST
Patent Text Reader

Abstract

The utility model relates to the field of camera modules, and discloses a camera module, which comprises a sensor unit, a lens unit and a driving motor, the lens unit is arranged on the driving motor, the sensor unit comprises a sensor, a hard circuit board and a flexible circuit board, the bottom of the hard circuit board is provided with a caulking groove, an electronic component part is arranged in the caulking groove, and the flexible circuit board is arranged in the caulking groove. The electronic component part is electrically connected with the hard circuit board, the hard circuit board is electrically connected with the flexible circuit board, and the sensor is fixed on the upper surface of the hard circuit board. The utility model provides the camera module which enables the thickness of the camera module to be reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the field of camera modules, and in particular to a camera module. Background Art

[0002] As mobile phones become increasingly compact, and with the development of photography technology in recent years, the size of camera modules in electronic devices is gradually increasing and the performance is gradually improving. Various camera lenses are widely used in camera modules of mobile phones. At present, most mobile phone camera modules are used in combination with multiple cameras. As mobile phones become smaller and thinner, the performance improvement of lens modules leads to a larger size of camera modules, which may cause the height of existing lens modules to be unable to adapt to the light and thin body of mobile phones. When installed on the mobile phone, it will cause a protrusion, which may cause glare and other adverse problems affecting the imaging of the picture. Therefore, it is necessary to provide a camera module that reduces the thickness of the camera module. Utility Model Content

[0003] The utility model aims to provide a camera module, so as to provide a camera module with reduced thickness.

[0004] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: a camera module, including a sensor unit, a lens unit and a drive motor, the lens unit is mounted on the drive motor, the sensor unit includes a sensor, a hard circuit board and a flexible circuit board, a groove is opened at the bottom of the hard circuit board, an electronic component part is arranged in the groove, the electronic component part is electrically connected to the hard circuit board, the hard circuit board is electrically connected to the flexible circuit board, and the sensor is fixed to the upper surface of the hard circuit board.

[0005] The beneficial effects of this program are:

[0006] With the development of mobile phone camera module technology, the requirements for module size are getting higher and higher. It is very important to complete the production of camera modules in a limited space. If the height of the module body can be reduced, the space occupied by the camera module in the mobile phone can be reduced. Through the above-mentioned arrangement, a groove is opened at the bottom of the hard circuit board, and an electronic component part is arranged in the groove. The electronic component part is placed on the back side of the hard circuit board and embedded. The height of the bracket shoulder can be reduced, thereby lowering the height of the module by embedding the electronic component part into the hard circuit board. The hard circuit board around the groove can play a role in strengthening the structural strength. At the same time, the thickness of the hard circuit board can be reduced in height, so that the overall thickness of the camera module is reduced. At the same time, the above operation will not affect the imaging quality of the camera module, making the module more miniaturized while maintaining functional integrity.

[0007] Preferably, as an improvement, it further includes an infrared filter portion, which includes an infrared filter and a filter holder. The filter holder is provided with a through hole, and a stepped groove is provided around the through hole, and the infrared filter is embedded in the stepped groove.

[0008] The beneficial effect is: the infrared filter can effectively filter out unnecessary infrared light, ensuring that the camera module obtains natural and accurate colors when shooting, and avoiding interference of infrared light on imaging.

[0009] Preferably, as an improvement, an annular light-shielding layer is further provided at the connection between the infrared filter and the stepped groove.

[0010] The beneficial effect is that the annular light-shielding layer helps to eliminate stray light entering the module, prevents stray light that does not participate in imaging from entering the bracket, ensures that the sensor receives effective light, and thus improves picture clarity and contrast.

[0011] Preferably, as an improvement, an exhaust hole is provided on the filter holder.

[0012] The beneficial effect is that the above arrangement allows exhaust when the camera module glue is heated and cured, thereby preventing internal pressure from increasing and causing misalignment and deformation between internal parts, which are then sealed with glue.

[0013] Preferably, as an improvement, the stepped groove is in the shape of a rectangular ring, and semicircular grooves are provided at the four corners of the stepped groove.

[0014] The beneficial effect is: by setting a semicircular groove, when the infrared filter is fixed on the stepped groove by glue, the semicircular groove can accommodate some overflow glue, so that the infrared filter and the filter bracket are as close as possible, avoiding the edge of the infrared filter from warping during the glue curing process; in addition, when the infrared filter needs to be removed, inserting a warp into the semicircular groove can help remove the infrared filter embedded in the stepped groove.

[0015] Preferably, as an improvement, the diameter of the semicircular groove is at least 0.2 mm. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 An exploded view of an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of the bottom structure of a rigid circuit board according to an embodiment of the present utility model;

[0018] Figure 3 This is a structural diagram of the filter holder according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0019] The following is further described in detail through specific implementation methods:

[0020] The figure marks in the drawings of the specification include: sensor 1, hard circuit board 2, flexible circuit board 3, embedding groove 4, electronic component part 5, drive motor 6, lens unit 7, infrared filter 8, filter bracket 9, through hole 10, stepped groove 11, annular shading layer 12, exhaust hole 13, and semicircular groove 14.

[0021] Example

[0022] The embodiment is basically as follows Figure 1-Figure 3 As shown, Figure 1 The camera module shown in the figure includes a sensor 1 unit, a lens unit 7 and a drive motor 6. The sensor 1 unit includes a sensor 1, a hard circuit board 2 and a flexible circuit board 3. The bottom of the hard circuit board 2 is opened as shown in FIG. Figure 2 The embedding groove 4 shown in the figure has an electronic component part 5 arranged therein. The electronic component part 5 is electrically connected to the rigid circuit board 2, and the rigid circuit board 2 is electrically connected to the flexible circuit board 3. The sensor 1 is fixed to the upper surface of the rigid circuit board 2, and the lens unit 7 is mounted on the drive motor 6. The drive motor 6 drives the lens unit 7 to move for focusing. Through the above arrangement, the electronic component part 5 is placed on the back side of the rigid circuit board 2 and embedded therein, which can reduce the height of the bracket shoulder. Therefore, by embedding the electronic component part 5 in the rigid circuit board 2, the height of the module is reduced, making the module as a whole more miniaturized while maintaining the functional integrity of the camera module.

[0023] This embodiment also includes an infrared filter unit, which includes an infrared filter 8 and a filter holder 9. The drive motor 6 is fixedly connected to the filter holder 9 by glue. The filter holder 9 is fixedly installed on the rigid circuit board 2 by glue. A through hole 10 is opened on the filter holder 9. A stepped groove 11 is provided around the through hole 10. The stepped groove 11 is a rectangular ring. Semicircular grooves 14 are provided at the four corners of the stepped groove 11. When the infrared filter 8 is fixed to the stepped groove 11 by glue, the semicircular groove 14 can accommodate overflowing glue on all sides, so that the infrared filter 8 and the filter holder 9 are as close as possible to avoid the edge of the infrared filter 8 from warping during the glue curing process. The minimum diameter of the semicircular groove 14 in this embodiment is 0.2 mm to ensure that the overflowing glue can be fully accommodated. In addition, when it is necessary to remove the infrared filter 8, inserting a warp or other sheet or strip object into the semicircular groove 14 can help remove the infrared filter 8 embedded in the stepped groove 11, making it easier to embed the infrared filter 8 in the stepped groove 11. By setting the infrared filter 8, unnecessary infrared light can be effectively filtered out, ensuring that the camera module obtains natural and accurate colors when shooting, and avoiding infrared light from interfering with imaging. An annular shading layer 12 is also provided at the connection between the infrared filter 8 and the stepped groove 11. The annular shading layer 12 helps to eliminate stray light entering the interior of the module, avoids stray light that does not participate in imaging from entering the interior of the bracket, and ensures that the sensor 1 receives effective light, thereby improving picture clarity and contrast. In this embodiment, the filter bracket 9 is provided with a hole as shown in the figure. Figure 3 The vent hole 13 shown above is used to vent air during the camera module glue curing process, preventing internal pressure buildup that could cause misalignment and deformation between internal components. The vent hole 13 is then sealed with glue. The filter holder 9 in this embodiment has a convex shape when viewed from above. This arrangement facilitates mounting the filter holder 9 on the rigid circuit board 2 by supporting the protruding portion during alignment.

[0024] The specific implementation process is as follows:

[0025] With the development of mobile phone camera module technology, the requirements for the size of the module are getting higher and higher. It is very important to complete the production of the camera module in a limited space. If the height of the module body can be reduced, the space occupied by the camera module in the mobile phone can be reduced. Through the above-mentioned arrangement, a groove 4 is opened at the bottom of the hard circuit board 2, and an electronic component part 5 is arranged in the groove 4. The electronic component part 5 is placed on the back side of the hard circuit board 2 and embedded. The height of the bracket shoulder can be reduced, and the height of the module body is reduced by embedding the electronic component part 5 into the hard circuit board 2. The hard circuit board 2 can play a role in strengthening the structural strength. At the same time, the thickness of the hard circuit board 2 can be reduced in height, so that the overall thickness of the camera module is reduced. At the same time, the above operation will not affect the imaging quality of the camera module, making the module more miniaturized while maintaining functional integrity.

[0026] The above description is merely an embodiment of the present invention, and the commonly known specific technical solutions and / or features of the solution are not described in detail here. It should be noted that for those skilled in the art, without departing from the technical solution of the present invention, several variations and improvements can be made, which should also be considered as the scope of protection of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection claimed in this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A camera module, characterized in that: It includes a sensor unit, a lens unit and a drive motor. The lens unit is installed on the drive motor. The sensor unit includes a sensor, a hard circuit board and a flexible circuit board. A groove is opened at the bottom of the hard circuit board. An electronic component part is arranged in the groove. The electronic component part is electrically connected to the hard circuit board, and the hard circuit board is electrically connected to the flexible circuit board. The sensor is fixed on the upper surface of the hard circuit board.

2. The camera module according to claim 1, wherein: It also includes an infrared filter part, which includes an infrared filter and a filter bracket. The filter bracket is provided with a through hole, and a stepped groove is provided around the through hole. The infrared filter is embedded in the stepped groove.

3. The camera module according to claim 2, wherein: An annular light-shielding layer is also provided at the connection between the infrared filter and the stepped groove.

4. The camera module according to claim 3, wherein: There is an exhaust hole on the filter holder.

5. The camera module according to claim 4, wherein: The stepped groove is in a rectangular ring shape, and semicircular grooves are provided at the four corners of the stepped groove.

6. The camera module according to claim 5, wherein: The minimum diameter of the semicircular groove is 0.2 mm.