Electronic device with high space utilization rate of electronic module

Abstract

The utility model discloses an electronic device with high space utilization rate of electronic modules, which comprises a device supporting structure body, a backboard electronic assembly and a plurality of electronic modules, the device supporting structure body is cylindrical, the backboard electronic assembly is arranged in the device supporting structure body, and the electronic modules are arranged in the backboard electronic assembly. The electronic modules are installed in the equipment supporting structure body in the radial direction and are in vertical insertion fit with the backboard electronic assembly, the multiple electronic modules are arranged in a stacked mode in the axial direction, and the circumferential contours of the electronic modules are matched with the radial section shape of the equipment supporting structure body. According to the utility model, the equipment supporting structure body is cylindrical, the circumferential contours of the electronic modules are matched with the radial cross section of the equipment supporting structure body, and the plurality of electronic modules are laminated along the axial direction, so that not only is the highly integrated laminated layout of the electronic modules realized, but also the high space utilization rate of conformal design is realized; the electronic device can be shaped, miniaturized and lightened at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment hardware architecture, in particular to an electronic equipment with high space utilization of electronic modules. Background Art

[0002] According to the existing module standards (ARINC, ASAAC, SEM, VITA, CPCI), the electronic modules are mostly rectangular in shape. Placing the rectangular electronic modules in a square electronic equipment support will increase space utilization and facilitate assembly and fixation. Figure 1 As shown, a rectangular chassis body serves as an electronic device support body 100 , and a rectangular electronic module composed of a board 200 , an inter-board connector 300 and a backplane 400 is placed in the rectangular chassis body.

[0003] However, electronic device supports come in many shapes, including conventional square and cylindrical. Once a rectangular electronic module is placed in a cylindrical electronic device support, a large amount of space is wasted at the four corners. This not only results in low space utilization, but also makes it difficult to find a suitable way to fix the electronic module to the electronic device support. This imposes hardware architectural constraints on the design, miniaturization, and lightweighting of electronic devices, increasing their size and weight. Figure 2 As shown, if the rectangular electronic module composed of the board 200, the inter-board connector 300 and the backplane 400 is placed in the cylindrical electronic device support 500, there will be four arched spaces wasted and it is difficult to achieve relative fixation.

[0004] It should be noted that the above technical information is only intended to deepen the understanding of the overall background technology of the present invention, and should not be regarded as an admission or suggestion in any form that the above technical information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] In view of the deficiencies in the above-mentioned background technology, the present invention proposes an electronic device with high space utilization of electronic modules, which solves the technical problem of mutual constraints among the existing electronic devices in terms of special shape, miniaturization and lightweight.

[0006] The technical solution of this application is:

[0007] An electronic device with high space utilization of electronic modules, comprising a device support structure, a backplane electronic assembly, and a plurality of electronic modules, wherein the device support structure is cylindrical, the backplane electronic assembly is arranged in the device support structure, the electronic module is radially installed into the device support structure and is vertically plugged into the backplane electronic assembly, and the plurality of electronic modules are stacked along the axial direction, and the circumferential profile of the electronic module is adapted to the radial cross-sectional shape of the device support structure. In this technical solution, the backplane electronic assembly is arranged along the axial direction of the inner wall of the device support structure, which not only does not occupy too much radial space of the device structure support body, but also makes it easy to plug and unplug the electronic module vertically connected to the backplane electronic assembly from the radial direction of the device support structure, and the circumferential profile of the electronic module is adapted to the radial cross-sectional shape of the device support structure. Therefore, this technical solution has both a highly integrated electronic module stacking layout and a conformal design with high space utilization, and can simultaneously achieve the specialization, miniaturization, and lightweight of the electronic device. Among them, since the backplane electronic assembly has a backplane rigid-flexible assembly, the backplane electronic assembly does not necessarily have to be sent axially to the inside of the equipment support structure and then fixed. It can also be installed radially from top to bottom like the electronic module, and then the output end of the backplane electronic assembly can be extended outside the equipment support structure by utilizing the easy deformation characteristics of the backplane rigid-flexible assembly.

[0008] On the basis of the above technical solution, as a preferred technical solution, the circumferential portion of the equipment support structure is provided with an axial hollow area. Under the premise of ensuring the supporting strength of the equipment support structure, this technical solution hollows out part of the circumferential portion of the equipment support structure, which can not only reduce the weight of the product, but also provide visualization conditions for the installation and fixation of the electronic module. More importantly, the electronic module can extend a certain distance along the radial direction of the equipment support structure in the axial hollow area. As an expandable and usable space, more devices and circuits can be arranged, thereby increasing the PCB board volume ratio within the unit cross-section of the electronic module. It should be noted that under the technical guidance of this technical solution, technical personnel in this field can adopt various forms of axial hollow areas under the premise of ensuring weight reduction, visualization, and PCB board volume ratio.

[0009] Based on the above technical solution, as a preferred technical solution, the axial hollow area includes a radial insertion port for the electronic module and a side port near the backplane electronic assembly, and the edge of the electronic module is flush with the edge of the radial insertion port and the edge of the side port in the axial direction. This technical solution provides a preferred layout position for the axial hollow area on the equipment support structure, that is, the radial insertion port and the side port are hollowed out at the bottom and top of both sides along the axial direction, respectively. While reducing the weight of the product, providing visual conditions for the installation and fixation of the electronic module, and increasing the volume ratio of the PCB board within the unit cross-section of the electronic module, it also provides an installation channel for the electronic module and the backplane electronic assembly, that is, the radial insertion port and the side port have multiple functions at the same time.

[0010] Based on the above technical solution, as a preferred technical solution, the shaft end of the device support structure is provided with a radial hollow area. This technical solution not only further reduces the weight of the product and provides better visualization conditions for the installation and fixation of the electronic module, but also provides more feasibility for the installation of the backplane electronic components. It should be noted that under the technical guidance of this technical solution, while ensuring weight reduction, visualization, and PCB board volume ratio, those skilled in the art can adopt various forms of radial hollow areas.

[0011] On the basis of the above technical solutions, as a preferred technical solution, the skeleton outer contour of the radial hollow area has a straight structure and arc transition structures located on both sides of the straight structure, and the edge of the electronic module is flush with the edge of the straight structure and the edge of the arc transition structure in the axial direction. This technical solution provides a preferred arrangement of the radial hollow area on the equipment support structure. The circumferential coordination of the electronic module and the equipment support structure adopts a conformal matching spatial structure design, wherein the arc transition structures are preferably arranged at four locations and are respectively located at the four corners of the skeleton outer contour of the radial hollow area. Then, the four corner circumferential transitions of the electronic module are flush with the four arc transition structures of the equipment support structure, and the upper edge of the electronic module is aligned with the straight structure of the equipment support structure. This can maximize the use of the hollow space without affecting the insertion and removal of the electronic module from the radial insertion port, thereby further improving the volume ratio of the PCB board within the unit cross-section of the electronic module.

[0012] Based on the above technical solution, as a preferred technical solution, a primary guide structure is provided between the electronic module and the device support structure, and a secondary guide structure is provided between the electronic module and the backplane electronic assembly. When installing the electronic module, the electronic module is first radially inserted into the device support structure, guided by the primary guide structure. When the electronic module is inserted into the device support structure to a certain depth, the secondary guide structure guides the electronic module to vertically insert into the backplane electronic assembly.

[0013] Based on the above technical solution, as a preferred technical solution, the primary guiding structure includes guide ribs and guide rail grooves that guide the insertion and engagement between the electronic module and the device support structure. Specifically, the insertion and engagement between the guide ribs and guide rail grooves provides primary guidance during assembly of the electronic module and the device support structure. The number, specific placement, and cross-sectional shape of the guide ribs and guide rail grooves are variously selected. Guided by this technical solution, those skilled in the art can select from a variety of practical implementations.

[0014] On the basis of the above technical solution, as a preferred technical solution, the electronic module includes an electronic module PCB board and a heat-conducting cold plate that are interconnected, the guide ribs are arranged on both sides of the heat-conducting cold plate, and the guide rail grooves are arranged on both sides of the inner wall of the device support structure. This technical solution provides a preferred primary guide structure, which realizes the guided insertion of the electronic module and the device support structure through the guide ribs arranged on both sides of the heat-conducting cold plate and the guide rail grooves arranged in the device support structure; under the concept of the primary guide structure in the above technical solution, the guide rail grooves and guide ribs can also be arranged in reverse, that is, the guide rail grooves are arranged on the heat-conducting cold plate, and the guide ribs are arranged on the device support structure. The number of heat-conducting cold plates and guide ribs arranged in pairs can also be adjusted, for example, a pair of heat-conducting cold plates and guide ribs for guiding insertion are only arranged on one side of the heat-conducting cold plate.

[0015] On the basis of the above technical solution, as a preferred technical solution, the secondary guiding structure includes guide pins and guide holes for guiding the insertion between the electronic module and the backplane electronic assembly. This technical solution provides a preferred secondary guiding structure, which realizes the guided insertion between the electronic module and the backplane electronic assembly through the guide pins and guide holes. Under the concept of the secondary guiding structure in the above technical solution, the number of guide pins and guide holes arranged in pairs can be selected in a variety of ways. Preferably, two pairs are used for each electronic module, and preferably, the two pairs of guide pins and guide holes are respectively arranged on both sides of the electronic module. At the same time, there are also multiple options for the positions of the guide pins and guide holes, for example, the guide pins are arranged on the electronic module, and the guide holes are arranged on the backplane electronic assembly, or the guide pins are arranged on the backplane electronic assembly, and the guide holes are arranged on the electronic module; in addition, there are also multiple options for the shapes of the guide pins and guide holes, for example, the cross-sections of the guide pins and guide holes can be circular, elliptical, arched, etc., and a structure with a circular cross-section is preferably adopted.

[0016] Based on the above technical solution, as a preferred technical solution, each of the electronic modules is connected to the backplane electronic assembly through a pair of backplane connector plugs and backplane connector sockets, and the guide pins and guide holes are respectively arranged on the backplane connector plugs and the backplane connector sockets. This technical solution uses the adaptation of the backplane connector plugs and the backplane connector sockets to achieve electrical interconnection between the electronic module and the backplane electronic assembly. At the same time, the backplane connector plugs and the backplane connector sockets provide space for the arrangement of the guide pins and the guide holes. The specific arrangement positions of the backplane connector plugs and the backplane connector sockets can be selected according to the guidance of this technical solution. For example, the backplane connector plugs can be arranged on the electronic module and the backplane connector sockets can be arranged on the backplane electronic assembly, or conversely, the backplane connector plugs can be arranged on the backplane electronic assembly and the backplane connector sockets can be arranged on the electronic module. Similarly, the specific arrangement positions of the guide pins and guide holes can also be selected according to the guidance of this technical solution, for example, the guide pins are arranged on the backplane connector plug, and the guide holes are arranged on the backplane connector socket, or conversely, the guide pins are arranged on the backplane connector socket, and the guide holes are arranged on the backplane connector plug.

[0017] Based on the above technical solution, as a preferred technical solution, the backplane connector plug is connected to the bottom edge of the electronic module, the backplane connector socket is connected to the upper end of the backplane electronic assembly, the guide pins are arranged on both sides of the plug shell of the backplane connector plug, and the guide holes are arranged on both sides of the socket shell of the backplane connector socket. This technical solution provides a preferred arrangement of the backplane connector plug and the backplane connector socket, where the guide pins and guide holes of the secondary guide structure are arranged on the backplane connector plug and the backplane connector socket, respectively, and are located on both sides of the electrical connection portion. Not only is the spatial arrangement and component layout reasonable, which facilitates the arrangement of the electrical connection portion, but the secondary guide is also more convenient and reliable.

[0018] Based on the above technical solution, as a preferred technical solution, different anti-misplacement key structures are provided between each pair of the backplane connector plugs and backplane connector receptacles. This technical solution, through the directional coordination of the anti-misplacement key structures, can accommodate a variety of key orientations, thereby preventing misuse when installing and using different electronic modules. As for the specific structure of the anti-misplacement key structure, under the guidance of the inventive concept of anti-misplacement, there are various options, such as anti-misplacement pins arranged in pairs, or anti-misplacement pins and anti-misplacement slots arranged in pairs, etc.

[0019] The anti-misplacement key structure includes a plug anti-misplacement pin provided on the plug housing and a socket anti-misplacement pin provided on the socket housing. The plug anti-misplacement pin is plugged into and matched with the socket anti-misplacement pin. The plug anti-misplacement pins on different electronic modules correspond to socket anti-misplacement pins in different directions.

[0020] On the basis of the above technical solution, as a preferred technical solution, the electronic module is threadedly connected to the device support structure through a non-loosening screw; or the electronic module is clamped to the device support structure through a locker and separated from the device support structure through a puller. This technical solution provides two ways of fixing the electronic module to the device support structure. One is directly connected by threads. When the electronic module and the backplane electronic component are plugged into place, the limiting surface of the electronic module is attached to the limiting surface of the device support structure and is locked and fastened by non-loosening screws. The use of non-loosening screws for fastening can also play a role in assisting pulling. The other is that the electronic module is connected to the device support structure through a locker and separated from the device support structure through a puller, that is, the locking structure and the pulling structure between the electronic module and the device support structure are changed from a single non-loosening screw to a locker and a puller.

[0021] Based on the above technical solution, as a preferred technical solution, the non-loosening screw is connected to the device support structure through the heat-conducting cold plate of the electronic module; the locking device includes a tightening nut and a three-lobed sleeve provided on the heat-conducting cold plate of the electronic module; the puller includes an auxiliary extraction operating rod hinged to the heat-conducting cold plate; and the device support structure is provided with a support surface that cooperates with the auxiliary extraction support point at the end of the auxiliary extraction operating rod. This technical solution provides preferred embodiments of the non-loosening screw, locking device, and puller. The similarities are that the non-loosening screw, locking device, and puller are all connected to the electronic module via the heat-conducting cold plate. The advantage of this feature is not only reflected in the connection reliability, but also in the excellent heat conduction effect. The heat-conducting cold plate can directly transfer the heat generated by the electronic module PCB to the device support structure for heat dissipation through the non-loosening screw or locking device and puller, thereby reducing the limitation of heat dissipation on thermal bridge effect. Among them, the structure of locking by not loosening the screws is relatively simple. When the locking device is used, the tightening nut of the locking device is rotated clockwise with a hexagonal screwdriver, so that the three-petal sleeve of the locking device is staggered and gradually adheres to the side of the equipment support structure to achieve radial locking. When the electronic module is pulled out from the equipment support structure, since there is no hand-held structure to apply force, the operating lever of the puller is operated with one hand, and the relative movement between the auxiliary pulling support point of the puller and the supporting surface of the equipment support structure is used to achieve the effect of pulling the electronic module out of the equipment support structure.

[0022] Compared with the prior art, the beneficial effects of the present invention include:

[0023] 1. It realizes the miniaturization design and installation from equipment to modules. The highly integrated and axially stacked layout saves the space occupied by traditional distributed equipment installation and frees the equipment distributed layout from dependence on the use of connectors and cables.

[0024] 2. The convenience of manual installation and fixation of the equipment is realized, and the quick plug-in and quick pull-out improves the operability and maintainability of the equipment;

[0025] 3. It improves the high utilization rate of the unit cross-sectional space of the electronic module single board, facilitates the layout of more devices and lines, meets the single-board function realization of the future integrated signal processing board, and facilitates the development of the system towards the microsystem. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of the assembly of a rectangular electronic module and a square electronic device support;

[0028] Figure 2 A cross-sectional view of the assembly of a rectangular electronic module and a cylindrical electronic device support;

[0029] Figure 3 This is the general assembly drawing of the electronic equipment with high space utilization of the electronic module provided by the utility model;

[0030] Figure 4 for Figure 3 Schematic diagram of the installation process of the electronic module;

[0031] Figure 5 for Figure 3 Internal assembly diagram in;

[0032] Figure 6 for Figure 3 Schematic diagram of the equipment support structure;

[0033] Figure 7 for Figure 3 The stacking diagram of the electronic modules in the

[0034] Figure 8 for Figure 3 Schematic diagram of the mid-backplane electronic components;

[0035] Figure 9 for Figure 4 Internal state diagram in ;

[0036] Figure 10 for Figure 9 Schematic diagram of the connection structure between the electronic module and the backplane electronic components;

[0037] Figure 11 for Figure 10 Enlarged view of point A in the middle;

[0038] Figure 12 for Figure 10 Enlarged view of point B in the middle;

[0039] Figure 13 for Figure 7 A magnified view of the midplane connector plug;

[0040] Figure 14 for Figure 13 Enlarged view of point C in the middle;

[0041] Figure 15 for Figure 8 A magnified view of the midplane connector socket;

[0042] Figure 16 for Figure 15 Enlarged view of point D in the middle;

[0043] Figure 17 A radial cross-sectional view of the electronic module, the equipment support structure, and the backplane electronic components after installation;

[0044] Figure 18 This is an axial cross-sectional view of the electronic module and the equipment support structure after assembly;

[0045] Figure 19 for Figure 3 A hollow schematic diagram of the equipment support structure;

[0046] Figure 20 for Figure 19 Left view of;

[0047] Figure 21 for Figure 19 sectional view of

[0048] Figure 22 Assembly drawing of the electronic module, the locker and the extractor;

[0049] Figure 23 for Figure 22 Graph of the change of viewing angle;

[0050] Figure 24 for Figure 23 Enlarged view of point E in the middle;

[0051] Figure 25This is the general assembly drawing using a locker and an extractor;

[0052] Figure 26 for Figure 25 Enlarged view of point F in the middle.

[0053] Description of Figure Numbers:

[0054] Equipment support structure 1;

[0055] Axial hollow area 1-1, radial insertion port 1-11, side port 1-12;

[0056] Radial hollow area 1-2, straight structure 1-21, arc transition structure 1-22;

[0057] Guide rail grooves 1-3, support surfaces 1-4;

[0058] Back panel electronic assembly 2;

[0059] Backplane connector plug 2-1, plug housing 2-10, guide pin 2-11, plug anti-error pin 2-12, plug insulator component 2-13;

[0060] Backplane connector socket 2-2, socket housing 2-20, guide hole 2-21, socket anti-error pin 2-22, socket insulator component 2-23;

[0061] Backplane rigid-flex components 2-3;

[0062] Board-line transfer electrical connector 2-4;

[0063] Electronic module 3;

[0064] Electronic module PCB board 3-1;

[0065] Heat-conducting cold plate 3-2, guide rib 3-21, and retaining screw 3-22;

[0066] Locking device 3-23, tightening nut 3-231, three-piece sleeve 3-232;

[0067] Puller 3-24, auxiliary pulling operating rod 3-241, auxiliary pulling support point 3-242. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the core concept of the present invention and the following embodiments, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] The present application provides these embodiments to make this application thorough and complete, and to fully express the scope of this application to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values ​​set forth in these embodiments should be interpreted as merely exemplary, and not as limiting.

[0070] It should be noted that, in the description of this application, unless otherwise specified, "several" means greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," "axial," "radial," and the like, indicating orientations or positional relationships, are intended solely to facilitate the description of this application and simplify the description, and do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0071] In addition, the terms "first," "second," and similar terms used in this application do not denote any order, quantity, or importance, but are simply used to distinguish different parts. "Perpendicular" does not mean perpendicular in the strict sense, but rather means within the tolerance range. "Parallel" does not mean parallel in the strict sense, but rather means within the tolerance range. "Include" or "comprising" and similar terms mean that the elements preceding the word include the elements listed after the word, and do not exclude the possibility of other elements being included.

[0072] It should also be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0073] All terms used in this application have the same meaning as understood by one of ordinary skill in the art to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in, for example, common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or highly formal sense, unless explicitly defined as such herein.

[0074] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the corresponding technologies, methods, and equipment should be considered part of the specification.

[0075] The specific embodiments are as follows:

[0076] An electronic device with high space utilization of electronic modules, such as Figures 3 to 8 As shown, it includes a device support structure 1, a backplane electronic assembly 2, and several electronic modules 3. The device support structure 1 is cylindrical, the backplane electronic assembly 2 is arranged inside the device support structure 1, and the electronic modules 3 are radially installed into the device support structure 1 and vertically plugged into the backplane electronic assembly 2. The electronic modules 3 are stacked in the axial direction, and the circumferential profile of the electronic modules 3 is adapted to the radial cross-sectional shape of the device support structure 1.

[0077] Specifically, the device support structure 1 is axially connected to a backplane electronic assembly 2 and radially connected to a plurality of parallel electronic modules 3. The electronic modules 3 are vertically plugged into the backplane electronic assembly 2. The radial cross-section of the device support structure 1 is approximately annular with an opening. The circumferential profile of the electronic modules 3 matches the radial cross-section of the device support structure 1, meaning that the axial projections of the electronic modules 3 and the device support structure 1 are flush and conformal.

[0078] In this embodiment, if Figure 8 and Figure 9 As shown, since the backplane electronic component 2 has a backplane rigid-flexible component 2-3 and a board-line adapter electrical connector 2-4 flexibly connected to the backplane rigid-flexible component 2-3, the backplane electronic component 2 does not necessarily have to be axially delivered to the inside of the equipment support structure 1 and then fixed. It can also be radially installed from top to bottom like the electronic module 3, and then the output end of the backplane electronic component 2 can be extended to the outside of the equipment support structure 1 by utilizing the easy deformation characteristics of the backplane rigid-flexible component.

[0079] In this embodiment, the backplane electronic assembly 2 is arranged axially along the inner wall of the device support structure 1. This not only avoids excessive radial space occupation within the device support structure 1, but also facilitates the insertion and removal of the electronic module 3, which is perpendicularly connected to the backplane electronic assembly 2, from the radial direction of the device support structure 1. The circumferential profile of the electronic module 3 matches the radial cross-section of the device support structure 1. Therefore, this technical solution combines a highly integrated stacked layout of electronic modules 3 with the high space utilization of a conformal design, enabling the simultaneous implementation of customized, miniaturized, and lightweight electronic devices.

[0080] On the basis of the above embodiments, as a preferred embodiment, Figures 19 to 21As shown, the circumferential portion of the device support structure 1 is provided with an axially hollowed-out region 1-1. While ensuring the supporting strength of the device support structure 1, this embodiment hollows out the circumferential portion of the device support structure 1. This not only reduces the weight of the product but also provides visual conditions for the installation and fixation of the electronic module 3. Furthermore, the backplane electronic assembly 2 and the electronic module 3 can be installed through the axially hollowed-out region 1-1.

[0081] More importantly, the electronic module 3 can extend a certain distance radially along the device support structure 1 within the axial hollow region 1-1, providing expandable space for the layout of more components and circuits, thereby increasing the PCB volume ratio per unit cross-section of the electronic module 3. It should be noted that, under the technical guidance of this technical solution, those skilled in the art may adopt various forms of axial hollow regions while ensuring weight reduction, visualization, and PCB volume ratio.

[0082] Based on the above embodiments, as a preferred embodiment, the axial hollow area 1-1 includes the radial insertion port 1-11 of the electronic module 3 and the radial insertion port 1-11 close to the backplane electronic component 2, and the edge of the electronic module 3 is flush with the edge of the radial insertion port 1-11 and the edge of the side port 1-12 in the axial direction.

[0083] This embodiment provides a preferred arrangement position of the axial hollow area 1-1 on the equipment support structure 1, that is, the bottom and the upper parts on both sides along the axial direction are hollowed out to form radial insertion ports 1-11 and side ports 1-12, which reduce the weight of the product, provide visual conditions for the installation and fixation of the electronic module 3, and increase the PCB board volume ratio within the unit cross-section of the electronic module 3. At the same time, it also provides a preferred installation channel for the electronic module 3 and the backplane electronic component 2, that is, the radial insertion port 1-11 and the side port 1-12 have multiple functions at the same time.

[0084] It should be noted that this embodiment is only a preferred arrangement of the axial hollow area 1-1. The axial hollow area 1-1 can also adopt other arrangements. The position, shape, and number of the radial insertion port 1-11, as well as the shape, position, and number of the side ports 1-12, can all be selected in a variety of ways. That is, in addition to arranging the radial insertion port 1-11 on the side of the device support structure 1 away from the backplane electronic assembly 2 and arranging the side ports 1-12 on both sides of the device support structure 1 close to the backplane electronic assembly 2 as shown in the figure, the radial insertion port 1-11 can also be arranged on the side of the device support structure 1 close to the backplane electronic assembly 2, and the side ports 1-12 can be arranged on the side of the device support structure 1 away from the backplane electronic assembly 2. In addition, the radial insertion port 1-11 and the side ports 1-12 can be set as continuous openings in the axial direction as shown in the figure, or as a plurality of openings arranged at intervals in the axial direction.

[0085] On the basis of the above embodiments, as a preferred embodiment, Figure 17 and Figure 18 As shown, the axial ends of the device support structure 1 are provided with radially hollowed regions 1-2. This embodiment not only further reduces product weight and provides better visualization for the installation and fixation of the electronic module 3, but also increases the feasibility of installing the backplane electronic assembly 2. It should be noted that under the technical guidance of this technical solution, those skilled in the art can adopt various structural forms of the radially hollowed regions 1-2 while ensuring weight reduction, visualization, and PCB board volume ratio.

[0086] Based on the above embodiments, as a preferred embodiment, the skeleton outer contour of the radial hollow area 1-2 has a straight structure 1-21 and an arc transition structure 1-22 located on both sides of the straight structure 1-21, and the edge of the electronic module 3 is flush with the edge of the straight structure 1-21 and the edge of the arc transition structure 1-22 in the axial direction.

[0087] This embodiment provides a preferred arrangement of radial hollow areas 1-2 on the device support structure 1, and the circumferential coordination of the electronic module 3 and the device support structure 1 adopts a conformal matching spatial structure design, wherein the arc transition structures 1-22 are preferably arranged at four locations and are respectively located at the four corners of the skeleton outer contour of the radial hollow area 1-2. The four corner circumferential transitions of the electronic module 3 are flush with the four arc transition structures 1-22 of the device support structure 1, and the upper edge of the electronic module 3 is aligned with the straight structure 1-21 of the device support structure 1, which can maximize the use of the hollow space without affecting the insertion and removal of the electronic module 3 from the radial insertion port 1-11, thereby further improving the PCB board volume ratio within the unit cross-section of the electronic module 3.

[0088] In addition, it is preferred that the straight structure 1-21 and the arc transition structure 1-22 are set to correspond to the outer contour of the radial insertion port 1-11, that is, the outer contour of the radial insertion port 1-11 includes the straight structure 1-21 and the arc transition structure 1-22, so that the circumferential extension range of the radial insertion port 1-11 covers the straight structure 1-21 and the arc transition structure 1-22.

[0089] It should be noted that the above content is only an illustration of the inventive concept and preferred method of this embodiment. Within the technical scope protected by this utility model, there are multiple options for the number and relative position relationship of the straight structure 1-21 and the arc transition structure 1-22. Those skilled in the art can implement them on their own according to the technical guidance of this utility model, and this embodiment will not be repeated.

[0090] On the basis of the above embodiments, as a preferred embodiment, Figure 5 、 Figure 6 、 Figure 9 、 Figure 10 As shown, a primary guide structure is provided between the electronic module 3 and the device support structure 1, and a secondary guide structure is provided between the electronic module 3 and the backplane electronic assembly 2. When installing the electronic module 3, the electronic module 3 is first radially inserted into the device support structure 1, guided by the primary guide structure. When the electronic module 3 is inserted into the device support structure 1 to a certain depth, the electronic module 3 is guided by the secondary guide structure to vertically insert into the backplane electronic assembly 2.

[0091] Based on the above embodiment, as a preferred embodiment, the primary guide structure includes guide ribs 3-21 and guide rail grooves 1-3 that guide the insertion and engagement between the electronic module 3 and the device support structure 1. Specifically, this embodiment achieves primary guidance during assembly of the electronic module 3 and the device support structure 1 through the insertion and engagement between the guide ribs 3-21 and the guide rail grooves 1-3. The number, specific placement, and cross-sectional shape of the guide ribs 3-21 and the guide rail grooves 1-3 are variously selectable. Guided by this technical solution, those skilled in the art can select from a variety of practical implementations.

[0092] Based on the above embodiments, as a preferred embodiment, the electronic module 3 includes an electronic module PCB board 3-1 and a heat-conducting cold plate 3-2 connected to each other, the guide ribs 3-21 are arranged on both sides of the heat-conducting cold plate 3-2, and the guide rail grooves 1-3 are arranged on both sides of the inner wall of the equipment support structure 1.

[0093] This embodiment provides a preferred primary guide structure, which achieves guided insertion and engagement between the electronic module 3 and the device support structure 1 through the guide ribs 3-21 provided on both sides of the heat-conducting cold plate 3-2 and the guide grooves 1-3 provided in the device support structure 1. Based on the concept of the primary guide structure in the above embodiment, and without departing from the scope of protection of the present invention, the guide grooves 1-3 and the guide ribs 3-21 can also be arranged in the opposite direction, that is, the guide grooves 1-3 are arranged on the heat-conducting cold plate 3-2, and the guide ribs 3-21 are arranged on the device support structure 1. The number of heat-conducting cold plates 3-2 and guide ribs 3-21 arranged in pairs can also be adjusted, for example, a pair of heat-conducting cold plates 3-2 and guide ribs 3-21 for guiding insertion can be provided on only one side of the heat-conducting cold plate 3-2.

[0094] On the basis of the above embodiments, as a preferred embodiment, Figure 11 and Figure 12As shown, the secondary guiding structure includes guide pins 2-11 and guide holes 2-21 for guiding the insertion between the electronic module 3 and the backplane electronic assembly 2. This embodiment provides a preferred secondary guiding structure, which realizes the guided insertion of the electronic module 3 and the backplane electronic assembly 2 through the guide pins 2-11 and the guide holes 2-21. Under the concept of the secondary guiding structure in the above embodiment, the number of guide pins 2-11 and guide holes 2-21 arranged in pairs can be selected in a variety of ways. Preferably, two pairs are used for each electronic module 3, and preferably, the two pairs of guide pins 2-11 and guide holes 2-21 are respectively arranged on both sides of the electronic module 3. At the same time, the positions of the guide pins 2-11 and guide holes 2-21 also have a variety of options, for example, the guide pins 2-11 are arranged on the electronic module 3, and the guide holes 2-21 are arranged on the backplane electronic assembly 2, or the guide pins 2-11 are arranged on the backplane electronic assembly 2, and the guide holes 2-21 are arranged on the electronic module 3.

[0095] On the basis of the above embodiments, as a preferred embodiment, Figures 13 to 16 As shown, each of the electronic modules 3 is connected to the backplane electronic assembly 2 through a pair of backplane connector plugs 2-1 and backplane connector sockets 2-2, and the guide pins 2-11 and the guide holes 2-21 are respectively arranged on the backplane connector plugs 2-1 and the backplane connector sockets 2-2.

[0096] This embodiment uses the adaptation of the backplane connector plug 2-1 and the backplane connector socket 2-2 to achieve electrical interconnection between the electronic module 3 and the backplane electronic component 2. At the same time, the backplane connector plug 2-1 and the backplane connector socket 2-2 provide layout space for the guide pins 2-11 and the guide holes 2-21.

[0097] As for the specific arrangement positions of the backplane connector plug 2-1 and the backplane connector socket 2-2, they can be selected according to the guidance of the present technical solution. For example, the backplane connector plug 2-1 can be arranged on the electronic module, and the backplane connector socket 2-2 can be arranged on the backplane electronic assembly 2. Or conversely, the backplane connector plug 2-1 can be arranged on the backplane electronic assembly 2, and the backplane connector socket 2-2 can be arranged on the electronic module.

[0098] Similarly, the specific arrangement positions of the guide pins 2-11 and guide holes 2-21 can also be selected in a variety of ways according to the guidance of the present technical solution. For example, the guide pins 2-11 can be arranged on the backplane connector plug 2-1, while the guide holes 2-21 can be arranged on the backplane connector socket 2-2. Or conversely, the guide pins 2-11 can be arranged on the backplane connector socket 2-2, while the guide holes 2-21 can be arranged on the backplane connector plug 2-1.

[0099] On the basis of the above embodiments, as a preferred embodiment, Figure 10 As shown, the backplane connector plug 2-1 is connected to the bottom edge of the electronic module 3, the backplane connector socket 2-2 is connected to the backplane electronic component 2, the guide pins 2-11 are arranged on both sides of the plug shell 2-10 of the backplane connector plug 2-1, and the guide holes 2-21 are arranged on both sides of the socket shell 2-20 of the backplane connector socket 2-2.

[0100] This embodiment provides a preferred structural form of the backplane connector plug 2-1 and the backplane connector socket 2-2, and the guide pins 2-11 and guide holes 2-21 of the secondary guiding structure are respectively arranged on the backplane connector plug 2-1 and the backplane connector socket 2-2, and are respectively located on both sides of the electrical connection part. Not only is the spatial arrangement and component layout reasonable, which facilitates the arrangement of the electrical connection part, but the secondary guiding is also more convenient and reliable.

[0101] Based on the above embodiment, as a preferred embodiment, each pair of backplane connector plugs 2-1 and backplane connector receptacles 2-2 is provided with a different anti-misplacement key structure. This embodiment, by coordinating the orientation of the anti-misplacement key structure, can accommodate a variety of key orientations, thereby preventing misuse when installing different electronic modules. As for the specific structure of the anti-misplacement key structure, guided by the inventive concept of misalignment prevention, various options are available, such as paired anti-misplacement pins, or paired anti-misplacement pins and anti-misplacement slots, etc.

[0102] On the basis of the above embodiments, as a preferred embodiment, the anti-misinsertion key position structure includes a plug anti-misinsertion pin 2-12 set on the plug housing 2-10 and a socket anti-misinsertion pin 2-22 set on the socket housing 2-20. The plug anti-misinsertion pin 2-12 is plugged into and matched with the socket anti-misinsertion pin 2-22. The plug anti-misinsertion pins 2-12 on different electronic modules 3 correspond to socket anti-misinsertion pins 2-22 in different directions.

[0103] On the basis of the above embodiments, as a preferred embodiment, Figures 3 to 6 As shown, the electronic module 3 is threadedly connected to the device support structure 1 through a non-loosening screw 3-22; or the electronic module 3 is clamped to the device support structure 1 through a locker 3-23 and separated from the device support structure 1 through a puller 3-24.

[0104] This embodiment provides two methods for securing the electronic module 3 to the device support structure 1. One method involves a direct threaded connection. When the electronic module 3 is plugged into the backplane electronic assembly 2, the retaining surface of the electronic module 3 abuts against the retaining surface of the device support structure 1 and is secured securely by a captive screw 3-22. Using the captive screw 3-22 for fastening not only simplifies the structure but also facilitates assembly and disassembly by providing an easy-to-use removal feature. For assembly, simply tighten the captive screw 3-22. For disassembly, simply loosen the captive screw 3-22 and then pull on it to remove the electronic module 3.

[0105] The other is that the electronic module 3 is connected to the equipment support structure 1 through a locker 3-23 and is separated from the equipment support structure 1 through a puller 3-24, that is, the locking structure and the pulling structure between the electronic module 3 and the equipment support structure 1 are respectively changed from a single non-loosening screw 3-22 to a locker 3-23 and a puller 3-24.

[0106] As a preferred embodiment, Figures 22 to 26 As shown, the captive screw 3 - 22 is connected to the equipment support structure 1 through the heat-conducting cold plate 3 - 2 of the electronic module 3 .

[0107] The locker 3-23 includes a tightening nut 3-231 and a three-lobe sleeve 3-232 set on the heat-conducting cold plate 3-2 of the electronic module 3. By rotating the tightening nut 3-231, the three-lobe sleeve 3-232 can be radially tightened against the inner wall of the equipment support structure 1 or detached from the inner wall of the equipment support structure 1.

[0108] The puller 3-24 includes an auxiliary pulling operating rod 3-241 hinged to the heat-conducting cold plate 3-2, and the equipment support structure 1 is provided with a support surface 1-4 that stops and cooperates with the auxiliary pulling support point 3-242 at the end of the auxiliary pulling operating rod 3-241.

[0109] That is, in this embodiment, the locker 3-23 adopts a three-petal structure with variable diameter, and the extractor 3-24 adopts a lever structure. Of course, in addition to this, within the scope of the inventive concept of the utility model, the locker 3-23 and the extractor 3-24 can have a variety of structural forms to choose from, for example, the locker 3-23 adopts other multi-petal structures, a spring tongue structure, and the extractor 3-24 adopts a pull-out structure, a push-up structure, etc.

[0110] It should also be noted that this embodiment provides preferred implementations of the captive screws 3-22, the locking device 3-23, and the extractor 3-24. These features are similar in that they are all connected to the electronic module 3 via a thermally conductive cold plate. This feature offers advantages not only in terms of connection reliability but also in terms of excellent heat conduction. The thermally conductive cold plate 3-2 can transfer heat generated by the electronic module PCB 3-1 directly to the device support structure 1 via the captive screws 3-22, the locking device 3-23, and the extractor 3-24, thereby reducing the heat dissipation limitations caused by thermal bridge effects.

[0111] Although the structure for locking the electronic module 3 by means of the captive screw 3-22 in this embodiment is relatively simple, the threaded hole structure on the device support structure 1 that matches the captive screw 3-22 has a preferred embodiment, namely, it is preferably coupled with the guide rail groove 1-3 or the guide rib 3-21. When the guide rail groove 1-3 is arranged on the inner wall of the device support structure 1, the threaded hole structure is arranged between adjacent guide rail grooves 1-3, and the outer wall of the threaded hole structure is aligned with the inner wall of one of the guide rail grooves 1-3; and when the guide rib 3-21 is arranged on the inner wall of the device support structure 1, the threaded hole structure is arranged between adjacent guide ribs 3-21, or the threaded hole is arranged on the guide rib 3-21. The structural mode of coupling the above-mentioned threaded hole structure with the guide rail groove 1-3 or the guide rib 3-21 can further improve space utilization.

[0112] When the embodiment of the locker 3-23 is adopted, in addition to having the same embodiment as the above-mentioned coupling arrangement, its operation method is: by using a hexagonal screwdriver to rotate the tightening nut 3-231 of the locker 3-23 clockwise, the three-petal sleeve of the locker 3-23 is staggered and gradually pressed against the side of the equipment support structure 1 to achieve radial locking. When the electronic module 3 is pulled out from the equipment support structure 1, there is no hand-held structure to apply force. At this time, the auxiliary extraction operating rod 3-241 of the puller 3-24 is operated with one hand, and the relative movement between the auxiliary extraction support point 3-242 of the puller 3-24 and the support surface 1-4 of the equipment support structure 1 is used to achieve the effect of pulling the electronic module 3 out of the equipment support structure 1.

[0113] As a preferred embodiment of the present invention, the electronic device with high space utilization of electronic modules includes three parts: a device support structure 1, a backplane electronic component 2, and an electronic module 3. Figure 3 As shown. The backplane electronic assembly 2 passes through the side of the equipment support structure 1 and is fixed to the equipment support structure 1 by screws 3-22 that do not loosen. The six electronic modules 3 are inserted into the backplane electronic assembly 2 in sequence from top to bottom through the guide grooves 1-3 of the equipment support structure 1. Figure 4 、 Figure 5 、 Figure 6 As shown, the integrity of the electronic compartment assembly in terms of structural reliability is achieved by fastening with screws 3-22 that do not loosen.

[0114] The six electronic modules 3 with different functions have a uniform appearance and are stacked in sequence according to the same axial spacing, such as Figure 7 As shown, the bottom edge of each electronic module 3 is press-fitted with a backplane connector plug 2-1 with different anti-misplacement key positions without soldering, and is plugged into the backplane connector socket 2-2 with a press-fitted soldering free position on the backplane electronic component 2 to achieve electrical connection. According to the different anti-misplacement key positions on the connector, the six electronic modules can be used in an anti-misplacement manner, as shown in FIG. Figures 10 to 16 shown.

[0115] The six electronic modules 3 are electrically interconnected with the backplane electronic assembly 2 via a blind-mate backplane connector plug 2-1 and a backplane connector receptacle 2-2. Guide pins 2-11 and guide holes 2-21 guide the connectors at each end. Two plug anti-mating pins 2-12 are located adjacent to the guide pins 2-11, and two receptacle anti-mating pins 2-22 are located adjacent to the guide holes 2-21. The guide holes 2-21 are preferably crown-strap holes, and the plug and receptacle anti-mating pins 2-12 and 2-22 are preferably square pins with keyed positions, allowing for 16 keying orientations.

[0116] The guide ribs 3-21 on the electronic module 3 and the guide grooves 1-3 on the equipment support structure 1 realize primary guidance. When the electronic module 3 is inserted into the equipment support structure 1 to a certain depth, the guide pins 2-11 on the backplane connector plug 2-1 at the lower end of the electronic module 3 and the guide holes 2-21 on the backplane connector socket 2-2 on the backplane electronic component 2 guide the insertion to realize secondary guidance. After further insertion to a certain depth, the metal plug shell 2-10 and plug insulator component 2-13 of the backplane connector plug 2-1 and the metal socket shell 2-20 and socket insulator component 2-23 of the backplane connector socket 2-2 are successively contacted and guided until they are inserted into place. At this time, the limit surface of the electronic module 3 is in contact with the limit surface of the equipment support structure 1 and is locked and fastened by the non-loosening screws 3-22.

[0117] Figure 17 and Figure 18 It is a cross-sectional view after the electronic module 3 is installed and fixed to the equipment support structure 1 and plugged into the backplane electronic component 2. From the figure, it can be clearly seen that the cross-section of the electronic module PCB board 3-1 has achieved the maximum area utilization rate relative to the cylindrical equipment support structure 1. Based on this, more electronic devices can be arranged here, realizing high space utilization of the single board. Figure 18The stacking arrangement of six types of electronic modules 3 in the axial space is demonstrated. The guide ribs 3-21 on both sides of the heat-conducting cold plate 3-2 of the electronic module 3 are guided and inserted into the guide grooves 1-3 in the equipment support structure 1. The heat-conducting cold plate 3-2 has built-in captive screws 3-22 on both sides that are screwed into the threaded holes on the equipment support structure 1 and then coated with thread glue for fastening. This is simple, convenient and highly reliable.

[0118] In order to achieve the volume ratio of the single board in the cylindrical space, the equipment support structure 1 is hollowed out at the bottom and top of both sides along the axial direction while ensuring the strength support. Figures 19 to 21 As shown, the electronic module 3 will extend a certain distance radially along the device support structure in the hollow area, which can be used as an expandable space to layout more devices and circuits, thereby increasing the PCB board volume ratio within the unit cross section of the electronic module 3, as shown in FIG. Figure 17 、 Figure 21 shown.

[0119] Anything not described in detail in the present invention is a conventional technical means known to those skilled in the art.

[0120] The above content shows and describes the basic principles, main features and beneficial effects of the present invention. The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. An electronic device with high space utilization of electronic modules, comprising a device support structure (1), a backplane electronic assembly (2) and a plurality of electronic modules (3), characterized in that: The device support structure (1) is cylindrical, the backplane electronic assembly (2) is arranged in the device support structure (1), the electronic module (3) is radially installed in the device support structure (1) and is vertically plugged into the backplane electronic assembly (2), and a plurality of electronic modules (3) are stacked in an axial direction, and the circumferential profile of the electronic module (3) is adapted to the radial cross-sectional shape of the device support structure (1).

2. The electronic device with high space utilization of electronic modules according to claim 1, characterized in that: The circumferential portion of the equipment support structure (1) is provided with an axial hollow area (1-1).

3. The electronic device with high space utilization of electronic modules according to claim 2, characterized in that: The axial hollowed-out area (1-1) includes a radial insertion opening (1-11) of the electronic module (3) and a side opening (1-12) close to the backplane electronic component (2); an edge of the electronic module (3) is flush with an edge of the radial insertion opening (1-11) and an edge of the side opening (1-12) in the axial direction.

4. The electronic device with high space utilization of electronic modules according to any one of claims 1 to 3, characterized in that: The shaft end of the equipment support structure (1) is provided with a radial hollow area (1-2).

5. The electronic device with high space utilization of electronic modules according to claim 4, characterized in that: The skeleton outer contour of the radial hollowed-out area (1-2) comprises a straight structure (1-21) and arc transition structures (1-22) located on both sides of the straight structure (1-21); the edge of the electronic module (3) is flush with the edge of the straight structure (1-21) and the edge of the arc transition structure (1-22) in the axial direction.

6. The electronic device with high space utilization of electronic modules according to any one of claims 1 to 3 and 5, characterized in that: A primary guiding structure is provided between the electronic module (3) and the equipment supporting structure (1), and a secondary guiding structure is provided between the electronic module (3) and the backplane electronic assembly (2).

7. The electronic device with high space utilization of electronic modules according to claim 6, characterized in that: The primary guide structure comprises guide ribs (3-21) and guide rail grooves (1-3) for guiding the insertion between the electronic module (3) and the equipment support structure (1).

8. The electronic device with high space utilization of electronic modules according to claim 7, characterized in that: The electronic module (3) comprises an electronic module PCB board (3-1) and a heat-conducting cold plate (3-2) connected to each other, the guide ribs (3-21) are arranged on both sides of the heat-conducting cold plate (3-2), and the guide rail grooves (1-3) are arranged on both sides of the inner wall of the equipment support structure (1).

9. The electronic device with high space utilization of electronic modules according to claim 7 or 8, characterized in that: The secondary guiding structure comprises a guiding pin (2-11) and a guiding hole (2-21) for guiding the insertion between the electronic module (3) and the backplane electronic assembly (2).

10. The electronic device with high space utilization of electronic modules according to claim 9, characterized in that: Each of the electronic modules (3) is connected to the backplane electronic assembly (2) via a paired backplane connector plug (2-1) and a backplane connector socket (2-2), and the guide pins (2-11) and the guide holes (2-21) are respectively arranged on the backplane connector plug (2-1) and the backplane connector socket (2-2).

11. The electronic device with high space utilization of electronic modules according to claim 10, characterized in that: The backplane connector plug (2-1) is connected to the bottom edge of the electronic module (3), the backplane connector socket (2-2) is connected to the upper end of the backplane electronic component (2), the guide pins (2-11) are arranged on both sides of the plug housing (2-10) of the backplane connector plug (2-1), and the guide holes (2-21) are arranged on both sides of the socket housing (2-20) of the backplane connector socket (2-2).

12. The electronic device with high space utilization of electronic modules according to claim 10 or 11, characterized in that: Different anti-misinsertion key structures are provided between each pair of the backplane connector plugs (2-1) and the backplane connector sockets (2-2).

13. The electronic device with high space utilization of electronic modules according to claim 12, characterized in that: The anti-misplacement key structure comprises a plug anti-misplacement pin (2-12) provided on the plug housing (2-10) of the backplane connector plug (2-1) and a socket anti-misplacement pin (2-22) provided on the socket housing (2-20) of the backplane connector socket (2-2); the plug anti-misplacement pin (2-12) and the socket anti-misplacement pin (2-22) are plugged and matched.

14. The electronic device with high space utilization of electronic modules according to any one of claims 1-3, 5, 7-8, 10-11, and 13, characterized in that: The electronic module (3) is threadedly connected to the device support structure (1) via a non-loosening screw (3-22); or the electronic module (3) is clamped to the device support structure (1) via a locker (3-23) and separated from the device support structure (1) via a puller (3-24).

15. The electronic device with high space utilization of electronic modules according to claim 14, characterized in that: The non-loosening screw (3-22) is connected to the equipment support structure (1) through the heat-conducting cold plate (3-2) of the electronic module (3); the locking device (3-23) includes a tightening nut (3-231) and a three-lobe sleeve (3-232) provided on the heat-conducting cold plate (3-2) of the electronic module (3); the extractor (3-24) includes an auxiliary extraction operating rod (3-241) hinged to the heat-conducting cold plate (3-2); and the equipment support structure (1) is provided with a support surface (1-4) that is engaged with an auxiliary extraction support point (3-242) at the end of the auxiliary extraction operating rod (3-241).

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