Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which aims to solve the technical problem that a heat dissipation device in the prior art is prone to generating condensate water. The heat dissipation device comprises a refrigeration chip, a heat conduction block, a radiator and a control panel. The cold face of the refrigeration chip is connected with the first end face of the heat conduction block, and the hot face is connected with the first end face of the radiator. The second end face of the heat conduction block makes contact with a heat source and is provided with a first temperature sensor. A second temperature sensor is arranged at the air inlet; the control panel receives a first temperature value, collected by the first temperature sensor, of the heat conduction block, collects a second temperature value, collected by the second temperature sensor, of the air inlet environment, and controls the refrigeration chip to be powered on, adjust the power-on current intensity or be powered off according to the first temperature value and the second temperature value. The control panel receives feedback of the two temperature sensors, it is guaranteed that the difference value between the first temperature value of the heat conduction block and the second temperature value of the air inlet environment does not exceed the preset difference value, and therefore condensate water can be prevented from being generated.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device. Background Art

[0002] Current electronic product cooling systems typically utilize metal heat sinks with increased surface area in contact with the air for heat exchange. This heat sink's temperature rises after being heated by a heat source. Once it exceeds the ambient temperature, it then exchanges heat with the cooler air through its surface, suppressing further temperature increases.

[0003] However, the radiators of current conventional electronic products can reach temperatures lower than the ambient temperature during operation. If the temperature is not properly controlled, condensation water can easily occur, and electronic products can easily be damaged when exposed to water. Utility Model Content

[0004] The purpose of this application is to provide a heat dissipation device and a laser ranging sensor to solve the technical problem of condensation water easily generated by the radiator in the prior art. The various technical effects that can be produced by the optional technical solutions provided in this application are described in detail below.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] The present application provides a heat dissipation device, comprising:

[0007] A cooling chip, wherein a cold surface of the cooling chip is connected to a first end surface of the heat conducting block, and a hot surface of the cooling chip is connected to a first end surface of the radiator;

[0008] The heat conducting block, wherein the second end surface of the heat conducting block contacts the heat source, and the heat conducting block is provided with a first temperature sensor;

[0009] A control board is connected to the refrigeration chip, the first temperature sensor and the second temperature sensor, and is used to receive the first temperature value of the heat conductive block collected by the first temperature sensor and the second temperature value of the air inlet environment collected by the second temperature sensor, and control the refrigeration chip to power on, adjust the power current intensity or cut off the power according to the first temperature value and the second temperature value.

[0010] In some embodiments, the heat dissipation device also includes a shell, and the refrigeration chip, heat conductive block, heat source, radiator, control board, and first temperature sensor are all arranged in the inner cavity of the shell; the inner cavity is provided with the air inlet, and the second temperature sensor is arranged on the air inlet or the shell.

[0011] In some embodiments, the housing is further provided with ventilation holes.

[0012] In some embodiments, the heat dissipation device further includes a humidity sensor, which is electrically connected to the control board. The control board is further configured to receive a humidity value measured by the humidity sensor.

[0013] In some embodiments, the humidity sensor is disposed in the housing to detect the humidity value of the airflow inside the heat dissipation device.

[0014] In some embodiments, the control board is provided with an internal database comprising psychrometric chart data.

[0015] In some embodiments, the control board is provided with a data processing module for solving the dew point temperature based on the psychrometric chart data, the first temperature value, the second temperature value and the humidity value;

[0016] The control board is further used to control the refrigeration chip to be powered on, adjust the power current intensity, or power off according to the dew point temperature and the first temperature difference threshold and the second temperature difference threshold obtained by weighted calculation.

[0017] In some embodiments, the heat dissipation device also includes a fan, which is arranged on the side of the radiator or facing the second end face of the radiator. The fan is electrically connected to the control board and is used to blow air to the radiator to bring the heat of the radiator out of the housing through the ventilation hole.

[0018] In some embodiments, the area of ​​the first end surface of the heat sink and the area of ​​the second end surface of the heat conductive block are both greater than or equal to the area of ​​the cooling chip, and the first end surface of the heat sink and the second end surface of the heat conductive block are in contact only through the cooling chip.

[0019] In some embodiments, the housing is provided with a mounting portion for mounting the product to be cooled.

[0020] Implementing one of the above-mentioned technical solutions of the present application has the following advantages or beneficial effects: In the heat dissipation device of the present application, since the cold surface of the refrigeration chip is connected to the first end surface of the heat conductive block, the hot surface of the refrigeration chip is connected to the first end surface of the radiator, and the second end surface of the heat conductive block is in contact with the heat source, the heat of the heat source can be transferred to the radiator through the refrigeration chip, and the heat of the radiator will not be transferred back to the heat conductive block, thereby achieving heat dissipation of the heat source. In addition, the heat conductive block is provided with a first temperature sensor, and the air inlet of the heat dissipation device is provided with a second temperature sensor. The control board is connected to the refrigeration chip, the first temperature sensor and the second temperature sensor. The control board receives the first temperature value of the heat conductive block collected by the first temperature sensor and the second temperature value of the air inlet environment collected by the second temperature sensor, and controls the refrigeration chip to be powered on, adjust the power current intensity or power off according to the first temperature value and the second temperature value, to ensure that the difference between the first temperature value on the heat conductive block and the second temperature value of the air inlet does not exceed the preset difference, thereby preventing the generation of condensed water. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work. In the drawings:

[0022] Figure 1 Schematic diagram of the structure of the heat dissipation device involved in the embodiment of the present application;

[0023] Figure 2 It is a schematic block diagram of the heat dissipation device involved in the embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present application clearer, the various exemplary embodiments to be described below will refer to the corresponding drawings, which constitute a part of the exemplary embodiments, in which various exemplary embodiments that may be used to implement the present application are described. Unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present disclosure. It should be understood that they are only examples of processes, methods and devices that are consistent with some aspects disclosed in the present application as detailed in the appended claims, and other embodiments may also be used, or structural and functional modifications may be made to the embodiments listed herein without departing from the scope and essence of the present application.

[0025] In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse" and the like indicate the orientation or positional relationship based on the figures, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the elements referred to must have a specific orientation, be constructed and operated in a specific orientation. The terms "first", "second" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "multiple" means two or more. The terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, an integral connection, a mechanical connection, an electrical connection, a communication connection, a direct connection, an indirect connection through an intermediate medium, and can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" includes any and all combinations of one or more related listed items. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0026] In order to illustrate the technical solution described in this application, a specific embodiment is provided below, and only the parts related to the embodiment of this application are shown.

[0027] like Figure 1-2 As shown, the present application provides a heat dissipation device, including a cooling chip 10 , a heat conducting block 20 , a radiator 30 , a control board 40 , a first temperature sensor 50 and a second temperature sensor 60 .

[0028] The cooling chip 10 has a cold surface connected to a first end surface of the heat conducting block 20 , and a hot surface connected to a first end surface of the heat sink 30 .

[0029] The heat conducting block 20 has a second end surface in contact with the heat source 70 , and the heat conducting block 20 is provided with a first temperature sensor 50 .

[0030] The second temperature sensor 60 is disposed at the air inlet of the heat dissipation device.

[0031] The control board 40 is connected to the refrigeration chip 10, the first temperature sensor 50 and the second temperature sensor 60, and is used to receive the first temperature value of the heat conductive block 20 collected by the first temperature sensor 50, and the second temperature value of the environment in which the air inlet is located collected by the second temperature sensor 60, and control the refrigeration chip 10 to power on, adjust the power current intensity or cut off the power according to the first temperature value and the second temperature value.

[0032] Specifically, the heat source 70 may be an electronic device or electronic equipment that generates heat when powered on or running, such as automotive electronic equipment, computer CPU, etc.

[0033] The cooling chip 10 can be a TEC semiconductor chip, a thermoelectric element made of semiconductor material. Its operating principle is based on the Peltier effect. When a DC voltage is applied to the TEC semiconductor, heat from one side is transferred to the other side, causing the temperature of one side to decrease and the temperature of the other side to increase. The forward and reverse application of voltage causes the temperature of the cold side and the hot side to change, making the TEC semiconductor chip an effective temperature regulation element. Therefore, the cooling chip 10 has a cold side and a hot side. When powered, the side that can dissipate heat is the hot side, and the opposite side is the cold side.

[0034] The heat conducting block 20 is made of a high heat conducting material or a high heat conducting component, such as a temperature averaging plate filled with a refrigerant.

[0035] The control board 40 can provide power to the refrigeration chip 10, the fan 90, the first temperature sensor 50, the second temperature sensor 60 and the humidity sensor 80, and / or perform information processing. It can start and stop the fan 90 and the operating state according to the temperature status, or control the refrigeration chip 10 to power on, adjust the power current intensity or cut off the power.

[0036] The second end surface of the radiator 30 is provided with heat dissipation fins. Of course, the second end surface of the radiator 30 is not limited to the form of heat dissipation fins, and can also be a heat dissipation structure of other structural forms, such as a tubular structure, a water-cooled structure, etc., which is not limited here.

[0037] The heat dissipation device also includes a second temperature sensor 60, which can be set at the air inlet of the heat dissipation device or on the outer surface of the shell 100 to measure the ambient temperature value of the air inlet of the heat dissipation device or the ambient temperature value of the shell 100, which is a second temperature value.

[0038] Since the second end surface of the heat conductive block 20 is in contact with the heat source 70, the first end surface of the heat conductive block 20 is connected to the cold surface of the cooling chip 10, and the hot surface of the cooling chip 10 is connected to the first end surface of the radiator 30, under normal circumstances, if the cooling chip 10 is not powered, the heat of the heat source 70 can be transferred from the heat conductive block 20 and the cooling chip 10 to the radiator 30 in sequence, realizing normal heat transfer and exchange, thereby realizing heat dissipation of the heat source 70.

[0039] As the operating time of the heat source 70 increases, the temperature of the heat source 70 gradually rises, and the temperature of the heat sink 30 also gradually rises. The temperature difference between the heat source 70 and the heat conductive block 20 will become smaller and smaller, making heat dissipation increasingly difficult. Therefore, the first temperature sensor 50 is used to collect the first temperature value of the heat conductive block 20, and the second temperature sensor 60 is used to collect the second temperature value of the air inlet environment. Based on the first and second temperature values, the control board 40 controls the cooling chip 10 to power on, adjust the current intensity, or power off, ensuring that the difference between the first temperature value of the heat conductive block 20 and the second temperature value of the second end surface of the heat sink 30 does not exceed a preset difference, thereby preventing the formation of condensation.

[0040] Furthermore, when the control board 40 detects that the difference between the first temperature value and the second temperature value is greater than a preset difference, the control board 40 reduces the power-on current of the cooling chip 10, or cuts off the power to the cooling chip 10; when the control board 40 detects that the difference between the first temperature value and the second temperature value becomes negative, that is, the first temperature value is less than the second temperature value, the control board 40 controls the cooling chip 10 to restore the power-on current, or restarts the cooling chip 10, thereby ensuring that the difference between the first temperature value on the heat conductive block 20 and the second temperature value of the air inlet environment does not exceed the preset difference, thereby preventing the generation of condensed water.

[0041] In some embodiments, if the difference between the first temperature value and the second temperature value is very small, condensed water will not be generated. In this case, the preset difference is set based on the temperature difference between the two temperatures that will generate condensed water.

[0042] In some embodiments, the preset difference may also be a weighted safety value of the humidity detected by the humidity sensor 80 and the dew point temperature (temperature difference) corresponding to the first temperature. The preset difference may be calculated in the control board 40 .

[0043] In some embodiments, in most cases, the heat dissipation of the electronic product serving as the heat source 70 does not require an excessively low temperature. It is only necessary to promptly remove the heat generated by the electronic product so that the temperature of the heat source 70 chip is not higher than a certain threshold. Therefore, this control method can not only avoid the generation of condensed water, but also more efficiently control the working temperature of the refrigeration chip 10.

[0044] In some embodiments, the heat dissipation device also includes a shell 100, and the cooling chip 10, the heat conductive block 20, the heat source 70, the radiator 30, the control board 40 and the first temperature sensor 50 are all arranged in the inner cavity of the shell 100, the inner cavity is provided with the air inlet, and the second temperature sensor 60 is arranged on the air inlet or the shell 100.

[0045] The housing 100 has an inner cavity for accommodating various components.

[0046] In some embodiments, the housing 100 is further provided with ventilation holes 101 to facilitate air circulation in the inner cavity.

[0047] like Figure 1 As shown, the ventilation holes 101 of the housing 100 face the second end surface of the heat sink 30 , so that the heat sink 30 can transfer heat outward through the ventilation holes 101 .

[0048] In some embodiments, the heat dissipation device further includes a humidity sensor 80 , which is electrically connected to the control board 40 . The control board 40 is further configured to receive a humidity value measured by the humidity sensor 80 .

[0049] In some embodiments, the humidity sensor 80 is disposed in the housing 100 to detect the humidity value of the airflow inside the heat dissipation device.

[0050] In some embodiments, the control board 40 is provided with an internal database including psychrometric chart data.

[0051] Specifically, the humidity sensor 80 is used to detect the humidity value of the air flow inside the heat dissipation device, which is the intake air humidity. The first temperature sensor 50 is arranged on the heat conductive block, and the temperature of the heat conductive block is detected as the first temperature value. The control board 40 combines the humidity value with the first temperature value, the second temperature value and the enthalpy-humidity diagram data of the internal database to calculate the dew point temperature, thereby calculating the preset difference, and comparing the difference between the first temperature value and the second temperature value with the preset difference, controlling the refrigeration chip 10 to power on, adjust the power-on current intensity or power off, thereby ensuring that the difference between the first temperature value on the heat conductive block 20 and the second temperature value on the second end face of the radiator 30 does not exceed the preset difference, which can prevent the generation of condensed water.

[0052] In some embodiments, such as Figure 2 As shown, the heat dissipation device also includes a fan 90, which is arranged on the side of the radiator 30 or facing the second end face of the radiator 30. The fan 90 is electrically connected to the control board 40 and is used to blow air to the radiator 30 to bring the heat of the radiator 30 out of the shell 100 through the ventilation hole 101.

[0053] The control board 40 supplies power to the fan 90 and can also control the start and stop and operating status of the fan 90 to enhance heat dissipation efficiency.

[0054] In some embodiments, there are multiple ventilation holes 101, and the multiple ventilation holes 101 form a ventilation area corresponding to the size of the second end surface of the heat sink 30. For example, the ventilation area is slightly smaller than the area of ​​the heat dissipation fins on the second end surface of the heat sink 30.

[0055] In some embodiments, the ventilation area is spaced apart from the second end surface of the heat sink 30 .

[0056] By setting the spacing between the ventilation area and the surface of the heat dissipation fins of the radiator 30, the heat dissipation efficiency can be improved and the normal and stable working state of the product can be protected.

[0057] In some embodiments, the area of ​​the first end surface of the heat sink 30 and the area of ​​the second end surface of the heat conductive block 20 are both greater than or equal to the area of ​​the cooling chip 10, and the first end surface of the heat sink 30 and the second end surface of the heat conductive block 20 are in contact only through the cooling chip 10.

[0058] Specifically, the area of ​​the first end surface of the radiator 30 can be equal to the area of ​​the second end surface of the heat conductive block 20, and both are greater than or equal to the area of ​​the cooling chip 10. The two are in contact only through the cooling chip 10, preventing heat from being transferred back from the radiator 30 to the heat conductive block 20.

[0059] In some embodiments, the housing 100 is provided with a mounting portion (not shown) for mounting the product to be cooled.

[0060] Specifically, the mounting portion can be a mounting hole or other fixing structure to facilitate the installation and use of the product to be dissipated heat. The product to be dissipated heat can be the heat source 70 itself, or it can be another product that includes the heat source 70 and needs to dissipate heat, and the location where the product needs to dissipate heat is the heat source 70.

[0061] In the heat dissipation device of the present embodiment, the cold surface of the cooling chip 10 is connected to the first end surface of the heat conductive block 20, the hot surface of the cooling chip 10 is connected to the first end surface of the heat sink 30, and the second end surface of the heat conductive block 20 is in contact with the heat source 70. This allows heat from the heat source 70 to be transferred to the heat sink 30 through the cooling chip 10, while heat from the heat sink 30 is not transferred back to the heat conductive block 20, thereby dissipating heat from the heat source 70. Furthermore, the heat conductive block 20 is provided with a first temperature sensor 50, and the air inlet of the heat dissipation device is provided with a second temperature sensor 60. The control board 40 is connected to the cooling chip 10, the first temperature sensor 50, and the second temperature sensor 60. The control board 40 receives a first temperature value of the heat conductive block 20 measured by the first temperature sensor 50 and a second temperature value of the air inlet measured by the second temperature sensor 60. Based on the first and second temperature values, the control board 40 controls the cooling chip 10 to be powered on, adjust the current intensity, or power off, ensuring that the difference between the first temperature value of the heat conductive block 20 and the second temperature value of the second end surface of the heat sink 30 does not exceed a preset difference, thereby preventing the formation of condensation.

[0062] The foregoing is merely a preferred embodiment of the present application. Those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present application. Furthermore, under the guidance of this application, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are intended to be included within the scope of protection of this application.

Claims

1. A heat dissipation device, characterized in that: include: A cooling chip, wherein a cold surface of the cooling chip is connected to a first end surface of the heat conducting block, and a hot surface of the cooling chip is connected to a first end surface of the radiator; The heat conducting block, wherein the second end surface of the heat conducting block contacts the heat source, and the heat conducting block is provided with a first temperature sensor; a second temperature sensor, disposed at an air inlet of the heat dissipation device; A control board is connected to the refrigeration chip, the first temperature sensor and the second temperature sensor, and is used to receive the first temperature value of the heat conductive block collected by the first temperature sensor, and the second temperature value of the air inlet environment collected by the second temperature sensor, and control the refrigeration chip to power on, adjust the power current intensity or cut off the power according to the first temperature value and the second temperature value.

2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device also includes a shell, and the refrigeration chip, heat conductive block, heat source, radiator, control board and first temperature sensor are all arranged in the inner cavity of the shell; the inner cavity is provided with the air inlet, and the second temperature sensor is arranged on the air inlet or the shell.

3. The heat dissipation device according to claim 2, characterized in that: The housing is also provided with ventilation holes.

4. The heat dissipation device according to claim 3, characterized in that: The heat dissipation device further includes a humidity sensor, which is electrically connected to the control board. The control board is further configured to receive a humidity value measured by the humidity sensor.

5. The heat dissipation device according to claim 4, characterized in that: The humidity sensor is arranged in the housing and is used to detect the humidity value of the air flow inside the heat dissipation device.

6. The heat dissipation device according to claim 4, characterized in that: The control board is provided with an internal database comprising psychrometric diagram data.

7. The heat dissipation device according to claim 6, characterized in that: The control panel is provided with a data processing module for solving the dew point temperature according to the psychrometric chart data, the first temperature value, the second temperature value and the humidity value; The control board is further used to control the refrigeration chip to be powered on, adjust the power current intensity, or power off according to the dew point temperature and the first temperature difference threshold and the second temperature difference threshold obtained by weighted calculation.

8. The heat dissipation device according to claim 3, characterized in that: The heat dissipation device also includes a fan, which is arranged on the side of the radiator or facing the second end surface of the radiator. The fan is electrically connected to the control board and is used to blow air to the radiator to bring the heat of the radiator out of the housing through the ventilation hole.

9. The heat dissipation device according to claim 1, wherein: The area of ​​the first end surface of the heat sink and the area of ​​the second end surface of the heat conducting block are both greater than or equal to the area of ​​the cooling chip, and the first end surface of the heat sink and the second end surface of the heat conducting block are in contact only through the cooling chip.

10. The heat dissipation device according to claim 2, wherein: The housing is provided with a mounting portion for mounting the product to be cooled.

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