Silicon wafer on-line cleaning combination device
By combining the design of wiping roller and arc-shaped gas collecting pipe, the problems of impurity removal and position deviation on the silicon wafer surface are solved, and the effect and safety of silicon wafer printing are improved.
Patent Information
- Application Number
- CN202422791758.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Existing technologies cannot effectively remove impurities on the surface of silicon wafers, and the high temperature of the silicon wafers before printing can easily cause positional deviation, affecting printing effects and safety.
The silicon wafer wiping mechanism is combined with a cooling and blowing mechanism. Large particles of impurities are first removed by a wiping roller, and then fine impurities are blown away through an arc-shaped air collecting pipe. The airflow direction is consistent with the width of the silicon wafer to avoid position deviation.
It achieves the complete removal of impurities on the surface of the silicon wafer, reduces the risk of screen puncture, improves the printing effect, and ensures the smooth transmission and cooling effect of the silicon wafer.
Smart Images
Figure CN223391605U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of solar cell manufacturing, and in particular relates to an online cleaning assembly device for silicon wafers. Background Art
[0002] The manufacturing process for crystalline silicon solar cells primarily includes cleaning, damage layer removal, texturing, diffusion, bonding, etching, anti-reflection film deposition, printing, sintering, and cell testing. Printing is a crucial step in the production of crystalline silicon solar cells. When silicon wafers are transported from the printing process to the printing process, their temperature is relatively high and foreign matter easily adheres to their surface. Impurities on the wafer surface can easily pierce the screen or cause the wafer to crack. Furthermore, high wafer temperature also accelerates the volatilization of organic matter in the screen slurry, resulting in poor printing performance.
[0003] In the prior art, before silicon wafers are printed, a fan is used to blow directly onto the surface of the silicon wafer to achieve the effect of cooling and dust removal. Since the silicon wafers are placed on a conveyor belt, once the air volume of the fan is increased, the silicon wafers will fall from the conveyor belt and cause the silicon wafers to break. Therefore, in the actual production process, the air volume of the fan is relatively weak. Obviously, this method cannot blow away foreign matter on the surface of the silicon wafer, and the cooling effect is average.
[0004] When the cleaning method of air flow channel blowing is adopted, the intersection of the air flow directions of the air flow channel is located on the center line of the silicon wafer on the transmission device. When the two groups of air flows meet and the air flow directions are opposite, the effects of the air flows cancel each other out and cannot effectively remove impurities on the surface of the silicon wafer. Excessive air flow can easily cause the position of the transmitted silicon wafer to move, and also cause the silicon wafer to be transferred off-center. Utility Model Content
[0005] The embodiment of the present utility model provides a silicon wafer online cleaning assembly device, which performs surface cleaning on the silicon wafer before it enters the screen printing process, aiming to remove impurities on the surface of the silicon wafer, while avoiding positional offset of the silicon wafer, which affects the introduction of the silicon wafer into the printer and the printing effect.
[0006] To achieve the above-mentioned object, the technical solution adopted by the present invention is as follows: providing a silicon wafer online cleaning assembly device, comprising: a silicon wafer wiping mechanism and a silicon wafer cooling and purge mechanism sequentially arranged along the silicon wafer transmission direction; the silicon wafer wiping mechanism and the silicon wafer cooling and purge mechanism are both fixed to the printing machine table and are both located directly above the transmission silicon wafer;
[0007] The silicon wafer wiping mechanism includes a lifting rod fixed to the printing machine table and a wiping roller rotatably connected to the lower end of the lifting rod, and the wiping roller is wrapped with a wiping cloth; the length of the wiping roller can cover the width of the silicon wafer, and the width direction of the silicon wafer is perpendicular to the direction of silicon wafer transmission;
[0008] The silicon wafer cooling and purging mechanism includes an arc-shaped gas collecting pipe fixed on the printing machine table and an air inlet pipe connected to the arc-shaped gas collecting pipe, the arc-shaped gas collecting pipe is parallel to the silicon wafer, and the arc-shaped gas collecting pipe is arched in the direction of transmission of the silicon wafer; a plurality of air outlet holes are evenly arranged along the circumferential length direction of the arc-shaped gas collecting pipe, and the air outlet holes are equipped with air nozzles, and the air nozzles are facing the direction of transmission of the silicon wafer; the length of the line connecting the two ends of the arc-shaped gas collecting pipe is greater than the width of the silicon wafer, and the length direction of the line connecting the two ends of the arc-shaped gas collecting pipe is perpendicular to the transmission direction of the silicon wafer.
[0009] In one achievable manner, the gas nozzle is flat in shape, the gas outlet of the gas nozzle is in a straight line shape, and the angle between the center line of the gas nozzle and the silicon wafer is an acute angle.
[0010] In one achievable manner, the acute angle between the center line of the gas nozzle and the silicon wafer is 30-60°.
[0011] In one achievable manner, the vertical distance between the arc-shaped gas collecting pipe and the silicon wafer is 50-60 mm.
[0012] In one practicable manner, the arc length between two adjacent air outlet holes on the arc-shaped air collecting pipe is 10-15 mm.
[0013] In one practicable manner, the air inlet pipe is connected to the middle of the arc length of the arc-shaped air collecting pipe.
[0014] In one feasible manner, a pressure regulating valve is provided on the air intake pipe.
[0015] In one achievable manner, the length of the wiping roller is 1.2-1.5 times the width of the silicon wafer.
[0016] In one achievable manner, the diameter of the wiping roller is 20-30 mm.
[0017] The silicon wafer online cleaning combination device provided by the utility model has the following beneficial effects compared with the prior art: first, the wiping mechanism can effectively sweep away larger granular impurities such as silicon nitride particles on the upper surface of the silicon wafer, and then the cooling and blowing mechanism can effectively blow away fine impurities such as silicon nitride dust on the upper surface of the silicon wafer; the impurities on the upper surface of the silicon wafer are cleared twice, and the cleaning effect is more obvious and more thorough, which not only reduces the probability of the screen being punctured, but also improves the printing effect; and the air outlet holes for blowing are evenly distributed along the width direction of the silicon wafer, so the blown air flow will be evenly distributed along the width direction of the silicon wafer, and will not be perpendicular to the transmission direction of the silicon wafer, so it will not cause the position of the silicon wafer to shift, thereby ensuring that the silicon wafer is smoothly transmitted to the printing process, which also avoids the problem of silicon wafer offset; at the same time, the advantage of the arc-shaped air collecting pipe is more obvious, which can blow impurities away from the direction of the transmission mechanism, and avoid impurities contaminating the transmission mechanism and the subsequent transmission silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 A schematic structural diagram of a silicon wafer online cleaning assembly device provided by an embodiment of the present utility model;
[0019] Figure 2 for Figure 1 A schematic diagram of the top view of the silicon wafer cooling and purge mechanism provided;
[0020] Description of reference numerals:
[0021] 1. Bolt; 2. Lifting rod; 3. Wiping roller; 4. Wiping cloth; 5. Silicon wafer; 6. Conveying mechanism; 7. Printing machine; 8. Arc-shaped air collecting pipe; 9. Air nozzle; 10. Inlet pipe; 11. Pressure regulating valve. DETAILED DESCRIPTION
[0022] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0023] Please also refer to Figure 1 and Figure 2 The present invention now provides a description of the silicon wafer online cleaning assembly. The assembly comprises a wafer wiping mechanism and a wafer cooling and purge mechanism, arranged sequentially along the transport direction of the silicon wafer 5. Both the wafer wiping mechanism and the wafer cooling and purge mechanism are fixed to a printing platform 7 and located directly above the transported silicon wafer 5. The wafer wiping mechanism comprises a lifting rod 2 fixed to the printing platform 7 and a wiping roller 3 rotatably connected to the lower end of the lifting rod 2. The wiping roller 3 is wrapped with a wiping cloth 4. The wiping roller 3 is long enough to cover the width of the silicon wafer 5, with the width of the silicon wafer 5 being perpendicular to the transport direction.
[0024] The silicon wafer cooling and purging mechanism includes an arc-shaped gas collecting pipe 8 fixed on the printing machine table 7 and an air inlet pipe 10 connected to the arc-shaped gas collecting pipe 8. The arc-shaped gas collecting pipe 8 is parallel to the silicon wafer 5, and the arc-shaped gas collecting pipe 8 is arched in the direction of the silicon wafer 5; a number of air outlet holes are evenly arranged along the circumferential length direction of the arc-shaped gas collecting pipe 8, and an air nozzle 9 is installed on the air outlet hole, and the air nozzle 9 is facing the direction of the silicon wafer 5; the length of the line connecting the two ends of the arc-shaped gas collecting pipe 8 is greater than the width of the silicon wafer 5, and the length direction of the line connecting the two ends of the arc-shaped gas collecting pipe 8 is perpendicular to the transmission direction of the silicon wafer.
[0025] The silicon wafer online cleaning combination device provided by the present invention has the following advantages compared with the prior art: first, the wiping mechanism can effectively sweep away larger granular impurities such as silicon nitride particles on the upper surface of the silicon wafer 5, and then the cooling and blowing mechanism can effectively blow away fine impurities such as silicon nitride dust on the upper surface of the silicon wafer 5; the impurities on the upper surface of the silicon wafer 5 are cleared twice, and the cleaning effect is more obvious and more thorough, which not only reduces the probability of the screen being punctured, but also improves the printing effect; and the air outlet holes for blowing are evenly distributed along the width direction of the silicon wafer 5, so the air flow blown out will be evenly distributed along the width direction of the silicon wafer 5 The cloth will not be perpendicular to the transmission direction of the silicon wafer 5, so it will not cause the position of the silicon wafer 5 to shift, thereby ensuring that the silicon wafer 5 is smoothly transmitted to the printing process, which also avoids the problem of silicon wafer 5 shifting; at the same time, the advantage of the arc-shaped gas collecting pipe 8 is more obvious, which can blow impurities away from the direction of the transmission mechanism 6, and avoid impurities contaminating the transmission mechanism 6 and the subsequent transmission silicon wafer 5; and the blowing of the silicon wafer 5 also serves the purpose of cooling the silicon wafer 5, thereby reducing the volatilization rate of organic matter in the slurry in the screen and maintaining good printing performance; the utility model has a simple structure, is easy to maintain, and is suitable for promotion.
[0026] Conventional one-step cleaning methods, using a sweeping device alone, cannot completely remove fine impurities such as silicon nitride dust from the surface of the silicon wafer 5. When using a purge device alone, removing larger silicon nitride particles from the surface of the silicon wafer 5 requires adjusting the airflow pressure to a high level, but this can easily cause the position of the silicon wafer 5 to shift, resulting in the phenomenon of silicon wafer 5 being misaligned. The present application adopts a combined wiping and airflow purge method, which can not only remove fine impurities but also avoid the problem of silicon wafer 5 shifting.
[0027] In some embodiments, see Figure 1 and Figure 2 The nozzle 9 is flat, with a straight-line outlet. The angle between the centerline of the nozzle 9 and the silicon wafer 5 is acute. The straight-line outlet of the nozzle 9 increases the outlet cross-sectional area during the purge process, allowing the airflow to cover a wider area and improving the purge effect.
[0028] The airflow blown out by the evenly distributed air nozzles 9 of the arc-shaped air collecting pipe 8 can form an uninterrupted arc-shaped wind knife on the upper surface of the silicon wafer 5, which not only blows the impurities on the silicon wafer 5 away from the silicon wafer 5, but also prevents the impurities from being blown onto the next silicon wafer 5 to be printed. In addition, the air nozzles 9 of the arc-shaped air collecting pipe 8 are inclined toward both sides of the transmission mechanism 6, so that there is an airflow component toward both sides of the transmission mechanism 6, which can blow the impurities to both sides of the width direction of the transmission mechanism 6, that is, blow them away from the transmission mechanism 6, and prevent impurities from contaminating the transmission mechanism 6 and the subsequent silicon wafers 5, so that the blowing effect is better.
[0029] In some embodiments, see Figure 1 The acute angle between the centerline of the air nozzle 9 and the silicon wafer 5 is 30-60°. The airflow is directed toward the direction of the silicon wafer 5, and part of the airflow is directed toward the width of the conveyor 6. This completely sweeps impurities outside the conveyor 6 and prevents impurities from being blown onto subsequent silicon wafers 5. For example, the tilt angle can be 30°, 35°, 40°, 45°, 55°, 60°, etc., with 45° being the most optimal.
[0030] In some embodiments, please refer to Figure 1 and Figure 2 The vertical distance between the curved gas collecting pipe 8 and the silicon wafer 5 is 50-60 mm. The distance here is the vertical distance from the center line of the curved gas collecting pipe 8 to the upper surface of the silicon wafer 5. The vertical distance from the lowest point of the curved gas collecting pipe 8 to the silicon wafer 55 is 30-40 mm.
[0031] In some embodiments, please refer to Figure 1 and Figure 2 The arc length between two adjacent outlet holes on the arc-shaped gas collecting pipe 8 is 10-15 mm. For example, the spacing is 10 mm, 12 mm, 14 mm, 15 mm, etc. The linear distance between the two outlet holes with the largest spacing on the arc-shaped gas collecting pipe 8 is generally greater than or equal to the lateral width of the transported silicon wafer 5 to ensure that the outlet airflow covers the width of the silicon wafer 5 and effectively removes dust from the silicon wafer 5.
[0032] In some embodiments, see Figure 2 The air inlet pipe 10 is connected to the middle of the arc length of the arc-shaped air collecting pipe 8 so that the air outlet holes on the arc-shaped air collecting pipe 8 at different distances from the air inlet pipe 10 have the same air outlet time.
[0033] In some embodiments, a pressure regulating valve 11 is provided on the air intake pipe 10. The inlet of the air intake pipe 10 is connected to the air pipe of the compressed air outside the workshop. The gas pressure on the air intake pipe 10 can be adjusted by the pressure regulating valve 11 according to the pressure demand, which is generally 1-2 MPa.
[0034] In some embodiments, the length of the wiping roller 3 is 1.2-1.5 times the width of the silicon wafer 5. The wiping cloth 4 is made of an ultra-thin sponge cloth or a dust-free cloth, and is wrapped around the wiping roller 3 in multiple layers. The wiping cloth 4 is made of a soft material and will not cause scratches or other damage to the upper surface of the silicon wafer 5. The lower edge of the wiping cloth 4 contacts the upper surface of the transported silicon wafer 5. During the transport of the silicon wafer 5, the wiping cloth 4 can remove particulate matter and impurities on the upper surface of the silicon wafer 5. After using it for a period of time, when part of the wiping cloth 4 is dirty, you can cut off a section with scissors and loosen the fastening screws to allow the wiping cloth 4 to contact the upper surface of the silicon wafer 5 again.
[0035] See Figure 1 The lifting rod 2 is fixed to the printing machine table 7 by a bolt 1. The lifting structure of the lifting rod 2 can be a plurality of connecting holes evenly arranged along the height direction of the lifting rod 2. The bolt 1 passes through different connecting holes to adjust the distance between the wiping roller 3 and the silicon wafer 5.
[0036] In some embodiments, the diameter of the wiping roller 3 is 20-30 mm.
[0037] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.
[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A silicon wafer online cleaning assembly device, characterized in that: include: A silicon wafer wiping mechanism and a silicon wafer cooling and purge mechanism are sequentially arranged along the transmission direction of the silicon wafer (5); the silicon wafer wiping mechanism and the silicon wafer cooling and purge mechanism are both fixed on the printing machine table (7) and are both located directly above the transmission silicon wafer (5); The silicon wafer wiping mechanism comprises a lifting rod (2) fixed on the printing machine table (7) and a wiping roller (3) rotatably connected to the lower end of the lifting rod (2), wherein the wiping roller (3) is wrapped with a wiping cloth (4); the length of the wiping roller (3) can cover the width of the silicon wafer (5), and the width direction of the silicon wafer (5) is perpendicular to the silicon wafer transmission direction; The silicon wafer cooling and purging mechanism comprises an arc-shaped gas collecting pipe (8) fixed on the printing machine table (7) and an air inlet pipe (10) connected to the arc-shaped gas collecting pipe (8), wherein the arc-shaped gas collecting pipe (8) is parallel to the silicon wafer (5) and arched in the direction of transmission of the silicon wafer (5); a plurality of air outlets are evenly arranged along the circumferential length direction of the arc-shaped gas collecting pipe (8), and an air nozzle (9) is installed on the air outlet, and the air nozzle (9) is oriented in the direction of transmission of the silicon wafer (5); the length of the line connecting the two ends of the arc-shaped gas collecting pipe (8) is greater than the width of the silicon wafer (5), and the length direction of the line connecting the two ends of the arc-shaped gas collecting pipe (8) is perpendicular to the transmission direction of the silicon wafer.
2. The silicon wafer online cleaning assembly device according to claim 1, wherein: The air nozzle (9) is flat in shape, the air outlet of the air nozzle (9) is in a straight line, and the angle between the center line of the air nozzle (9) and the silicon wafer (5) is an acute angle.
3. The silicon wafer online cleaning assembly device according to claim 1, wherein: The acute angle between the center line of the gas nozzle (9) and the silicon wafer (5) is 30-60°.
4. The silicon wafer online cleaning assembly device according to claim 1, wherein: The vertical distance between the arc-shaped gas collecting pipe (8) and the silicon wafer (5) is 50-60 mm.
5. The silicon wafer online cleaning assembly device according to claim 1, wherein: The arc length between two adjacent air outlet holes on the arc-shaped air collecting pipe (8) is 10-15 mm.
6. The silicon wafer online cleaning assembly device according to claim 1, wherein: The air inlet pipe (10) is connected to the middle of the arc length of the arc-shaped air collecting pipe (8).
7. The silicon wafer online cleaning assembly device according to claim 1, wherein: A pressure regulating valve (11) is provided on the air inlet pipe (10).
8. The silicon wafer online cleaning assembly device according to claim 1, wherein: The length of the wiping roller (3) is 1.2-1.5 times the width of the silicon wafer (5).
9. The silicon wafer online cleaning assembly device according to claim 1, wherein: The diameter of the wiping roller (3) is 20-30 mm.