Display RGB-LED lamp bead structure

Abstract

The utility model discloses a display RGB-LED lamp bead structure, and relates to the technical field of semiconductor devices, the lamp bead structure comprises an LED support on which an LED chip is arranged; the positive electrode of the LED chip is connected to the positive electrode pin through wire bonding; the negative electrode of the LED chip is connected to the negative electrode pin through wire bonding; wherein each of the positive electrode pin and the negative electrode pin comprises a bonding part, a stretching part and a bonding pad part, the bonding parts extend towards the inner side of the support in the LED support and are in bonding connection with the wire, the bonding pad parts are exposed on the surface of one side, far away from the LED chip, of the LED support, the extending direction faces the outer side of the LED support, and the stretching parts are connected between the bonding parts and the bonding pad parts. According to the utility model, the sealing performance of the lamp bead can be improved while the lamp bead is ensured to be at a thinner level, so that the service life of the lamp bead is prolonged, and the problem that water vapor is easy to intrude from the pin due to the thinner lamp bead in the prior art is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor devices, and specifically to a display RGB-LED lamp bead structure. Background Art

[0002] With the widespread application of display technology and the diversification of application scenarios, the application of LED display devices, a key component of display screens, has become more important. Therefore, the reliability and performance requirements of LED lamp beads are becoming increasingly higher. From the perspective of LED lamp bead technology, the packaging technology and product structure have a significant impact on their performance and reliability. Early outdoor LED lamp beads usually adopted a single RGB fixed solder functional area flat + stretched structure + external foot structure. The stretched structure is mainly used to prevent water vapor infiltration, but the lamp beads are relatively thick and the heat dissipation performance is also poor. The display screen structure is very thick and the installation is relatively cumbersome. Early indoor LED lamp beads usually adopted a single RGB fixed solder functional area flat + external foot structure. Without the stretched structure, the waterproof performance of the lamp beads is relatively poor. Water vapor is more likely to enter than glue, causing the lamp beads to burn and fail. However, the lamp beads are relatively thin, so the display screen can be thinner and the installation is more beautiful.

[0003] Existing TOP LED devices use TOP stamping injection molding brackets as brackets. The brackets are divided into front and back sides. The front side is made of PPA and stamped metal parts as the functional area of ​​the lamp bead (including the wire bonding area and the crystal bonding area). The PPA part is formed into a bowl by injection molding to protect the functional area. The back side consists of PPA and pins. The pins are formed by bending. The front and back of the outdoor lamp beads are connected by a metal tensile structure, while the front and back structures of the indoor lamp beads are normal and direct. Silver glue or insulating glue is used to fix the chip in the functional area on the front side, and then the bonding wires are welded to the chip electrodes and the functional area to form an electrical connection between the chip and the functional area. The bracket is sealed with glue through a dispensing process, and then blanked into regular lamp beads that can emit RGB three primary colors.

[0004] Therefore, the existing structure of outdoor lamp beads usually has a tensile structure + an inner foot structure, which makes the lamp beads thicker. Indoor lamp beads do not have a tensile structure, which can effectively reduce the height of the lamp beads for easier application. However, indoor lamp beads are easily penetrated by water vapor during use, which eventually leads to LED lamp burnout and caterpillar abnormalities due to the easy invasion of water vapor during use by the client. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a display RGB-LED lamp bead structure, which improves the sealing of the lamp beads while ensuring that the lamp beads are at a relatively thin level, thereby increasing the service life of the lamp beads.

[0006] In order to achieve the above-mentioned purpose, the present invention is implemented through the following technical solutions:

[0007] A display RGB-LED lamp bead structure, the lamp bead structure comprising:

[0008] An LED bracket having an LED chip disposed thereon;

[0009] A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding;

[0010] A cathode pin, to which the cathode of the LED chip is connected via wire bonding;

[0011] Among them, the positive pin and the negative pin both include a bonding portion, a stretching portion and a pad portion, the bonding portion extends toward the inner side of the bracket in the LED bracket and is bonded to the wire, the pad portion is exposed on the side surface of the LED bracket away from the LED chip, and the extension direction is toward the outside of the LED bracket, and the stretching portion is connected between the bonding portion and the pad portion.

[0012] According to one aspect of the above technical solution, the LED bracket wraps the stretching portion.

[0013] According to one aspect of the above technical solution, the stretching portion is transitionally connected between the bonding portion and the pad portion.

[0014] According to one aspect of the above technical solution, the bonding portion and the pad portion are parallel to each other.

[0015] According to one aspect of the above technical solution, a surface of the pad portion close to the LED chip contacts the LED bracket, and a surface of the pad portion away from the LED chip is exposed for LED lamp bead welding.

[0016] According to one aspect of the above technical solution, a surface of the pad portion that is away from the LED chip is flush with a surface of the LED bracket.

[0017] According to one aspect of the above technical solution, a surface of the pad portion on one side away from the stretching portion is flush with a side surface of the LED bracket.

[0018] According to one aspect of the above technical solution, the LED chip includes a blue light chip, a green light chip and a red light chip;

[0019] The positive electrodes of the blue light chip, the green light chip and the red light chip are all connected to the positive electrode pins through wire bonding.

[0020] According to one aspect of the above technical solution, the negative electrode pin includes a first negative electrode pin, a second negative electrode pin and a third negative electrode pin;

[0021] The cathodes of the blue light chip, the green light chip and the red light chip are respectively connected to the first cathode pin, the second cathode pin and the third cathode pin through wire bonding.

[0022] According to one aspect of the above technical solution, the lamp bead structure further includes a transparent encapsulating glue, which is filled in the lamp bowl groove of the LED bracket to cover the blue light chip, the green light chip and the red light chip.

[0023] Compared with the prior art, the RGB-LED lamp bead structure shown in the present invention has the following beneficial effects:

[0024] The lamp bead structure is achieved by providing an LED bracket, arranging an LED chip on the LED bracket, and then bonding the positive pole of the LED chip to the positive pin through a wire, and bonding the negative pole of the LED chip to the negative pin through a wire. By arranging the positive pin and the negative pin to include a bonding portion, a stretching portion and a pad portion, the bonding portion faces the inner side of the LED bracket for bonding with the wire, and the pad portion faces the outer side of the LED bracket for welding and fixing with the solder joint on the circuit board, and by making the bonding portion and the pad portion parallel to each other and extending in opposite directions, more bending or folding is generated when the positive pin, the negative pin and the LED bracket are engaged, so that water vapor is not easy to invade the lamp bead during use, effectively improving the service life, and can reduce the thickness of the lamp bead, facilitate the arrangement of the lamp bead, and improve the applicability of the lamp bead. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 This is a top view schematic diagram showing the structure of an RGB-LED lamp bead in one embodiment of the present invention;

[0027] Figure 2 This is a bottom view schematic diagram showing the structure of an RGB-LED lamp bead in one embodiment of the present invention;

[0028] Figure 3 This is a cross-sectional diagram showing the structure of an RGB-LED lamp bead in one embodiment of the present invention.

[0029] Description of Figure Numbers:

[0030] LED bracket 10, LED chip 20, blue light chip 21, green light chip 22, red light chip 23, positive pin 30, first negative pin 31, second negative pin 32, third negative pin 33, bonding part 34a, stretching part 34b, pad part 34c, wire 40, packaging glue 50. DETAILED DESCRIPTION

[0031] To make the objectives, features, and advantages of the present invention more readily apparent, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The accompanying drawings illustrate several embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are intended only to describe specific embodiments and are not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] Example 1

[0034] See also Figure 1-Figure 3 The first embodiment of the present invention provides a display RGB-LED lamp bead structure, the lamp bead structure comprising:

[0035] An LED bracket 10 having an LED chip 20 disposed thereon;

[0036] Anode pin 30, the anode of the LED chip 20 is bonded to the anode pin 30 via a wire 40;

[0037] A cathode pin, to which the cathode of the LED chip 20 is bonded via a wire 40;

[0038] Among them, the positive pin 30 and the negative pin both include a bonding portion 34a, a stretching portion 34b and a pad portion 34c, the bonding portion 34a extends toward the inside of the LED bracket 10 and is bonded to the wire 40, the pad portion 34c is exposed on the side surface of the LED bracket 10 away from the LED chip 20, and extends toward the outside of the LED bracket 10, and the stretching portion 34b is connected between the bonding portion 34a and the pad portion 34c.

[0039] In this embodiment, the LED bracket 10 is a PPA bracket, that is, a plastic-encapsulated bracket, which has good insulation capabilities. The LED chip 20 is fixed to the bottom of the lamp bowl structure of the LED bracket 10 through insulating bonding glue, that is, it is fixed on a plane inside the lamp bowl structure of the LED bracket 10 through insulating bonding glue.

[0040] The LED structure is an RGB-LED structure, which has three LED chips 20 emitting light of different colors, including a blue chip 21, a green chip 22, and a red chip 23. These chips are typically arranged in a strip array or a triangular array on the LED bracket 10. Generally, when the blue chip 21, the green chip 22, and the red chip 23 are arranged in a strip array, the green chip 22 is usually located between the blue chip 21 and the red chip 23. This is because the human eye is more sensitive to green light. By placing the green chip 22 in the middle, the light emitted by the blue chip 21 and the red chip 23 on both sides can effectively suppress the green light.

[0041] In this embodiment, there is one positive electrode pin 30, which is a common electrode pin. The positive electrodes of the blue light chip 21, the green light chip 22 and the red light chip 23 are all electrically connected to the positive electrode pin 30. For example, they can be bonded through a wire 40. Usually, silver wire is used for bonding. This is because silver wire has good conductivity and its cost is lower than that of other precious metal wires, which can effectively reduce material costs.

[0042] In addition, there are three negative electrode pins, namely the first negative electrode pin 31, the second negative electrode pin 32 and the third negative electrode pin 33. For the convenience of description, the negative electrode and the negative electrode pin of the LED chip 20 are exemplified in the order of description in this embodiment. The negative electrodes of the blue light chip 21, the green light chip 22 and the red light chip 23 are electrically connected to the first negative electrode pin 31, the second negative electrode pin 32 and the third negative electrode pin 33 respectively, and are also bonded using a wire 40, for example, a silver wire is used for bonding.

[0043] It should be noted that the structures of the positive pin 30, the first negative pin 31, the second negative pin 32 and the third negative pin shown in this embodiment are consistent, but they can be arranged on the LED bracket 10 in a specific manner to improve the aesthetics of the pin setting.

[0044] For example, the positive pin 30, the first negative pin 31, the second negative pin 32 and the third negative pin 33 can be symmetrically arranged in pairs on the LED bracket 10. For example, the positive pin 30 and the first negative pin 31 are symmetrically arranged along the central X-axis of the LED bracket 10, and the positive pin 30, the first negative pin 31 and the third negative pin 33, the second negative pin 32 are symmetrical along the central Y-axis of the LED bracket 10, thereby improving the aesthetics of the pin setting and ensuring that there is sufficient distance between the pins to avoid short circuit connections under special circumstances.

[0045] Since the structures of the positive electrode pin 30 , the first negative electrode pin 31 , the second negative electrode pin 32 and the third negative electrode pin 33 are consistent, in this embodiment, the specific structures of these four pins will be described in detail by taking the positive electrode pin 30 as an example.

[0046] In this embodiment, the positive pin 30 includes a bonding portion 34a, a stretching portion 34b and a pad portion 34c, and the bonding portion 34a, the stretching portion 34b and the pad portion 34c are connected in sequence. More specifically, the bonding portion 34a, the stretching portion 34b and the pad portion 34c are formed at one time by stamping, and the bonding portion 34a and the pad portion 34c are parallel to each other in the horizontal direction, and the stretching portion 34b is connected between the bonding portion 34a and the pad portion 34c, specifically, is transitionally connected between the bonding portion 34a and the pad portion 34c.

[0047] Specifically, the bonding portion 34a in the positive pin 30 is at least partially exposed to the bottom of the lamp bowl structure in the LED bracket 10 near the surface of the LED chip 20, so as to be bonded to the positive electrode of any LED chip 20 through the wire 40, and the pad portion 34c is exposed outside the LED bracket 10 away from the surface of the LED chip 20, so as to be welded and fixed to the solder point on the circuit board through the pad portion 34c.

[0048] Among them, the extension direction of the bonding portion 34a is toward the inner side of the LED bracket 10, and the extension direction of the pad portion 34c is toward the outer side of the LED bracket 10. The stretching portion 34b connected between the bonding portion 34a and the pad portion 34c is roughly in the shape of the letter S, and its two ends are respectively connected to the bonding portion 34a and the pad portion 34c. The positive pin 30 as a whole presents a relatively smooth letter Z shape or a Z-shaped mirror image shape, wherein the stretching portion 34b is completely wrapped by the LED bracket 10. That is to say, when the positive pin 30 only exposes part of the surface of the bonding portion 34a and part of the surface of the pad portion 34c, most of the positive pin 30 is in contact with the LED bracket 10 and is wrapped by the LED bracket 10. Therefore, the lamp bead structure can produce more bends or bends through the cooperation of the positive pin 30 and the LED bracket 10 shown in this embodiment, thereby extending the water vapor intrusion path. In this case, water vapor is not easy to invade the interior of the LED lamp bead, which can effectively improve the service life and will not make the lamp bead too thick, which is conducive to the application and arrangement of the lamp bead.

[0049] In addition, the surface of the side of the pad portion 34c away from the LED chip 20 is flush with the surface of the LED bracket 10, which is beneficial to improving the aesthetics of the lamp bead, or it can be slightly raised or recessed, as long as it does not affect the welding and fixation of the pad portion 34c and the solder joint on the circuit board.

[0050] As an RGB-LED lamp bead, it is also necessary to enclose the LED chip 20 and the wire 40 in the lamp bowl structure of the LED bracket 10, specifically by encapsulating them with encapsulating glue 50. The encapsulating glue 50 is filled in the lamp bowl structure of the LED bracket 10 to cover the blue light chip 21, the green light chip 22, the red light chip 23 and the wire 40, and needs to be molded. The encapsulating glue 50 is transparent. After molding, the surface of the encapsulating glue 50 is flush with the surface of the LED bracket 10, thereby improving the aesthetics.

[0051] Therefore, compared with the prior art, the RGB-LED lamp bead structure shown in this embodiment has the following beneficial effects:

[0052] The lamp bead structure is provided with an LED bracket 10, an LED chip 20 is provided on the LED bracket 10, and then the positive pole of the LED chip 20 is bonded to the positive pin 30 through a wire 40, and the negative pole of the LED chip 20 is bonded to the negative pin through the wire 40. By setting the positive pin 30 and the negative pin to include a bonding portion 34a, a stretching portion 34b and a pad portion 34c, the bonding portion 34a faces the inner side of the LED bracket 10 for bonding with the wire 40, and the pad portion 34c faces the outer side of the LED bracket 10 for welding and fixing with the solder point on the circuit board, and by making the bonding portion 34a and the pad portion 34c parallel to each other and extending in opposite directions, more bending or folding is generated when the positive pin 30, the negative pin and the LED bracket 10 are engaged, so that water vapor is not easy to invade the lamp bead during use, effectively improving the service life, and can reduce the thickness of the lamp bead, facilitate the arrangement of the lamp bead, thereby improving the applicability of the lamp bead.

[0053] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0054] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A display RGB-LED lamp bead structure, characterized in that: The lamp bead structure includes: An LED bracket having an LED chip disposed thereon; A positive electrode pin, to which the positive electrode of the LED chip is connected via wire bonding; A cathode pin, to which the cathode of the LED chip is connected via wire bonding; Among them, the positive pin and the negative pin both include a bonding portion, a stretching portion and a pad portion, the bonding portion extends toward the inner side of the bracket in the LED bracket and is bonded to the wire, the pad portion is exposed on the side surface of the LED bracket away from the LED chip, and the extension direction is toward the outside of the LED bracket, and the stretching portion is connected between the bonding portion and the pad portion.

2. The RGB-LED lamp bead structure according to claim 1, characterized in that: The LED bracket wraps the stretching portion.

3. The RGB-LED lamp bead structure according to claim 2, characterized in that: The stretching portion is transitionally connected between the bonding portion and the pad portion.

4. The RGB-LED lamp bead structure according to claim 3, characterized in that: The bonding portion and the pad portion are parallel to each other.

5. The RGB-LED lamp bead structure according to claim 1, characterized in that: A surface of the soldering pad portion close to the LED chip contacts the LED bracket, and a surface of the soldering pad portion away from the LED chip is exposed for soldering LED lamp beads.

6. The RGB-LED lamp bead structure according to claim 5, characterized in that: A surface of the pad portion that is away from the LED chip is flush with a surface of the LED bracket.

7. The RGB-LED lamp bead structure according to claim 5, characterized in that: A surface of the pad portion that is away from the stretching portion is flush with a side surface of the LED bracket.

8. The RGB-LED lamp bead structure according to any one of claims 1 to 7, characterized in that: The LED chips include blue light chips, green light chips and red light chips; The positive electrodes of the blue light chip, the green light chip and the red light chip are all connected to the positive electrode pins through wire bonding.

9. The RGB-LED lamp bead structure according to claim 7, characterized in that: The negative electrode pin includes a first negative electrode pin, a second negative electrode pin and a third negative electrode pin; The cathodes of the blue light chip, the green light chip and the red light chip are respectively connected to the first cathode pin, the second cathode pin and the third cathode pin through wire bonding.

10. The RGB-LED lamp bead structure according to claim 9, characterized in that: The lamp bead structure further includes a transparent packaging glue, which is filled in the lamp bowl groove of the LED bracket to cover the blue light chip, the green light chip and the red light chip.

Images