Laser cutting device

Abstract

The embodiment of the utility model discloses a laser cutting device. The laser cutting device comprises a rack, a carrying table, a laser assembly and a cooling assembly. According to the embodiment of the invention, the glass substrate is placed on the carrying table, then the laser assembly is used for carrying out cutting or punching treatment on the glass substrate, and the cooling pieces arranged on the two sides of the carrying table are started while the surface of the glass substrate is treated, so that the two opposite sides of the glass substrate can be synchronously cooled; therefore, the glass substrate can be uniformly cooled, and the surface treatment quality of the glass substrate is improved.

Description

Technical Field

[0001] The present application relates to the field of laser cutting technology, and in particular to a laser cutting device. Background Art

[0002] As optoelectronic devices become more advanced in performance, the processing of their components is becoming increasingly sophisticated. However, the hard and brittle nature of many electronic and optical materials significantly increases the difficulty of processing. Glass substrates are a prime example of this. To process glass substrates into functional components, they must undergo processes such as cutting and drilling.

[0003] At present, in order to ensure the processing quality of glass substrates, most manufacturers generally use laser cutting (i.e., laser cutting) technology to process glass substrates. The most widely used method for cutting glass is the crack control method. The steps of cutting glass substrates are as follows: first, the surface of the glass substrate is heated by laser scanning. The energy of the laser will rapidly increase the temperature of the scanning area, which will cause the glass substrate to be subjected to large compressive stress due to thermal expansion of the surface. Tensile stress will then be generated inside the glass substrate, but this stress is not enough to cause the glass substrate to crack; second, the area scanned by the laser is rapidly cooled. Such impact will cause a large temperature gradient inside the glass substrate, which will generate large tensile stress on the surface of the glass substrate. When this tensile stress exceeds a threshold, the surface of the glass substrate will crack along a predetermined direction, thereby achieving the cutting of the glass substrate. However, it was found during processing that the cooling effect of the existing laser cutting technology is uneven, resulting in poor surface quality of the glass substrate cut by the laser. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a laser cutting device to solve the problem of poor cutting quality of the glass substrate surface caused by uneven cooling effect in the prior art.

[0005] The present application provides a laser cutting device, comprising:

[0006] frame;

[0007] A carrier, which is provided on one side of the frame and is used to place a glass substrate;

[0008] a laser assembly, the laser assembly being capable of traversing and / or lifting relative to the frame to face the glass substrate on the stage, the laser assembly being used to process the surface of the glass substrate;

[0009] A cooling assembly includes at least two cooling members, and at least one cooling member is provided on opposite sides of the carrier. The cooling members are configured to be connected to an air source to blow cooling air toward the glass substrate on the carrier.

[0010] Based on the above-mentioned laser cutting device, a glass substrate is placed on a carrier, and then the glass substrate is cut or drilled using a laser assembly. While the surface of the glass substrate is being processed, cooling elements arranged on both sides of the carrier are turned on so that the opposite sides of the glass substrate can be cooled simultaneously, thereby making the glass substrate cooler more evenly, thereby improving the surface treatment quality of the glass substrate.

[0011] Optionally, a pipe structure is provided in the cooling element, and the pipe structure includes an air inlet channel and at least two air outlet channels spaced apart along a first direction, the air outlet of the air outlet channel is opposite to the carrier, and the air inlet thereof is connected to the air inlet channel.

[0012] Optionally, the air outlets of all the air outlet ducts gradually move away from the carrier along the first direction, and the air inlets of all the air outlet ducts remain flush along the first direction.

[0013] Optionally, the laser cutting device also includes a guide plate integrally formed with the cooling element and provided on the carrier, the guide plate including a connecting portion and a guide portion at a preset angle to each other, the guide plate is connected to the carrier via the connecting portion, and the guide portion is used to change the flow direction of the gas flowing out of the air outlet.

[0014] Optionally, the connecting portion is rotatably connected to the carrier.

[0015] Optionally, a rotating base is provided on the surface of the carrier, a rotating shaft is rotatably connected inside the rotating base, and the connecting portion is fixedly connected to the rotating shaft to rotate relative to the carrier.

[0016] Optionally, the laser cutting device includes a first movable module and a second movable module, the first movable module is used to drive the laser component to move along a first direction, and the second movable module is used to drive the laser component to move along a second direction.

[0017] Optionally, the laser cutting device further includes a third movable module connected to the first movable module or the second movable module, and the third movable module is used to drive the laser assembly to move in a vertical direction.

[0018] One or more of the above embodiments of the present application have at least one or more of the following beneficial effects:

[0019] A glass substrate is placed on a stage, and then a laser assembly is used to perform processes such as cutting or drilling on the glass substrate. While the surface of the glass substrate is being processed, the cooling elements on both sides of the stage are turned on so that the opposite sides of the glass substrate can be cooled simultaneously, thereby allowing the glass substrate to be cooled more evenly, thereby improving the surface treatment quality of the glass substrate.

[0020] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of this application will be more easily understood with reference to the accompanying drawings. Those skilled in the art will readily appreciate that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this application. Furthermore, similar numbers in the figures represent similar components, where:

[0022] Figure 1 This is a schematic diagram of the structure of a laser cutting device provided by the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of a cooling assembly provided by the present invention;

[0024] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0025] Figure 4 This is a cross-sectional view provided by the present invention for displaying a cooling assembly;

[0026] Figure 5 yes Figure 4 Enlarged view of point B in the middle.

[0027] Description of Reference Numerals

[0028] 1. Frame; 2. Carrier; 3. Laser assembly; 4. Cooling assembly; 41. Cooling element; 411. Air outlet duct; 412. Air inlet duct; 5. Guide plate; 51. Connecting portion; 52. Drainage portion; 6. Rotating base; 61. Rotating shaft; 7. First movable module; 8. Second movable module; 9. Third movable module. DETAILED DESCRIPTION

[0029] Some embodiments of the present application are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application.

[0030] As described in the background art, currently when a glass substrate is laser cut, the surface quality of the glass substrate cut out by the laser is poor due to uneven cooling effect on the cut portion of the glass substrate surface.

[0031] Therefore, the present invention creatively proposes a laser cutting device comprising a frame, a stage, a laser assembly, and a cooling assembly. A glass substrate is placed on the stage, and then the laser assembly is used to perform processes such as cutting or drilling on the glass substrate. While the surface of the glass substrate is being processed, cooling elements on both sides of the stage are activated, allowing the opposing sides of the glass substrate to be cooled simultaneously. This allows for more uniform cooling of the glass substrate, thereby improving the surface treatment quality of the glass substrate.

[0032] The present application will be described in detail below through specific embodiments.

[0033] Reference Figure 1 As shown, this embodiment provides a laser cutting device, which includes a frame 1, a carrier 2, a laser assembly 3 and a cooling assembly 4. The carrier 2 is provided on one side of the frame 1 and is used to place a glass substrate. The laser assembly 3 can be relatively moved laterally and / or raised and lowered to be opposite to the glass substrate on the carrier 2. The laser assembly 3 is used to process the surface of the glass substrate; the cooling assembly 4 includes at least two cooling members 41, and at least one cooling member 41 is provided on both opposite sides of the carrier 2. The cooling member 41 is configured to be connected to an air source to blow cooling air to the glass substrate on the carrier 2.

[0034] In some examples, the stage 2 is equipped with a built-in vacuum suction pipe to vacuum-suction the glass substrate onto the surface of the stage 2 to prevent damage to the glass substrate during fixation. Of course, the mounting method of the glass substrate can also be changed according to factors such as the size of the glass substrate and processing requirements, such as using a locking structure such as a bench vise to fix the glass substrate.

[0035] In some examples, the carrier 2 is rectangular, with at least one cooling element 41 positioned along each of its four sides. During the glass substrate cutting process, the cutting direction is typically linear, particularly along the linear direction of the glass substrate itself. The rectangular glass substrate is properly positioned on the carrier 2, with its four sides aligned parallel to the four sides of the carrier 2. This allows the cooling element 41 to uniformly cool the glass substrate along the cutting direction of the laser assembly 3 during the cutting process.

[0036] In an alternative embodiment, the cooling element 41 is provided with a duct structure comprising an air inlet duct 412 and at least two air outlet ducts 411 spaced apart along a first direction. The air outlets of the air outlet ducts 411 face the carrier 2, and the air inlets of the air outlet ducts 411 communicate with the air inlet duct 412. In this embodiment, the first direction is parallel to the longitudinal direction of the carrier 2, so that the cooling element 41 can uniformly cool the glass substrate along a linear direction of the glass substrate. The air inlet ducts 412 can be connected to an air source device, such as a fan, to blow cooling air to the glass substrate.

[0037] Furthermore, the air outlets of the air outlet ducts 411 gradually move away from the carrier 2 along the first direction, and the air inlets of all the air outlet ducts 411 remain aligned along the first direction. Specifically, in some cases where the laser assembly 3 cuts in a relatively single direction, for example, when the laser assembly 3 cuts a glass substrate along the first direction, by controlling the cutting speed of the laser assembly 3, when the laser assembly 3 cuts the corresponding position on the glass substrate along the first direction, the corresponding air outlet duct 411 can blow air to the corresponding position, thereby achieving more precise cooling of the cutting position.

[0038] In another alternative embodiment, cooling element 41 comprises multiple independent air ducts, each of which is connected to a corresponding air source. By controlling the activation time of the air source, the timing and air volume of cooling air blown by each air duct can be controlled. Of course, it is also possible to control multiple independent air ducts with a single air source, and to provide an electromagnetic on / off valve between the air duct and the air source to achieve control of the air supply of each air duct.

[0039] Furthermore, in some examples, the laser cutting device also includes a deflector plate 5 integrally formed with the cooling element 41 and disposed on the carrier 2. The deflector plate 5 includes a connecting portion 51 and a flow guide portion 52 formed at a predetermined angle to each other. The deflector plate 5 is connected to the carrier 2 via the connecting portion 51. The flow guide portion 52 is used to change the direction of gas flowing out of the air outlet. By integrating the deflector plate 5 with the cooling element 41 as a block, the airflow direction is directly adjusted. Of course, the deflector plate 5 can also be provided separately from the cooling element 41 as needed. In this example, the air outlet duct 411 can be provided within the flow guide portion 52.

[0040] It should be noted that the shape of the deflector 5 can be adjusted based on actual cooling needs. It can be V-shaped, T-shaped, or other shapes that can adapt to changing the direction of gas flow. In this embodiment, the deflector 5 is L-shaped, with the connecting portion 51 and the guide portion 52 forming two sides of the L-shape. When the laser assembly 3 processes the glass substrate, the cooling air flowing out of the air outlet duct 411 is further directed by the guide portion 52 toward the cutting position, thereby enhancing the cooling effect.

[0041] In some examples, the connection portion 51 is rotatably connected to the carrier 2. In this embodiment, a rotating base 6 is provided on the surface of the carrier 2, and a rotating shaft 61 is rotatably connected to the rotating base 6. The connection portion 51 is fixedly connected to the rotating shaft 61 so as to rotate relative to the carrier 2. Specifically, based on feedback from the actual cutting process, the angle formed by the guide portion 52 relative to the glass substrate on the carrier 2 can be adjusted in real time by rotating the rotating shaft 61 to change the blowing area of ​​the cooling element 41 on the glass substrate on the carrier 2. At the same time, a damping sleeve can be added to the side of the rotating shaft 61 to further improve the rotation accuracy of the rotating shaft 61 and facilitate timely locking of the rotating shaft 61 to ensure that the guide plate 5 can be stabilized immediately after adjustment. Of course, the guide plate 5 can also be rotatably connected to the carrier 2 through other rotating structures, such as by providing a hinge chain on the carrier 2 to enable the guide plate 5 to rotate relative to the carrier 2.

[0042] In some examples, the laser cutting device further includes a first movable module 7 and a second movable module 8 . The first movable module 7 is used to drive the laser assembly 3 to move along a first direction, and the second movable module 8 is used to drive the laser assembly 3 to move along a second direction.

[0043] In this embodiment, both the first movable module 7 and the second movable module are slider guide modules.

[0044] Furthermore, the laser cutting device further includes a third movable module 9 connected to the first movable module 7 or the second movable module 8. The third movable module 9 is used to drive the laser assembly 3 to move in the vertical direction. In this embodiment, the third movable module 9 is a ball screw module.

[0045] Specifically, the first movable module 7 is disposed on the frame 1, the second movable module 8 is fixedly connected to the moving member of the first movable module 7, and the third movable module 9 is fixedly connected to the moving member of the second movable module 8. When adjusting the position of the laser assembly 3 to align the laser assembly 3 with the glass substrate on the stage 2, the first movable module 7 and the second movable module 8 are used to move the laser assembly 3 horizontally, and the third movable module 9 is used to move the laser assembly 3 vertically. Ultimately, the position of the laser assembly 3 and the glass substrate on the stage 2 is adjusted, so that the laser assembly 3 can cut the glass substrate on the stage 2.

[0046] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0048] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A laser cutting device, characterized in that: The laser cutting device comprises: Rack (1); A carrier (2), the carrier (2) being arranged on one side of the frame (1) and being used for placing a glass substrate; a laser assembly (3), wherein the laser assembly (3) can be moved laterally and / or raised and lowered relative to the frame (1) so as to be opposite to the glass substrate on the carrier (2), and the laser assembly (3) is used to process the surface of the glass substrate; A cooling assembly (4), the cooling assembly (4) comprising at least two cooling members (41), with at least one cooling member (41) being provided on opposite sides of the carrier (2), the cooling member (41) being configured to be connected to an air source so as to blow cooling air toward the glass substrate on the carrier (2); The cooling element (41) is provided with a pipeline structure, the pipeline structure including an air inlet duct (412) and at least two air outlet ducts (411) spaced apart along a first direction, the air outlet of the air outlet duct (411) is opposite to the carrier (2), and the air inlet thereof is connected to the air inlet duct (412); The air outlets of all the air outlet ducts (411) gradually move away from the carrier (2) along the first direction, and the air inlets of all the air outlet ducts (411) remain flush along the first direction.

2. The laser cutting device according to claim 1, wherein: The laser cutting device also includes a guide plate (5) integrally formed with the cooling member (41) and provided on the carrier (2), wherein the guide plate (5) includes a connecting portion (51) and a guide portion (52) which are at a preset angle to each other, and the guide plate (5) is connected to the carrier (2) via the connecting portion (51), and the guide portion (52) is used to change the flow direction of the gas flowing out of the air outlet.

3. The laser cutting device according to claim 2, wherein: The connecting portion (51) is rotatably connected to the carrier (2).

4. The laser cutting device according to claim 3, wherein: A rotating base (6) is provided on the surface of the carrier (2), a rotating shaft (61) is rotatably connected inside the rotating base (6), and the connecting portion (51) is fixedly connected to the rotating shaft (61) to rotate relative to the carrier (2).

5. The laser cutting device according to any one of claims 1 to 4, characterized in that: The laser cutting device comprises a first movable module (7) and a second movable module (8), wherein the first movable module (7) is used to drive the laser component (3) to move along a first direction, and the second movable module (8) is used to drive the laser component (3) to move along a second direction.

6. The laser cutting device according to claim 5, wherein: The laser cutting device further comprises a third movable module (9) connected to the first movable module (7) or the second movable module (8), and the third movable module (9) is used to drive the laser assembly (3) to move in a vertical direction.

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