Automatic feeding device for semiconductor substrate
Through the combination of electric suction cups and air pump injection tubes, automatic loading and cleaning of semiconductor substrates are realized, which solves the problem of substrate contamination and improves production efficiency and product quality.
Patent Information
- Application Number
- CN202520072156.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2035-01-13
AI Technical Summary
During the loading process of semiconductor substrates, the substrates are easily contaminated by dust and impurities, resulting in low production efficiency and unstable product quality.
An automatic loading device for semiconductor substrates was designed. An electric suction cup was used to realize automatic loading of substrates. A double-track slide and an air pump injection tube were combined to form an air wall to prevent the intrusion of external pollutants. Impurities on the substrate surface were removed by the jet air flow.
It improves production efficiency, ensures the cleanliness of the substrate, reduces impurity contamination, and improves product quality and reliability.
Smart Images
Figure CN223396931U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor substrate production, in particular to an automatic feeding device for semiconductor substrates. Background Art
[0002] Semiconductor substrates are core materials in semiconductor device manufacturing. They are typically made of materials with specific electrical properties to meet the performance requirements of different devices. The most common semiconductor substrate material is silicon, but gallium arsenide, silicon carbide, gallium nitride, and other materials are also used depending on the application. The choice of these materials depends on parameters such as the device's operating frequency, power level, and temperature range.
[0003] Among them, in the semiconductor manufacturing process, loading of semiconductor substrates is a key step, which is crucial to ensuring production efficiency and product quality. During the loading process, the substrate is likely to be contaminated by dust, impurities and other pollutants. If these external factors are not effectively controlled, they may adhere to the surface of the substrate for a long time, thereby significantly reducing the overall performance and reliability of the semiconductor device.
[0004] To this end, it is particularly important to develop an automatic loading device for semiconductor substrates that can clean attached impurities. It not only needs to meet the production requirements of cleanliness, but also should integrate advanced automation technology to achieve precise management and efficient processing of substrates. Utility Model Content
[0005] In order to overcome the shortcomings of the above-mentioned prior art, the utility model provides an automatic loading device for semiconductor substrates that can clean attached impurities, can meet the production requirements of cleanliness, and also integrates advanced automation technology to achieve precise management and efficient processing of substrates.
[0006] The technical solution is: an automatic loading device for semiconductor substrates, including a machine box, a conveyor, a feed box, a transfer box, a double-track slide, an electric suction cup, a rodless cylinder, a movable plate, a movable frame, a spacer, an air pump and a spray pipe. A conveyor for transporting substrates is provided on the top of the machine box, a feed box for feeding substrates is provided on one side of the machine box, one end of the conveyor is connected to the feed box, and a transfer box for transferring and discharging substrates is provided on the rear side of the machine box, a double-track slide is provided on the front side of the transfer box, an electric suction cup for adsorbing and loading substrates is provided between the two sliders of the double-track slide, and a suction cup for adsorbing and loading substrates is provided on the side of the transfer box. There is a rodless cylinder at each of the four inner positions, a movable plate is set between the sliders of the two rodless cylinders on the same side, a hollow movable frame is set between the two movable plates, and partition plates are symmetrically slidably set on the movable frame. Plate bodies are arranged at intervals on the opposite sides of the two partition plates to separate the placement of each substrate. An opening for discharging the substrate is opened on the rear side of the transfer box, and an air pump is symmetrically set above the opening of the transfer box. A spray pipe is set inside the opening of the transfer box, and the nozzle of the spray pipe passes through the side wall of the opening, and the spray pipe is connected to the air pump to be used to spray air flow to form a wind wall to clean the substrate.
[0007] As a further preferred solution, it also includes an infrared detector and a display screen. An infrared detector for detecting the substrate is provided on the feed box, and a display screen electrically connected to the infrared detector is provided on one side of the transfer box. The display screen is used to display the detection data.
[0008] As a further preferred solution, it also includes a double-slide slide and a push plate. The double-slide slide is installed at the bottom of the movable frame. A push plate is provided on each of the two slides of the double-slide slide, and the push plate is connected to the bottom end of the partition plate on the same side.
[0009] As a further preferred solution, it also includes a scale plate and a pointer. The scale plate is symmetrically arranged on the lower side of the front of the moving frame, and the pointer indicating the index of the scale plate on the same side is arranged on the front side of the push plate.
[0010] As a further preferred solution, a support frame is further included, and the bottom of the movable frame is symmetrically provided with a support frame for supporting.
[0011] As a further preferred solution, it also includes a stop block, an annular bevel rod, a contact plate and a push block. An annular bevel rod is rotatably provided on the inner top of the transfer box, a contact plate is rotatably provided on the annular bevel rod, and a stop block that abuts against the contact plate is provided on the top of the moving frame. A push block for pushing out the substrate is also provided at the end of the annular bevel rod.
[0012] The utility model has the following advantages: the utility model realizes the automatic loading process of the substrate through the setting of the electric suction cup, which significantly improves the production efficiency and the convenience of operation, and then uses the design of the double-track slide to transfer the substrate from the loading position to the transfer box, which not only provides a safe transportation environment for the substrate, but also its box structure can effectively prevent the invasion of external dust and other pollutants, thereby preliminarily ensuring the cleanliness of the substrate. In addition, in order to further improve the cleanliness of the substrate, an air pump and a spray pipe are also provided to efficiently remove impurities attached to the surface of the substrate, and the airflow generated during the cleaning process can form a wind wall to help block impurities and prevent the removed particles from falling back onto the surface of the substrate, thereby ensuring that the substrate can meet the cleaning standards before entering the subsequent production links, avoiding contamination by impurities, and thereby improving the quality and reliability of the final product. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model.
[0014] Figure 2 It is a schematic diagram of the three-dimensional structure of the internal components of the transfer box of the present invention.
[0015] Figure 3 It is a three-dimensional structural diagram of the components such as the movable frame, support frame and double-slide plate slide of the utility model.
[0016] Figure 4 It is a three-dimensional structural sectional view of the components such as the stop block, annular inclined groove rod and contact plate of the utility model.
[0017] Figure 5 It is a schematic diagram of the three-dimensional structure of the transfer box, air pump and injection pipe of the utility model.
[0018] Among them: 100-base plate, 1-chassis, 2-conveyor, 3-feed box, 4-infrared detector, 5-transfer box, 6-display screen, 7-double-track slide, 8-electric suction cup, 9-rodless cylinder, 10-moving plate, 11-moving frame, 111-scale plate, 12-support frame, 13-double-slide slide, 14-push plate, 141-pointer, 15-spacer, 16-block, 17-annular inclined groove rod, 18-contact plate, 19-push block, 20-air pump, 21-injection pipe. DETAILED DESCRIPTION
[0019] The following further describes the technical solution with reference to specific embodiments. It should be noted that terms such as "up," "down," "left," and "right" used herein to indicate directions refer only to the positions of the structures depicted in the corresponding drawings. Component numbers, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. References to "connected" and "coupled" in this application, unless otherwise specified, include both direct and indirect connections (couplings).
[0020] Embodiment: A semiconductor substrate automatic loading device, such as Figure 1-Figure 5As shown, it includes a chassis 1, a conveyor 2, a feed box 3, a transfer box 5, a double-track slide 7, an electric suction cup 8, a rodless cylinder 9, a movable plate 10, a movable frame 11, a partition plate 15, an air pump 20 and a spray pipe 21. A conveyor 2 for transporting a substrate 100 is provided on the top of the chassis 1, a feed box 3 for feeding the substrate 100 is provided on the right side of the chassis 1, one end of the conveyor 2 is connected to the feed box 3, and a transfer box 5 for transferring and discharging the substrate 100 is provided on the rear side of the chassis 1. The conveyor 2 is designed to adopt a transport direction from right to left. Its main task is to smoothly transport the substrate 100 from the feed box 3 to the transfer box 5. This process not only involves physical transportation, but also includes the precise positioning of the substrate 100. The transfer box 5 is not limited to being the final processing location of the substrate 100, it also provides a closed environment that can block external impurities, which not only helps to protect the substrate 100 from external contamination during transportation, positioning and unloading operations, thereby maintaining the cleanliness of its surface, and this is crucial to ensuring the quality of the substrate 100 in the subsequent processing process. A double-track slide 7 is provided on the front side of the transfer box 5, and an electric suction cup 8 for adsorbing and loading the substrate 100 is provided between the two sliders of the double-track slide 7. This not only realizes the automation of the loading process of the substrate 100 and improves the efficiency, but also provides a kind of A more gentle and suitable loading method. The advantage of the electric suction cup 8 is that it can provide a stable and adjustable adsorption force, which is very important for substrates 100 of different materials and weights, because it can reduce the scratches or damage to the substrate 100 during the loading process, thereby ensuring the surface quality and integrity of the substrate 100, reducing the potential risk of damage to the surface of the substrate 100, and providing a safer and more efficient loading operation for the substrate 100. A rodless cylinder 9 is provided on each of the four inner sides of the transfer box 5, and a moving plate 10 is provided between the sliders of the two rodless cylinders 9 on the same side, and a hollow moving frame 11 is provided between the two moving plates 10, allowing the moving frame 11 to be driven by the rodless cylinder 9 to move up in the vertical direction. The transfer box 5 is provided with an opening for discharging the substrates 100. An air pump 20 is symmetrically arranged above the opening of the transfer box 5. An injection pipe 21 is provided inside the opening of the transfer box 5. The nozzle of the injection pipe 21 passes through the side wall of the opening, and the injection pipe 21 is connected to the air pump 20 to spray air to form a wind wall to clean the substrate 100. The strong airflow can effectively remove impurities from the substrate 100 that is in the process of discharging.The substrate 100 is kept clean continuously and stably to ensure the quality of the product.
[0021] like Figure 1 As shown, it also includes an infrared detector 4 and a display screen 6. An infrared detector 4 for detecting the substrate 100 is provided on the feed box 3, which can detect the substrate 100 with defects. A display screen 6 electrically connected to the infrared detector 4 is provided on the left side of the transfer box 5, and the display screen 6 is used to display the detection data.
[0022] like Figure 3 As shown, it also includes a double-slide slide 13 and a push plate 14. The double-slide slide 13 is installed at the bottom of the moving frame 11. A push plate 14 is provided on each of the two slides of the double-slide slide 13. The push plate 14 is connected to the bottom end of the spacer plate 15 on the same side, so that the movement of the spacer plate 15 is automated.
[0023] like Figure 2 and Figure 3 As shown, it also includes a scale plate 111 and a pointer 141. The scale plate 111 is symmetrically arranged on the lower side of the front of the moving frame 11, and the pointer 141 indicating the index of the scale plate 111 on the same side is arranged on the front side of the pushing plate 14. The position of the spacer 15 can be adjusted intuitively through data to ensure the accuracy of the spacing adjustment of the substrate 100.
[0024] like Figure 2-Figure 4 As shown, a support frame 12 is also included. The bottom of the moving frame 11 is symmetrically provided with a support frame 12 for providing stable support for the moving frame 11.
[0025] like Figure 2 and Figure 4 As shown, it also includes a stopper 16, an annular bevel rod 17, a contact plate 18 and a pusher block 19. An annular bevel rod 17 is rotatably provided on the inner top of the transfer box 5, and a contact plate 18 is rotatably provided on the annular bevel rod 17. A stopper 16 that abuts against the contact plate 18 is provided on the top of the moving frame 11, and a pusher block 19 for pushing out the substrate 100 is also provided at the end of the annular bevel rod 17. The annular bevel rod 17 has a circumferential oblique bevel, so that the contact plate 18 can move smoothly along the track of the bevel when squeezed, and the linear motion is converted into the rotational motion of the annular bevel rod 17 by utilizing the extrusion fit of the inclined surface, so as to drive the pusher block 19 to rotate and push out the substrates 100 one by one, so as to realize automatic discharging operation.
[0026] In the process of loading the substrate 100, the conveyor 2 is first started, and the substrate 100 to be loaded and processed is placed on the conveyor 2. The substrate 100 transported by the conveyor 2 will enter the feed box 3, and then be scanned and inspected by the infrared detector 4. Then the staff can view the inspection data on the display screen 6 and pick out the defective substrates 100. Subsequently, the substrate 100 will be transported by the conveyor 2 to the bottom of the double-track slide 7, and then the double-track slide 7 will be started. The electric suction cup 8 is driven forward by the double-track slide 7, so that the electric suction cup 8 is close to the substrate 100, and then the electric suction cup 8 is started to adsorb the substrate 100. After the substrate 100 is adsorbed, the double-track slide 7 drives the electric suction cup 8 and the substrate 100 to move into the transfer box 5. At the same time, the rodless cylinder 9 is started to drive the movable plate 10 to move upward, and then the movable frame 11 and its upper components are moved upward together. After the upper position of the partition plate 15 is level with the substrate 100, the electric suction cup 8 continues to move backward, so that the substrate 100 is embedded in the compartment between the two partition plates 15. After the substrate 100 moves to the appropriate position, the electric suction cup 8 is released, so that the loading operation of the substrate 100 can be realized, and then the electric suction cup 8 will continue to move forward, thereby achieving continuous loading of the substrate 100, presenting an automated loading operation.
[0027] In order to ensure that the substrate 100 can be correctly placed in the appropriate compartment, the double-slide slide 13 can be started to drive the push plates 14 and the spacer plates 15 on both sides to move away from or closer to each other to adjust the size of the space suitable for the substrate 100. Then, the pointer 141 on the scale plate 111 can be used to determine whether the spacing has been adjusted to the right position. After the moving frame 11 is loaded with a certain number of substrates 100, the unloading operation can be started, and the material receiving equipment on the rear side of the transfer box 5 is ready to be started. Then, the rodless cylinder 9 will continue to drive the substrates 100 in the moving frame 11 to continue to move upward until the block 16 contacts the contact plate 18. With the further drive of the rodless cylinder 9, the contact plate 18 contacts the block 16, and the continued upward movement of the moving frame 11 puts pressure on the contact plate 18, so that the contact plate 18 follows the trajectory of the annular bevel rod 17 and squeezes the annular bevel rod 1 7 generates thrust, causing the annular inclined slot rod 17 to rotate. As the annular inclined slot rod 17 rotates, the pushing block 19 at the bottom will be driven to rotate, thereby contacting and pushing out the substrate 100, so that it is pushed out from the opening of the transfer box 5, and then the subsequent material receiving equipment is started to take out the substrate 100. At the same time, the air pump 20 continuously supplies air to the injection pipe 21 to form a wind wall surrounding the opening trajectory of the transfer box 5, blowing the substrate 100 placed at the opening to remove impurities on the surface of the substrate 100 and ensure the quality of subsequent production.
[0028] The above is a detailed introduction to the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. At the same time, for those skilled in the art, based on the idea of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.
Claims
1. A semiconductor substrate automatic loading device, comprising a housing (1), characterized in that: The machine box (1) further comprises a conveyor (2), wherein the conveyor (2) for transporting the substrate (100) is provided on the top of the machine box (1), a feed box (3) for feeding the substrate (100) is provided on one side of the machine box (1), one end of the conveyor (2) is connected to the feed box (3), and a transfer box (5) for transferring and discharging the substrate (100) is provided on the rear side of the machine box (1), a double-track slide (7) is provided on the front side of the transfer box (5), an electric suction cup (8) for adsorbing and loading the substrate (100) is provided between the two sliders of the double-track slide (7), a rodless cylinder (9) is provided at each of the four inner peripheries of the transfer box (5), and a rodless cylinder (9) is provided between the sliders of the two rodless cylinders (9) on the same side. A movable plate (10), a hollow movable frame (11) is provided between the two movable plates (10), a partition plate (15) is symmetrically slidably provided on the movable frame (11), and plate bodies are arranged at intervals on opposite sides of the two partition plates (15) for spacing the placement of each substrate (100), an opening for discharging the substrate (100) is provided on the rear side of the transfer box (5), an air pump (20) is symmetrically provided above the opening of the transfer box (5), and a spray pipe (21) is provided inside the opening of the transfer box (5), the nozzle of the spray pipe (21) passes through the side wall of the opening, and the spray pipe (21) is connected to the air pump (20) for spraying air to form a wind wall to clean the substrate (100).
2. The automatic loading device for semiconductor substrates according to claim 1, characterized in that: It also includes an infrared detector (4) and a display screen (6). The infrared detector (4) for detecting the substrate (100) is provided on the feed box (3), and a display screen (6) electrically connected to the infrared detector (4) is provided on one side of the transfer box (5). The display screen (6) is used to display detection data.
3. The automatic loading device for semiconductor substrates according to claim 2, characterized in that: It also includes a double-slide slide (13) and a push plate (14). The double-slide slide (13) is installed at the bottom of the moving frame (11). A push plate (14) is respectively provided on the two slides of the double-slide slide (13). The push plate (14) is connected to the bottom end of the spacer plate (15) on the same side.
4. The automatic loading device for semiconductor substrates according to claim 3, characterized in that: It also includes a scale plate (111) and a pointer (141), wherein the scale plate (111) is symmetrically arranged on the lower side of the front of the moving frame (11), and the pointer (141) is arranged on the front side of the pushing plate (14) to indicate the index of the scale plate (111) on the same side.
5. The automatic loading device for semiconductor substrates according to claim 4, characterized in that: A support frame (12) is also included, and the bottom of the movable frame (11) is symmetrically provided with a support frame (12) for supporting.
6. The automatic loading device for semiconductor substrates according to claim 5, characterized in that: The invention also includes a stopper (16), an annular bevel rod (17), a contact plate (18) and a pusher block (19). The inner top of the transfer box (5) is rotatably provided with an annular bevel rod (17), and a contact plate (18) is rotatably provided on the annular bevel rod (17). A stopper (16) abutting against the contact plate (18) is provided on the top of the moving frame (11), and a pusher block (19) for pushing out the substrate (100) is also provided at the end of the annular bevel rod (17).