Fluid heat dissipation type refrigeration back sticker

Abstract

The utility model discloses a fluid heat dissipation type refrigeration back sticker which comprises a connecting and fixing frame body, a water source device, a temperature adjusting assembly, a fluid device, a back sticker body, a main control circuit board and a power supply assembly. The temperature adjusting assembly is arranged on the connecting and fixing frame body and comprises a fan, a semiconductor chilling plate, a heat dissipation piece and a temperature guide plate, the heating face of the semiconductor chilling plate is attached to the heat dissipation piece, the refrigerating face of the semiconductor chilling plate is attached to the temperature guide plate, the back attaching body is arranged at the front end of the connecting and fixing frame body, and the inner side face of the back attaching body is attached to the temperature guide plate. The fluid device and the water source device are arranged on the connecting and fixing frame body, and the fluid output end of the fluid device faces the heat dissipation piece of the temperature adjusting assembly. The fluid device arranged on the fluid heat dissipation type refrigeration back paste provides jet fluid for the heating end of the semiconductor refrigeration sheet, the air blowing amount of a fan in the temperature adjusting assembly can be supplemented, water can be sprayed to the heat dissipation piece, and evaporation of water is used for auxiliary cooling of the semiconductor refrigeration sheet.

Description

Technical Field

[0001] The utility model discloses a fluid heat dissipation refrigeration back sticker, which relates to a back sticker device used for heat dissipation and cooling of objects and human bodies in multiple environments, and in particular to a back sticker which enhances heat dissipation through flowing liquid and gas. Background Art

[0002] With the intensification of the greenhouse effect and the increase in extreme weather conditions, products that cool objects or people are increasingly popular among those working or exercising in high-temperature environments. However, many of the available heat dissipation products are more like concept products, offering only a taste of novelty. They often fail to solve practical problems in harsh summer weather, such as outdoor construction sites, workshops, and fixed-station work. However, for outdoor activities like hiking, cycling, and mountaineering, which involve sweating and require heat dissipation, heat dissipation is essential.

[0003] Chinese patent publication number CN220582821U discloses an authorized utility model patent named Backpack Heat Dissipation Assembly, the overall technical features of which include a shell and a fan arranged inside the shell, the shell including a mounting portion and an air distribution portion connected to the lower side of the mounting portion. The fan is arranged on the mounting portion, the front side wall of the mounting portion has an air inlet, and the front side wall of the air distribution portion has a plurality of air outlets, and the plurality of air outlets are distributed along the length direction of the air distribution portion. The fan includes a wind wheel, the wind wheel has an air inlet cavity and a plurality of side air outlet ducts connected to the air inlet cavity, the air inlet is connected to the air inlet cavity, and the side air outlet ducts are connected to the air distribution portion. The wind enters from the front of the air inlet cavity, and is then discharged to the air distribution portion through the side air outlet ducts. The air is evenly discharged from the plurality of air outlets distributed along the length direction of the air distribution portion to ensure uniform heat dissipation.

[0004] By reading the above technical features disclosed in the patent document, it can be seen that there are still several technical problems to be solved in the patent technical solution.

[0005] 1) The backpack heat dissipation component uses a fan to blow air. When the backpack heat dissipation component is in a high temperature and high humidity environment, the heat dissipation mode of simply using a fan to blow air cannot achieve the ideal heat dissipation effect.

[0006] 2) The airflow introduced by the fan is discharged through several air outlets distributed along the length direction of the air distribution part. When the air inlet of the heat dissipation component is blocked or the airflow introduced by the fan is small due to other circumstances, the air outlet of the far end of the air distribution part will be less than the air outlet of the near end of the air distribution part, thereby causing uneven heat dissipation effect of the heat dissipation component.

[0007] 3) When the backpack heat dissipation component is in use, the air outlets of the air distribution part must be placed in close contact with the human body or the heat dissipation object. When the air outlets of the air distribution part are blocked by the back of the human body or the heat dissipation object, the air output of the air distribution part will be reduced or the air output function will be lost. The reduction in air output or the loss of air output function will cause: (1) The wind pressure in the air distribution part increases. The increased wind pressure will cause vibration and abnormal noise of the backpack heat dissipation component when released to the outside in an instant, thereby affecting the user experience of the backpack heat dissipation component. (2) The increase in wind pressure in the air distribution part will generate reverse wind pressure on the fan during the blowing process. The reverse wind pressure will not only affect the fan's air output, but also damage the fan and shorten the fan's service life. Utility Model Content

[0008] To address the aforementioned issues in the prior art, the present invention provides a fluid-heat dissipation cooling backing patch that utilizes a semiconductor chip cooling method. The cooling energy generated by the fluid-heat dissipation cooling backing patch is transferred to the human body or the object being dissipated through the backing. To ensure the cooling effect of the semiconductor chip, a fluid device is provided on the backing patch to spray fluid to dissipate heat at the heat-generating end of the semiconductor chip.

[0009] The technical solution adopted by the fluid heat dissipation refrigeration back sticker of the utility model is as follows: the overall structure of the back sticker includes a connecting frame, a water source device, a temperature adjustment component, a fluid device, a sticker back body, a main control circuit board and a power supply component.

[0010] Specifically, the temperature regulating assembly is arranged on the connecting frame, and includes a fan, a semiconductor refrigeration sheet, a heat sink and a heat conduction plate. The heating surface of the semiconductor refrigeration sheet is arranged in contact with the heat sink, and the cooling surface of the semiconductor refrigeration sheet is arranged in contact with the heat conduction plate. The back body is arranged at the front end of the connecting frame, and its inner side is in contact with the heat conduction plate. The fluid device and the water source device are arranged on the connecting frame, and the fluid output end of the fluid device is arranged toward the heat sink or fan of the temperature regulating assembly. The power supply assembly is arranged on the connecting frame, and is an external power interface, or an external cable, or a rechargeable battery. The main control circuit board is arranged on the connecting frame, and the main control circuit board is electrically connected to the power supply assembly, the temperature regulating assembly, and the fluid device.

[0011] As an option, in the specific structure of a fluid heat dissipation refrigeration back patch of the present invention, the fan is arranged on a connecting frame on one side of the heat sink, and is located at the side of the heat sink and blows air toward the heat sink. An air inlet is provided on the connecting frame at one end located at the fan, and an air outlet is provided on the other end separating the fan and the heat sink. A heat dissipation channel is formed between the reverse side of the heat sink that is bonded to the semiconductor refrigeration sheet and the inner wall of the connecting frame on this side, and the air inlet, fan, heat dissipation channel and air outlet are connected;

[0012] As an option, in the specific structure of a fluid-heat-dissipating refrigeration back patch of the present invention, the temperature regulating component also includes a shell, and the temperature regulating component is arranged on the connecting frame through the shell, and the fan is arranged on the outer side of the heat sink or in the heat dissipation groove outside the heat sink, and an air inlet is provided on the shell near the fan, and an air outlet is provided on the shell close to the heat sink.

[0013] Optionally, in the specific structure of the fluid heat dissipation refrigeration back patch of the present invention, the connecting frame is further provided with a shoulder strap.

[0014] Optionally, in the specific structure of the fluid heat dissipation cooling type back patch of the present invention, the connecting frame is further provided with a waist belt.

[0015] Optionally, in the specific structure of the fluid heat dissipation cooling type back patch of the present invention, the connecting frame is further provided with a combination of a shoulder strap and a waist belt.

[0016] As an option, in the specific structure of a fluid heat dissipation cooling type back sticker of the present invention, the back sticker is fixed to or detachably provided at an opening on the back side of the back sticker of the backpack.

[0017] Further optionally, the back sticker is fixedly connected to the opening of the backpack by riveting its connecting frame.

[0018] Further optionally, the back sticker is fixedly connected to the opening of the backpack by sewing its connecting frame.

[0019] Further optionally, a plastic frame or lining plate corresponding to the connecting frame is provided at the opening of the backpack, and the back sticker is fixedly connected to the plastic frame or lining plate provided at the opening of the backpack by welding the connecting frame.

[0020] Further optionally, the connecting frame of the back sticker is detachably connected to the opening of the backpack via bolts.

[0021] Further optionally, the back sticker and its connecting frame are detachably connected to the opening of the backpack via a zipper.

[0022] Further optionally, a rotary clip is provided at the opening of the backpack, and the back sticker is detachably clamped at the opening of the backpack via the rotary clip.

[0023] Specifically, in the specific structure of the fluid heat dissipation refrigeration back sticker of the present invention, the structure of the fluid device has the following specific implementation methods.

[0024] In embodiment 1, the fluid device includes a water pump, a water pipe and a nozzle. The main control circuit board is electrically connected to the water pump. The nozzle is connected to the water outlet of the water pump through the water pipe. The nozzle is set toward the heat sink of the temperature adjustment component. The water inlet of the water pump is connected to the water source device through the water pipe.

[0025] In the second embodiment, the fluid device includes an air pump, an air pipe, a three-way sleeve and a nozzle. The main control circuit board is electrically connected to the air pump, and the air pump is connected to the nozzle through the air pipe. The middle section of the air pipe is nested with a three-way sleeve, and the third interface of the three-way sleeve is connected to the water source device. The nozzle is set toward the heat sink of the temperature regulating component.

[0026] In embodiment three, the fluid device includes an air source interface, an air pipe, a water pipe and a gas-liquid two-fluid nozzle. One gas input end of the gas-liquid two-fluid nozzle is connected to the air source interface through the air pipe, and the other liquid input end is connected to the water source device through the water pipe. The nozzle is set toward the heat sink of the temperature regulating component.

[0027] In the fourth embodiment, the fluid device includes an air pump, an air pipe, a water pipe and a gas-liquid two-fluid nozzle. The main control circuit board is electrically connected to the air pump. One gas input end of the gas-liquid two-fluid nozzle is connected to the air outlet of the air pump through the air pipe, and the other liquid input end is connected to the water source device through the water pipe. The nozzle is set toward the heat sink of the temperature regulating component.

[0028] In embodiment five, the fluid device includes an air pump, an air pipe I, an air pipe II, a water pipe and a gas-liquid two-fluid nozzle. The main control circuit board is electrically connected to the air pump, the air pump is connected to the water source device through the air pipe I, the water source device is connected to the gas input end of the gas-liquid two-fluid nozzle through the air pipe II, the water source device is connected to the liquid input end of the gas-liquid two-fluid nozzle through the water pipe, and the nozzle of the gas-liquid two-fluid nozzle is set toward the heat sink of the temperature regulating component.

[0029] In the sixth embodiment, the fluid device is a vortex cooler and an air pipe. The air inlet of the vortex cooler is connected to an external air source through the air pipe, the hot air outlet is arranged outside the connecting frame, and the cold air outlet is arranged toward the heat sink of the temperature regulating assembly.

[0030] In a seventh embodiment, the fluid device includes a vortex cooler, an air pipe, and a cold air pipe. The vortex cooler's air inlet is connected to an external air source via the air pipe, its hot air outlet is positioned outside the connecting frame, and its cold air outlet is connected to the cold air pipe and blows air to the heat sink of the temperature control assembly through the cold air pipe.

[0031] In the eighth embodiment, the fluid device includes a vortex cooler, an air pipe, a cold air pipe, and an air nozzle. The vortex cooler's air inlet is connected to an external air source, its hot air outlet is positioned outside the connecting frame, and its cold air outlet is connected to the air nozzle via the cold air pipe, with the air nozzle positioned toward the heat sink of the temperature control assembly.

[0032] In the ninth embodiment, the fluid device includes an air pump, an air pipe and a vortex cooler. The main control circuit board is electrically connected to the air pump. The air inlet of the vortex cooler is connected to the air outlet of the air pump through the air pipe. The hot air outlet is arranged outside the connecting frame, and the cold air outlet is arranged toward the heat sink.

[0033] In the tenth embodiment, the fluid device includes an air pump, an air pipe, a cold air pipe and a vortex cooler. The main control circuit board is electrically connected to the air pump. The air inlet of the vortex cooler is connected to the air outlet of the air pump through the air pipe. The hot air end outlet is arranged outside the connecting frame body, and the cold air end is connected to the cold air pipe and blows air to the heat dissipation part of the temperature regulating component through the cold air pipe.

[0034] In the eleventh embodiment, the fluid device includes an air pump, an air pipe, a cold air pipe, and a vortex cooler. The main control circuit board is electrically connected to the air pump. The vortex cooler's air inlet is connected to the air pump's air outlet via the air pipe, with its hot air outlet positioned outside the connecting frame. Its cold air outlet is connected to an air nozzle via the cold air pipe, and the air nozzle is positioned toward the heat sink of the temperature control assembly.

[0035] In Example 12, the fluid device comprises an ultrasonic microporous atomizer disposed through the adjacent walls of the hard liquid pot and the heat sink, or the adjacent walls of the soft liquid capsule and the heat sink, and an atomizer circuit electrically connected to the main control circuit board. The ultrasonic microporous atomizer is electrically connected to the atomizer circuit, with its permeable surface facing the hard liquid pot or soft liquid capsule, and its atomizing surface facing the heat sink.

[0036] In the structural embodiments 1 to 4 of the fluid device of a fluid heat dissipation refrigeration type back sticker of the present invention, the fluid device further includes an ultrasonic atomization sheet, which is arranged at the bottom position of the heat sink and is electrically connected to the main control circuit board through an ultrasonic circuit.

[0037] Specifically, in the specific structure of the fluid heat dissipation refrigeration back sticker of the present invention, the structure of the water source device has the following specific implementation methods.

[0038] In the first embodiment, the water source device is a water source interface provided on the connecting frame.

[0039] In the second embodiment, the water source device is a hard liquid pot made of metal, glass or plastic material. The hard liquid pot is provided with a water inlet for connecting to a water pipe, an air pipe or a three-way sleeve, a liquid injection port for replenishing the liquid in the cavity, and a sealing cover on the liquid injection port.

[0040] In a third embodiment, the water source device is a soft liquid sac made of rubber, polyethylene (PE), polyvinyl chloride (PVC), polyurethane (PU), or thermoplastic polyurethane (TPU). The soft liquid sac is provided with a water inlet for connecting to a water pipe, an air pipe, or a three-way sleeve, and a liquid injection port for replenishing the liquid in the cavity. The liquid injection port is provided with a sealing cap.

[0041] In the fourth embodiment, the water source device is a bottle cap structure provided on the machine body and can be screwed together with a water storage bottle. The bottle cap structure is provided with a water receiving hole for connecting with a water pipe, an air pipe, or a three-way sleeve.

[0042] Specifically, in the specific structure of a fluid heat dissipation refrigeration type back sticker of the present invention, the fluid device is an ultrasonic microporous atomizing sheet and an atomizing circuit electrically connected to a main control circuit board, and the ultrasonic microporous atomizing sheet is electrically connected to the atomizing circuit.

[0043] In a further embodiment 1, corresponding through-holes are provided on the hard liquid pot and its adjacent connecting frame, and the ultrasonic microporous atomizing sheet is arranged through the through-holes, with its permeable surface facing the through-holes of the hard liquid pot and its atomizing surface facing the through-holes of the connecting frame.

[0044] In a further embodiment 2, the soft liquid sac and its adjacent connecting frame are provided with corresponding through holes, and the ultrasonic microporous atomizing sheet is arranged through the through holes, with its permeable surface facing the through holes of the soft liquid sac and its atomizing surface facing the through holes of the connecting frame.

[0045] In a further third embodiment, the ultrasonic microporous atomizing sheet is arranged at the water receiving hole of the bottle cap structure, and its water permeable surface faces the body of the water storage bottle matched with the bottle cap structure.

[0046] In the fluid heat dissipation cooling type back-attached water source device structure of the present invention, optionally, the hard liquid pot or soft liquid bladder is provided with a liquid outlet pipe connected to the internal cavity thereof, and the front end of the liquid outlet pipe is provided with a liquid outlet nozzle with an on / off valve. Alternatively, the bottle cap structure is provided with a liquid outlet pipe connected to the water storage bottle, and the front end of the liquid outlet pipe is provided with a liquid outlet nozzle with an on / off valve.

[0047] In the fluid-heat dissipation refrigeration back-mounted heat sink structure of the present invention, the heat sink is specifically a metal heat sink made of aluminum alloy or copper alloy. Alternatively, the heat sink is a heat sink structure made of graphite or graphene. Alternatively, the heat sink is a heat sink structure made of CNT nanotubes. Alternatively, the heat sink is a condenser assembly.

[0048] In the fluid-heat dissipation cooling back patch of the present invention, the back patch structure is specifically a soft hollow structure made of rubber, polyethylene (PE), polyvinyl chloride (PVC), polyurethane (PU), or thermoplastic polyurethane (TPU). Alternatively, the back patch is a hard hollow structure made of metal, glass, or plastic. The soft or hard cavity structure of the back patch is filled with a temperature-conducting liquid.

[0049] In the back body structure of a fluid-heat dissipation cooling back patch of the present invention, specifically, the connecting frame is provided with an audio storage chip and an audio playback component electrically connected to a main control circuit board. Alternatively, the connecting frame and the main control circuit board are provided with a Bluetooth module, a Wi-Fi module, and a satellite positioning chip.

[0050] The beneficial effects of the fluid heat dissipation refrigeration back sticker of the utility model are:

[0051] 1. The heat dissipation back sticker adopts semiconductor refrigeration technology to cool down the human body or objects. Compared with the heat dissipation mode that simply uses fan blowing, the cooling heat dissipation has a more ideal heat dissipation effect. Therefore, the heat dissipation back sticker can better adapt to various high temperature and high humidity environments.

[0052] 2) The cold energy generated by the fluid heat dissipation refrigeration back patch is transferred to the human body or the object to be refrigerated through the back patch body. The back patch body is in close contact with the human body or the object to be refrigerated, which can further prevent the cold energy generated by the semiconductor refrigeration sheet in the back patch from being lost during the heat dissipation process, thereby further enhancing the heat dissipation effect of the fluid heat dissipation refrigeration back patch.

[0053] 3) A fluid device is provided on the back sticker to provide a jet fluid to the heating end of the semiconductor refrigeration chip, which can supplement the blowing volume of the fan in the temperature adjustment component, and can also spray water on the heat sink, using the evaporation of water to assist in cooling the semiconductor refrigeration chip.

[0054] 4) A soft water bag is used as the backing body between the temperature equalizing plate in the backing and the human body or the heat dissipation object, which not only increases the comfort, but also utilizes the fluidity and large specific heat capacity of water to solve the problems of rapid temperature changes and local uneven heating and cooling.

[0055] The beneficial effects of the present invention are not limited to this description. For better understanding, a more detailed description is given in the specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0057] Figure 1 This is a three-dimensional schematic diagram of the overall structure of a fluid heat dissipation refrigeration back sticker of the utility model (I);

[0058] Figure 2 This is a three-dimensional schematic diagram of the decomposed structure of a fluid heat dissipation refrigeration back sticker of the utility model (I);

[0059] Figure 3 This is a three-dimensional schematic diagram of the overall structure of a fluid heat dissipation refrigeration back sticker of the utility model (II);

[0060] Figure 4 This is a three-dimensional schematic diagram of the decomposed structure of a fluid heat dissipation refrigeration back sticker of the utility model (II);

[0061] Figure 5 This is a three-dimensional schematic diagram of the decomposed structure of a fluid heat dissipation refrigeration back sticker of the utility model (three);

[0062] Figure 6 This is a three-dimensional schematic diagram of the connection structure between a fluid heat dissipation cooling type back sticker and a backpack of the utility model (I);

[0063] Figure 7 This is a three-dimensional schematic diagram of the connection structure between a fluid heat dissipation cooling type back sticker and a backpack of the utility model (II);

[0064] Figure 8 This is a three-dimensional schematic diagram of the connection structure between a fluid heat dissipation cooling type back sticker and a backpack of the utility model (three);

[0065] Figure 9 This is a three-dimensional schematic diagram of the overall structure of a fluid heat dissipation refrigeration back sticker of the utility model (three);

[0066] Figure 10 This is a three-dimensional schematic diagram of the overall structure of a fluid heat dissipation refrigeration back sticker of the utility model (four);

[0067] Figure 11 This is a three-dimensional schematic diagram of the decomposed structure of a fluid heat dissipation refrigeration back sticker of the utility model (four);

[0068] Figure 12 This is a three-dimensional schematic diagram of the decomposed structure of a fluid heat dissipation refrigeration back sticker of the utility model (five);

[0069] Figure 13 This is a three-dimensional schematic diagram of the decomposed structure of a fluid heat dissipation refrigeration back sticker of the utility model (six); DETAILED DESCRIPTION

[0070] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0071] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0072] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0073] The utility model discloses a fluid heat dissipation type refrigeration back sticker, which comprises a connecting frame, a water source device, a temperature regulating component, a fluid device, a sticker back body, a main control circuit board and a power supply component.

[0074] The connecting frame is the overall structural frame of the back sticker, and is used to support the positioning of all components of the back sticker and the positional relationship between all components.

[0075] The temperature regulating component is a refrigeration device of the back sticker, and the back sticker realizes the heat dissipation function of the back sticker through its refrigeration function.

[0076] The backing body is a cold energy conductor, which is used to conduct the cold energy generated by the temperature regulating component arranged in the connecting frame body to the outside of the connecting frame body to the object that needs heat dissipation and temperature reduction.

[0077] The fluid device is an auxiliary heat dissipation device for the temperature regulating component. The temperature regulating component also generates excess heat while cooling. The fluid device sprays liquid or gas toward the heating end of the temperature regulating component. The turbulent liquid or gas quickly carries the heat generated in the temperature regulating component out of the connecting frame.

[0078] The water source device is loaded with liquid water, which provides liquid (liquid water) to the fluid device.

[0079] In the specific structural components of a fluid-heat-dissipating refrigeration back patch of the present invention, the connecting frame and the temperature adjustment component are its core components. The internal structure of the temperature adjustment component and the connection method between the temperature adjustment component and the connecting frame have the following two implementation methods in the technical solution of a fluid-heat-dissipating refrigeration back patch of the present invention.

[0080] The first embodiment of the temperature regulating assembly structure and its connection method with the connecting frame;

[0081] like Figure 1 — Figure 4 As shown, the utility model is a fluid heat dissipation refrigeration backing sticker, comprising a connecting frame 1, a temperature adjustment component 2, a sticker backing 3, a fluid device 4, a water source device 5, a main control circuit board 6 and a power supply component.

[0082] Figure 2 Figure 4 As shown, the temperature adjustment assembly 2 is mounted on the connecting frame 1 and includes a fan 2a, a semiconductor cooling fin 2b, a heat sink 2c, and a thermal conductive plate 2d. The heating surface 2b1 (not shown) of the semiconductor cooling fin 2b is positioned against the heat sink 2c, while the cooling surface 2b2 of the semiconductor cooling fin 2b is positioned against the thermal conductive plate 2d. A backing member 3 is mounted at the front end of the connecting frame 1. The outer surface of the backing member 3 is designed to contact the back of the human body, while the inner surface of the backing member 3 contacts the thermal conductive plate 2d.

[0083] Figure 2 Figure 4 As shown, in the structure of the temperature adjustment assembly 2, the fan 2a is arranged on the connecting frame 1 on one side of the heat sink 2c. The fan 2a is located at the side of the heat sink 2c and blows air toward the heat sink 2c. Figure 1 Figure 2 Figure 4 As shown, the connecting frame 1 is provided with an air inlet 1a at one end located near the fan 2a, and an air outlet 1b at the other end separating the fan 2a and the heat sink 2c. A heat dissipation channel is formed between the surface of the heat sink 2c opposite to the semiconductor cooling plate 2b and the inner wall of the connecting frame 1. The air inlet 1a, fan 2a, heat dissipation channel, and air outlet 1b are interconnected.

[0084] like Figure 1 Figure 2 As shown, the fluid device 4 and the water source device 5 are both arranged on the connecting frame 1, the fluid output end of the fluid device 4 is arranged toward the heat sink 2c or fan 2a of the temperature adjustment component 2, and the power supply component (not shown in the figure) is arranged on the connecting frame 1. Figure 4 As shown, the main control circuit board 6 is arranged on the connecting frame 1 , and the main control circuit board 6 is electrically connected to the power supply component (not shown in the figure), the temperature adjustment component 2 , and the fluid device 4 .

[0085] A second embodiment of the temperature regulating assembly structure and its connection method with the connecting frame;

[0086] like Figure 5 As shown, the utility model is a fluid heat dissipation cooling type back sticker, including a connecting frame 1, a temperature adjustment component 2, a sticker back 3, a fluid device 4, a water source device 5, a main control circuit board 6 (refer to Figure 4 The temperature control assembly 2 is mounted on the connecting frame 1 and includes a fan 2a, a semiconductor cooling fin 2b, a heat sink 2c, and a thermal conductive plate 2d. The heating surface 2b1 of the semiconductor cooling fin 2b is aligned with the heat sink 2c, and the cooling surface 2b2 of the semiconductor cooling fin 2b is aligned with the thermal conductive plate 2d. The back body 3 is mounted at the front end of the connecting frame 1. The outer surface 3a of the back body 3 is designed to be aligned with the back of the human body, and the inner surface 3b of the back body 3 is aligned with the thermal conductive plate 2d.

[0087] The temperature adjustment component 2 includes a shell 2e, and the temperature adjustment component 2 is set on the connecting frame 1 through the shell 2e. The fan 2a is set on the outer side of the heat sink 2c or in the heat dissipation groove 2c1 outside the heat sink 2c. The shell 2e is provided with an air inlet 1a near the fan 2a, and the shell 2e is provided with an air outlet 1b close to the heat sink 2c.

[0088] The fluid device 4 and the water source device 5 are both arranged on the connecting frame 1, the fluid output end of the fluid device 4 is arranged toward the heat sink 2c of the temperature adjustment component 2, and the power supply component is arranged on the connecting frame 1. Figure 4 As shown, the main control circuit board 6 is arranged on the connecting frame 1 , and the main control circuit board 6 is electrically connected to the power supply component (not shown in the figure), the temperature adjustment component 2 , and the fluid device 4 .

[0089] In the embodiment of the above-mentioned specific structural components of the fluid heat dissipation refrigeration back sticker of the utility model, Figure 2 Figure 4 Figure 5 As shown, the temperature adjustment components 2 are provided on the connecting frame 1 in two pieces and are symmetrically arranged on the left and right. The heat conducting plates 2d are provided in two pieces corresponding to the temperature adjustment components 2 and are symmetrically arranged on the left and right.

[0090] In the specific structural components of the fluid heat dissipation and cooling back patch of the present invention, as an option, the power supply component of the fluid heat dissipation and cooling back patch is an external power supply interface provided on the fixing frame.

[0091] In the specific structural components of the fluid heat dissipation refrigeration back patch of the present invention, as an option, the power supply component of the fluid heat dissipation refrigeration back patch is an external cable provided on the fixed frame.

[0092] In the specific structural components of the fluid heat dissipation refrigeration back patch of the present invention, as an option, the power supply component of the fluid heat dissipation refrigeration back patch is a rechargeable battery arranged on the fixed frame.

[0093] Specific Figure 1 As shown, in a specific structural component of a fluid heat dissipation refrigeration type back sticker of the present invention, the main control circuit board 6 is arranged on the connecting frame 1, and is electrically connected to the power supply component and the temperature adjustment component 2.

[0094] The heat dissipation working principle and function of the fluid heat dissipation refrigeration back patch described in the present invention will be further described below with reference to the accompanying drawings.

[0095] Specific examples Figure 2 and Figure 4 As shown, the power provided by the power supply assembly enters the fan 2a and semiconductor cooling plate 2b of the temperature adjustment assembly 2 under the control of the main control circuit board 6. The cooling surface 2b2 of the semiconductor cooling plate 2b begins to cool under the action of the current. The thermal conductive plate 2d, which is in contact with the cooling surface 2b2 of the semiconductor cooling plate 2b, further conducts the cold energy received by the semiconductor cooling plate 2b to the backing body 3. When an object to be cooled is placed on the backing body 3, or the backing body 3 is affixed to the object to be cooled, the cold energy received by the backing body 3 is conducted to the object to be cooled, thereby achieving the purpose of cooling the object.

[0096] While the main control circuit board 6 controls the semiconductor refrigeration plate 2b to perform cooling, the fan 2a starts to rotate under the control of the main control circuit board 6. The fan 2a draws air outside the connecting frame 1 into the connecting frame 1 through the air inlet 1a. The fast-flowing air in the connecting frame 1 brings the heat energy generated by the semiconductor refrigeration plate 2b absorbed by the heat sink 2c out of the connecting frame 1 through the air outlet 1b.

[0097] The utility model provides a fluid heat dissipation refrigeration type back patch which also has the function of cooling the human body. When the back patch is used for cooling the human body, the back patch is preferably attached to the back of the human body.

[0098] Specific Figure 3 As shown, the connecting frame 1 is further provided with a shoulder strap 7, and the fluid heat dissipation back patch is attached to the back of the human body through the shoulder strap 7 to achieve its function of cooling the human body.

[0099] Specific reference Figure 3 As shown, the connecting frame 1 is further provided with a waist belt (not shown in the figure), and the fluid heat dissipation back patch is attached to the back of the human body through the waist belt to achieve its function of cooling the human body.

[0100] Specific reference Figure 3As shown, the connecting frame 1 is also provided with a combination of a shoulder strap 7 and a waist belt (not shown in the figure), and the fluid heat dissipation back patch is attached to the back of the human body through the combination to achieve its function of cooling the human body.

[0101] Specific Figure 6 As shown, the fluid heat dissipation back patch can be fixedly or detachably arranged on the back side 8a of the human body patch of the backpack 8.

[0102] Figure 7 As shown, an opening 8b is provided on the back surface 8a of the backpack 8. The fluid heat dissipation back patch can be fixed to or detachably arranged on the opening 8b of the back surface 8a of the backpack 8 through the connecting frame 1.

[0103] Furthermore, when the fluid heat dissipation back patch is fixedly arranged at the opening on the back of the backpacker's back patch, one or more of the following technical solutions can be selected.

[0104] Figure 6 As shown, the back sticker is fixedly connected to the opening 8b of the back sticker 8a of the backpack 8 by riveting the frame 1 with rivets 8c.

[0105] refer to Figure 6 As shown, the back sticker is fixedly connected to the opening 8b of the back side 8a of the backpack 8 by sewing the connecting frame 1 with needle and thread.

[0106] Figure 7 As shown, the opening 8b of the back surface 8a of the backpack 8 is provided with a plastic frame 8d or a lining plate 8e corresponding to the connecting frame 1, and the back sticker is fixedly connected to the 8d or lining plate 8e provided at the opening 8b of the back surface 8a of the backpack 8 by welding the connecting frame 1.

[0107] Furthermore, when the fluid heat dissipation back patch is detachably arranged at the opening on the back of the backpacker's back patch, one or more of the following technical solutions may be selected.

[0108] Figure 6 As shown, the back sticker is detachably connected to the opening 8b of the back sticker 8a of the backpack 8 by using bolts 8f through the connecting frame 1.

[0109] refer to Figure 6 As shown, the back sticker is detachably connected to the opening 8b of the back side 8a of the backpack 8 by using a zipper through the connecting frame 1.

[0110] refer to Figure 8As shown, the back sticker 8 is provided with a rotary clip 8g at the opening 8b of the back sticker 8a. The back sticker is removably secured to the opening 8b of the back sticker 8a via the rotary clip 8g. The rotary clip 8g comprises a connecting shaft 8g1, a clamp 8g2, and a pressing shaft 8g3. Two connecting shafts 8g1 are fixedly mounted at the opening 8b of the backpack 8. The clamp 8g2 selectively connects to the two connecting shafts 8g1. The pressing shaft 8g3 is located at the front end of the clamp 8g2. When the back sticker is in contact with the opening 8b of the back sticker 8a, the clamp 8g2 is rotated upward, causing the pressing shaft 8g3 to press against the edge of the back sticker's connecting frame 1.

[0111] In the technical solution adopted by the fluid heat dissipation refrigeration back sticker described in the present invention, when the heat dissipation back sticker is in a high-temperature environment where the usage scenario is too harsh, the high temperature generated by the semiconductor refrigeration plate in the temperature regulating device during the refrigeration process is absorbed by the heat sink and cannot be effectively and quickly discharged from the shell. The fluid device sprays liquid or gas toward the heat sink of the temperature regulating component, and the turbulent liquid or gas quickly brings the heat generated in the temperature regulating component out of the connecting frame, thereby reducing the damage to the temperature regulating device caused by the excessive temperature of the heat sink.

[0112] In the technical solution adopted by the fluid heat dissipation refrigeration back patch described in the present invention, the specific structure and component arrangement of the fluid device have the following multiple implementation methods.

[0113] Example 1 Figure 6 Figure 10 As shown, the fluid device includes a water pump 4a, a water pipe 4b, and a nozzle 4c. A main control circuit board 6 (not shown) is electrically connected to the water pump 4a. The nozzle 4c is connected to the water outlet of the water pump 4a via the water pipe 4b. The nozzle 4c is positioned toward the heat sink 2c of the temperature adjustment assembly 2. The water inlet of the water pump 4a is connected to the water source device 5 via the water pipe 4b. The water pump 4a pumps liquid water from the water source device 5 into the water pipe 4b, and then the water is sprayed by the nozzle 4c toward the heat sink 2c of the temperature adjustment assembly 2 within the connection frame 1.

[0114] Example 2 Figure 11 As shown, the fluid device includes a water pipe 4b, a nozzle 4c, an air pipe 4e, and an air pump 4g. A main control circuit board 6 (not shown) is electrically connected to the air pump 4g, and the nozzle 4c is positioned toward the heat sink 2c of the temperature adjustment assembly 2. The air pump 4g is connected to the water source device 5 via the air pipe 4e, and the nozzle 4c is connected to the water source device 5 via the water pipe 4b. The pressurized gas generated by the air pump 4g enters the water source device 5 through the air pipe 4e. Liquid water in the water source device 5, under the action of the pressurized gas generated by the air pump 4g, is ejected through the water pipe 4b and nozzle 4c toward the heat sink 2c of the temperature adjustment assembly 2.

[0115] Example 3 Reference Figure 12 As shown, the fluid device includes a water pipe 4b, a nozzle 4c, an air pipe 4e, an air pump 4g, and a three-way pipe 4z. A main control circuit board 6 (not shown) is electrically connected to the air pump 4g. The nozzle 4c is positioned toward the heat sink 2c of the temperature control assembly 2. The air pump 4g is connected to the nozzle 4c via the air pipe 4e. The three-way pipe 4z is nested in the middle section of the air pipe 4e. The third port 4z1 of the three-way pipe 4z is connected to the water source 5. When the pressurized gas generated by the air pump 4g flows in the air pipe 4e, negative pressure is simultaneously generated in the three-way sleeve 4z connected to the air pipe 4e and the water pipe 4b connected to the three-way sleeve 4z, and the negative pressure is transmitted to the water source device 5. Under the action of the Bernoulli principle, the liquid in the water source device 5 enters the air pipe 4e through the water pipe 4b and the three-way sleeve 4z. After the liquid in the water source device 5 is mixed with the gas generated by the air pump 4g in the air pipe 4e, it is ejected by the nozzle 4c toward the heat sink 2c of the temperature adjustment component 2.

[0116] Example 4 Figure 1 As shown, the fluid device includes a water pipe 4b, an air source interface 4d, an air pipe 4e, and a gas-liquid two-fluid nozzle 4f. The gas input end 4f1 of the gas-liquid two-fluid nozzle 4f is connected to the gas source interface 4d via the air pipe 4e, and the liquid input end 4f2 of the gas-liquid two-fluid nozzle 4f is connected to the water source device 5 via the water pipe 4b. The nozzle of the gas-liquid two-fluid nozzle 4f is positioned toward the heat sink 2c of the temperature control assembly 2. An external pressure gas source enters the gas-liquid two-fluid nozzle 4f through the gas source interface 4d and the air pipe 4e. Simultaneously, liquid water in the water source device 5 combines with gas from the external pressure gas source under the action of the Bernoulli principle of the air flow within the gas-liquid two-fluid nozzle 4f. The gas-liquid mixture is then sprayed through the nozzle of the gas-liquid two-fluid nozzle 4f toward the heat sink 2c of the temperature control assembly 2 within the connection frame 1.

[0117] Example 5 Figure 13 As shown, the fluid device includes a water pipe 4b, an air pump 4g, air pipes I 4x, air pipes II 4y, and a gas-liquid two-fluid nozzle 4f. A main control circuit board 6 (not shown) is electrically connected to the air pump 4g. The air pump 4g is connected to a water source device 5 via air pipe I 4x. The water source device 5 is connected to the gas input port 4f1 of the gas-liquid two-fluid nozzle 4f via air pipe II 4y. The water source device is connected to the liquid input port 4f2 of the gas-liquid two-fluid nozzle via a water pipe. The nozzle of the gas-liquid two-fluid nozzle 4f is positioned toward the heat sink 2c of the temperature control assembly 2. The pressurized gas generated by the air pump 4g passes through the air pipe I 4x, the water source device 5 and the air pipe II 4y and enters the gas-liquid two-fluid nozzle 4f. At the same time, the liquid water in the water source device 5 is combined with the pressurized gas generated by the air pump 4g under the action of the Bernoulli principle of the air flow in the gas-liquid two-fluid nozzle 4f. The gas-liquid mixture is then sprayed toward the heat sink 2c of the temperature adjustment component 2 in the connecting frame 1 through the nozzle of the gas-liquid two-fluid nozzle 4f.

[0118] Example 6 Figure 5 As shown, the fluid device comprises a vortex cooler 4h, an air source interface 4d, and an air pipe 4e. The air inlet nozzle 4h1 of the vortex cooler 4h is connected to the external air source interface 4d via the air pipe 4e. The hot air outlet 4h2 of the vortex cooler 4h is positioned toward the exterior of the connecting frame 1, while the cold air outlet 4h3 of the vortex cooler 4h is positioned toward the heat sink 2c of the temperature adjustment assembly 2. An external pressurized air source enters the vortex cooler 4h through the air source interface 4d and the air pipe 4e. The compressed air undergoes energy conversion within the vortex cooler 4h. The cold air generated by the vortex cooler 4h is blown from its cold air end 4h3 toward the heat sink 2c of the temperature adjustment assembly 2, while the hot air generated by the vortex cooler 4h is discharged from its hot air end 4h2 toward the exterior of the connecting frame 1.

[0119] Example 7 Figure 7 As shown, the fluid device includes a vortex cooler 4h and a cold air pipe 4i. The vortex cooler 4h's air inlet nozzle 4h1 is connected to an external air source, and its hot air outlet 4h2 is positioned toward the outside of the connecting frame. One end of the cold air pipe 4i is connected to the cold air outlet 4h3 of the vortex cooler 4h, and the other end is positioned toward the heat sink 2c of the temperature control assembly 2. An external pressurized air source enters the vortex cooler 4h through its air inlet nozzle 4h1. The compressed air undergoes energy conversion within the vortex cooler 4h. The cold air generated by the vortex cooler 4h is then connected to the cold air pipe 4i and blown toward the heat sink 2c of the temperature control assembly 2 through its cold air outlet 4h3. The hot air generated by the vortex cooler 4h is then discharged from its hot air outlet 4h2 toward the outside of the connecting frame 1.

[0120] Example 8 Figure 7 As shown, the fluid device includes a vortex cooler 4h, a cold air pipe 4i, and an air nozzle 4j. The air inlet nozzle 4h1 of the vortex cooler 4h is connected to an external air source. The cold air end 4h3 of the vortex cooler 4h is connected to the air nozzle 4j via the cold air pipe 4i. The air nozzle 4j is positioned toward the heat sink 2c of the temperature control assembly 2. The hot air end 4h2 of the vortex cooler 4h is positioned toward the outside of the connecting frame 1. An external pressure air source enters the vortex cooler 4h through the air inlet nozzle 4h1. The compressed air undergoes energy conversion within the vortex cooler 4h. The cold air generated by the vortex cooler 4h is then blown toward the heat sink 2c of the temperature control assembly 2 through its cold air end 4h3, which is connected to the cold air pipe 4i and the air nozzle 4j. The hot air generated by the vortex cooler 4h is discharged from its hot air end 4h2 toward the outside of the connecting frame 1.

[0121] Example 9 Figure 2As shown, the fluid device includes an air pump 4g, an air pipe 4e, and a vortex cooler 4h. A main control circuit board 6 (not shown) is electrically connected to the air pump 4g. The air inlet 4h1 of the vortex cooler 4h is connected to the air outlet of the air pump 4a via the air pipe 4e. The hot air outlet 4h2 of the vortex cooler 4h is positioned toward the exterior of the connecting frame 1, while the cold air outlet 4h3 of the vortex cooler 4h is positioned toward the heat sink 2c of the temperature control assembly 2. The air source generated by the air pump 4g enters the vortex cooler 4h through the air pipe 4e. The compressed air undergoes energy conversion within the vortex cooler 4h. The cold air generated by the vortex cooler 4h is blown from its cold air outlet 4h3 toward the heat sink 2c of the temperature control assembly 2. The hot air generated by the vortex cooler 4h is discharged from its hot air outlet 4h2 toward the exterior of the connecting frame 1.

[0122] Example 10 Figure 9 As shown, the fluid device includes an air pump 4g, an air pipe 4e, a vortex cooler 4h, and a cold air pipe 4i. A main control circuit board 6 (not shown) is electrically connected to the air pump 4g. The air inlet 4h1 of the vortex cooler 4h is connected to the air outlet of the air pump 4g via the air pipe. The hot air outlet 4h2 of the vortex cooler 4h is disposed toward the exterior of the connecting frame 1. The cold air pipe 4i has one end connected to the cold air outlet 4h3 of the vortex cooler 4hd and the other end disposed toward the heat sink 2c of the temperature control assembly 2. The air source generated by the air pump 4g enters the vortex cooler 4h through the air pipe 4e. The compressed air undergoes energy conversion within the vortex cooler 4h. The cold air generated by the vortex cooler 4h is blown toward the heat sink 2c of the temperature control assembly 2 through the cold air pipe 4i connected to the cold air outlet 4h3. The hot air generated by the vortex cooler 4h is discharged toward the exterior of the connecting frame 1 through the hot air outlet 4h2.

[0123] Example 11 Figure 9 As shown, the fluid device includes an air pump 4g, an air pipe 4e, a vortex cooler 4h, a cold air pipe 4i, and an air nozzle 4j. A main control circuit board 6 (not shown) is electrically connected to the air pump 4g. The air inlet nozzle 4h1 of the vortex cooler 4h is connected to the air outlet of the air pump 4g via the air pipe. The hot air end 4h2 of the vortex cooler 4h is disposed toward the exterior of the connecting frame 1. The cold air end 4h3 of the vortex cooler 4h is connected to the air nozzle 4j via the cold air pipe 4i. The air nozzle 4j is disposed toward the heat sink 2c of the temperature control assembly 2. The air source generated by the air pump 4g enters the vortex cooler 4h through the air pipe 4e. The compressed air undergoes energy conversion within the vortex cooler 4h. The cold air generated by the vortex cooler 4h is then blown toward the heat sink 2c of the temperature control assembly 2 through its cold air end 4h3, which is connected to the cold air pipe 4i and the air nozzle 4j. The hot air generated by the vortex cooler 4h is discharged from the hot air end 4h2 toward the exterior of the connecting frame 1.

[0124] Furthermore, in the first, second, third, fourth and fifth embodiments of the fluid device of the technical solution adopted by the fluid heat dissipation cooling back patch of the present invention, when the fluid supply device acts on the heat dissipation cavity, preferably, the fluid supply device also includes an ultrasonic atomizer.

[0125] Specific examples Figure 7 As shown, the ultrasonic atomizer includes an atomizing sheet 4k and an atomizing circuit. The ultrasonic atomizing sheet 4k is arranged at the bottom position of the heat sink 2c of the adjustment component 2. The ultrasonic atomizing sheet 4k is electrically connected to the atomizing circuit, and the ultrasonic circuit is electrically connected to the main control circuit board 6 (not drawn in the figure).

[0126] When the nozzle 4c of the fluid device or the gas-liquid two-fluid nozzle 4f sprays water onto the heat sink 2c of the temperature adjustment component 2, part of the water will drip downward. The ultrasonic wave generated by the ultrasonic atomizer 4k located below the heat sink 2c will atomize the dripping water droplets, which will then float toward the heat sink 2c under the action of the wind force of the fan 2a and be discharged through the air outlet 1b set on the connecting frame 1.

[0127] In the technical solution adopted by the fluid heat dissipation cooling back sticker of the present invention, in the first, second, third, fourth and fifth embodiments of the fluid device, the water source device includes the following multiple implementation methods.

[0128] Example 1 Reference Figure 1 As shown, the water source device 5 is a water source interface 52 provided on the connecting frame 1 , and the water pipe 4 b of the fluid device is connected to an external tap water source through the water source interface 52 .

[0129] Example 2 Figure 1 Figure 9 Figure 13 As shown, the primary water source device 5 is a hard liquid pot 5A made of metal, glass, or plastic. It is provided with a water inlet 5a for connection to the water pipe 4b, air pipe 4e, or three-way sleeve 4z, and a liquid inlet 5y for replenishing the liquid in the cavity. The liquid inlet 5y is provided with a sealing cap 51. The water pipe 4b, air pipe 4e, or three-way sleeve 4z of the fluid device is connected to the hard liquid pot 5A through the water inlet 5a. The liquid inlet 5y is used to replenish the liquid in the hard liquid pot 5A, and the sealing cap 51 seals the liquid inlet 5y of the hard liquid pot 5A.

[0130] Example 3 Figure 1 Figure 9 Figure 13As shown, the main water source device 5 is a soft liquid sac 5B made of rubber, polyethylene (PE), polyvinyl chloride (PVC), polyurethane (PU), or thermoplastic polyurethane (TPU). The soft liquid sac 5B is provided with a water inlet 5a and an injection port 5y for replenishing the liquid in the cavity. The injection port 5y is equipped with a sealing cap 51. The water pipe 4b, air pipe 4e, or three-way sleeve 4z of the fluid device is connected to the soft liquid sac 5B through the water inlet 5a. The injection port 5y is used to replenish the liquid in the soft liquid sac 5B, and the sealing cap 51 is used to seal the injection port 5y of the soft liquid sac 5B. The soft water sac 5B not only increases comfort but also utilizes the fluidity and high specific heat capacity of water to solve the problems of rapid temperature changes and localized hot and cold unevenness.

[0131] Example 4 Figure 10 Figure 11 Figure 12 Figure 13 As shown, the primary water source device 5 is a bottle cap structure 5C mounted on the housing 1. The lower end of the bottle cap 5C can be screwed onto a water storage bottle 5D. The bottle cap 5C has a water inlet 5a, through which a water pipe 4b, an air pipe 4e, or a three-way sleeve 4z passes. The water pipe 4b, air pipe 4e, or three-way sleeve 4z of the fluid device 2 is connected to the liquid contained in the water storage bottle 5D.

[0132] In the technical solution adopted by the fluid heat dissipation refrigeration back patch described in the present invention, the specific structure and component arrangement of the fluid device also include embodiment 12.

[0133] like Figure 2 As shown, the fluid device is an ultrasonic microporous atomizing sheet 4k and an atomizing circuit (not shown in the figure) electrically connected to a main control circuit board 6 (not shown in the figure), and the ultrasonic microporous atomizing sheet 4k is electrically connected to the atomizing circuit (not shown in the figure).

[0134] As optional Figure 2 As shown, the hard liquid pot 5A and its adjacent connecting frame 1 are provided with corresponding through-holes 1d. The ultrasonic microporous atomizing sheet 4k is disposed through the through-holes 1d of the hard liquid pot 5A and the connecting frame 1d1. The ultrasonic microporous atomizing sheet 4k has its permeable surface 4k1 facing the through-hole 1d of the hard liquid pot 5A, and its atomizing surface 4k2 facing the through-hole 1d of the connecting frame 1.

[0135] As an optional reference Figure 2As shown, the soft liquid capsule 5B and its adjacent connecting frame 1 are provided with corresponding through-holes 1d. The ultrasonic microporous atomizing sheet 4k is disposed through the through-holes 1d of the soft liquid capsule 5B and the connecting frame 1d1. The ultrasonic microporous atomizing sheet 4k has its water-permeable surface 4k1 facing the through-hole 1d of the soft liquid capsule 5B, and its atomizing surface 4k2 facing the through-hole 1d of the connecting frame 1.

[0136] As optional Figure 13 As shown, the ultrasonic microporous atomizing sheet 4k is arranged at the water receiving hole 5a of the bottle cap structure 5C, and its water permeable surface 4k1 is arranged toward the bottle body of the water storage bottle 5D matched with the bottle cap structure 5C.

[0137] refer to Figure 2 Figure 13 As shown, when the liquid in the hard liquid pot 5A, soft liquid capsule 5B, or water storage bottle 5D in conjunction with the bottle cap structure 5C contacts the water-permeable surface 4k1 of the ultrasonic microporous atomizing sheet 4k, the liquid molecules in the hard liquid pot 5A, soft liquid capsule 5B, or water storage bottle 5D, under the action of gravity, penetrate through the micropores of the water-permeable surface 4k1 to the atomizing surface 4k2 of the ultrasonic microporous atomizing sheet 4k. The ultrasonic microporous atomizing sheet 4k generates high-frequency vibrations through a high-frequency power supply. This high-frequency vibration causes the liquid that permeates the micropores of the water-permeable surface 4k1 to produce a fine mist of water particles, which is then sprayed toward the heat sink 2c of the temperature control assembly 2.

[0138] In order to enhance the use scenario of the fluid heat dissipation refrigeration back patch described in the present invention, the liquid in its water source device not only has the function of providing thermal energy for the temperature regulation component, but also has the function of providing drinking water for the user of the heat dissipation back patch under certain circumstances.

[0139] Specific Figure 5 As shown, the hard liquid pot 5a or the soft liquid sac 5c of the water source device 5 is provided with an infusion tube 5f, the rear end of the infusion tube 5f penetrates into the cavity of the hard liquid pot 4a or the soft liquid sac 4c, and the front end of the infusion tube 5f is provided with a liquid outlet nozzle 5h with a switch valve 5g.

[0140] Specific Figure 10 As shown, a liquid infusion tube 5f is provided on the bottle cap structure 5d of the water source device 5, the rear end of the liquid infusion tube 5f penetrates into the cavity of the water storage bottle 5e, and the front end of the liquid infusion tube 5f is provided with a liquid outlet nozzle 5h with a switch valve 5g.

[0141] In certain circumstances, the user of the fluid heat dissipation cooling back patch described in the present invention can add clean water to the water source device 5. When the user feels thirsty, the user places the liquid outlet 5h of the infusion tube 5f in the mouth and opens the switch valve 5g to directly drink the clean water from the drinking water source device 5.

[0142] The fluid heat dissipation refrigeration back sticker described in the utility model has a heat dissipation element made of a good thermal conductor material.

[0143] As an option, Figure 2 Figure 5 As shown, the heat sink 2c is a heat sink made of metal material, preferably aluminum alloy or copper alloy.

[0144] As an option, refer to Figure 2 Figure 5 As shown, the heat sink 2c is a heat sink structure made of graphite or graphene material.

[0145] Optionally, the heat sink is a heat sink structure made of CNT nanotube material.

[0146] As an option, Figure 11 As shown, the heat sink 2c is a condenser assembly 2z.

[0147] In order to improve the temperature regulation effect of the fluid heat dissipation refrigeration back patch described in the present invention on an object and further promote the back patch body to transfer the absorbed cold energy to the object to be cooled as quickly as possible, the back patch body is made of a good thermal conductor material.

[0148] Optionally, the backing body is a soft cavity structure made of rubber, polyethylene (PE), polyvinyl chloride (PVC), polyurethane (PU), or thermoplastic polyurethane rubber (TPU), and the soft cavity structure is filled with a temperature-conducting liquid.

[0149] Optionally, the backing body is a hard cavity structure made of metal, glass or plastic material, and the hard cavity structure is filled with a temperature-conducting liquid.

[0150] The fluid heat dissipation cooling back sticker of the present invention can optionally include an audio storage chip and an audio playback component electrically connected to a main control circuit board on the connecting frame. The back sticker can store and play various audio data through the audio storage chip and the audio playback component.

[0151] The fluid heat dissipation cooling back sticker of the present invention can optionally include a Bluetooth module and a Wi-Fi module on the main control circuit board, and can be connected to the Internet or the Internet of Things via the Bluetooth module and the Wi-Fi module.

[0152] The fluid heat dissipation cooling back sticker of the present invention can optionally include a satellite positioning chip on the main control circuit board. The back sticker realizes its geographic positioning function through the satellite positioning chip.

[0153] The above is a detailed introduction to a fluid-heat dissipation cooling backing provided by an embodiment of the present invention. Those skilled in the art will appreciate that variations in the specific implementation and scope of application are possible based on the principles of the present invention. Therefore, the contents of this specification should not be construed as limiting the present invention; any modifications based on the principles of the present invention are within the scope of protection of the present invention.

Claims

1. A fluid heat dissipation cooling type back sticker, characterized in that: It includes a connecting frame, a water source device, a temperature regulating component, a fluid device, a backing body, a main control circuit board and a power supply component; The temperature regulating assembly is arranged on the connecting frame, and includes a fan, a semiconductor refrigeration sheet, a heat sink and a temperature conducting plate. The heating surface of the semiconductor refrigeration sheet is arranged in contact with the heat sink, and the cooling surface of the semiconductor refrigeration sheet is arranged in contact with the temperature conducting plate. The backing body is arranged at the front end of the connecting frame, and its inner side is in contact with the heat conducting plate; The fluid device and the water source device are arranged on the connecting frame, and the fluid output end of the fluid device is arranged toward the heat sink or fan of the temperature adjustment component; The power supply component is arranged on the connecting frame and is an external power interface, or an external cable, or a rechargeable battery; The main control circuit board is arranged on the connecting frame, and the main control circuit board is electrically connected to the power supply component, the temperature adjustment component, and the fluid device.

2. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The fan is arranged on the connecting frame on one side of the heat sink, and is located at the side of the heat sink and blows air toward the heat sink. The connecting frame is provided with an air inlet at one end located at the fan, and an air outlet is provided at the other end separating the fan and the heat sink. A heat dissipation channel is formed between the reverse side of the heat sink that is bonded to the semiconductor refrigeration sheet and the inner wall of the connecting frame on this side, and the air inlet, fan, heat dissipation channel and air outlet are connected; or The temperature regulating assembly further comprises a shell, and the temperature regulating assembly is arranged on the connecting frame through the shell. The fan is arranged on the outer side of the heat sink or in the heat dissipation groove outside the heat sink. An air inlet is arranged on the shell near the fan, and an air outlet is arranged on the shell near the heat sink.

3. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The connecting frame is provided with a shoulder strap or a waist belt; or The connecting frame is provided with a combination of a shoulder strap and a waist belt; or The back sticker is fixed to or detachably arranged at an opening on the back side of the backpack body sticker.

4. The fluid heat dissipation cooling back sticker according to claim 3, characterized in that: The back sticker is fixedly connected to the opening of the backpack by riveting the connecting frame; or By sewing its connecting frame to the opening of the backpack; or The opening of the backpack is provided with a plastic frame or a lining plate corresponding to the connecting frame, and the back sticker is fixedly connected to the plastic frame or the lining plate provided at the opening of the backpack through welding of the connecting frame.

5. The fluid heat dissipation cooling back sticker according to claim 3, characterized in that: The back sticker and its connecting frame are detachably connected to the opening of the backpack by bolts; or The back sticker and its connecting frame are detachably connected to the opening of the backpack via a zipper; or The opening of the backpack is provided with a rotary clip, and the back sticker is detachably clamped at the opening of the backpack through the rotary clip.

6. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The fluid device includes a water pump, a water pipe and a nozzle, the main control circuit board is electrically connected to the water pump, the nozzle is connected to the water outlet of the water pump through the water pipe, the nozzle is arranged toward the heat sink of the temperature adjustment component, and the water inlet of the water pump is connected to the water source device through the water pipe; or The fluid device includes an air pump, an air pipe, a three-way sleeve and a nozzle, the main control circuit board is electrically connected to the air pump, the air pump is connected to the nozzle through the air pipe, the middle section of the air pipe is embedded with a three-way sleeve, the third interface of the three-way sleeve is connected to the water source device, and the nozzle is arranged toward the heat sink of the temperature adjustment component; or The fluid device includes an air source interface, an air pipe, a water pipe and a gas-liquid two-fluid nozzle, wherein one gas input end of the gas-liquid two-fluid nozzle is connected to the air source interface through the air pipe, and the other liquid input end of the gas-liquid two-fluid nozzle is connected to the water source device through the water pipe, and the nozzle is arranged toward the heat sink of the temperature adjustment component; or The fluid device includes an air pump, an air pipe, a water pipe and a gas-liquid two-fluid nozzle. The main control circuit board is electrically connected to the air pump. One gas input end of the gas-liquid two-fluid nozzle is connected to the air outlet of the air pump through the air pipe, and the other liquid input end is connected to the water source device through the water pipe, and the nozzle is set toward the heat sink of the temperature regulating component; or the fluid device includes an air pump, air pipe I, air pipe II, a water pipe and a gas-liquid two-fluid nozzle. The main control circuit board is electrically connected to the air pump, the air pump is connected to the water source device through air pipe I, the water source device is connected to the gas input end of the gas-liquid two-fluid nozzle through air pipe II, the water source device is connected to the liquid input end of the gas-liquid two-fluid nozzle through the water pipe, and the nozzle of the gas-liquid two-fluid nozzle is set toward the heat sink of the temperature regulating component.

7. The fluid heat dissipation cooling back sticker according to claim 6, characterized in that: The fluid device further includes an ultrasonic atomizing sheet, which is arranged at the bottom of the heat sink of the temperature regulating assembly and is electrically connected to the main control circuit board through an ultrasonic circuit.

8. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The fluid device is a vortex cooler and an air pipe, the air inlet of the vortex cooler is connected to the external air source through the air pipe, the hot air outlet is arranged outside the connecting frame, and the cold air outlet is arranged toward the heat sink of the temperature adjustment component; or the fluid device includes a vortex cooler, an air pipe and a cold air pipe, the air inlet of the vortex cooler is connected to the external air source through the air pipe, the hot air outlet is arranged outside the connecting frame, and the cold air end is connected to the cold air pipe and blows air toward the heat sink of the temperature adjustment component through the cold air pipe; or The fluid device includes a vortex cooler, an air pipe, a cold air pipe and an air nozzle. The air inlet nozzle of the vortex cooler is connected to an external air source, the hot air end outlet is arranged outside the connecting frame, and the cold air end outlet is connected to the air nozzle through the cold air pipe, and the air nozzle is arranged toward the heat dissipation part of the temperature adjustment component.

9. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The fluid device includes an air pump, an air pipe and a vortex cooler, the main control circuit board is electrically connected to the air pump, the air inlet of the vortex cooler is connected to the air outlet of the air pump through the air pipe, the hot air outlet is arranged outside the connecting frame, and the cold air outlet is arranged toward the heat sink; or The fluid device includes an air pump, an air pipe, a cold air pipe and a vortex cooler. The main control circuit board is electrically connected to the air pump. The air inlet of the vortex cooler is connected to the air outlet of the air pump through the air pipe. The hot air outlet is arranged outside the connecting frame. The cold air end is connected to the cold air pipe and blows air to the heat dissipation component of the temperature adjustment component through the cold air pipe; or The fluid device includes an air pump, an air pipe, a cold air pipe and a vortex cooler. The main control circuit board is electrically connected to the air pump. The air inlet nozzle of the vortex cooler is connected to the air outlet of the air pump through the air pipe. The hot air end outlet is arranged outside the connecting frame body, and the cold air end outlet is connected to the air nozzle through the cold air pipe. The air nozzle is arranged toward the heat dissipation part of the temperature adjustment component.

10. The fluid heat dissipation cooling back sticker according to claim 6, characterized in that: The water source device is a water source interface provided on the connecting frame; or The water source device is a hard liquid pot made of metal, glass or plastic material, which is provided with a water receiving hole for connecting to a water pipe, an air pipe or a three-way sleeve, and a liquid injection port for replenishing the liquid in the cavity, and the liquid injection port is provided with a sealing cover; or The water source device is a soft liquid sac made of rubber, polyethylene, polyvinyl chloride, polyurethane, or thermoplastic polyurethane rubber material. The soft liquid sac is provided with a water receiving hole for connecting to a water pipe, an air pipe, or a three-way sleeve, and a liquid injection port for replenishing the liquid in the cavity. A sealing cover is provided on the liquid injection port.

11. The fluid heat dissipation cooling back sticker according to claim 6, characterized in that: The water source device is a bottle cap structure provided on the machine body that can be screwed together with the water storage bottle; The bottle cap structure is provided with a water receiving hole for connecting with a water pipe, an air pipe or a three-way sleeve.

12. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The fluid device is an ultrasonic microporous atomizer and an atomizer circuit electrically connected to the main control circuit board, and the ultrasonic microporous atomizer is electrically connected to the atomizer circuit; The hard liquid pot and its adjacent connecting frame are provided with corresponding through holes, and the ultrasonic microporous atomizing sheet is arranged through the through holes, with its water permeable surface facing the through holes of the hard liquid pot and its atomizing surface facing the through holes of the connecting frame; or The soft liquid sac and the adjacent connecting frame are provided with corresponding through holes, and the ultrasonic microporous atomizing sheet is provided through the through holes, with its water permeable surface facing the through holes of the soft liquid sac and its atomizing surface facing the through holes of the connecting frame; or The ultrasonic microporous atomizing sheet is arranged at the water receiving hole of the bottle cap structure, and the water permeable surface thereof faces the water storage bottle body matched with the bottle cap structure.

13. The fluid heat dissipation cooling back patch according to claim 10 or 11, characterized in that: The hard liquid pot or soft liquid bladder is provided with a liquid outlet pipe, and the front end of the liquid outlet pipe is provided with a liquid outlet nozzle with an on-off valve; or A liquid outlet pipe connected with the water storage bottle is provided on the bottle cap structure, and a liquid outlet nozzle with a switch valve is provided at the front end of the liquid outlet pipe.

14. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The heat sink is a metal heat sink made of aluminum alloy or copper alloy; or A heat dissipation structure made of graphite or graphene material; or A heat dissipation structure made of CNT nanotube material; or Condenser assembly.

15. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The backing body is a soft cavity structure made of rubber, polyethylene, polyvinyl chloride, polyurethane, or thermoplastic polyurethane rubber material; or A rigid hollow structure made of metal, glass or plastic material; The soft cavity structure or the hard cavity structure is filled with a temperature-conducting liquid.

16. The fluid heat dissipation cooling back sticker according to claim 1, characterized in that: The connecting frame is provided with an audio storage chip and an audio playback component electrically connected to the main control circuit board; or The main control circuit board is provided with a Bluetooth module, a Wifi module and a satellite positioning chip.

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