Probe of detector and detector

Abstract

The utility model discloses a probe of a detector and the detector, relates to the technical field of detectors, and aims to solve the problem that characteristic X-rays irradiate a sensor chip to influence the measurement accuracy of the detector. According to the probe of the detector, a window is formed in a shell, a window material is arranged at the window, and radioactive rays enter through the window material. The shell and the refrigerator are both arranged on the base structure, the shielding layer is arranged on the face, facing the window, of the refrigerator, and the cold side of the refrigerator faces the shielding layer. The first face of the substrate is arranged on the face, facing the window, of the shielding layer, and the amplifier is arranged on the substrate. The sensor chip is used for converting radioactive rays into electric signals, the sensor chip is arranged on the second face of the substrate, the sensor chip is electrically connected with the amplifier, and the shielding layer is used for preventing characteristic X-rays from irradiating the sensor chip. A first surface of the collimator is provided on the sensor chip, and a second surface of the collimator faces the window material. The temperature sensor is arranged on the substrate and electrically connected with the substrate.

Description

Technical Field

[0001] The utility model relates to the technical field of detectors, in particular to a probe head of a detector and a detector. Background Art

[0002] Handheld X-ray fluorescence spectrometers, scanning electron microscopes, transmission electron microscopes, and other equipment are used to detect and evaluate the characteristic X-ray radiation (also known as fluorescent X-rays) generated when a sample is irradiated with an X-ray or electron beam. X-ray detectors are key components in these devices. To meet the cryogenic operating conditions, X-ray detectors must be vacuum packaged, typically using a TO8 package structure.

[0003] In existing technology, detectors typically consist of a sensor chip, a substrate, and a cooler. In actual use, when high-energy X-rays penetrate the sensor chip and substrate and strike the cooler, they generate characteristic X-rays with energies of approximately 2 to 3 keV. These characteristic X-rays then strike the sensor chip, generating noise that affects the X-ray detector's measurement accuracy. Utility Model Content

[0004] The purpose of the utility model is to provide a probe head and a detector for reducing or preventing characteristic X-rays from irradiating a sensor chip, so as to improve the measurement accuracy of the detector.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a probe head for a detector. The probe head comprises: a housing, a base structure, a refrigerator, a shielding layer, a substrate, an amplifier, a sensor chip, a collimator, and a temperature sensor. The housing has a window formed therein, and a window material is disposed at the window. Radiation enters through the window material, and the window material seals the window. The housing is mounted on the base structure, with a housing cavity defined between the housing and the base structure. A refrigerator is disposed within the housing cavity and electrically connected to the base structure. The shielding layer is disposed on a side of the refrigerator facing the window, with the cold side of the refrigerator facing the shielding layer. The substrate has a first surface and a second surface facing each other, with the first surface of the substrate being disposed on a side of the shielding layer facing the window, and the amplifier is disposed on the substrate. The sensor chip is configured to convert radiation into an electrical signal, and the sensor chip is disposed on the second surface of the substrate and electrically connected to the amplifier. The shielding layer is configured to block characteristic X-rays from entering the sensor chip, which are transmitted from the refrigerator to the window material. The collimator has a first surface and a second surface facing each other, with the first surface of the collimator being disposed on the sensor chip, and the second surface of the collimator facing the window material. The temperature sensor is arranged on the substrate, the temperature sensor is electrically connected to the substrate, and the temperature sensor is used to output a temperature signal to the outside.

[0006] Compared with the prior art, in the probe of the detector provided by the present invention, the shielding layer is used to block characteristic X-rays from entering the sensor chip. Therefore, when the detector made using the above-mentioned probe is actually working, the noise can be reduced or avoided to improve the measurement accuracy of the detector and prevent the energy resolution of the detector from deteriorating.

[0007] In one implementation, the shielding layer is any one of a gold foil shielding layer, a tungsten foil shielding layer, a tantalum foil shielding layer, and a lead foil shielding layer.

[0008] In one implementation, the thickness of the shielding layer is greater than or equal to 0.1 mm and less than or equal to 1.5 mm.

[0009] In one implementation, a groove is formed on the substrate, and the amplifier is located in the groove; the sensor chip is electrically connected to the amplifier via a bonding wire.

[0010] In one implementation, the base structure includes:

[0011] A base, the shell is arranged on the base, the accommodating cavity is provided between the shell and the base; the refrigerator is arranged on the base;

[0012] A pin is located in the accommodating cavity; the pin passes through the base along the direction from the window to the refrigerator; the second surface of the substrate is electrically connected to the pin through a binding wire; and the refrigerator is electrically connected to the pin.

[0013] In one implementation, the pin and the base are sealed by a glass insulator; and / or the base is a Kovar base or a copper base.

[0014] In one implementation, the substrate is any one of a paper substrate impregnated with phenolic resin, a paper substrate impregnated with epoxy resin, a glass fiber fabric substrate impregnated with epoxy resin, a Teflon substrate, a ceramic substrate, or a polyester film substrate.

[0015] In one implementation, the ceramic substrate is a copper-clad alumina ceramic substrate, an aluminum nitride ceramic substrate, or a beryllium oxide ceramic substrate.

[0016] In one implementation, the cooler is a thermoelectric cooler.

[0017] In a second aspect, the present invention further provides a detector, which includes the probe of the detector described in the above technical solution.

[0018] Compared with the prior art, the beneficial effects of the detector provided by the present invention are the same as the beneficial effects of the probe of the detector described in the above technical solution, and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 It is a cross-sectional view of the probe of the detector in the embodiment of the present utility model.

[0021] Reference numerals:

[0022] 1-shell, 2-base structure, 20-base, 21-pin, 22-mounting bolt, 3-cooler, 4-shielding layer, 5-substrate, 6-amplifier, 7-sensor chip, 8-collimator, 90-temperature sensor, 91-window material, 92-electrostatic resistor. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more, unless otherwise specifically defined.

[0026] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0027] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0028] In order to solve the above technical problems, in the first aspect, the present invention provides a probe of a detector. Figure 1 The probe of the above-mentioned detector includes: a shell 1, a base structure 2, a refrigerator 3, a shielding layer 4, a substrate 5, an amplifier 6, a sensor chip 7, a collimator 8, and a temperature sensor 90. The shell 1 has a window, and a window material 91 is provided at the window. Radiation enters through the window material 91, and the window material 91 seals the window. The shell 1 is mounted on the base structure 2, and a storage cavity is defined between the shell 1 and the base structure 2. The storage cavity contains: a refrigerator 3 mounted on the base structure 2, and the refrigerator 3 is electrically connected to the base structure 2. The shielding layer 4 is disposed on the side of the refrigerator 3 facing the window, and the cold side of the refrigerator 3 faces the shielding layer 4. The substrate 5 has a first surface and a second surface facing each other. The first surface of the substrate 5 is disposed on the side of the shielding layer 4 facing the window, and the amplifier 6 is disposed on the substrate 5. The sensor chip 7 is used to convert radiation into an electrical signal. The sensor chip 7 is disposed on the second surface of the substrate 5 and is electrically connected to the amplifier 6. The shielding layer 4 is used to block characteristic X-rays from entering the sensor chip 7. The characteristic X-rays are transmitted from the refrigerator to the window material. The collimator 8 has a first surface and a second surface facing each other. The first surface of the collimator 8 is disposed on the sensor chip 7, and the second surface of the collimator 8 faces the window material 91. The temperature sensor 90 is disposed on the substrate 5 and is electrically connected to the substrate 5. The temperature sensor 90 is used to output a temperature signal to the outside world.

[0029] In the detector provided by the embodiments of the present invention, the shielding layer is used to block characteristic X-rays from entering the sensor chip. Therefore, when a detector manufactured using this probe is actually in operation, noise generation can be reduced or avoided, thereby improving the detector's measurement accuracy and preventing degradation of the detector's energy resolution. Specifically, when a detector manufactured using this probe is actually in operation, characteristic X-rays transmitted from the cooler to the window material are absorbed by the shielding layer as they pass through it, preventing the characteristic X-rays from entering the sensor chip.

[0030] As a possible implementation, the shell may be made of an iron-nickel alloy or a nickel-cobalt alloy, and the shell is used to provide durable and reliable protection for the normal operation of other structures.

[0031] As a possible implementation method, in order to ensure airtightness and permeability while not blocking or significantly attenuating radiation, the window material is made of beryllium or a silicon lattice with a polymer film.

[0032] As a possible implementation, the radiation includes X-rays, electron beams, or characteristic X-rays, etc. The energy of the characteristic X-rays transmitted from the refrigerator to the window material is different from the energy of the characteristic X-rays incident through the window material.

[0033] As a possible implementation, see Figure 1 The base structure 2 includes a base 20 and pins 21. The housing 1 is mounted on the base 20, with a receiving cavity defined between the housing 1 and the base 20. The refrigerator 3 is mounted on the base 20, with the pins 21 located within the receiving cavity. The pins 21 extend through the base 20 from the window to the refrigerator 3. The second surface of the substrate 5 is electrically connected to the pins 21 via a binding wire, and the refrigerator is electrically connected to the pins.

[0034] In the embodiment of the present invention, the vacuum sealing process is completed by energy storage welding, and the vacuum degree is 10 -3 ~10 - 7 The above-mentioned accommodation cavity has high airtightness, good mechanical stability and good thermal stability.

[0035] The base is made of a metal with high thermal conductivity. For example, the base is a Kovar base or a copper base. The base provides mechanical support for mounting other structures and has good thermal conductivity. It also provides electrical signals to other structures through pins. Figure 1 , there are protruding mounting bolts 22 at the bottom of the base, which are connected to other devices using the above-mentioned mounting bolts 22. Exemplarily, the mounting bolts 22 can be bonded or welded to the bottom of the base.

[0036] The base has through-holes, and pins are installed on the base along the direction from the window to the cooler. As a possible implementation, the pins and base are sealed with a glass insulator. Furthermore, the pins are gold-plated, and two of them are soldered to leads on the cooler to electrically connect the cooler to the pins. The remaining pins are connected to the baseboard via bonding wires for signal and control connections.

[0037] As a possible implementation, the cooler is a thermoelectric cooler, which includes a plurality of Peltier elements.

[0038] The above-mentioned refrigerator is used to maintain the temperature inside the shell. The so-called refrigerator usually adopts a semiconductor refrigeration structure layer, which has the characteristics of no need for refrigerant, continuous operation, no pollution, simple structure, low noise, long life, high efficiency, low power consumption, and easy control and operation. It can both cool and heat, allowing the detector to work at room temperature, as well as in deep space environment or extreme environment.

[0039] In the embodiment of the present invention, the cooler is a Peltier cooler (TEC) (Thermo Electric Cooler). The Peltier cooler (TEC) is made of a material containing a large amount of high-atomic-number elements. Its hot and cold surface substrates are metallized alumina ceramics, and the cooling element is an alternating arrangement of n-type and p-type bismuth telluride (Bi2Te3) materials.

[0040] See also Figure 1 , a shielding layer 4 is provided between the substrate 5 and the refrigerator 3. When the radiation enters the substrate 5 and the refrigerator 3, the shielding layer 4 blocks the generated characteristic X-rays from irradiating into the sensor chip 7. Therefore, the shielding layer 4 is made of a material that can block characteristic X-rays, and the material used to make the shielding layer 4 also has excellent thermal conductivity. As a possible implementation method, the atomic number of the elements contained in the material of the shielding layer 4 is greater than the atomic number of the elements contained in the material of the refrigerator 3. Exemplarily, the shielding layer is any one of a gold foil shielding layer, a tungsten foil shielding layer, a tantalum foil shielding layer or a lead foil shielding layer. Of course, the shielding layer can also be made of other heavy element materials with excellent thermal conductivity. According to common knowledge, metal materials can shield magnetic fields within a certain intensity range. Based on this characteristic, in the embodiment of the utility model, the shielding layer can protect the incident radiation from the influence of the magnetic field generated by the refrigerator.

[0041] As a possible implementation, the thickness of the shielding layer is greater than or equal to 0.1 mm and less than or equal to 1.5 mm. For example, the thickness of the shielding layer can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, or 1.5 mm.

[0042] In an embodiment of the present invention, the shielding layer is a gold foil shielding layer with a thickness greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

[0043] As a possible implementation, see Figure 1The substrate 5 has a groove, the amplifier 6 is located in the groove, and the sensor chip 7 is electrically connected to the amplifier 6 via bonding wires. Exemplarily, the substrate 5 has a groove or hole, and both the first and second surfaces of the substrate 5 have pads and wiring. The amplifier 6 is embedded in the groove or hole. The pads are used for bonding wires, and the wiring surface is used to mount electronic components such as inductors, capacitors, and temperature sensors 90. Furthermore, the amplifier 6 is away from the shielding layer 4. Furthermore, a sealed chamber is formed between the substrate 5 and the sensor chip 7 to protect the amplifier 6 and the bonding wires located therein.

[0044] Since the shielding layer is used to block characteristic X-rays from entering the sensor chip, compared with the method of increasing the substrate thickness in the existing technology, it can not only improve the blocking effect of characteristic X-rays, but also avoid the situation where the bonding wire between the sensor chip and the amplifier becomes longer due to the increase in substrate thickness, the parasitic capacitance of the bonding wire increases, the noise in the amplifier increases, and the energy resolution of the detector deteriorates, thereby ensuring the energy resolution of the detector and the spectrometer.

[0045] The substrate is made of a material that generates as little characteristic X-rays as possible due to radiation exposure. As one possible implementation, the substrate can be any one of a phenolic resin-impregnated paper substrate, an epoxy resin-impregnated paper substrate, an epoxy resin-impregnated glass fiber fabric substrate, a Teflon substrate, a ceramic substrate, or a polyester film substrate.

[0046] In an optional manner, the ceramic substrate is a copper-clad alumina ceramic substrate, an aluminum nitride ceramic substrate or a beryllium oxide ceramic substrate.

[0047] As a possible implementation, the amplifier may be an amplifier ASIC or an amplifier circuit, and the amplifier is used to amplify the electrical signal generated by the sensor chip.

[0048] In an optional manner, the amplifier may transmit the electrical signal to the outside world via wireless means (eg, Bluetooth, infrared, or Wi-Fi).

[0049] As a possible implementation, the sensor chip can be any known X-ray-sensitive sensor chip or electron beam-sensitive sensor chip, configured to convert X-rays, electron beams, or characteristic X-rays into electrical signals. For example, the sensor chip can be a Si(Li) detector, an HPGe detector (i.e., a high-purity germanium detector), a PIN diode, a detector comprising a compound semiconductor, an SDD (Silicon Drift Detector) with an external transistor, or an SDD with an integrated FET (Field Effect Transistor).

[0050] The collimator is made of a light-blocking material that blocks radiation. For example, the collimator is made of metal or a resin mixed with a metal such as barium, which has an atomic number greater than zinc. The collimator is used to collimate X-rays into the sensitive area of ​​the sensor chip.

[0051] As a possible implementation, see Figure 1 The probe of the above-mentioned detector also includes an electrostatic resistor 92 arranged on the substrate 5.

[0052] In combination with the above description, the following describes the assembly and manufacturing process of the probe of the detector by taking a possible implementation as an example. It should be understood that the following description is only for understanding and is not intended to be a specific limitation.

[0053] See also Figure 1 , first, embed the amplifier 6 into the groove.

[0054] Next, silver paste is applied to the second surface of substrate 5, and sensor chip 7 is attached to the second surface of substrate 5. The curing temperature is 150°C. The readout electrode of sensor chip 7 is connected to amplifier 6 via wire bonding or flip-chip bonding. Furthermore, electronic components such as inductors, capacitors, and temperature sensor 90 are also mounted on the surface of substrate 5.

[0055] Next, a layer of PbSn, InSn, BiSn, or AuSn solder is evenly coated on the center of the base 20, and then the cooler 3 is soldered to the base 20 at a soldering temperature greater than or equal to 110°C and less than or equal to 280°C. Exemplary soldering temperatures include 110°C, 130°C, 150°C, 180°C, 200°C, 210°C, 250°C, 260°C, or 280°C.

[0056] Next, solder is applied on the side of the refrigerator 3 facing the window, and the shielding layer 4 is welded to the refrigerator 3. The welding temperature can be set according to actual conditions.

[0057] Next, epoxy resin thermal conductive adhesive is applied to the surface of the shielding layer 4 facing the window, and the first surface of the substrate 5 is bonded to the shielding layer 4 .

[0058] Next, the sensor chip 7 and the electrode pads on the substrate 5 are wire-bonded to the corresponding pins 21 of the base structure 2 .

[0059] Next, the collimator 8 is mounted and soldered to the surface of the sensor chip 7 .

[0060] Next, the vacuum capping process is completed by energy storage welding, that is, the base 20 and the shell 1 are welded together.

[0061] In a second aspect, an embodiment of the present invention further provides a detector, which includes the probe of the detector described in the above technical solution.

[0062] The beneficial effects of the detector provided by the embodiment of the present invention are the same as the beneficial effects of the probe of the detector described in the above technical solution, and will not be described in detail here.

[0063] As a possible implementation, the detector further includes a readout electronics system, a digital pulse analyzer, etc. The power supply and output signal of the sensor chip, amplifier, and temperature sensor are controlled by an external circuit board through pins.

[0064] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0065] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A probe of a detector, characterized in that: include: A housing, wherein a window is formed on the housing, a window material is provided at the window, and radiation enters through the window material; the window material closes the window; A base structure, wherein the shell is disposed on the base structure; a receiving cavity is provided between the shell and the base structure; and the receiving cavity is provided with: a refrigerator, disposed on the base structure and electrically connected to the base structure; a shielding layer, disposed on a side of the refrigerator facing the window; the cold side of the refrigerator faces the shielding layer; a substrate having a first surface and a second surface opposite to each other, wherein the first surface of the substrate is arranged on a side of the shielding layer facing the window; an amplifier, disposed on the substrate; a sensor chip for converting the radiation into an electrical signal; the sensor chip is disposed on the second surface of the substrate and is electrically connected to the amplifier; the shielding layer is used to block characteristic X-rays from entering the sensor chip; the characteristic X-rays are transmitted from the refrigerator to the window material; A collimator having a first surface and a second surface opposite to each other, wherein the first surface of the collimator is disposed on the sensor chip, and the second surface of the collimator faces the window material; A temperature sensor is provided on the substrate and is electrically connected to the substrate; the temperature sensor is used to output a temperature signal to the outside.

2. The probe of the detector according to claim 1, characterized in that: The shielding layer is any one of a gold foil shielding layer, a tungsten foil shielding layer, a tantalum foil shielding layer or a lead foil shielding layer.

3. The probe of the detector according to claim 1 or 2, characterized in that: The thickness of the shielding layer is greater than or equal to 0.1 mm and less than or equal to 1.5 mm.

4. The probe of the detector according to claim 1, characterized in that: A groove is formed on the substrate, and the amplifier is located in the groove; the sensor chip is electrically connected to the amplifier via a bonding wire.

5. The probe of the detector according to claim 1, characterized in that: The base structure comprises: A base, the shell is arranged on the base, the accommodating cavity is provided between the shell and the base; the refrigerator is arranged on the base; A pin is located in the accommodating cavity; the pin passes through the base along the direction from the window to the refrigerator; the second surface of the substrate is electrically connected to the pin through a binding wire; and the refrigerator is electrically connected to the pin.

6. The probe of the detector according to claim 5, characterized in that: The pin and the base are sealed by a glass insulator; and / or the base is a Kovar alloy base or a copper base.

7. The probe of the detector according to claim 1, characterized in that: The substrate is any one of a paper substrate impregnated with phenolic resin, a paper substrate impregnated with epoxy resin, a glass fiber fabric substrate impregnated with epoxy resin, a Teflon substrate, a ceramic substrate or a polyester film substrate.

8. The probe of the detector according to claim 7, characterized in that: The ceramic substrate is a copper-clad alumina ceramic substrate, an aluminum nitride ceramic substrate or a beryllium oxide ceramic substrate.

9. The probe of the detector according to claim 1, characterized in that: The cooler is a thermoelectric cooler.

10. A detector, characterized in that: The detector comprises the probe of the detector according to any one of claims 1 to 9.

Images