Slot device

Abstract

The utility model relates to a slot device, and the device comprises a slot main body which is used for the insertion of a to-be-tested object; the sensing assembly is arranged in the slot main body and is used for acquiring sensing data of a to-be-detected object inserted into the slot main body, and the sensing assembly is provided with a first surface close to the to-be-detected object; wherein the slot main body is provided with a protection part, the protection part surrounds the sensing assembly and is arranged in the slot main body, the height of the protection part in the first direction is smaller than or equal to the height of the sensing assembly in the first direction, and the first direction is the direction perpendicular to the first surface. The slot device can protect the sensing assembly and is low in cost.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a slot device. Background Art

[0002] After a memory stick is inserted into a motherboard slot, a temperature sensor is needed to monitor its temperature. The closer the temperature sensor is to the memory stick, the more accurate the monitoring data. However, frequent insertion and removal of memory sticks can easily cause friction or collisions with the temperature sensor, causing damage or even failure.

[0003] Related technologies usually use very precise processes to manufacture motherboard slots of appropriate sizes to install temperature sensors to reduce friction and collision between memory sticks and temperature sensors when plugging and unplugging them. However, this method cannot guarantee the reduction of friction and collision problems, and has high process requirements and high costs. Utility Model Content

[0004] In view of the above, it is necessary to provide a slot device that can protect the sensor component at a low cost.

[0005] The present application provides a slot device, comprising: a slot body for inserting an object to be tested; a sensor component, arranged in the slot body, for acquiring sensor data of the object to be tested inserted in the slot body, the sensor component having a first surface close to the object to be tested; wherein the slot body is provided with a protective portion, the protective portion surrounding the sensor component and arranged in the slot body, the height of the protective portion in a first direction being less than or equal to the height of the sensor component in the first direction, and the first direction being a direction perpendicular to the first surface.

[0006] In the present application, by providing a protective portion surrounding the sensor component on the slot body, the sensor component can be protected when the object to be tested is inserted into the slot device, thereby reducing friction and collision between the object to be tested and the sensor component. In addition, since the height of the protective portion in the direction perpendicular to the first surface is less than or equal to the height of the sensor component in the direction perpendicular to the first surface, after the object to be tested is inserted into the slot device, the sensor component can still be close to the object to be tested, thereby protecting the sensor component without affecting the operation of the sensor component. The protective portion of the present application protects the sensor component, and the structural design is simple, which can reduce costs.

[0007] In some embodiments, the guard portion is in an "L" shape, with a long side and a short side disposed around the sensing component.

[0008] In some embodiments, the long side has an inclined surface, and the inclined surface is a side close to the object to be tested inserted into the slot body.

[0009] In some embodiments, the slot device further includes a circuit board, which is disposed in the slot body and is connected to the sensing component circuit.

[0010] In some embodiments, the circuit board includes a receiving portion, which is formed by bending at least a portion of the circuit board. The sensing component includes a sensor, and the receiving portion is used to accommodate the sensor.

[0011] In some embodiments, the slot body has a placement portion in a groove or hollow shape, and the sensor component and the accommodating portion are disposed in the placement portion.

[0012] In some embodiments, the sensor assembly further includes a first clamping member and a second clamping member, the first clamping member being disposed on the circuit board and located on a side of the circuit board close to the slot body, the second clamping member being disposed on the circuit board and located on a side of the circuit board away from the slot body, the first clamping member and the second clamping member cooperating to fix the sensor in the accommodating portion.

[0013] In some embodiments, the width of the protective portion is greater than the width of the first clamping member or the second clamping member and is more than twice the width of the sensor.

[0014] In some embodiments, the slot body includes a slot portion, which is an elongated rectangular body. The slot portion is formed with a slot that matches the shape of the object to be measured.

[0015] In some embodiments, the slot body includes a fixing portion, which is disposed at both ends of the slot portion and is used to cooperate with the slot portion to fix the object to be tested inserted into the slot. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of a scene in which a memory stick is inserted into a motherboard slot in the related art.

[0017] Figure 2 This is a schematic diagram of an application scenario of the slot device according to an embodiment of the present application.

[0018] Figure 3 1 is a schematic diagram of a scenario in which a slot device according to an embodiment of the present application is plugged into an object to be tested.

[0019] Figure 4 It is a three-dimensional diagram of the slot device of an embodiment of the present application.

[0020] Figure 5 This application Figure 4 A schematic diagram of the structural decomposition of the slot device of the embodiment.

[0021] Figure 6 This application Figure 4 A schematic diagram of the cross-sectional structure of the slot device according to an embodiment.

[0022] Figure 7 It is a structural schematic diagram of the circuit board in the slot device of an embodiment of the present application.

[0023] Figure 8It is a structural schematic diagram of the slot body in the slot device of an embodiment of the present application.

[0024] Description of main component symbols:

[0025] 10. Motherboard slot; 20. Memory stick; 101. Temperature sensor; 1. Slot device; 2. Object to be tested; 3. Test device; 11. Slot body; 12. Sensor component; 13. Circuit board; 111. Protective portion; A. First surface; 112. Hook; 113. Placement portion; 121. Sensor; 122a. First clamping member; 122b. Second clamping member; 131. Accommodating portion; 132. Blocking portion; 133. Circuit body.

[0026] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0027] In the description of the embodiments of this application, words such as "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary," "or," and "for example" is intended to present the relevant concepts in a concrete manner.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. It should be understood that, unless otherwise specified in this application, " / " means or. For example, A / B can mean A or B. "And / or" in this application is merely a way to describe the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone. "At least one" means one or more. "Multiple" means two or more than two. For example, at least one of a, b or c can mean: a, b, c, a and b, a and c, b and c, a, b and c.

[0029] It should also be noted that the terms "first" and "second" in the description, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0030] Figure 1 It is a schematic diagram of a scene in which a memory stick 20 is inserted into a motherboard slot 10 in the related art.

[0031] The IC (integrated circuit) of the memory module 20 may be at risk of malfunctioning if it is kept at a low temperature, outside of its operating temperature. Therefore, after the memory module 20 is inserted into the motherboard slot 10 (i.e., the motherboard's slot assembly), a temperature sensor 101 is required to monitor its temperature. The motherboard or entire system will only operate the memory module 20 when the temperature of the memory module 20 is within the operating temperature range. The closer the temperature sensor 101 is to the memory module 20, the more accurate the monitoring data. Ideally, close contact is best. See [Note: The following appears to be unrelated text and should likely be omitted.] Figure 1 As shown, under normal circumstances, the surface of the memory stick 20 is not a flat surface, and the memory stick 20 needs to be frequently plugged in and out during use. The relative positions of the temperature sensor 101 and the memory stick 20 are fixed, which can easily cause friction or collision between the memory stick 20 and the temperature sensor 101, which may cause damage to the temperature sensor 101 or the memory stick 20, or even malfunction.

[0032] In the related art, a very precise process is usually used to manufacture a motherboard slot 10 of appropriate size to install the temperature sensor 101, so as to reduce the friction and collision between the memory stick 20 and the temperature sensor 101 when plugging and unplugging. However, this cannot guarantee that the friction and collision problem will be reduced.

[0033] To this end, embodiments of the present application provide a slot device that can protect the sensor assembly at a low cost. Some embodiments will be described below with reference to the accompanying drawings. The following embodiments and features thereof may be combined with one another unless they conflict.

[0034] Figure 2 This is a schematic diagram of an application scenario of the slot device according to an embodiment of the present application.

[0035] like Figure 2 As shown, a slot device 1 can be installed on a computer motherboard or a test device 3 to receive a memory module 20 or other object required for use on the computer motherboard or test device 3. The slot device 1 can have a slot compatible with a DIMM or SIMM memory module. The memory module or other object required for use on the computer motherboard or test device 3 is collectively referred to as an object under test 2.

[0036] In some embodiments, the device under test 2 may include a DIMM (Dual Inline Memory Module) memory module or a SIMM (Single Inline Memory Module) memory module. The device under test 2 may also include other types of memory modules.

[0037] In some embodiments, as Figure 2As shown, multiple slot devices 1 can be provided to correspond to the number of UUTs 2. For example, if one, two, three, ...n UUTs need to be connected to a computer motherboard or test device 3, the number of slot devices can correspond to one, two, three, ...n, where n is a positive integer. Thus, the power motherboard or test device 3 can utilize multiple slot devices 1 to connect multiple UUTs 2 and perform data reading or performance testing on multiple UUTs 2, thereby improving work efficiency.

[0038] Figure 3 1 is a schematic diagram of a scene in which the slot device 1 according to an embodiment of the present application is plugged into the object to be tested 2 . Figure 4 It is a three-dimensional diagram of the slot device 1 according to an embodiment of the present application. Figure 5 This application Figure 4 A schematic diagram of the structural decomposition of the slot device 1 of the embodiment.

[0039] like Figures 3 to 5 As shown, the socket device 1 of the embodiment of the present application may include a socket body 11 and a sensor component 12. The socket body 11 may be used to insert the object under test 2. The sensor component 12 may be disposed in the socket body 11 and used to obtain sensor data of the object under test 2 inserted in the socket body 11. The sensor component 12 has a first surface A close to the object under test 2.

[0040] In the embodiment of this application, Figure 3 As shown, the slot body 11 can be provided with a protective portion 111. The protective portion 111 is provided on the slot body 11 so as to surround the sensor component 12. In addition, the height of the protective portion 111 in the first direction is less than or equal to the height of the sensor component 12 in the first direction. By providing the protective portion 111 surrounding the sensor component 12 on the slot body 11, the sensor component 12 can be protected when the object under test 2 is inserted into the slot device 1, thereby reducing friction and collision between the object under test 2 and the sensor component 12. In addition, because the height of the protective portion 111 in the direction perpendicular to the first surface A is less than or equal to the height of the sensor component 12 in the direction perpendicular to the first surface A, after the object under test 2 is inserted into the slot device 1, the sensor component 12 can still be close to the object under test 2, thereby protecting the sensor component 12 without affecting its operation.

[0041] In some embodiments, the first direction may be a direction perpendicular to the first surface A.

[0042] In some embodiments, as Figure 4 or Figure 5 As shown, the protection portion 111 is in an “L” shape, with the long side and the short side being arranged around the sensor component 12 .

[0043] In some embodiments, the sensing assembly 12 may include a sensor 121 , which is disposed at the center of the sensing assembly 12 , and the width of the protective portion 111 may be more than twice the width of the sensor 121 .

[0044] In some embodiments, the sensor 121 may be a temperature sensor, and the sensed data may be temperature sensing data. The temperature sensor 121 may be a semiconductor temperature sensor, such as a temperature sensor based on a BJT (Bipolar Junction Transistor).

[0045] In other embodiments, the sensor 121 may be any type of sensor other than a temperature sensor, such as a travel sensor, a current sensor, or a position sensor, etc. The sensor data may be data such as travel, electrical parameters, or position.

[0046] In some embodiments, the sensor assembly 12 may include at least one connector having thermal conductivity and electrical conductivity. The connector may be disposed in the receiving portion 131 with at least a portion located on a side of the receiving portion 131 away from the socket body 11 , and is used to connect the sensor assembly 12 to the circuit board 13 .

[0047] In some embodiments, the connector may be copper, silver, gold, or other metals or alloys with good thermal and electrical conductivity. The connector may be configured as a via hole or pad hole connecting the sensor 121 to the flexible printed circuit board. This allows for circuit connection between the sensor 121 and the flexible printed circuit board.

[0048] Figure 6 This application Figure 4 A schematic diagram of the cross-sectional structure of the slot device 1 according to the embodiment.

[0049] In some embodiments, as Figure 6 As shown, the long side of the protective portion 111 may have an inclined surface, which is the side closest to the object under test 2 inserted into the socket body 11. In other words, the protective portion 111 can be configured as a guide angle to provide a certain degree of guidance when the object under test 2 is inserted into the socket body 11.

[0050] like Figure 5 As shown, the slot device 1 of the embodiment of the present application may further include a circuit board 13, which is disposed in the slot body 11. The circuit board 13 is electrically connected to the sensor component 12. After the sensor component 12 obtains sensor data from the object under test 2, it can be connected to the controller circuit of the test device 3 via the circuit board 13, so that the sensor data can be transmitted to the controller via the circuit board 13 for data processing.

[0051] In some embodiments, the circuit board 13 may be a flexible circuit board, also known as a flexible printed circuit (FPC). A flexible printed circuit board (FPC) is a highly reliable and flexible printed circuit board 13 made from a polyimide or polyester film substrate. In other words, the flexible circuit board in the embodiments of the present application may have a certain degree of elasticity or deformability. In this case, the elasticity or deformability of the flexible circuit board can be utilized to provide a certain degree of cushioning when the object under test 2 is inserted into the slot device 1 and contacts the sensor assembly 12, thereby reducing damage to the sensor assembly 12.

[0052] In some embodiments, circuit board 13 can be formed by embedding circuit components in a flexible, thin plastic sheet. The circuit components in circuit board 13 can connect sensor assembly 12 to the main board or test device 3. This facilitates sensor assembly 12 to transmit sensing data to the main board or test device 3 via circuit board 13.

[0053] Figure 7 1 is a schematic structural diagram of the circuit board 13 in the slot device 1 according to an embodiment of the present application.

[0054] In some embodiments, as Figure 7 As shown, the circuit board 13 may include a receiving portion 131 formed by bending at least a portion of the circuit board 13, and the receiving portion 131 is used to receive the sensor assembly 12. As described above, the sensor assembly 12 may include a sensor 121, and the receiving portion 131 is used to receive the sensor 121.

[0055] In some embodiments, the position of the accommodating portion 131 accommodating the sensor 121 may have a through hole, which can be used to fix the sensor 121 and allow the sensor 121 to pass through. This can facilitate the sensor 121 to be close to the object 2 to obtain more accurate sensing data.

[0056] In some embodiments, as Figure 7 As shown, the circuit board 13 may further include a barrier portion 132 and a circuit main body portion 133. The accommodating portion 131 and the barrier portion 132 may form a housing structure for accommodating the sensor assembly 12. The sensor assembly 12 may be disposed within the accommodating portion 131 and located on a side of the accommodating portion 131 close to the socket body 11. Thus, the accommodating portion 131 and the barrier portion 132 may securely hold the sensor assembly 12 within the housing structure formed by the accommodating portion 131 and the barrier portion 132.

[0057] In some embodiments, the circuit body portion 133 of the circuit board 13 can be configured to fit snugly within the socket body 11. In some embodiments, the circuit body portion 133 of the circuit board 13 can have a positioning groove, and the socket body 11 can have a positioning protrusion that matches the positioning groove of the circuit body portion 133. Thus, the positioning groove and the positioning protrusion can be used to quickly and accurately install the circuit board 13 on the socket body 11, improving installation efficiency.

[0058] In some embodiments, the receiving portion 131 and the blocking portion 132 can be formed by extending and bending the circuit main body 133. Specifically, the receiving portion 131 and the blocking portion 132 can be formed by bending a portion of the circuit main body 133 through the hollow area of ​​the slot body 11 in the same direction as the insertion direction of the object under test 2.

[0059] In the embodiment of the present application, the accommodating portion 131 is used to set the sensor component 12, and is close to the object to be measured 2 after the object to be measured 2 is plugged in; the blocking portion 132 is used to offset the friction and impact of the object to be measured 2 during the plugging process of the object to be measured 2, and can be correspondingly expanded and contracted to change the position of the sensor component 12 set on the accommodating portion 131, thereby further effectively protecting the sensor component 12.

[0060] As described above, the receiving portion 131 may be provided with a barrier portion 132 in the same direction as the insertion direction of the object 2 to be tested. In some embodiments, the barrier portion 132 may have a preset tilt angle, such as 45°, 60°, or 75°. The preset tilt angle may be in the range of 0° to 90°.

[0061] The circuit board 13 in the embodiment of the present application may be made of an insulating film, a conductor, and an adhesive. The insulating film serves as a protective covering to isolate the circuit from dust and moisture and reduce stress during flexing. The conductor forms the conductive layer. The adhesive bonds the insulating film to the conductive layer. The insulating film may be made of polyimide or polyester. The conductor may comprise copper foil deposited in the insulating film by electrodeposition (ED) or plating.

[0062] In some embodiments, the circuit board 13 may not include adhesive. It will be appreciated that a laminated circuit without adhesive in the circuit board 13 can form a thinner circuit with greater flexibility. Compared to adhesive-based laminated circuits, this embodiment exhibits improved thermal conductivity. In this case, the thin structure of the adhesive-free flexible circuit and the elimination of the adhesive's thermal resistance improve thermal conductivity. This allows the deformation and high thermal conductivity of the circuit board 13 to be utilized to protect the sensor assembly 12, while also improving the accuracy of the sensor data acquired by the sensor assembly 12.

[0063] In some embodiments, as Figure 6 As shown, the sensor component 12 may further include a first clamping member 122a and a second clamping member 122b. The first clamping member 122a is arranged on the circuit board 13 and is located on a side of the circuit board 13 close to the slot body 11. The second clamping member 122b is arranged on the circuit board 13 and is located on a side of the circuit board 13 away from the slot body 11. The first clamping member 122a and the second clamping member 122b cooperate to fix the sensor 121 to the accommodating portion 131.

[0064] In some embodiments, the width of the protection portion 111 is greater than the width of the first clamping member 122 a or the second clamping member 122 b and is more than twice the width of the sensor 121 .

[0065] In some embodiments, the first clamping member 122a and the second clamping member 122b may be objects with a certain degree of elasticity, such as non-conductive springs, sponges, silicone pads, or other elastic objects.

[0066] Figure 8 It is a structural diagram of the slot body 11 in the slot device 1 according to an embodiment of the present application.

[0067] In some embodiments, as Figure 8 As shown, the socket body 11 may have a recessed or hollowed-out placement portion 113, and at least a portion of the flexible printed circuit board may be disposed within the placement portion 113. Specifically, the sensor assembly 12 and the receiving portion 131 of the printed circuit board 13 may be disposed within the placement portion 113, while the receiving portion 131 and the barrier portion 132 may be portions disposed within the placement portion 113. In this case, placing the flexible printed circuit board within the recessed or hollowed-out placement portion 113 can reduce the overall weight and space requirements of the socket device 1, thereby lowering costs and conserving space, allowing for the deployment of more socket devices 1 on a single computer motherboard or test device 3.

[0068] In some embodiments, the socket body 11 may be in the shape of an elongated plate, with one long side of the socket body 11 extending along the surface of the elongated plate and then extending parallel to the surface of the elongated plate to form a hook portion 112. In this embodiment, the hook portion 112 may serve as a socket for inserting the object to be tested 2.

[0069] In some embodiments, the area of ​​a portion of the long board surface of the slot body 11 is larger than the area of ​​the remaining portion. The larger portion can be used to set the sensor component 12 and the flexible circuit board, and the smaller portion can facilitate optimizing space utilization and reducing the weight of the slot body 11.

[0070] In other embodiments, the slot device 1 may further include a slot portion, a fixing portion, and a circuit connection portion. The slot portion may be used to form a slot. The slot portion is an elongated rectangular body, and the rectangular body may be formed with a groove that matches the shape of the object to be tested 2, that is, a slot. In this embodiment, the hook portion 112 of the slot body 11 may be used to install and fix the slot portion. In other words, in this case, the hook portion 112 may not be used as a slot for inserting the object to be tested 2. The slot for inserting the object to be tested 2 is formed by the rectangular slot portion.

[0071] In some embodiments, a fixing portion can be disposed within the slot portion and used to cooperate with the slot portion to secure the object under test 2 inserted into the slot. The fixing portion can be disposed at both ends of the slot portion. The fixing portion can be a snap-fit ​​mechanism disposed at both ends of the slot portion. The coordination between the slot body 11, the slot portion, and the fixing portion can secure the object under test 2 inserted into the slot, thereby enhancing the stability of the object under test 2 inserted into the slot device 1.

[0072] In some embodiments, the circuit connection portion can be disposed within a slot in the slot portion and can be used to establish an electrical connection between the mainboard and the object under test 2. The circuit connection portion can be disposed within the slot in the slot portion and, when the object under test 2 is inserted into the slot, contact the conductive contact pad (commonly known as a "gold finger") of the object under test 2. Thus, the mainboard and the object under test 2 can be electrically connected via the circuit connection portion.

[0073] In some embodiments, the socket body 11 , the socket portion, and the fixing portion may be made of non-metallic materials, and the circuit connection portion may be made of conductive metal materials.

[0074] In the present application, by providing a protective portion 111 surrounding the sensor component 12 on the slot body 11, the sensor component 12 can be protected when the object to be tested 2 is inserted into the slot device 1, thereby reducing friction and collision between the object to be tested 2 and the sensor component 12. In addition, since the height of the protective portion 111 in the direction perpendicular to the first surface A is less than or equal to the height of the sensor component 12 in the direction perpendicular to the first surface A, after the object to be tested 2 is inserted into the slot device 1, the sensor component 12 can still be close to the object to be tested 2, thereby protecting the sensor component 12 without affecting the operation of the sensor component 12. The protective portion 111 of the present application protects the sensor component 12, and the structural design is simple, which can reduce costs.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A slot device, characterized in that: include: The slot body is used to insert the object to be tested; a sensor component, disposed in the slot body, for acquiring sensor data of the object to be measured plugged into the slot body, the sensor component having a first surface close to the object to be measured; The slot body is provided with a protective portion, which is arranged on the slot body around the sensor component. The height of the protective portion in the first direction is less than or equal to the height of the sensor component in the first direction, and the first direction is a direction perpendicular to the first surface.

2. The slot device according to claim 1, wherein: The protective portion is in an "L" shape, and the long side and the short side are arranged around the sensor component.

3. The slot device according to claim 2, wherein: The long side has an inclined surface, and the inclined surface is a side close to the object to be tested inserted into the slot body.

4. The slot device according to claim 1, wherein: The slot device further includes a circuit board, which is arranged in the slot body and is connected to the sensor component circuit.

5. The slot device according to claim 4, wherein: The circuit board includes a receiving portion, which is formed by bending at least a portion of the circuit board. The sensing component includes a sensor, and the receiving portion is used to accommodate the sensor.

6. The slot device according to claim 5, wherein: The slot body has a placement portion in a groove or hollow shape, and the sensor component and the accommodating portion are arranged on the placement portion.

7. The slot device according to claim 5, wherein: The sensor assembly also includes a first clamping member and a second clamping member. The first clamping member is arranged on the circuit board and is located on a side of the circuit board close to the slot body. The second clamping member is arranged on the circuit board and is located on a side of the circuit board away from the slot body. The first clamping member and the second clamping member cooperate to fix the sensor to the accommodating portion.

8. The slot device according to claim 7, wherein: The width of the protection portion is greater than the width of the first clamping member or the second clamping member and is more than twice the width of the sensor.

9. The slot device according to claim 1, wherein: The slot body includes a slot portion, which is in the form of an elongated rectangular body. The slot portion is formed with a slot that matches the shape of the object to be measured.

10. The slot device according to claim 9, wherein: The slot body includes a fixing portion, which is provided at both ends of the slot portion and is used to cooperate with the slot portion to fix the object to be tested inserted into the slot.

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