Automatic laser etching equipment for thin film circuit board

Abstract

The utility model discloses a laser etching automation device for a film circuit board, comprising a main body assembly which comprises a sorting device, a conveyor belt, a circuit board main body and a lifting moving device; the anti-damage assembly comprises a suction adjusting device, a first suction cup, a second suction cup and a third suction cup, the bottom of the suction adjusting device is sequentially and movably connected with the first suction cup, the second suction cup and the third suction cup from inside to outside, and the distribution density of the first suction cup, the second suction cup and the third suction cup is gradually reduced; the anti-damage assembly further comprises first suction holes and second suction holes, sixteen first suction holes are formed in the suction face of the first suction cup, and eight second suction holes are formed in the suction face of the second suction cup. According to the utility model, the suction force can be gradually reduced from inside to outside, so that the device is suitable for the easily deformed edge part of the film circuit board, and the film circuit board is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of laser engraving for thin film circuit boards, in particular to automated laser engraving equipment for thin film circuit boards. Background Art

[0002] Thin-film circuit boards require laser engraving during the processing process, and are usually processed using laser engraving automated equipment.

[0003] In existing laser engraving automation equipment, suction cups are usually provided in the sorting structure, and the suction cups are usually arranged at equal intervals, so that the suction force on all parts of the film circuit board is consistent. However, the edge of the film circuit board is easily deformed, and excessive suction may cause damage. Therefore, it is necessary to provide a structure that can be adjusted according to the suction force on each part of the film circuit board to solve the above problem. Utility Model Content

[0004] The purpose of the present utility model is to provide an automated laser engraving device for thin-film circuit boards to solve the problem raised in the above-mentioned background technology that suction cups are usually provided in the sorting structure of the existing automated laser engraving equipment, and the suction cups are usually arranged at equal intervals, so that the suction force on all parts of the thin-film circuit board is consistent, while the edge part of the thin-film circuit board is easily deformed and excessive suction may cause damage.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The utility model is an automated laser engraving device for thin film circuit boards, comprising:

[0007] The main body assembly includes a sorting device, a conveyor belt, a circuit board body, and a lifting and moving device. The conveyor belt is provided in the middle of the sorting device, the circuit board body is placed on the top of the conveyor belt, and the side of the sorting device is fixedly connected to the lifting and moving device;

[0008] The anti-damage component includes a suction adjustment device, a first suction cup, a second suction cup and a third suction cup. The bottom of the suction adjustment device is movably connected to the first suction cup, the second suction cup and the third suction cup from the inside to the outside.

[0009] Furthermore, the distribution density of the first suction cup, the second suction cup and the third suction cup gradually decreases.

[0010] Furthermore, the anti-damage component also includes first suction holes and second suction holes. The first suction cup adsorption surface is provided with sixteen first suction holes, and the second suction cup adsorption surface is provided with eight second suction holes.

[0011] Furthermore, the main body component also includes a first supporting frame, a laser dotting device, a second supporting frame and a camera. The first supporting frame is provided on the side of the conveyor belt, and the bottom of the first supporting frame is fixedly connected to the laser dotting device. The second supporting frame is provided on the side of the conveyor belt, and the bottom of the second supporting frame is fixedly connected to the camera.

[0012] Furthermore, it also includes a convenient disassembly and assembly component, which includes a rectangular frame and a rectangular block. The top of the suction adjustment device is fixedly connected to the rectangular frame, and the bottoms of the first suction cup, the second suction cup and the third suction cup are fixedly inserted into the rectangular block. The rectangular frame is movably connected to the rectangular block.

[0013] Furthermore, the convenient disassembly and assembly component also includes a spring, a buckle and a through hole. The side of the rectangular block is fixedly connected to one end of the spring, and the other end of the spring is fixedly connected to the buckle. Through holes are opened on both sides of the rectangular frame, and the buckle is movably connected to the through holes.

[0014] Compared with the prior art, the advantages of the present invention are:

[0015] In the present utility model, the bottom of the suction adjustment device is movably connected to the first suction cup, the second suction cup and the third suction cup in sequence from the inside to the outside, and the distribution density of the first suction cup, the second suction cup and the third suction cup is gradually reduced. At the same time, sixteen first suction holes are opened on the adsorption surface of the first suction cup, and eight second suction holes are opened on the adsorption surface of the second suction cup. The arrangement of the above components can realize the gradual reduction of suction from the inside to the outside, so that it can be applied to the edge part of the thin film circuit board that is easily deformed, thereby avoiding damage to the thin film circuit board.

[0016] Based on the above beneficial effects, by pressing the buckle, with the cooperation of the spring, the rectangular block together with the single first suction cup, the second suction cup and the third suction cup can be disassembled, and at the same time, with the cooperation of the buckle and the spring, the single first suction cup, the second suction cup and the third suction cup can be installed, thereby facilitating the individual and convenient replacement of the first suction cup, the second suction cup and the third suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is the overall front view of the utility model;

[0019] Figure 2 This is a plastic rear view of the present utility model;

[0020] Figure 3 This is a schematic diagram of the third suction cup connection of the present utility model;

[0021] Figure 4 For the utility model Figure 3 Enlarged view of point A in the middle;

[0022] Figure 5 This is a schematic diagram of the rectangular frame connection of the present utility model;

[0023] Figure 6 This is a schematic diagram of the buckle connection of the utility model.

[0024] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0025] 101. Sorting device; 102. Conveyor belt; 103. Circuit board body; 104. Lifting and moving device; 105. First receiving frame; 106. Laser dotting equipment; 107. Second receiving frame; 108. Camera;

[0026] 201, suction force adjustment device; 202, first suction cup; 203, second suction cup; 204, third suction cup; 205, first suction hole; 206, second suction hole;

[0027] 301, rectangular frame; 302, rectangular block; 303, spring; 304, buckle; 305, through hole. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0031] See also Figure 1-6 As shown, this embodiment is an automated laser engraving device for thin film circuit boards, comprising:

[0032] The main assembly includes a sorting device 101, a conveyor belt 102, a circuit board body 103, and a lifting and moving device 104. The conveyor belt 102 is provided in the middle of the sorting device 101, and the circuit board body 103 is placed on the top of the conveyor belt 102. The side of the sorting device 101 is fixedly connected to the lifting and moving device 104;

[0033] The anti-damage component includes a suction adjustment device 201, a first suction cup 202, a second suction cup 203, and a third suction cup 204. The bottom of the suction adjustment device 201 is movably connected to the first suction cup 202, the second suction cup 203, and the third suction cup 204 in sequence from the inside to the outside;

[0034] The conveyor belt 102 is used to transport the circuit board body 103, the lifting and moving device 104 is used to drive the suction adjustment device 201 to move up and down, and the suction adjustment device 201 is used to make the first suction cup 202, the second suction cup 203 and the third suction cup 204 have suction.

[0035] The distribution density of the first suction cup 202, the second suction cup 203 and the third suction cup 204 gradually decreases;

[0036] The position distribution of the above components ensures the change of suction in different areas.

[0037] The anti-damage component further includes a first suction hole 205 and a second suction hole 206. The first suction cup 202 has sixteen first suction holes 205 on its suction surface, and the second suction cup 203 has eight second suction holes 206 on its suction surface.

[0038] The number of the first suction holes 205 and the second suction holes 206 is set to further ensure the change of suction force between the first suction cup 202 and the second suction cup 203.

[0039] The main assembly also includes a first support frame 105, a laser dotting device 106, a second support frame 107, and a camera 108. The first support frame 105 is provided on the side of the conveyor belt 102, and the bottom of the first support frame 105 is fixedly connected to the laser dotting device 106. The second support frame 107 is provided on the side of the conveyor belt 102, and the bottom of the second support frame 107 is fixedly connected to the camera 108.

[0040] The first receiving frame 105 and the second receiving frame 107 play a supporting role, and the laser marking device 106 and the camera 108 play a marking and irradiation role respectively.

[0041] The convenient disassembly and assembly component includes a rectangular frame 301 and a rectangular block 302. The top of the suction adjustment device 201 is fixedly connected to the rectangular frame 301. The bottoms of the first suction cup 202, the second suction cup 203 and the third suction cup 204 are fixedly inserted into the rectangular block 302. The rectangular frame 301 is movably connected to the rectangular block 302.

[0042] The rectangular frame 301 and the rectangular block 302 cooperate with each other to provide a guarantee for the initial disassembly and installation of the first suction cup 202 , the second suction cup 203 and the third suction cup 204 .

[0043] The convenient disassembly and assembly component also includes a spring 303, a buckle 304 and a through hole 305. The side of the rectangular block 302 is fixedly connected to one end of the spring 303, and the other end of the spring 303 is fixedly connected to the buckle 304. Through holes 305 are formed on both sides of the rectangular frame 301, and the buckle 304 is movably connected to the through holes 305.

[0044] The above components are used in conjunction with each other to achieve convenient disassembly and replacement of the first suction cup 202 , the second suction cup 203 and the third suction cup 204 .

[0045] Working principle: Place the circuit board body 103 on the top of the conveyor belt 102. When the conveyor belt 102 drives the circuit board body 103 to move to the bottom of the laser dotting device 106, the dotting process is carried out. Then the camera 108 detects the circuit board body 103. When the circuit board body 103 moves to the bottom of the suction adjustment device 201 on the sorting device 101, it is set according to the detection result. When an unqualified circuit board body 103 is detected, the lifting and moving device 104 drives the suction adjustment device 201, the first suction cup 202, the second suction cup 203 and the third suction cup 204 to move downward to suck up the unqualified circuit board body 103. And remove it. When the first suction cup 202, the second suction cup 203 and the third suction cup 204 are damaged, press the buckle 304. At this time, the spring 303 is compressed. When the buckle 304 moves to the inside of the through hole 305, remove the damaged first suction cup 202, the second suction cup 203 or the third suction cup 204. Then repeat the above process in reverse to replace the new first suction cup 202, the second suction cup 203 or the third suction cup 204. This step can be applied to the edge part of the thin film circuit board that is easily deformed, thereby avoiding damage to the thin film circuit board, and at the same time facilitating the individual and convenient replacement of the first suction cup, the second suction cup and the third suction cup.

[0046] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0047] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A laser engraving automation equipment for thin film circuit boards, characterized in that: include: A main body component, the main body component comprising a sorting device (101), a conveyor belt (102), a circuit board main body (103) and a lifting and moving device (104); a conveyor belt (102) is provided in the middle of the sorting device (101); the circuit board main body (103) is placed on the top of the conveyor belt (102); and the side of the sorting device (101) is fixedly connected to the lifting and moving device (104); An anti-damage component comprises a suction adjustment device (201), a first suction cup (202), a second suction cup (203) and a third suction cup (204); the bottom of the suction adjustment device (201) is movably connected to the first suction cup (202), the second suction cup (203) and the third suction cup (204) in sequence from the inside to the outside.

2. The laser engraving automation equipment for thin film circuit boards according to claim 1, characterized in that: The distribution density of the first suction cup (202), the second suction cup (203) and the third suction cup (204) gradually decreases.

3. The laser engraving automation equipment for thin film circuit boards according to claim 1, characterized in that: The anti-damage component further comprises a first suction hole (205) and a second suction hole (206); the first suction cup (202) has sixteen first suction holes (205) on its suction surface, and the second suction cup (203) has eight second suction holes (206) on its suction surface.

4. The laser engraving automation equipment for thin film circuit boards according to claim 1, characterized in that: The main body component also includes a first receiving frame (105), a laser dotting device (106), a second receiving frame (107) and a camera (108); the first receiving frame (105) is provided on the side of the conveyor belt (102); the bottom of the first receiving frame (105) is fixedly connected to the laser dotting device (106); the second receiving frame (107) is provided on the side of the conveyor belt (102); the bottom of the second receiving frame (107) is fixedly connected to the camera (108).

5. The laser engraving automation equipment for thin film circuit boards according to claim 1, characterized in that: The invention also includes a convenient disassembly and assembly component, which includes a rectangular frame (301) and a rectangular block (302). The top of the suction adjustment device (201) is fixedly connected to the rectangular frame (301), and the bottoms of the first suction cup (202), the second suction cup (203) and the third suction cup (204) are fixedly inserted into the rectangular block (302). The rectangular frame (301) is movably connected to the rectangular block (302).

6. The laser engraving automation equipment for thin film circuit boards according to claim 5, characterized in that: The convenient disassembly and assembly component further comprises a spring (303), a buckle (304) and a through hole (305); the side of the rectangular block (302) is fixedly connected to one end of the spring (303); the other end of the spring (303) is fixedly connected to the buckle (304); through holes (305) are provided on both sides of the rectangular frame (301); and the buckle (304) is movably connected to the through hole (305).

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