Automatic laser etching equipment for thin film circuit board

By adopting the suction adjustment device and suction hole design in the laser engraving automation equipment, the problem of edge deformation of the film circuit board is solved, the convenient replacement and damage protection of the suction cup are realized, and the adaptability and reliability of the equipment are improved.

CN223402647UActive Publication Date: 2025-09-30PRETECH (XIAMEN) ELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202422832383.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-20
Publication Date
2025-09-30
Estimated Expiration
2034-11-20

AI Technical Summary

Technical Problem

The suction cups in existing laser engraving automation equipment are arranged at equal distances, which makes the edge of the film circuit board easily deformed and damaged, and the suction force is uneven.

Method used

The first suction cup, the second suction cup and the third suction cup connected by the suction adjustment device have a gradually decreasing density. Combined with the suction hole design, the suction force gradually decreases from the inside to the outside, adapting to the deformation of the edge of the film circuit board and preventing damage.

Benefits of technology

It effectively avoids deformation and damage to the edge of the thin film circuit board, facilitates the separate replacement and installation of the suction cup, and improves the adaptability and reliability of the equipment.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The utility model discloses a laser etching automation device for a film circuit board, comprising a main body assembly which comprises a sorting device, a conveyor belt, a circuit board main body and a lifting moving device; the anti-damage assembly comprises a suction adjusting device, a first suction cup, a second suction cup and a third suction cup, the bottom of the suction adjusting device is sequentially and movably connected with the first suction cup, the second suction cup and the third suction cup from inside to outside, and the distribution density of the first suction cup, the second suction cup and the third suction cup is gradually reduced; the anti-damage assembly further comprises first suction holes and second suction holes, sixteen first suction holes are formed in the suction face of the first suction cup, and eight second suction holes are formed in the suction face of the second suction cup. According to the utility model, the suction force can be gradually reduced from inside to outside, so that the device is suitable for the easily deformed edge part of the film circuit board, and the film circuit board is prevented from being damaged.
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