Paster electronic component pin shaping test automation equipment

Abstract

The utility model relates to automatic equipment for shaping and testing pins of surface-mounted electronic components. The automatic equipment comprises a rack; the feeding assembly is used for feeding the electronic elements; the station carrying assembly is used for carrying the electronic elements to all stations; the carrier tape type packaging machine is used for packaging the shaped electronic elements into a carrier tape; the discharging mechanical arm is used for carrying the electronic elements on the station carrying assembly into the carrier tape type packaging machine. The shaping assembly is used for shaping the pins of the electronic component; the electrical test assembly is used for carrying out electrical test on the electronic component; and the test carrying mechanism is used for carrying the electronic elements between the station carrying assembly and the electrical test assembly. According to the invention, the electronic component automatically flows in each station under the carrying of the station carrying assembly, the pin shape of the electronic component is trimmed through the shaping assembly, and the test mechanism automatically detects the shaped electronic component; shaping and detection are automatic in the whole process, detection work efficiency is improved, and stability and reliability are achieved.

Description

Technical Field

[0001] The invention relates to electronic component testing equipment, in particular to automated equipment for testing the pin shaping of patch electronic components. Background Art

[0002] With the increasing popularity of integrated circuits, surface-mount electronic components are widely used. These components are typically soldered to PCB pads using a placement machine. Some surface-mount electronic components with pins are prone to deformation during the production process, resulting in loose solder joints. To prevent this, the pins of surface-mount electronic components often need to be reshaped, and electrical testing is required after production. Currently, these reshaping and testing procedures are performed manually. Summary of the Invention

[0003] In view of the deficiencies in the prior art, the present invention aims to provide an automated device for testing the pin shaping of patch electronic components.

[0004] The technical solution adopted by the present invention to solve the technical problem is: an automated device for testing the pin shaping of patch electronic components, comprising:

[0005] a rack; a loading assembly, which is arranged on the rack and is used to load electronic components; a station carrying assembly, which is arranged on the rack and is used to carry electronic components to each station; a carrier-type packaging machine, which is arranged on the rack and is used to pack the shaped electronic components into a carrier tape; a unloading robot, which is arranged on the rack and is used to carry the electronic components on the station carrying assembly into the carrier-type packaging machine; a shaping assembly, which is arranged on the rack and is used to shape the pins of the electronic components; an electrical testing assembly, which is arranged on the rack and is used to test the electronic components Conduct electrical testing; a central fixed frame, which is fixedly connected to the frame and located above the station assembly; a test transport mechanism, which is provided on the central fixed frame and is used to transport electronic components between the station carrying assembly and the electrical test assembly; the loading assembly, shaping assembly, electrical test assembly and unloading manipulator are arranged along the carrying direction of the station carrying assembly; the station carrying assembly includes a horizontally rotating station turntable, product positioning blocks distributed in a ring array around the rotation axis of the station turntable, and a turntable drive mechanism for driving the station turntable to intermittently rotate;

[0006] The shaping assembly includes a component pressing mechanism arranged on the central fixed frame, an upper shaping claw assembly arranged on the frame, and a lower shaping claw assembly, the upper shaping claw assembly includes an upper straight-lift linear module arranged on the frame, an upper shaping claw arranged on the upper straight-lift linear module, the bottom of the upper shaping claw is provided with a shaping surface for pressing and shaping the pins of the electronic component, the lower shaping claw assembly includes a lower straight-lift linear module arranged on the frame, a lower shaping claw arranged on the lower straight-lift linear module, the top of the lower shaping claw is provided with a shaping surface for pressing and shaping the pins of the electronic component, the upper shaping claw is located above the product positioning block, the lower shaping claw is located below the product positioning block, and a shaping avoidance hole is provided on the work station turntable just below the pins of the electronic component to avoid the lower shaping claw, and the upper shaping claw assembly and the lower shaping claw assembly are distributed along the rotation direction of the work station turntable;

[0007] The electrical testing assembly includes a detection frame arranged on the frame, a detection seat arranged on the detection frame, a detection positioning plate arranged on the top of the detection seat, a push plate arranged to slide horizontally below the detection positioning plate, an adapter plate arranged in the detection seat, a detection spring arranged on the adapter plate, and a detection pusher for pushing the push plate, the push plate is provided with a pusher claw for driving the detection spring to fit the pins of the electronic component, the top of the detection positioning plate is provided with a detection positioning pit for positioning the electronic component, the detection spring extends into the detection positioning pit, and the pusher claw is used to move the detection spring.

[0008] As a further improvement of this design, the upper straight-lifting linear module is connected to the upper shaping claw through a shaping adjustment mechanism, and the lower straight-lifting linear module is connected to the lower shaping claw through a shaping adjustment mechanism. The upper shaping claw and the lower shaping claw are both U-shaped. The shaping adjustment mechanism includes a horizontal cylinder arranged on the upper straight-lifting linear module and the lower straight-lifting linear module, and a horizontal rotating cylinder arranged on the horizontal cylinder. The opening width of the upper shaping claw and the lower shaping claw is greater than the maximum width on both sides of the electronic component, and the rotation axis of the horizontal rotating cylinder is vertical.

[0009] As a further improvement of the present design, the element pressing mechanism includes a pressing lifting cylinder arranged on the central fixing frame, a pressing lifting seat arranged on the pressing lifting cylinder, and a pressing block arranged on the pressing lifting seat.

[0010] As a further improvement of this design, the loading assembly includes a tray loading mechanism, a loading robot group arranged on the frame, the loading robot group includes a horizontally moving loading linear module, a loading cylinder arranged on the loading linear module, and a loading vacuum suction nozzle slidably connected to the loading cylinder.

[0011] As a further improvement of this design, the unloading robot includes a unloading linear module, a unloading lifting module arranged on the unloading linear module, a unloading rotary motor arranged on the unloading lifting module, and a unloading vacuum suction nozzle arranged on the unloading rotary motor, and the rotation axis of the unloading vacuum suction nozzle is vertical.

[0012] As a further improvement of the present design, the carrier-type packaging machine includes a packaging rack, a carrier supply tray arranged on the packaging rack, a carrier receiving tray, a film supply assembly, and a sealing assembly, wherein the sealing assembly is arranged between the carrier supply tray and the carrier receiving tray, the film supply assembly includes a film supply rack, a film supply tray arranged on the film supply rack, and a guide roller arranged on the film supply rack; the sealing assembly includes a carrier guide rail, a heat sealing cylinder arranged on the film supply rack, a heat sealing heating block arranged on the heat sealing cylinder, and a carrier traction assembly arranged on the carrier guide rail at the rear side of the heat sealing heating block, the carrier traction assembly includes a carrier traction wheel and a carrier traction motor that drives the carrier traction wheel to rotate, the carrier traction wheel is provided with a traction protrusion that cooperates with the carrier edge positioning hole; the tail end of the carrier guide rail is provided with a cutter for cutting the carrier; one of the guide rollers is located above the carrier guide rail on the front side of the heat sealing heating block.

[0013] As a further improvement of this design, the carrier guide rail is provided with a pressing slide that slides up and down, and a pressing rubber roller is arranged on the pressing slide. The pressing slide is provided with a pressing elastic part that applies a downward elastic force to the pressing slide, and the pressing rubber roller is pressed into engagement with the carrier traction wheel.

[0014] As a further improvement of this design, the frame is also provided with an appearance detection component, which includes a detection positioning seat arranged on the frame, a side detection camera component and a top detection camera component arranged on the frame, the side detection camera component includes a side fill light and a reflector located on the side of the detection positioning seat, and a side detection camera body arranged on the frame, the side fill light is provided with a detection hole to avoid the reflector, and the top detection camera assembly includes a top detection frame and a top detection camera body arranged on the top detection frame.

[0015] As a further improvement of the present design, it also includes a laser marking machine and a marking detection camera arranged on the central fixed frame, and a smoking exhaust pipe is provided on the frame.

[0016] As a further improvement of the present design, it also includes a defective product linear module arranged on the frame and a defective product material tray arranged on the defective product linear module.

[0017] As a further improvement of this design, the test transport mechanism includes a transport rack arranged on the frame, a transport lifting linear module arranged on the transport rack, a transport motor arranged on the transport lifting linear module, a transport beam arranged on the transport motor, and a transport vacuum suction nozzle arranged at both ends of the transport beam.

[0018] The beneficial effects of the present invention are as follows: the present invention automatically circulates electronic components in each workstation under the transportation of the workstation carrier assembly, trims the pin shape of the electronic components through the shaping assembly, and the testing mechanism automatically detects the shaped electronic components; the shaping and testing are fully automated, thereby improving the efficiency of the testing work and being stable and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and examples.

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention from a side perspective.

[0021] Figure 2 It is a schematic diagram of the rear perspective three-dimensional structure of the present invention.

[0022] Figure 3 It is a schematic diagram of the three-dimensional structure of the combination of the workstation carrying component and the laser marking machine of the present invention.

[0023] Figure 4 It is a schematic diagram of the combined structure of the upper shaping claw assembly and the element pressing mechanism of the present invention.

[0024] Figure 5 It is a schematic diagram of the combined structure of the lower shaping claw assembly and the element pressing mechanism of the present invention.

[0025] Figure 6 It is a schematic diagram of the three-dimensional structure of the feeding robot of the present invention.

[0026] Figure 7 It is a schematic diagram of the three-dimensional structure of the blanking robot of the present invention.

[0027] Figure 8 It is a schematic diagram of the combined structure of the appearance detection component and the test handling mechanism of the present invention.

[0028] Figure 9 It is a schematic diagram of the combined structure of the electrical test assembly and the test handling mechanism of the present invention.

[0029] Figure 10 It is a schematic diagram of the cross-sectional structure of the electrical testing component of the present invention.

[0030] Figure 11 It is a schematic diagram of the overall structure of the carrier-type packaging machine of the present invention.

[0031] Figure 12 It is a schematic diagram of the partial cross-sectional structure of the carrier-type packaging machine of the present invention.

[0032] In the figure, 1. frame, 2. shaping assembly, 20. lower shaping claw assembly, 200. lower shaping lifting linear module, 201. lower shaping claw, 21. upper shaping claw assembly, 210. upper shaping lifting linear module, 211. upper shaping claw, 22. component clamping mechanism, 220. clamping lifting cylinder, 221. clamping lifting seat, 222. clamping block, 23. shaping adjustment mechanism, 230. horizontal cylinder, 231. horizontal rotating cylinder, 3. test transport mechanism, 30. transport lifting linear module, 31. transport frame, 32. transport vacuum nozzle, 33. transport Transport motor, 34. Transport beam, 4. Loading assembly, 40. Tray loading mechanism, 41. Loading manipulator assembly, 410. Loading linear module, 411. Loading cylinder, 412. Loading vacuum nozzle, 5. Unloading manipulator, 50. Unloading linear module, 51. Unloading lifting module, 52. Unloading rotary motor, 53. Unloading vacuum nozzle, 6. Workstation transport assembly, 60. Turntable drive mechanism, 61. Product positioning block, 62. Shaping avoidance hole, 63. Workstation turntable, 64. Center fixing frame, 7. Electrical test assembly, 70. Inspection frame, 71. Adapter plate, 72. Detection seat, 73. Push plate, 74. Detection positioning plate, 75. Detection pusher, 76. Pusher claw, 77. Detection positioning pit, 78. Detection spring, 8. Shape detection assembly, 80. Detection positioning seat, 81. Side detection camera assembly, 810. Reflector, 811. Side detection camera body, 812. Detection hole, 813. Side fill light, 82. Top detection camera assembly, 820. Top detection frame, 821. Top detection camera body, 9. Carrier packaging machine, 90. Packaging frame, 91. Film supply assembly, 910. Guide roller, 91 1. Film supply rack, 912. Film supply tray, 92. Carrier tape supply tray, 93. Carrier tape collection tray, 94. Sealing assembly, 940. Heat sealing cylinder, 941. Heat sealing heating block, 942. Carrier tape guide rail, 943. Carrier tape traction assembly, 9430. Traction boss, 9431. Carrier tape traction wheel, 9432. Carrier tape traction motor, 95. Cutter, 96. Pressing slide, 97. Pressing rubber roller, 98. Pressing elastic member, 10. Laser marking machine, 11. Smoke exhaust duct, 12. Marking detection camera, 13. Defective product linear module, 14. Defective product tray. DETAILED DESCRIPTION

[0033] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. The exemplary embodiments and descriptions are only used to explain the present invention but are not intended to limit the present invention. Example

[0034] See Figure 1 and Figure 3This embodiment provides an automated device for testing the pin shaping of patch electronic components, including:

[0035] Frame 1; a loading assembly 4, which is arranged on the frame 1 and is used to load electronic components;

[0036] A workstation transport assembly 6, which is provided on the rack 1 and is used to transport electronic components to each workstation;

[0037] A carrier tape packaging machine 9 is provided on the frame 1 and is used to pack the shaped electronic components into a carrier tape; a blanking robot 5 is provided on the frame 1 and is used to carry the electronic components on the station carrying assembly 6 to the carrier tape packaging machine 9;

[0038] A shaping component 2, which is provided on the frame 1 and is used to shape the pins of electronic components;

[0039] An electrical testing assembly 7, which is provided on the rack 1 and is used to perform electrical testing on electronic components;

[0040] A central fixed frame 64, which is fixedly connected to the frame 1 and located above the station assembly;

[0041] A test transport mechanism 3 , which is provided on the central fixed frame 64 and is used to transport electronic components between the station carrier assembly 6 and the electrical test assembly 7 ;

[0042] The loading assembly 4, shaping assembly 2, electrical testing assembly 7 and unloading manipulator 5 are arranged along the carrying direction of the workstation carrying assembly 6;

[0043] The workstation transport assembly 6 includes a horizontally rotating workstation turntable 63, product positioning blocks 61 distributed in a circular array around the rotation axis of the workstation turntable 63, and a turntable driving mechanism 60 for driving the workstation turntable 63 to rotate intermittently;

[0044] Please attend Figure 4 and Figure 5The shaping assembly 2 includes a component pressing mechanism 22 arranged on the central fixed frame 64, an upper shaping claw assembly 21 and a lower shaping claw assembly 20 arranged on the frame 1, the upper shaping claw assembly 21 includes an upper shaping lifting linear module 210 arranged on the frame 1, an upper shaping claw 211 arranged on the upper shaping lifting linear module 210, and a shaping surface (not shown in the figure) is provided at the bottom of the upper shaping claw 211 for pressing and shaping the pins of the electronic components. The lower shaping claw assembly 20 includes a lower shaping lifting linear module 200 arranged on the frame 1, a lower shaping claw 211 arranged on the lower shaping lifting linear module 200. The shaping claw 201 has a shaping surface (not shown in the figure) on the top of the lower shaping claw 201 for pressing and shaping the pins of the electronic component. The upper shaping claw 211 is located above the product positioning block 61, and the lower shaping claw 201 is located below the product positioning block 61. A shaping avoidance hole 62 for avoiding the lower shaping claw 201 is provided on the work station turntable 63 just below the pins of the electronic component. The upper shaping claw assembly 21 and the lower shaping claw assembly 20 are distributed along the rotation direction of the work station turntable 63. The upper shaping claw 211 and the lower shaping claw 201 can be used to shape the pins in the upper and lower directions at one time without crushing the pins.

[0045] See Figure 9 and Figure 10 The electrical test assembly 7 includes a detection frame 70 disposed on the frame 1, a detection seat 72 disposed on the detection frame 70, a detection positioning plate 74 disposed on the top of the detection seat 72, a push plate 73 disposed below the detection positioning plate 74 and sliding horizontally, an adapter plate 71 disposed in the detection seat 72, a detection spring 78 disposed on the adapter plate 71, and a detection pusher 75 for pushing the push plate 73. The push plate 73 is provided with a pusher claw 76 for driving the detection spring 78 to engage with the pins of the electronic component. The top of the detection positioning plate 74 is provided with a detection positioning pit 77 for positioning the electronic component. The detection spring 78 extends into the detection positioning pit 77, and the pusher claw 76 is used to move the detection spring 78. The pusher claw 76 on the push plate 73 is used to control the contact and separation of the detection spring 78 with the pins of the electronic component, facilitating the insertion and removal of the electronic component and ensuring close contact between the detection spring 78 and the pins during testing.

[0046] The electronic components are automatically transferred between the workstations by the workstation carrier assembly 6, the pin shapes of the electronic components are trimmed by the shaping assembly 2, and the testing mechanism automatically detects the shaped electronic components; the shaping and testing are fully automated, which improves the efficiency of the testing work and is stable and reliable.

[0047] See Figure 4 and Figure 5The upper straightening and lifting linear module 210 is connected to the upper shaping claw 211 via a shaping adjustment mechanism 23, while the lower straightening and lifting linear module 200 is connected to the lower shaping claw 201 via a shaping adjustment mechanism 23. Both the upper shaping claw 211 and the lower shaping claw 201 are U-shaped. The shaping adjustment mechanism 23 includes a horizontal cylinder 230 disposed on the upper straightening and lifting linear module 210 and the lower straightening and lifting linear module 200, and a horizontal rotary cylinder 231 disposed on the horizontal cylinder 230. The opening width of the upper shaping claw 211 and the lower shaping claw 201 is greater than the maximum width of the electronic component on either side, and the rotation axis of the horizontal rotary cylinder 231 is vertical. Utilizing the adjustment mechanism and the upper shaping claw 211 and the lower shaping claw 201, whose opening width is greater than the width of the pin, facilitates single-sided shaping of pins, accommodating electronic components with pins of different width specifications.

[0048] See Figure 4 The component pressing mechanism 22 includes a pressing and lifting cylinder 220 mounted on the central fixing frame 64, a pressing and lifting seat 221 mounted on the pressing and lifting cylinder 220, and a pressing block 222 mounted on the pressing and lifting seat 221. To prevent damage to electronic components, the pressing block 222 can be made of a plastic material with a lower hardness than the electronic components, such as Teflon or Peek. The pressing block 222 facilitates pressing the electronic components during pin shaping, improving stability during pin shaping.

[0049] See Figure 6 The loading assembly 4 includes a tray loading mechanism 40 and a loading robot assembly 41 mounted on the frame 1. The loading robot assembly 41 includes a horizontally movable loading linear module 410, a loading cylinder 411 mounted on the loading linear module 410, and a loading vacuum nozzle 412 slidably connected to the loading cylinder 411. The tray loading mechanism 40 and the loading robot assembly 41 facilitate tray loading and are convenient. The tray loading mechanism 40 adopts a commonly used clip-type tray loading mechanism 40 on the market.

[0050] See Figure 7 The unloading robot 5 includes a linear unloading module 50, an unloading lift module 51 mounted on the linear unloading module 50, a rotary unloading motor 52 mounted on the lift module 51, and a vacuum unloading nozzle 53 mounted on the rotary unloading motor 52. The vacuum unloading nozzle 53 rotates vertically. The rotary unloading motor 52 and linear unloading module 50 facilitate compensating for uneven heights and orientations of electronic components on the product positioning block 61.

[0051] See Figure 11 and Figure 12The carrier-type packaging machine 9 includes a packaging frame 90, a carrier supply tray 92 arranged on the packaging frame 90, a carrier receiving tray 93, a film supply assembly 91, and a sealing assembly 94. The sealing assembly 94 is arranged between the carrier supply tray 92 and the carrier receiving tray 93. The film supply assembly 91 includes a film supply frame 911, a film supply tray 912 arranged on the film supply frame 911, and a guide roller 910 arranged on the film supply frame 911; the sealing assembly 94 includes a carrier guide rail 942, a heat sealing cylinder 940 arranged on the film supply frame 911, and a heat sealing cylinder 940 arranged on the heat sealing cylinder The heat sealing heating block 941 on 940, and the carrier traction assembly 943 arranged on the carrier guide rail 942 on the rear side of the heat sealing heating block 941, the carrier traction assembly 943 includes a carrier traction wheel 9431, and a carrier traction motor 9432 that drives the carrier traction wheel 9431 to rotate, and the carrier traction wheel 9431 is provided with a traction protrusion 9430 that cooperates with the carrier edge positioning hole; the tail end of the carrier guide rail 942 is provided with a cutter 9595 for cutting the carrier; one of the guide rollers 910 is located above the carrier guide rail 942 on the front side of the heat sealing heating block 941.

[0052] See Figure 12 The carrier guide rail 942 is provided with a pressing slide 9696 that slides up and down, and a pressing rubber roller 9797 arranged on the pressing slide 9696. The pressing slide 9696 is provided with a pressing elastic member 9898 that applies a downward elastic force to the pressing slide 9696. The pressing rubber roller 9797 is pressed into engagement with the carrier traction wheel 9431.

[0053] See Figure 8 The frame 1 is also provided with a shape detection assembly 8, which includes a detection positioning seat 80 disposed on the frame 1, a side detection camera assembly 81 and a top detection camera assembly 82 disposed on the frame 1. The side detection camera assembly 81 includes a side fill light 813 and a reflector 810 located on the side of the detection positioning seat 80, and a side detection camera body 811 disposed on the frame 1. The side fill light 813 has a detection hole 812 that avoids the reflector 810. The top detection camera assembly 82 includes a top detection frame 820 and a top detection camera body 821 disposed on the top detection frame 820. The shape detection assembly 8 facilitates automatic inspection of reshaped electronic components. The reflector and the fill light help reduce the width of the side detection camera group, thereby reducing the width of the shape detection assembly 8, making it easier to place the shape detection assembly 8.

[0054] See Figure 3, and also includes a laser marking machine 1010 and a marking detection camera 1212 arranged on the central fixed frame 64, which are convenient for marking electronic components that have passed the inspection and facilitate subsequent direct packaging; in order to prevent smoke pollution during marking, a smoke exhaust pipe 1111 is provided on the frame 1.

[0055] See Figure 2 It also includes a defective product linear module 1313 set on the frame 1 and a defective product material tray 1414 set on the defective product linear module 1313, which is convenient for collecting defective products without affecting the unloading and packaging of qualified products.

[0056] See Figure 9 The test handling mechanism 3 includes a handling frame 31 mounted on the frame 1, a handling and lifting linear module 30 mounted on the handling frame 31, a handling motor 33 mounted on the handling and lifting linear module 30, a handling beam 34 mounted on the handling motor 33, and handling vacuum nozzles 32 mounted at both ends of the handling beam 34. The vacuum nozzles 32 at both ends of the handling beam 34 facilitate loading and unloading of electrical test components 7, thereby improving efficiency.

[0057] During operation, the loading robot group 41 takes out the electronic components on the tray loading mechanism 40 and places them in the product positioning block 61. The station carrying assembly 6 first carries the electronic components to the working position of the upper shaping claw 211. The upper shaping claw 211 descends to press down the upturned pins on one side of the electronic components. The upper shaping claw 211 then rises and rotates 180 degrees and then descends to press down the upturned pins on the other side of the electronic components. The station carrying assembly 6 continues to rotate and carries the electronic components to the working position of the lower shaping claw 201. The lower shaping claw 201 descends to press up the downturned pins on one side of the electronic components. 01 then descends, rotates 180 degrees, and then ascends again to press upward on the downward-curving pins on the other side of the electronic component; the station carrier assembly 6 continues to rotate and carries the electronic components sequentially to the working position of the electrical test assembly 7. The test transport mechanism 3 transports the electronic components in the product positioning block 61 to the detection positioning pit 77 of the detection positioning plate 74. The pusher claw 76 of the push plate 73 brings the detection spring 78 into contact with the pins of the electronic component. The testing instrument performs electrical testing on the electronic component. The electrical testing is to electrically connect the electrical measuring instrument to the detection spring 78. The test transport mechanism 3 transports the electronic component to the electronic positioning block. After the electronic component has been tested by multiple electrical test assemblies 7 in sequence, the station carrier assembly 6 carries the tested electronic component to the working position of the appearance inspection assembly 8. The test transport mechanism 3 transports the electronic component in the product positioning block 61 to the detection positioning seat 80. The side detection camera assembly 81 and the top detection camera assembly 82 take photos of the electronic component for inspection. The workstation transport assembly 6 then carries the electronic components to the marking position, where the laser marker 1010 marks the qualified components. The unloading robot 5 then carries the marked components to the carrier tape packaging machine 9. The unloading robot 5 then carries the unmarked components to the defective product tray 1414. The carrier tape packaging machine 9 operates, with the film supply assembly applying film to the carrier tape, and the heat-sealing heating block 941 of the sealing assembly 94 thermally bonding the film to the carrier tape. The carrier tape receiving tray 93 rewinds the filled carrier tape onto the tray.

[0058] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention's description and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An automated device for testing the pin shaping of patch electronic components, characterized in that: include: frame; A loading assembly, which is arranged on the frame and is used to load electronic components; A workstation transport assembly, which is provided on the rack and is used to transport electronic components to each workstation; A carrier tape packaging machine, which is arranged on the frame and is used to pack the shaped electronic components into a carrier tape; a blanking robot, which is arranged on the frame and is used to carry the electronic components on the station carrying assembly into the carrier tape packaging machine; A shaping assembly, which is arranged on the frame and is used to shape the pins of the electronic components; An electrical testing assembly, which is arranged on the rack and is used to perform electrical testing on electronic components; a central fixed frame, which is fixedly connected to the frame and located above the workstation assembly; A test transport mechanism, which is provided on the central fixed frame and is used to transport electronic components between the station carrying assembly and the electrical test assembly; The loading assembly, shaping assembly, electrical testing assembly and unloading manipulator are all arranged and distributed along the carrying direction of the workstation carrying assembly; The workstation transport assembly includes a horizontally rotating workstation turntable, product positioning blocks distributed in a circular array around the rotation axis of the workstation turntable, and a turntable drive mechanism for driving the workstation turntable to rotate intermittently; The shaping assembly includes a component pressing mechanism arranged on the central fixed frame, an upper shaping claw assembly arranged on the frame, and a lower shaping claw assembly, the upper shaping claw assembly includes an upper straight-lift linear module arranged on the frame, an upper shaping claw arranged on the upper straight-lift linear module, the bottom of the upper shaping claw is provided with a shaping surface for pressing and shaping the pins of the electronic component, the lower shaping claw assembly includes a lower straight-lift linear module arranged on the frame, a lower shaping claw arranged on the lower straight-lift linear module, the top of the lower shaping claw is provided with a shaping surface for pressing and shaping the pins of the electronic component, the upper shaping claw is located above the product positioning block, the lower shaping claw is located below the product positioning block, and a shaping avoidance hole is provided on the work station turntable just below the pins of the electronic component to avoid the lower shaping claw, and the upper shaping claw assembly and the lower shaping claw assembly are distributed along the rotation direction of the work station turntable; The electrical testing assembly includes a detection frame arranged on the frame, a detection seat arranged on the detection frame, a detection positioning plate arranged on the top of the detection seat, a push plate arranged to slide horizontally below the detection positioning plate, an adapter plate arranged in the detection seat, a detection spring arranged on the adapter plate, and a detection pusher for pushing the push plate, the push plate is provided with a pusher claw for driving the detection spring to fit the pins of the electronic component, the top of the detection positioning plate is provided with a detection positioning pit for positioning the electronic component, the detection spring extends into the detection positioning pit, and the pusher claw is used to move the detection spring.

2. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: The upper straight-lifting linear module is connected to the upper shaping claw through a shaping adjustment mechanism, and the lower straight-lifting linear module is connected to the lower shaping claw through a shaping adjustment mechanism. The upper shaping claw and the lower shaping claw are both U-shaped. The shaping adjustment mechanism includes a horizontal cylinder arranged on the upper straight-lifting linear module and the lower straight-lifting linear module, and a horizontal rotating cylinder arranged on the horizontal cylinder. The opening width of the upper shaping claw and the lower shaping claw is greater than the maximum width on both sides of the electronic component, and the rotation axis of the horizontal rotating cylinder is vertical.

3. The chip electronic component pin shaping test automation equipment according to claim 2, characterized in that: The component pressing mechanism includes a pressing lifting cylinder arranged on the central fixing frame, a pressing lifting seat arranged on the pressing lifting cylinder, and a pressing block arranged on the pressing lifting seat.

4. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: The loading assembly includes a tray loading mechanism, a loading robot group arranged on the frame, and the loading robot group includes a horizontally moving loading linear module, a loading cylinder arranged on the loading linear module, and a loading vacuum suction nozzle slidably connected to the loading cylinder.

5. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: The blanking robot includes a blanking linear module, a blanking lifting module arranged on the blanking linear module, a blanking rotary motor arranged on the blanking lifting module, and a blanking vacuum suction nozzle arranged on the blanking rotary motor, and the rotation axis of the blanking vacuum suction nozzle is vertical.

6. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: The carrier packaging machine includes a packaging frame, a carrier supply tray arranged on the packaging frame, a carrier receiving tray, a film supply assembly, and a sealing assembly, wherein the sealing assembly is arranged between the carrier supply tray and the carrier receiving tray, the film supply assembly includes a film supply frame, a film supply tray arranged on the film supply frame, and a guide roller arranged on the film supply frame; the sealing assembly includes a carrier guide rail, a heat sealing cylinder arranged on the film supply frame, a heat sealing heating block arranged on the heat sealing cylinder, and a carrier traction assembly arranged on the carrier guide rail at the rear side of the heat sealing heating block, the carrier traction assembly includes a carrier traction wheel and a carrier traction motor that drives the carrier traction wheel to rotate, and the carrier traction wheel is provided with a traction protrusion that cooperates with the carrier edge positioning hole; the tail end of the carrier guide rail is provided with a cutter for cutting the carrier; one of the guide rollers is located above the carrier guide rail on the front side of the heat sealing heating block.

7. The chip electronic component pin shaping test automation equipment according to claim 6, characterized in that: The carrier guide rail is provided with a pressing slide that slides up and down, and a pressing rubber roller arranged on the pressing slide. The pressing slide is provided with a pressing elastic member that applies a downward elastic force to the pressing slide, and the pressing rubber roller is pressed into engagement with the carrier traction wheel.

8. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: The frame is also provided with an appearance detection component, which includes a detection positioning seat arranged on the frame, a side detection camera component and a top detection camera component arranged on the frame. The side detection camera component includes a side fill light and a reflector located on the side of the detection positioning seat, and a side detection camera body arranged on the frame. The side fill light is provided with a detection hole to avoid the reflector. The top detection camera assembly includes a top detection frame and a top detection camera body arranged on the top detection frame.

9. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: It also includes a laser marking machine and a marking detection camera which are arranged on the central fixing frame, and a smoking exhaust pipe is arranged on the frame.

10. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: It also includes a defective product linear module arranged on the frame and a defective product material tray arranged on the defective product linear module.

11. The chip electronic component pin shaping test automation equipment according to claim 1, characterized in that: The test transport mechanism includes a transport frame arranged on the frame, a transport lifting linear module arranged on the transport frame, a transport motor arranged on the transport lifting linear module, a transport beam arranged on the transport motor, and transport vacuum suction nozzles arranged at both ends of the transport beam.

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