Glue injection sealing forming assembly and glue injection mold

Abstract

The utility model belongs to the technical field of glue injection molds, and particularly relates to a glue injection sealing forming assembly and a glue injection mold. The sealing device comprises a base and a flexible sealing ring, and a mounting ring is arranged on the edge of the top of the base; the flexible sealing ring is arranged on the mounting ring in a wrapping mode, a circle of first sealing protrusion used for making contact with a workpiece is formed on the top of the flexible sealing ring, and a circle of second sealing protrusion is formed on the periphery of the flexible sealing ring. The utility model is used for solving the problem of low yield caused by easy deformation and glue leakage of the sealing ring. The first sealing protrusion formed at the top of the sealing ring is in contact with the chip, the whole sealing ring is the flexible sealing ring, the first sealing protrusion can be pressed to deform, the first sealing protrusion can achieve a better sealing effect, and meanwhile, the second sealing protrusion is located on the periphery and can also achieve a sealing effect with an external mold.

Description

Technical Field

[0001] The utility model belongs to the technical field of glue injection molds, and particularly relates to a glue injection sealing molding component and a glue injection mold. Background Art

[0002] When packaging a chip, it is usually necessary to cover the periphery of the chip with a coating material by means of glue injection or other methods to protect the chip and ensure the electrical performance of the chip. When injecting glue, a glue injection mold is usually used. In order to achieve glue injection and coating of specific positions of the chip, a sealing ring sandwiched between both sides of the chip is required in the mold. The sealing ring is a component that plays a key sealing role and assists the glue in coating the periphery of the chip.

[0003] At present, the sealing ring is usually made of PTFE material and is clamped on the chip surface by the PTFE sealing ring. PTFE material has the advantages of high temperature resistance, corrosion resistance, low friction coefficient and easy demolding.

[0004] However, the mechanical properties of PTFE sealing rings are relatively low, and they will deform after long-term high-temperature use. The deformed sealing rings need to be replaced. In addition, since PTFE sealing rings have a certain hardness, the part that contacts the chip surface needs to have a certain contact area. In this way, if the sealing ring produces some deformation during the injection of glue, it will affect the final molding of the chip injection, resulting in a decrease in the overall yield rate. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a glue injection sealing molding component and a glue injection mold for solving the problem that the sealing ring is easy to deform and leak glue, resulting in low yield.

[0006] On the one hand, the technical solution of the present invention to solve the above technical problems is as follows: a glue injection sealing molding component, comprising:

[0007] A base, wherein a mounting ring is provided on the top edge of the base;

[0008] A flexible sealing ring is provided on the mounting ring, wherein a first sealing protrusion for contacting the workpiece is formed on the top of the flexible sealing ring, and a second sealing protrusion is formed on the outer periphery of the flexible sealing ring.

[0009] Compared with the existing technology, the above technical solution has the following beneficial effects:

[0010] By setting a flexible sealing ring on the base, the first sealing protrusion formed on the top of the sealing ring is used to contact the chip. Since the overall sealing ring is a flexible sealing ring, the first sealing protrusion can be deformed under pressure, so that the first sealing protrusion can have a better sealing effect. At the same time, the second sealing protrusion is located on the periphery and can also play a sealing role with the external mold.

[0011] Based on the above technical solution, the embodiment of the present application can also be improved as follows:

[0012] In one embodiment, the cross-sections of the first sealing protrusion and the second sealing protrusion are wedge-shaped.

[0013] In one embodiment, the bottom of the mounting ring is provided with grooves on both the inner and outer sides, and the inner and outer edges of the flexible sealing ring are provided with sealing collars matching the grooves.

[0014] In one embodiment, a plurality of air holes are formed on the base and located on the inner side of the mounting ring.

[0015] In one embodiment, the outer diameter of the outermost circle of the second sealing protrusion is larger than the outer diameter of the base.

[0016] In one embodiment, the flexible sealing ring is a fluoroplastic sealing ring.

[0017] In one embodiment, the flexible sealing ring is a PFA sealing ring.

[0018] On the other hand, the utility model also discloses a glue injection mold, which includes:

[0019] The above-mentioned glue injection sealing molding component;

[0020] A fixed mold, the top of which is provided with a receiving cavity;

[0021] The movable mold is arranged opposite to the fixed mold, and two opposite glue injection sealing molding components are respectively arranged at the bottom of the movable mold and in the accommodating cavity.

[0022] Furthermore, the inner diameter of the accommodating cavity is larger than the outer diameter of the base, and smaller than the outer diameter of the outermost circle of the second sealing protrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1This is a schematic diagram of the overall structure of Example 1 of the present utility model.

[0025] Figure 2 This is a schematic diagram of the overall structure of Example 2 of the present utility model.

[0026] Reference numerals:

[0027] 1. Base; 2. Mounting ring; 3. Flexible sealing ring; 4. First sealing protrusion; 5. Second sealing protrusion; 6. Slot; 7. Sealing collar; 8. Air hole;

[0028] 9. Fixed mold; 10. Moving mold; 11. Accommodating cavity; 12. Chip; 13. Glue injection space; 14. Mounting hole. DETAILED DESCRIPTION

[0029] The following embodiments of the technical solution of the present invention are described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0030] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this utility model belongs.

[0031] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In addition, the terms "first," "second," etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. In the description of this utility model, "plurality" means more than two, unless otherwise specifically defined.

[0033] In this application, unless otherwise expressly specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0034] Example 1

[0035] like Figure 1 As shown, the utility model provides a glue injection sealing molding component, which includes: a base 1 and a flexible sealing ring 3. The base 1 is a circular base 1, which is used to carry a circular chip 12. The top edge of the base 1 is provided with a mounting ring 2, and the flexible sealing ring 3 is covered on the mounting ring 2, covering the inner side surface, fixed surface and outer side surface of the mounting ring 2. A circle of first sealing protrusions 4 for contacting the workpiece is formed on the top of the flexible sealing ring 3, and a circle of second sealing protrusions is formed on the outer periphery of the flexible sealing ring 3. The first sealing protrusion 4 and the second sealing protrusion are integrally formed with the flexible sealing ring 3, and can be specifically formed on the mounting ring 2 of the base 1 by injection molding.

[0036] By arranging a flexible sealing ring 3 on the base 1, the first sealing protrusion 4 formed on the top of the sealing ring is used to contact the chip 12. Since the overall sealing ring is a flexible sealing ring 3, the first sealing protrusion 4 can be deformed under pressure, so that the first sealing protrusion 4 can have a better sealing effect. At the same time, the flexible sealing ring 3 can apply greater pressure to achieve a better sealing effect without damaging the chip 12. The second sealing protrusion is located on the periphery and can also play a sealing role with the external mold.

[0037] In this embodiment, the first sealing protrusion 4 is located at the top, and the second sealing protrusion 5 is located at the periphery, and an annular glue injection space 13 is formed between the first sealing protrusion 4 and the second sealing protrusion 5 .

[0038] In order to improve the sealing effect, the cross-sections of the first sealing protrusion 4 and the second sealing protrusion are wedge-shaped. When the top of the wedge-shaped sealing protrusion contacts the external chip 12 or the mold, the surface contact can be changed to line-surface contact. The wedge-shaped sealing protrusion with line-surface contact can better play a sealing role after pressure is applied.

[0039] In order to ensure that the sealing ring is firmly connected to the base 1, a card groove 6 is provided on the inner and outer sides of the bottom of the mounting ring 2, and a sealing clamp ring 7 matching the card groove 6 is provided on the inner and outer edges of the flexible sealing ring 3. After the sealing clamp ring 7 is inserted into the card groove 6 to the inside, the sealing ring can be tightly wrapped on the mounting ring 2 to prevent the sealing ring from moving axially and falling off.

[0040] Furthermore, a small slot 6 is provided at the bottom of the slot 6. Similarly, a sealing ring matching the small slot 6 is formed at the bottom of the sealing ring 7. The matching of the sealing ring and the small slot 6 can prevent the sealing ring from moving and falling off in the radial direction, thereby further improving the stability and firmness of the sealing ring wrapping.

[0041] The base 1 is provided with a plurality of air holes 8 on the inner side of the mounting ring 2, and the air holes 8 pass through the top surface of the base 1. When the chip 12 is placed on the glue injection sealing molding assembly, the surface of the chip 12 contacts the first sealing protrusion 4, and the chip 12 completely covers the first sealing protrusion 4 on the top. The air holes 8 on the base 1 can be connected to an external air source. Before glue injection, air is pumped out to form a negative pressure between the chip 12 workpiece and the base 1, so that the chip 12 is adsorbed on the first sealing protrusion 4. After the glue injection is completed, air is injected through the air holes 8 to eject the chip 12.

[0042] The base 1 is provided with a mounting hole 14 on the inner side of the mounting ring 2 , and can be screwed onto other molds by passing fasteners such as bolts through the mounting hole 14 .

[0043] The outer diameter of the outermost ring of the second sealing protrusion is larger than the outer diameter of the base 1, so that the mold for fixing the injection-sealed molding component on the outside can first contact the outermost second sealing protrusion to play a sealing role.

[0044] In this embodiment, the flexible sealing ring 3 is a fluoroplastic sealing ring. Specifically, the flexible sealing ring 3 is a PFA sealing ring. The sealing ring made of PFA has good high temperature resistance, corrosion resistance, anti-adhesion and mechanical properties.

[0045] Example 2

[0046] like Figure 2 As shown, the present invention further discloses a glue injection mold, which includes: the glue injection sealing molding component of embodiment 1, a fixed mold 9 and a movable mold 10.

[0047] An accommodating cavity 11 is provided at the top of the fixed mold 9; the movable mold 10 is arranged opposite to the fixed mold 9 and is located above the fixed mold 9. Two opposite glue injection and sealing molding components are respectively provided at the bottom of the movable mold 10 and in the accommodating cavity 11. Specifically, the two glue injection and sealing molding components are fixed to the movable mold 10 and the fixed mold 9 through mounting holes 14 provided on the base 1. After the movable mold 10 is lowered, the two glue injection and sealing molding components are attached together, with a chip 12 sandwiched in the middle. Then, glue is injected into the glue injection space 13 formed by the two glue injection and sealing molding components through the glue injection holes on the movable mold 10.

[0048] Specifically, the inner diameter of the accommodating cavity 11 is larger than the outer diameter of the base 1 and smaller than the outer diameter of the outermost circle of the second sealing protrusion. The outer diameter of the base 1 is smaller than the inner diameter of the accommodating cavity 11, so that the base 1 and the accommodating cavity 11 in the fixed mold 9 are gap-fitted, which is convenient for taking the base 1. The outer diameter of the second sealing protrusion is larger than the inner diameter of the accommodating cavity 11, so that a seal is formed between the second sealing protrusion and the accommodating cavity 11 to avoid glue leakage in the glue injection space 13.

[0049] The glue injection space 13 can be formed by two oppositely arranged sealing rings and the inner wall of the accommodating cavity 11 of the fixed mold 9. The glue injection space 13 formed by the first sealing protrusion 4 and the second sealing protrusion on the sealing ring and the inner wall of the fixed mold 9 corresponds to the outer peripheral position of the chip 12. The first sealing protrusion 4 contacts the surface of the chip 12 to prevent glue leakage at the position of the chip 12. The second sealing protrusion contacts the inner wall of the fixed mold 9 to prevent glue leakage in the gap with the inner wall of the fixed mold 9.

[0050] Specifically, air passages are provided on the fixed mold 9 and the movable mold 10 at positions corresponding to the air holes 8 in the base 1. After being connected to an external air source, negative pressure is drawn to adsorb the chip 12 on the first sealing protrusion 4 before glue injection. After glue injection, air is injected to eject the chip 12.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A glue injection sealing molding component, characterized in that: include: A base, wherein a mounting ring is provided on the top edge of the base; A flexible sealing ring is provided on the mounting ring, wherein a first sealing protrusion for contacting the workpiece is formed on the top of the flexible sealing ring, and a second sealing protrusion is formed on the outer periphery of the flexible sealing ring.

2. The glue injection sealing molding assembly according to claim 1, characterized in that: The cross-sections of the first sealing protrusion and the second sealing protrusion are wedge-shaped.

3. The glue injection sealing molding assembly according to claim 1, characterized in that: The inner and outer sides of the bottom of the mounting ring are both provided with clamping grooves, and the inner and outer edges of the flexible sealing ring are provided with sealing clamping rings matching the clamping grooves.

4. The glue injection sealing molding assembly according to claim 1, characterized in that: A plurality of air holes are formed on the base and located on the inner side of the mounting ring.

5. The glue injection sealing molding assembly according to claim 2, characterized in that: The outer diameter of the outermost circle of the second sealing protrusion is larger than the outer diameter of the base.

6. The glue injection sealing molding assembly according to claim 1, characterized in that: The flexible sealing ring is a fluoroplastic sealing ring.

7. The glue injection sealing molding assembly according to claim 6, characterized in that: The flexible sealing ring is a PFA sealing ring.

8. A glue injection mold, characterized in that: include: The glue injection sealing molding assembly according to any one of claims 1 to 7; A fixed mold, the top of which is provided with a receiving cavity; The movable mold is arranged opposite to the fixed mold, and two opposite glue injection sealing molding components are respectively arranged at the bottom of the movable mold and in the accommodating cavity.

9. The injection mold according to claim 8, characterized in that: The inner diameter of the accommodating cavity is larger than the outer diameter of the base, and smaller than the outer diameter of the outermost circle of the second sealing protrusion.

Images