Metal surface treatment electroplating device

Abstract

The utility model discloses a metal surface treatment electroplating device which comprises a base and a tray assembly, an electroplating pool is fixedly installed at the top of the base, electric rods are symmetrically arranged on the outer walls of the two sides of the electroplating pool, and the top ends of the electric rods are slidably connected with movable rods; the tray assembly suitable for workpieces of different sizes is installed at the tail end of the movable rod, the tray assembly comprises a frame, a first sleeve, a second sleeve, a buckle and a clamping groove, the first sleeve is fixedly installed at the bottom of the left side of the frame, and the second sleeve is fixedly installed at the bottom of the right side of the frame; the inner wall of the second sleeve is slidably connected with a buckle, and a clamping groove is formed in the position, corresponding to the buckle, of the movable rod. According to the metal surface treatment electroplating device, the frame can be changed according to workpieces of different sizes, and meanwhile, the multiple workpieces can be machined at the same time, so that the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating devices, in particular to a metal surface treatment electroplating device. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis, which prevents metal oxidation and improves wear resistance and conductivity.

[0003] For example, the patent document with application number CN202321029008.1 discloses an electroplating device for metal surface treatment. The utility model electroplating device for metal surface treatment starts a servo motor, and the servo motor rotates the telescopic connecting rod and the connecting gear. The connecting gear rotates on the first spur gear and rotates the second spur gear at the same time. The second spur gear moves the gear mounting rod, so that the gear mounting rod can move up and down. The staff then places the workpiece on the hanger hook assembly, so that the workpiece can be placed in the processing pool and then taken out more conveniently, which does not require manual operation by the staff, thereby improving the staff's efficiency. However, the electroplating device for metal surface treatment has certain limitations. It is easy for the workpiece to shake because it is hung on the hook, and it is impossible to process multiple workpieces at the same time.

[0004] Therefore, in view of this, the shortcomings of the existing structure are studied and improved, and a metal surface treatment electroplating device is proposed. Utility Model Content

[0005] The purpose of the present invention is to provide a metal surface treatment electroplating device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a metal surface treatment electroplating device, comprising a base and a tray assembly, a plating pool fixedly mounted on the top of the base, and electric rods symmetrically arranged on the outer walls of both sides of the plating pool, the top of the electric rod is slidably connected to a movable rod, the tray assembly for use with workpieces of different sizes is installed at the end of the movable rod, the tray assembly comprises a frame, a first sleeve, a second sleeve, a buckle and a slot, the first sleeve is fixedly mounted on the left bottom of the frame, and the second sleeve is fixedly mounted on the right bottom of the frame, the inner wall of the second sleeve is slidably connected to the buckle, and a slot is provided at the position of the movable rod corresponding to the buckle.

[0007] Preferably, a filter is fixedly mounted on the inner wall of the frame, and the first sleeve is arranged in a "U"-shaped structure as a whole.

[0008] Preferably, a return spring is fixedly installed on the right front end of the buckle, and two groups of buckles are provided.

[0009] Preferably, the buckle is arranged in an "L"-shaped structure as a whole, and a push block is fixedly installed at the right rear end of the buckle.

[0010] Preferably, the buckle is movably connected to the second sleeve via a push block, and a liquid level sensor is fixedly mounted on the middle inner wall.

[0011] Compared with the prior art, the beneficial effects of the present invention are: the metal surface treatment electroplating device can not only change the frame according to workpieces of different sizes, but also can process multiple workpieces simultaneously to improve work efficiency.

[0012] 1. The utility model uses the tray assembly to squeeze the push block, causing it to push the buckle provided inside the second sleeve toward the middle, disengaging the corresponding slot provided on the movable rod, and allowing the frame provided with the filter to be removed horizontally from the movable rod. This allows the device to replace the corresponding frame according to the size of the workpiece, thereby improving the applicability of the device. At the same time, the device is also equipped with multiple sets of electric rods that can be freely coordinated according to needs, greatly improving its ability to process workpieces in multiple batches and reducing interference;

[0013] 2. The liquid level sensor in this utility model converts the electroplating liquid level signal in the container into a corresponding electrical quantity signal in real time and transmits it to the controller. The computer in the controller compares the measured electroplating liquid level signal with the set signal and, based on the nature of the deviation, issues opening and closing commands to the electroplating liquid electric valve to ensure that the container reaches the set level. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the tray assembly of the utility model;

[0016] Figure 3 For this utility model Figure 1 A in the middle is an enlarged structural diagram;

[0017] Figure 4 This is a schematic diagram of the connection structure between the buckle and the return spring of the utility model.

[0018] In the figure: 1. Base; 2. Electroplating tank; 3. Electric rod; 4. Movable rod; 5. Tray assembly; 501. Frame; 502. First sleeve; 503. Second sleeve; 504. Buckle; 505. Slot; 6. Filter; 7. Return spring; 8. Push block; 9. Liquid level sensor. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] like Figure 1-Figure 4 As shown, a metal surface treatment electroplating device includes a base 1 and a tray assembly 5, an electroplating pool 2 is fixedly installed on the top of the base 1, and electric rods 3 are symmetrically provided on the outer walls of both sides of the electroplating pool 2, and the top of the electric rod 3 is slidably connected to a movable rod 4, and a tray assembly 5 suitable for workpieces of different sizes is installed at the end of the movable rod 4, and the tray assembly 5 includes a frame 501, a first sleeve 502, a second sleeve 503, a buckle 504 and a slot 505, the first sleeve 502 is fixedly installed on the left bottom of the frame 501, and the second sleeve 503 is fixedly installed on the right bottom of the frame 501, the inner wall of the second sleeve 503 is slidably connected to the buckle 504, and the movable rod 4 has a slot 505 at the position corresponding to the buckle 504.

[0021] The push block 8 is squeezed to push the buckle 504 set inside the second sleeve 503 to move toward the middle, disengaging the card slot 505 set corresponding to the movable rod 4, and removing the frame 501 with the filter 6 horizontally from the movable rod 4, so that the device can replace the corresponding frame 501 according to the size of the workpiece, thereby improving the applicability of the device. At the same time, the device is also provided with multiple groups of electric rods 3, which can be freely coordinated according to needs, thereby greatly improving its ability to process workpieces in multiple batches and reducing interference.

[0022] Furthermore, a filter screen 6 is fixedly mounted on the inner wall of the frame 501, and the first sleeve 502 is arranged in a "U"-shaped structure as a whole.

[0023] The first sleeve 502 facilitates the docking and limiting of the frame 501 and the movable rod 4 to prevent them from shaking.

[0024] Furthermore, a return spring 7 is fixedly mounted on the front right side of the buckle 504 , and two groups of the buckle 504 are provided.

[0025] The buckle 504 prevents the second sleeve 503 from shaking left and right after installation.

[0026] Furthermore, the buckle 504 is configured in an “L”-shaped structure as a whole, and a push block 8 is fixedly mounted on the right rear end of the buckle 504 .

[0027] The push block 8 is used to control the movement of the buckle 504 and to disengage from the slot 505 .

[0028] Furthermore, the buckle 504 is movably connected to the second sleeve 503 through the push block 8, and a liquid level sensor 9 is fixedly installed on the middle inner wall.

[0029] The liquid level sensor 9 is used to monitor the electroplating liquid inside the electroplating tank 2 in real time to maintain a normal amount.

[0030] Working principle: When using the metal surface treatment electroplating device, first squeeze the push block 8 so that the push block 8 pushes the buckle 504 set inside the second sleeve 503 to move toward the middle, disengaging the corresponding slot 505 set with the movable rod 4, and removing the frame 501 with the filter 6 horizontally from the movable rod 4, so that the device can replace the corresponding frame 501 according to the size of the workpiece, improving the applicability of the device. At the same time, the device is also equipped with multiple groups of electric rods 3, which can be freely matched according to needs, and the liquid level sensor 9 set in the device converts the electroplating liquid level signal in the container into a corresponding electrical signal in real time and transmits it to the controller. The computer in the controller compares the measured electroplating liquid level signal with the set signal, and according to the nature of the deviation, sends an open and close instruction to the electroplating liquid electric valve to ensure that the container reaches the set position. This is the working principle of the metal surface treatment electroplating device.

Claims

1. A metal surface treatment electroplating device, comprising a base (1) and a tray assembly (5), characterized in that: The top of the base (1) is fixedly mounted with an electroplating pool (2), and electric rods (3) are symmetrically arranged on the outer walls of both sides of the electroplating pool (2), the top of the electric rod (3) is slidably connected to a movable rod (4), and the tray assembly (5) for use with workpieces of different sizes is mounted on the end of the movable rod (4), and the tray assembly (5) comprises a frame (501), a first sleeve (502), a second sleeve (503), a buckle (504) and a slot (505), the first sleeve (502) is fixedly mounted on the left bottom of the frame (501), and the second sleeve (503) is fixedly mounted on the right bottom of the frame (501), the inner wall of the second sleeve (503) is slidably connected to the buckle (504), and the movable rod (4) is provided with a slot (505) at a position corresponding to the buckle (504).

2. A metal surface treatment electroplating device according to claim 1, characterized in that: A filter screen (6) is fixedly mounted on the inner wall of the frame (501), and the first sleeve (502) is arranged in a "U"-shaped structure as a whole.

3. The metal surface treatment electroplating device according to claim 1, characterized in that: A return spring (7) is fixedly mounted on the front right side of the buckle (504), and the buckle (504) is provided with two groups.

4. The metal surface treatment electroplating device according to claim 1, characterized in that: The buckle (504) is arranged in an "L"-shaped structure as a whole, and a push block (8) is fixedly installed at the right rear end of the buckle (504).

5. The metal surface treatment electroplating device according to claim 1, characterized in that: The buckle (504) is movably connected to the second sleeve (503) via a push block (8), and a liquid level sensor (9) is fixedly installed on the inner wall of the middle portion.

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