Bonding wire arc deformation detection equipment

Abstract

The utility model relates to the technical field of bonding wire design detection, in particular to bonding wire arc deformation detection equipment, which comprises a turntable, a test piece and an acquisition part, an axis is arranged on the turntable, the turntable rotates by taking the axis as an axis, and the turntable is provided with a placement part extending along the radial direction of the turntable. The test piece is used for fixing a to-be-tested bonding wire arc, and the test piece is movably connected with the placement part, so that the test piece can be switched between a test state and a debugging state. When the test piece is in a debugging state, the test piece can slide along the placement part; when the test piece is in a test state, the test piece is fixed on the turntable. The collection part and the placement part are oppositely arranged in the extension direction of the axis. According to the bonding wire arc deformation detection equipment provided by the invention, a physical test means in a dynamic service state of a bonding wire arc is filled up, and the reliability of bonding wire packaging is improved.

Description

Technical Field

[0001] The present application relates to the technical field of bonding wire design and detection, and in particular to a bonding wire arc deformation detection device. Background Art

[0002] A bonding wire is a thin metal wire used in semiconductor devices to connect the chip to pins or external circuitry. It bridges the gap between the chip and external circuitry, achieving electrical connection and information exchange. Bonding wires are formed through primary welding, arc drawing, and secondary welding. As chip I / O pin density increases, the spacing between pads decreases. This causes the bond wire arc to deflect with movement or vibration in dynamic service environments (for example, during semiconductor manufacturing, where semiconductor devices are moved between assembly, testing, and encapsulation processes at high speeds; or during service, where semiconductor devices are often moved, dropped, or collided). If the bond wire arc is insufficiently stiff and deflected excessively during movement, it can easily come into contact with adjacent bond wires, causing short circuit failure or erroneous calculation results. Therefore, in the process of selecting bonding wires and designing wire arcs for specific applications, checking the matching degree between the offset of the wire arc and the spacing between adjacent bonding wires becomes the key to ensuring the reliability of the bonding wire packaging.

[0003] However, most existing bond wire arc detection schemes use computer modeling to calculate the resonant frequency and amplitude of the wire arc to simulate and predict the use status of the bond wire arc. However, the input bond wire physical properties, wire arc model accuracy, and boundary conditions have a great impact on the simulation and prediction data, resulting in a large deviation between the simulation and prediction data and the actual bond wire arc service results, causing the reliability of the bond wire package to deteriorate. Utility Model Content

[0004] The purpose of the present application is to provide a bonding wire arc deformation detection device to solve, to a certain extent, the existing bonding wire arc detection schemes in the prior art, which mostly obtain the resonance frequency and amplitude of the wire arc through computer modeling calculations, and realize the simulation and prediction of the use status of the bonding wire arc based on the input bonding wire physical parameters, wire arc model, and boundary conditions. This computer simulation prediction data is greatly affected by the input bonding wire physical parameters, wire arc model accuracy, and boundary conditions, and there is a large deviation from the actual bonding wire arc service results, resulting in the technical problem of poor bonding wire packaging reliability.

[0005] According to a first aspect of the present application, a bonding wire arc deformation detection device is provided, comprising a turntable, a test piece, and a collection unit, wherein the turntable is provided with an axis and is rotatable about the axis, and the turntable is provided with a placement portion extending in a radial direction of the turntable;

[0006] The test piece is used to fix the arc of the bonding wire to be tested, and the test piece is movably connected to the placement portion so that the test piece can be switched between a test state and a debugging state;

[0007] When the test piece is in the debugging state, the test piece can slide along the placement portion;

[0008] When the test piece is in the test state, the test piece is fixed to the placement portion;

[0009] The collecting portion and the placing portion are arranged opposite to each other in the extending direction of the axis, so as to collect image information of the arc of the bonding wire to be tested on the test piece.

[0010] Preferably, the placement portion includes a placement groove, the placement groove extends along the radial direction of the turntable, and the test piece can be embedded in the placement groove and slidably connected to the placement groove.

[0011] Preferably, the seating portion further comprises a limit stop edge and a positioning stud, the seating groove extends along the radial direction, the limit stop edge is provided on a side wall of the seating groove extending along the radial direction, and the limit stop edge extends from one side of the seating groove to the middle of the seating groove;

[0012] The limit stop is provided with a plurality of limit threaded holes extending along the axis and penetrating the limit stop. The plurality of limit threaded holes are spaced apart along the radial direction. The positioning stud can be threadedly connected with the limit threaded hole to penetrate the limit threaded hole and abut the test piece in the placement groove.

[0013] Preferably, the placement portion includes:

[0014] a first scale extending along the radial direction, the first scale being disposed on at least one side of the seating groove in a direction perpendicular to an extension direction of the seating groove;

[0015] The second scale is arranged on the test piece, and the two ends of the arc of the bonding wire to be tested are fixedly connected to the first point and the second point of the test piece respectively, and the extension direction of the second scale is perpendicular to the connection direction of the first point and the second point.

[0016] Preferably, it also includes a shell, which has a sealed chamber, and the turntable is rotatably arranged in the sealed chamber. A collection window is provided on the side of the shell facing the placement part, and the collection part collects image information of the arc of the bonding wire to be tested on the test piece through the collection window.

[0017] Preferably, there are multiple placement portions, and the multiple placement portions are evenly distributed along the circumferential direction of the turntable;

[0018] Preferably, the bonding wire arc deformation detection device further includes a rotation drive unit fixedly connected to the housing and transmission-connected to the turntable to drive the turntable to rotate.

[0019] Preferably, the bonding wire arc deformation detection device further includes an encoder, which is arranged between the rotation drive unit and the turntable, and the encoder is communicatively connected with the acquisition unit and the rotation drive unit.

[0020] Preferably, the housing further comprises a collection frame fixed to the outside of the housing and disposed on one side of the collection window, the collection frame extending along the radial direction, and the collection portion being slidably connected to the collection frame along the radial direction;

[0021] Preferably, the shell further includes a fill light, which is arranged on the inner wall of the shell and around the edge of the collection window.

[0022] Compared with the prior art, the present invention has the following advantages:

[0023] The bonding wire arc deformation detection device provided by the present application is configured to set a test piece for fixing the bonding wire arc to be tested in a placement portion of a turntable. On the one hand, when the test piece is in a test state, the test piece and the turntable are fixed, so that the bonding wire arc to be tested can rotate with the turntable, so as to simulate the state of the bonding wire arc in a dynamic service environment in a limited space, and to collect image information of the bonding wire arc to be tested by setting a collection portion relative to the placement portion in the extension direction of the axis, so as to obtain the maximum deviation of the bonding wire arc to be tested in a moving state by analyzing the image information of the bonding wire arc to be tested, and then to verify the rigidity of the bonding wire arc and the setting The spatial matching provides physical verification data, effectively improving the data accuracy of the bonding wire arc inspection, the matching degree of the wire arc rigidity and the setting space, and improving the reliability of the bonding wire arc packaging; on the other hand, when the test piece is in the debugging state, the test piece can slide along the placement part extending in the radial direction of the turntable, so that the bonding wire arc deformation detection equipment can simulate the dynamic service environment of the bonding wire arc at different speeds, thereby improving the testing flexibility and adaptability of the bonding wire arc deformation detection equipment; furthermore, there are multiple placement parts distributed along the circumference of the rotating disk, and multiple test pieces can be arranged at the same time in one test to improve the efficiency of batch testing.

[0024] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the description of the prior art. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0026] Figure 1 A schematic diagram of the axonometric structure of a bonding wire arc deformation detection device provided in an embodiment of the present application;

[0027] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the bonding wire arc deformation detection equipment provided at point A;

[0028] Figure 3 A schematic cross-sectional view of a bonding wire arc deformation detection device provided in an embodiment of the present application;

[0029] Figure 4 This is a schematic diagram of the axonometric structure of the turntable provided in an embodiment of the present application;

[0030] Figure 5 A schematic diagram of a partially enlarged structure of a turntable provided in an embodiment of the present application;

[0031] Figure 6 A schematic cross-sectional view of a housing according to an embodiment of the present application;

[0032] Figure 7 A schematic diagram of the structure of the test piece provided in an embodiment of the present application;

[0033] Figure 8 A schematic flow chart of a bonding wire arc deformation detection method provided in an embodiment of the present application.

[0034] Reference numerals:

[0035] 1-turntable; 2-mounting part; 21-mounting slot; 22-limiting edge; 221-limiting threaded hole; 23-positioning stud; 24-first scale; 3-test piece; 31-first point; 32-second point; 33-second scale; 4-collection part; 5-housing; 51-collection frame; 52-collection window; 53-fill light; 54-support leg; 6-rotation drive part; 7-encoder; 8-bond wire arc to be tested. DETAILED DESCRIPTION

[0036] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0037] The components of the embodiments of the present application generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application.

[0038] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0039] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0041] Refer to the following Figures 1 to 8 The present invention describes a bonding wire arc deformation detection device according to some embodiments of the present application.

[0042] See also Figures 1 to 7As shown, an embodiment of the first aspect of the present application provides a bonding wire arc deformation detection device, which includes a turntable 1, a test piece 3 and a collection part 4. The turntable 1 is provided with an axis, and the turntable 1 can rotate around the axis. The turntable 1 is provided with a placement part 2 extending in the radial direction of the turntable 1. The test piece 3 is used to fix the bonding wire arc 8 to be tested, and the test piece 3 is movably connected to the placement part 2 so that the test piece 3 can switch between the test state and the debugging state. When the test piece 3 is in the debugging state, the test piece 3 can slide along the placement part 2; when the test piece 3 is in the test state, the test piece 3 is fixed to the turntable 1. The collection part 4 and the placement part 2 are arranged relative to each other in the extension direction of the axis, so as to collect image information of the bonding wire arc 8 to be tested on the test piece 3.

[0043] According to the bonding wire arc deformation detection device provided by the above technical features, the test piece 3 for fixing the bonding wire arc 8 to be tested is set in the placement part 2 of the turntable 1. On the one hand, when the test piece 3 is in the test state, the test piece 3 is fixed to the turntable 1, so that the bonding wire arc 8 to be tested can rotate with the turntable 1, so as to simulate the state of the bonding wire arc in a dynamic service environment in a limited space, and the acquisition part 4 is arranged relative to the placement part 2 in the extension direction of the axis to collect image information of the bonding wire arc 8 to obtain the bonding wire arc 8 to be tested in the moving state by analyzing the image information of the bonding wire arc 8 to be tested. The maximum deviation of arc 8 fills the gap in the physical test method of the moving state of the bonding wire arc, provides physical verification data for testing the matching degree between the rigidity of the bonding wire arc and the setting space, effectively improves the data accuracy of testing the matching degree between the rigidity of the bonding wire arc and the setting space, and improves the reliability of the bonding wire package; on the other hand, when the test piece 3 is in the debugging state, the test piece 3 can slide along the placement part 2 extending in the radial direction of the turntable 1, so that the bonding wire arc deformation detection equipment can simulate the dynamic service environment of the bonding wire arc at different speeds, thereby improving the testing flexibility and adaptability of the bonding wire arc deformation detection equipment.

[0044] like Figure 1 、 Figure 3 and Figure 4 As shown, the dotted line shown in the figure may be an example of the above-mentioned axis.

[0045] Preferably, if Figures 2 to 4As shown, the placement portion 2 may include a placement groove 21, which extends in the radial direction of the turntable 1. The test piece 3 can be embedded in the placement groove 21 and is slidably connected to the placement groove 21, so that in the debugging state, the test piece 3 and the placement portion 2 can slide. The placement portion 2 is arranged into the placement groove 21, which not only effectively compresses the space occupied by the placement portion 2 and the test piece 3, but also can effectively shorten the distance between the upper surface of the test piece 3 and the upper surface of the turntable 1, so that the acquisition portion 4 can focus on the first scale 24 and the second scale 33 described below.

[0046] However, the placement portion 2 is not limited to the placement groove 21 . As long as the placement portion 2 and the test piece 3 can be slidably connected in the debugging state, the placement portion 2 may also include a slideway, a slide rail, etc.

[0047] Preferably, if Figure 5 As shown, in the extension direction of the above-mentioned axis, the size of the above-mentioned test piece 3 can be equal to the depth of the above-mentioned placement groove 21. In this way, when the test piece 3 is set in the placement groove 21, the upper surface of the test piece 3 can be set flush with the upper surface of the turntable 1, so as to further facilitate the above-mentioned acquisition part 4 to focus on the first scale 24 and the second scale 33 at the same time.

[0048] Preferably, if Figure 4 and Figure 5 As shown, the above-mentioned placement portion 2 may further include a limit stop 22 and a positioning stud 23. The limit stop 22 is fixedly provided on one side of the placement groove 21 in the circumferential direction of the turntable 1. In the circumferential direction, the limit stop 22 extends from one side of the placement groove 21 to the middle of the placement groove 21. Figure 4 and Figure 5 As shown, the above-mentioned limit stop 22 is provided with a plurality of limit threaded holes 221 extending along the axial direction and penetrating the limit stop 22. The plurality of limit threaded holes 221 are spaced apart in the radial direction. The positioning studs 23 can be threadedly connected with the limit threaded holes 221 to penetrate the limit threaded holes 221 and abut against the test piece 3 in the mounting groove 21. In this way, the test piece 3 is squeezed by both the bottom surface of the mounting groove 21 and the positioning studs 23 to achieve the fixation between the test piece 3 and the turntable 1 when the test piece 3 is in the test state, so as to achieve the fixation of the test piece 3 relative to the turntable 1 during the rotation of the turntable 1.

[0049] Optionally, although not shown in the figures, both sides of the placement groove in the circumferential direction of the turntable may be fixedly provided with the above-mentioned limit stop edges to further improve the fixing stability of the test piece.

[0050] However, the present invention is not limited to this, and the structure for fixing the test piece 3 and the turntable 1 is not limited to the form of the above-mentioned limit block and positioning stud 23. As long as the test piece 3 can be fixed relative to the turntable 1 during the rotation of the turntable 1, the fixing structure can also be other structures. For example, the fixing structure can also be a positioning pin that passes through the turntable 1 and the test piece 3 at the same time, or the fixing structure can also be a clamp fixedly set on the turntable 1.

[0051] Preferably, if Figure 5 As shown, in the radial direction of the turntable 1, the distance between two adjacent limiting threaded holes 221 is smaller than the size of the test piece 3. In this way, no matter where the test piece 3 is in the mounting groove 21, there is at least one limiting threaded hole 221 that can be directly opposite to the test piece 3, that is, there can be at least one positioning stud 23 that can abut against the test piece 3, effectively improving the freedom of setting the position of the test piece 3 in the mounting groove 21.

[0052] Furthermore, the distance between two adjacent limiting threaded holes 221 is less than or equal to 1 / 2 of the width of the test piece, so as to further ensure that at least two studs are used to fasten the test piece when the test piece is fixed at any position along the axis extension direction, thereby increasing the reliability of the fastening.

[0053] Preferably, if Figure 2 、 Figure 4 and Figure 5 As shown, the placement portion 2 may further include a first scale 24 which may extend in a radial direction. The first scale 24 is disposed on one side of the placement groove 21 in the circumferential direction of the turntable 1 to facilitate rapid positioning of the test piece 3 when in an adjusted state.

[0054] Preferably, if Figure 4 As shown, a plurality of placement portions 2 can be provided on the above-mentioned turntable 1, and the plurality of placement portions 2 can be evenly distributed along the circumferential direction of the turntable 1 to achieve synchronous testing of a plurality of test pieces 3, thereby improving the testing efficiency of the bonding wire arc deformation detection device.

[0055] In an embodiment, Figure 5 and Figure 6 As shown, the test piece 3 may include a first point 31 and a second point 32, and the two ends of the bonding wire arc 8 to be tested may be fixedly connected to the test piece 3 via the first point 31 and the second point 32, respectively. Optionally, the bonding wire arc 8 to be tested may be welded to the test piece 3 to simulate the connection method between the bonding wire arc 8 to be tested and the semiconductor device. However, this is not limited to this. The connection method between the bonding wire arc 8 to be tested and the test piece 3 may be adaptively adjusted according to the connection method between the bonding wire arc 8 to be tested and the semiconductor device. It should be noted that the first point 31 and the second point 32 may be understood as the first welding point and the second welding point formed during the bonding process of the bonding wire on the bonding machine.

[0056] Preferably, if Figure 5 and Figure 6 As shown, the upper surface of the test piece 3 may further be provided with a second scale 33, and the second scale 33 may be perpendicular to the direction of the line connecting the first point 31 and the second point 32. In this way, when the acquisition unit 4 acquires the image information of the arc 8 of the bonding wire to be tested on the test piece 3, the second scale 33 can be acquired together, and the analysis of the image information is facilitated by the reference of the second scale 33.

[0057] Optionally, the first scale 24 and the second scale 33 may be provided on the surface of the turntable 1 and the test piece 3 by laser etching to ensure the durability and stability of the first scale 24 and the second scale 33. However, this is not limiting. As long as they can be clearly marked, the first scale 24 and the second scale 33 may also be fixed to the surface of the turntable 1 and the test piece 3 by other means, such as gluing, etching, printing, etc.

[0058] like Figure 7 As shown in the figure, among the two bonding wire arcs 8 to be tested, the solid line in the figure represents the position of the bonding wire arc 8 in the initial state, and the dotted line in the figure represents the position of the bonding wire arc 8 in the test state. Figure 7 As shown, when the bonding wire arc 8 to be tested is assembled with the test piece 3 (the bonding wire arc 8 to be tested is in the initial state), the plane confirmed by the bonding wire arc 8 to be tested is perpendicular to the second scale 33, so that the offset of the bonding wire arc 8 to be tested can be quickly obtained during the test process.

[0059] It should be noted that if Figure 5 As shown in the figure, an example is shown in which the direction of the line connecting the first point 31 and the second point 32 is perpendicular to the radial direction. However, this is not limited to this. The angle between the direction of the line connecting the first point 31 and the second point 32 and the extension direction of the mounting groove 21 (i.e., the radial direction) can be adaptively adjusted based on the movement direction of the bond wire arc 8 under test and the orientation of the minimum installation gap of the bond wire arc 8 under test. In other words, the setting angle of the bond wire arc 8 under test and the second scale 33 can be adaptively adjusted according to test requirements.

[0060] In an embodiment, preferably, Figures 1 to 3As shown, the above-mentioned bonding wire arc deformation detection equipment can also include a shell 5, which has a closed chamber, and the turntable 1 can be rotatably arranged in the closed chamber. In this way, on the one hand, the protection of the turntable 1 by the shell 5 can effectively reduce the influence of external factors on the test results and improve the test accuracy; on the other hand, by adjusting the air pressure in the closed chamber (for example, vacuuming or pressurizing), the state of the bonding wire arc 8 to be tested in an extreme air pressure environment can be simulated, thereby increasing the test adaptability range of the bonding wire arc deformation detection equipment.

[0061] Preferably, if Figure 2 As shown, a collection window 52 is provided on the side of the housing 5 facing the placement portion 2, and the collection portion 4 collects image information of the bond wire arc 8 to be tested on the test piece 3 through the collection window 52. Specifically, the housing 5 can be provided with a collection port, which can be blocked with a transparent material (e.g., a glass plate, an acrylic plate, etc.) to form the collection window 52, ​​so as to ensure both the airtightness of the sealed chamber and the clarity of the image information collected by the collection portion 4.

[0062] Optionally, the collection window 52 and the housing 5 are detachable to facilitate assembly of the test piece 3 and the turntable 1 .

[0063] Alternatively, as Figure 1 As shown, the bonding wire arc deformation detection device further includes a plurality of legs 54 , and the housing 5 can be fixed on the legs 54 so as to erect the housing 5 at a predetermined height so as to reserve installation space for the rotation drive unit 6 described below.

[0064] Optionally, as not shown in the figures, the housing may also be provided with an air inlet pipe and a pressure relief valve, so as to facilitate gas injection and exhaust of the sealed chamber via the air inlet pipe and the pressure relief valve.

[0065] Optionally, not shown in the figures, a temperature regulating device may be embedded in the shell to facilitate controlling the temperature of the sealed chamber.

[0066] It should be noted that the sealing structure, temperature regulating device, intake pipe pressure relief valve and other structures provided on the housing 5 are all existing technologies in this field and will not be described in detail here.

[0067] Preferably, if Figure 1 As shown, the above-mentioned bonding wire arc deformation detection equipment can also include a rotation drive unit 6, which is fixedly connected to the shell 5 and is transmission-connected to the turntable 1 to drive the turntable 1 to rotate. In this way, the automatic drive of the turntable 1 is realized, which facilitates the control of the rotation speed of the turntable 1.

[0068] Optionally, the rotation driving unit 6 may be a driving motor.

[0069] Preferably, if Figure 1 and Figure 3 As shown, the above-mentioned bonding wire arc deformation detection device can also include an encoder 7, which can be arranged between the rotation drive unit 6 and the turntable 1. The encoder 7 is communicatively connected with the acquisition unit 4 and the rotation drive unit 6. In this way, the encoder 7 can mark the positions of the above-mentioned acquisition window 52 and multiple placement parts 2, and monitor the rotation angle of the turntable 1, thereby realizing that when the placement part 2 passes through the acquisition window 52, ​​the acquisition unit 4 can automatically acquire image information.

[0070] Preferably, if Figure 1 and Figure 3 As shown, the shell 5 may further include a collection rack 51, which is fixed to the outside of the shell 5 and is arranged on one side of the collection window 52. The collection rack 51 extends in a radial direction, and the collection portion 4 is slidably connected to the collection rack 51 in a radial direction to adjust the position of the collection portion 4 in the radial direction, so as to facilitate adjustment of the position of the collection portion 4 according to the position of the test piece 3.

[0071] Optionally, the collection rack 51 may be provided with a slideway and a slider that are slidably connected to each other, and the collection portion 4 may be detachably connected to the slider.

[0072] Preferably, the acquisition unit 4 can be a high-speed camera to quickly and clearly capture image information of the bond wire loop 8 under test during the high-speed rotation of the test piece 3. Optionally, the acquisition unit 4 can include a magnifying lens to facilitate analysis of the information on the second scale 33 and improve the test accuracy of the bond wire loop 8 under test.

[0073] Preferably, if Figure 3 and Figure 6 As shown, the shell 5 may further include a fill light 53, which may be disposed on the inner wall of the shell 5 and around the edge of the collection window 52, ​​so as to provide fill light for the collection unit 4 and ensure clarity of the image information collected by the collection unit 4.

[0074] Alternatively, as Figure 6 As shown, the fill light 53 can be arranged along an edge parallel to the extension direction of the collection window 52 .

[0075] Preferably, not shown in the figure, the above-mentioned fill light 53 can also be set along the edge of the collection window 52 for at least one circle, so as to achieve the effect of a shadowless lamp through the distribution of the annular fill light, thereby avoiding the formation of arc shadows to interfere with the measurement of the collected image.

[0076] An embodiment of the second aspect of the present application also provides a bonding wire arc deformation detection method, which is used for the bonding wire arc deformation detection device described in any of the above embodiments. Therefore, it has all the beneficial technical effects of the bonding wire arc deformation detection device, which will not be repeated here.

[0077] The steps include:

[0078] S010 acquires detection parameters, and acquires velocity (v) and acceleration (a) data of the bond wire arc 8 under the limit state of movement according to the dynamic service environment of the bond wire arc 8 under test.

[0079] S020 installs the bond wire loop 8 to be tested and bonds the bond wire loop 8 to a predetermined position on the test piece 3 according to the design structure of the bond wire loop 8. It should be noted that after the bond is completed, the highest point of the bond wire loop 8 to be tested, the first point 31, and the second point 32 are coplanar and perpendicular to the test piece substrate.

[0080] Optionally, the design structure of the bonding wire arc may include a design arc height, a span, a solder joint form, and the like.

[0081] Optionally, the step of installing the bonding wire arc 8 to be tested in S020 may also include fixing the two ends of the bonding wire arc 8 to be tested to the first point 31 and the second point 32 of the test piece 3 respectively, and marking the highest point of the bonding wire arc 8 to be tested.

[0082] Optionally, the number of test pieces 3 and the installation angles of the bonding wire arcs 8 to be tested of different test pieces 3 are selected according to test requirements.

[0083] S030 installation and debugging test piece 3, according to the formula: Calculate the rotation radius of the test piece 3 and fix the test piece 3 to the corresponding position of the placement portion 2. Preferably, after calculating the rotation radius, the test piece 3 can be slid along the placement groove 21 to the position of the rotation radius indicated by the first scale 24, and the positioning stud 23 is screwed into the corresponding limiting threaded hole 221 to clamp the test piece 3, thereby completing the installation of the test piece 3.

[0084] Optionally, if a plurality of test pieces 3 are selected, the plurality of test pieces 3 may be disposed in a plurality of placement slots 21 in a one-to-one correspondence.

[0085] Optionally, the bonding wire arc deformation detection method may further include S040 adjusting the environment in the sealed chamber, and adjusting the air pressure and temperature in the sealed chamber according to the dynamic service environment of the bonding wire arc 8 to be tested.

[0086] Optionally, the above-mentioned adjustment of the air pressure in the sealed chamber may include evacuating the sealed chamber, injecting gas (to simulate high pressure), heating, etc., to simulate different service environments of the bonding wire arc 8 to be tested.

[0087] S050: Adjust the position of the collecting part 4. According to the installation position of the test piece 3, adjust the position of the collecting part 4 so that the collecting part 4 is aligned with the test piece 3 and adjust the focal length.

[0088] S060 sets the rotation parameters according to The rotational angular velocity of the test piece 3 is calculated, and the output power of the rotation drive is set according to the rotational angular velocity, so that the rotational speed of the turntable 1 reaches ω.

[0089] S070 collects images and drives the turntable 1 to rotate. Whenever the test piece 3 passes the location of the collecting unit 4 , the collecting unit 4 is controlled to collect test image data of the test piece 3 .

[0090] Preferably, the capture frame rate f of the acquisition unit should satisfy Wherein v is the speed, and D is the diameter of the bonding wire, so as to ensure that the acquisition unit can clearly obtain the image data of the arc 8 of the bonding wire to be tested in a dynamic service environment.

[0091] S080 calculates the offset, compares the test image data with the initial state of the test piece 3, and obtains the maximum offset distance d of the bond wire arc 8 to be tested in the moving state 偏移 .

[0092] Measure the offset of the highest point in the test image data relative to the line connecting the first point 31 and the second point 32, and record it as the maximum offset distance d 偏移 .

[0093] Specifically, if Figure 7 As shown, Among them, P 偏移 Can be the offset pixel of the highest point in the test image data, P 标尺 It can be the pixel distance of the second scale 33, L 标尺 It can be the actual size of the second scale 33 .

[0094] S090 determines whether the stiffness of the bonding wire arc 8 to be tested is qualified and compares the offset distance d 偏移 Design installation gap d with the bonding wire arc 8 to be tested 间隙 .

[0095] If d 偏移 ≥d 间隙 , then the stiffness of the bonding wire arc 8 to be tested is unqualified and needs to be redesigned and the above test repeated.

[0096] Optionally, the above redesign may include replacing bonding wires with other components, changing the wire diameter of the bonding wire, or changing the geometric dimensions of the wire arc.

[0097] If d 偏移 <d 间隙 , then the stiffness of the bonding wire arc 8 to be tested is qualified and the design is completed.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A bonding wire arc deformation detection device, characterized in that: The test piece includes a turntable, a test piece, and a collection portion. The turntable is provided with an axis, the turntable can rotate around the axis, and the turntable is provided with a placement portion extending in a radial direction of the turntable. The test piece is used to fix the arc of the bonding wire to be tested, and the test piece is movably connected to the placement portion so that the test piece can be switched between a test state and a debugging state; When the test piece is in the debugging state, the test piece can slide along the placement portion; When the test piece is in the test state, the test piece is fixed to the placement portion; The collecting portion and the placing portion are arranged opposite to each other in the extending direction of the axis, so as to collect image information of the arc of the bonding wire to be tested on the test piece.

2. The bonding wire arc deformation detection device according to claim 1, characterized in that: The placement portion includes a placement groove, which extends along the radial direction of the turntable. The test piece can be embedded in the placement groove and is slidably connected to the placement groove.

3. The bonding wire arc deformation detection device according to claim 2, characterized in that: The placement portion further includes a limit stop edge and a positioning stud, the placement groove extends along the radial direction, the limit stop edge is provided on the side wall of the placement groove extending along the radial direction, and the limit stop edge extends from one side of the placement groove to the middle of the placement groove; The limit stop is provided with a plurality of limit threaded holes extending along the axis and penetrating the limit stop. The plurality of limit threaded holes are spaced apart along the radial direction. The positioning stud can be threadedly connected with the limit threaded hole to penetrate the limit threaded hole and abut the test piece in the placement groove.

4. The bonding wire arc deformation detection device according to claim 2, characterized in that: The placement unit includes: a first scale extending along the radial direction, the first scale being disposed on at least one side of the seating groove in a direction perpendicular to an extension direction of the seating groove; The second scale is arranged on the test piece, and the two ends of the arc of the bonding wire to be tested are fixedly connected to the first point and the second point of the test piece respectively, and the extension direction of the second scale is perpendicular to the connection direction of the first point and the second point.

5. The bonding wire arc deformation detection device according to any one of claims 1 to 4, characterized in that: The apparatus further includes a shell having a sealed chamber, wherein the turntable is rotatably disposed in the sealed chamber, and a collection window is provided on a side of the shell facing the placement portion, and the collection portion collects image information of the arc of the bonding wire to be tested on the test piece through the collection window.

6. The bonding wire arc deformation detection device according to claim 5, characterized in that: There are multiple placement parts, and the multiple placement parts are evenly distributed along the circumferential direction of the turntable.

7. The bonding wire arc deformation detection device according to claim 5, characterized in that: The bonding wire arc deformation detection device further includes a rotation drive unit fixedly connected to the housing and transmission-connected to the turntable to drive the turntable to rotate.

8. The bonding wire arc deformation detection device according to claim 7, characterized in that: The bonding wire arc deformation detection device further includes an encoder, which is disposed between the rotation drive unit and the turntable. The encoder is communicatively connected with the acquisition unit and the rotation drive unit.

9. The bonding wire arc deformation detection device according to claim 5, characterized in that: The shell further includes a collection frame fixed to the outside of the shell and arranged on one side of the collection window. The collection frame extends along the radial direction, and the collection portion is slidably connected to the collection frame along the radial direction.

10. The bonding wire arc deformation detection device according to claim 5, characterized in that: The shell further comprises a fill light, which is arranged on the inner wall of the shell and around the edge of the collection window.

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