High-precision portable ultrasonic thickness gauge

Abstract

The utility model belongs to the field of ultrasonic non-destructive testing, and aims to solve the problems that the wall thickness of a metal transportation pipeline in the current petrochemical industry needs to be accurately measured, and an existing thickness gauge is complex to operate, low in precision, inconvenient to carry and the like. According to the high-precision portable ultrasonic thickness gauge, a high-voltage pulse excitation module is connected with a main control module, the high-voltage pulse excitation module is connected with an ultrasonic thickness measuring probe through an ultrasonic thickness gauge probe interface I, and the ultrasonic thickness gauge probe is arranged on the outer wall of a pipeline to be measured; the simulation conditioning module is connected with an ultrasonic thickness measuring probe through an ultrasonic thickness gauge probe interface I I; the echo acquisition module is connected with the analog conditioning module, and the echo acquisition module and the analog conditioning module are both connected with the main control module; the real-time clock module and the SD card storage module are connected with the main control module. The device can efficiently complete the accurate measurement of the wall thickness of the petrochemical metal transportation pipeline, and improves the detection efficiency of the corrosion condition of the petrochemical metal transportation pipeline.

Description

Technical Field

[0001] The utility model belongs to the field of ultrasonic non-destructive testing, and in particular relates to a high-precision portable ultrasonic thickness gauge. Background Art

[0002] In the modern petrochemical industry, the safe and efficient operation of metal transportation pipelines is crucial. However, due to the long-term effects of the transported media and harsh environments, pipelines can corrode, directly impacting the stability and safety of the entire transportation system. Therefore, monitoring and evaluating pipe wall corrosion is extremely important.

[0003] To ensure the long-term stability of pipelines, accurate measurement of pipe wall thickness is a critical requirement. Traditional thickness gauges face numerous challenges in practical application. These devices are often expensive, lack accuracy, are difficult to carry, and suffer from inefficient manual data recording and data loss. These issues limit the accuracy and efficiency of metal pipe wall thickness measurements, hindering the timely assessment and effective management of pipeline corrosion. Utility Model Content

[0004] In order to solve at least one of the above technical problems existing in the prior art, the utility model provides a high-precision portable ultrasonic thickness gauge.

[0005] The utility model adopts the following technical solution: a high-precision portable ultrasonic thickness gauge, comprising a main control module, an ultrasonic signal transmitting module, an ultrasonic signal receiving module, an ultrasonic data storage module and an ultrasonic thickness gauge probe; the ultrasonic signal transmitting module comprises a high-voltage pulse excitation module and an ultrasonic thickness gauge probe interface I; wherein the high-voltage pulse excitation module is connected to the main control module, and the high-voltage pulse excitation module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface I, and the ultrasonic thickness gauge probe is placed on the outer wall of the measured pipe; the ultrasonic signal receiving module comprises an analog conditioning module, an echo acquisition module and an ultrasonic thickness gauge probe interface II; the analog conditioning module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface II; the echo acquisition module is connected to the analog conditioning module, and both the echo acquisition module and the analog conditioning module are connected to the main control module; the ultrasonic data storage module comprises a real-time clock module and an SD card storage module; and both the real-time clock module and the SD card storage module are connected to the main control module.

[0006] Preferably, the main control module is a separate FPGA+ARM architecture, the core chip of the FPGA is EG4S20BG256, the core chip of the ARM is GD32F407VGT6, the data transmission between the FPGA and the ARM uses the EXMC bus, and the instruction transmission uses the UATR bus.

[0007] Preferably, the high-voltage pulse excitation module includes an isolation module, a PWM drive module, a high-voltage DC module, and a pulse excitation module; wherein the isolation module is connected to the main control module via the GPIO interface of the FPGA, the PWM drive module is connected to the isolation module, the high-voltage DC module is connected to the main control module via the GPIO interface of the FPGA, the PWM drive module and the high-voltage DC module are both connected to the pulse excitation module, and the pulse excitation module is connected to the ultrasonic thickness gauge probe interface I.

[0008] Preferably, the analog conditioning module includes a limiting module, a preamplifier module, a bandpass filter module, a post-amplifier module, and an output module; the limiting module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface II, the preamplifier module is connected to the limiting module, the bandpass filter module is connected to the preamplifier module, the main control module and the bandpass filter module are both connected to the post-amplifier module, and the post-amplifier module and the echo acquisition module are both connected to the output module.

[0009] Preferably, the post-stage amplifier module includes a DA module, a voltage inversion module, and a variable gain amplifier module; wherein the DA module is connected to the FPGA of the main control module via the SPI bus, the voltage inversion module is connected to the DA module, and the voltage inversion module, the output module and the bandpass filter module are all connected to the variable gain amplifier module.

[0010] Preferably, the echo acquisition module includes a signal attenuation module, a signal conversion module, and an A / D acquisition module; the signal attenuation module is connected to the output module, the signal conversion module is connected to the signal attenuation module, and the signal conversion module and the FPGA of the main control module are both connected to the A / D acquisition module.

[0011] Preferably, the real-time clock module is connected to the FPGA of the main control module via an IIC bus, and the SD card storage module is connected to the FPGA of the main control module via an SDIO bus.

[0012] Preferably, it also includes an HMI touch screen, which is connected to the ARM of the main control module via a UATR bus.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] This instrument is easy to operate, stable and reliable, and offers high measurement accuracy. It utilizes the pulse reflection principle to accurately measure the wall thickness of petrochemical metal pipes. This high-precision portable thickness gauge significantly improves the accuracy and efficiency of petrochemical metal pipe wall thickness measurements. Furthermore, the ultrasonic data storage module enables efficient real-time recording and storage of measured thickness data, ensuring strong retention and preventing loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 It is a structural block diagram of this embodiment;

[0017] Figure 2 is a circuit diagram of the high-voltage DC module of this embodiment;

[0018] Figure 3 is a circuit diagram of the analog conditioning module of this embodiment;

[0019] Figure 4 1 is a circuit diagram of the echo acquisition module of this embodiment;

[0020] Figure 5 This is a circuit diagram of the SD card storage module of this embodiment. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention are clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without making any creative work are within the scope of protection of the present invention.

[0022] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the efficacy and purpose that can be achieved by the present invention, should fall within the scope of the technical content disclosed by the present invention. It should be noted that in this specification, relational terms such as first and second are only used to distinguish one entity from several other entities, and do not necessarily require or imply any actual relationship or order between these entities.

[0023] The utility model provides an embodiment:

[0024] like Figure 1As shown, a high-precision portable ultrasonic thickness gauge includes a main control module, an ultrasonic signal transmitting module, an ultrasonic signal receiving module, an ultrasonic data storage module and an ultrasonic thickness gauge probe; the ultrasonic signal transmitting module includes a high-voltage pulse excitation module and an ultrasonic thickness gauge probe interface I; wherein the high-voltage pulse excitation module is connected to the main control module for receiving a control signal and transmitting an ultrasonic sharp pulse excitation signal; the high-voltage pulse excitation module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface I for sending a pulse excitation signal to the ultrasonic thickness gauge probe, and the ultrasonic thickness gauge probe is placed on the outer wall of the measured pipe; The acoustic signal receiving module includes an analog conditioning module, an echo acquisition module and an ultrasonic thickness gauge probe interface II; the analog conditioning module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface II, and is used to receive the echo analog signal and amplify and filter the signal; the echo acquisition module is connected to the analog conditioning module, and the echo acquisition module and the analog conditioning module are both connected to the main control module, and are used to acquire the echo analog signal and send it to the main control module after analog-to-digital conversion; the ultrasonic data storage module includes a real-time clock module and an SD card storage module; the real-time clock module and the SD card storage module are both connected to the main control module.

[0025] In this embodiment, the main control module utilizes a separate FPGA + ARM architecture. The FPGA core chip is the EG4S20BG256, and the ARM core chip is the GD32F407VGT6. Data transmission between the FPGA and ARM utilizes the EXMC bus, while command transmission utilizes the UATR bus. The main control FPGA core EG4S20BG256 is responsible for ultrasonic signal transmission, echo signal acquisition, data communication, and peripheral control. The main control ARM core GD32F407VGT6 is responsible for performing data algorithm processing on the digital echo signal and transmitting the thickness measurement results to the HMI touch screen and the main control FPGA core EG4S20BG256. The HMI touch screen is connected to the ARM of the main control module via the UATR bus.

[0026] The high-voltage pulse excitation module is connected to the core chip EG4S20BG256 of the FPGA through the GPIO interface. The high-voltage pulse excitation module includes an isolation module, a PWM drive module, a high-voltage DC module, and a pulse excitation module; the isolation module is connected to the main control module via the GPIO interface of the FPGA, and the isolation voltage chip π140E61 is used to isolate the low-voltage PWM signal from the high-voltage output signal to prevent the high-voltage pulse signal from interfering with the normal operation of the main control chip; the PWM drive module is connected to the isolation module, and the isolated low-side gate drive chip SLM27517 is used to convert the low-voltage PWM signal output by the isolation module into a high-voltage and high-current PWM signal; the PWM drive module and the high-voltage DC module are both connected to the pulse excitation module, and the core circuit adopts a non-tuned excitation circuit, which uses PWM control signals and DC high voltage to realize the charging and discharging of the energy storage element capacitor, and generates an ultrasonic sharp pulse excitation signal through the instantaneous discharge of the capacitor; the pulse excitation module is connected to the ultrasonic thickness gauge probe interface I.

[0027] like Figure 2 As shown in the figure, the high-voltage DC module uses the high-performance fixed-frequency current control mode controller UC3845 as the core. The external control pin SHDN is used to control the high-voltage output of the module. The high-level output of the SHDN pin is turned off, and the low-level output of the SHDN pin is turned on. The SHDN pin is connected to the GPIO interface of the main control FPGA core EG4S20BG256 to realize the high-voltage output control of the module.

[0028] like Figure 3 As shown, the analog conditioning module includes a limiting module, a preamplifier module, a bandpass filter module, a post-amplifier module, and an output module; the limiting module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface II, the preamplifier module is connected to the limiting module, the bandpass filter module is connected to the preamplifier module, the main control module and the bandpass filter module are both connected to the post-amplifier module, and the post-amplifier module and the echo acquisition module are both connected to the output module.

[0029] The amplitude limiting module is composed of two diodes D2 and D3 with opposite directions and a current limiting resistor R15, which limits the echo signal to the range of ±0.7V. The pre-amplification module uses a high-speed operational amplifier SGM8301 to design a common-mode amplifier circuit to perform preliminary amplification of the echo signal. The bandpass filter circuit uses two high-speed operational amplifiers SGM8301 and resistors and capacitors with a precision of 1% to design a bandpass filter, effectively filtering out noise signals and retaining echo signals.

[0030] The post-amplification module is connected to both the main control module and the bandpass filter module, and is used to perform secondary amplification on the filtered echo signal to compensate for the loss of signal filtering. The post-amplification module includes a DA module, a voltage inversion module, and a variable gain amplifier module. The core of the DA module is the 16-bit high-precision digital-to-analog converter MS5541, which is connected to the main control FPGA core EG4S20BG256 chip through the SPI bus interface and outputs a stable and accurate analog positive voltage. The voltage inversion module uses the precision operational amplifier MS8628 to design an inversion amplifier circuit to convert the positive voltage output by the DA module into the required negative voltage as the gain control voltage of the variable gain amplifier module. The core of the variable gain amplifier module selects the voltage-controlled gain amplifier VCA810. The control voltage of VCA810 is linearly related to the gain, and under a ±5V power supply, the typical output amplitude of VCA810 is ±1.8V, which performs gain amplification on the filtered echo signal to ensure that the signal amplitude range meets the data acquisition conditions.

[0031] The output module is connected to both the post-amplification module and the echo acquisition module. A voltage follower design, using the high-speed SGM8301 operational amplifier, improves the circuit's load-driving capability and ensures proper echo signal acquisition. The post-amplification module includes a DA module, a voltage inversion module, and a variable-gain amplifier module. The DA module is connected to the main control module's FPGA via an SPI bus, while the voltage inversion module is connected to the DA module. The voltage inversion module, output module, and bandpass filter module are all connected to the variable-gain amplifier module.

[0032] like Figure 4 As shown, the echo acquisition module consists of a signal attenuation module, a signal conversion module, and an A / D acquisition module. The signal attenuation module is connected to the output module, which in turn is connected to the signal attenuation module. Both the signal conversion module and the main control module's FPGA are connected to the A / D acquisition module. The signal attenuation module, comprised of resistors R8, R9, and R10, employs a π-type attenuation structure, which not only attenuates the echo signal but also provides impedance matching. The signal conversion module uses an SC7516 differential amplifier to perform single-ended-to-differential conversion on the attenuated echo signal, converting the signal to a range of 0V to 1.8V to meet the input range of the A / D converter. The core of the A / D acquisition module is the high-performance SC1269 analog-to-digital converter chip, featuring a fully differential input and a signal-to-noise ratio of 78dBFS at a maximum sampling rate of 125MSPS. It converts the input differential echo signal into a digital signal and transmits it to the main control FPGA core, the EG4S20BG256 chip.

[0033] The ultrasonic data storage module includes a real-time clock module and an SD card storage module. The core of the real-time clock module uses an external RTC chip PCF8563, which is connected to the main control FPGA core EG4S20BG256 through the IIC bus interface to provide accurate real-time measurement time for data recording; please refer to Figure 5 The SD card storage module uses a micro SD 32GB memory card and is connected to the main control FPGA core EG4S20BG256 through the SDIO bus interface. The SDIO bus interface includes four data lines: CLK clock line, CMD command line and DATA[3:0]. The data transmission is stable, fast and highly secure. The module is used to store thickness measurement results and real-time measurement time.

[0034] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A high-precision portable ultrasonic thickness gauge, characterized by: It includes a main control module, an ultrasonic signal transmitting module, an ultrasonic signal receiving module, an ultrasonic data storage module and an ultrasonic thickness gauge probe; The ultrasonic signal transmitting module includes a high-voltage pulse excitation module and an ultrasonic thickness gauge probe interface I; wherein the high-voltage pulse excitation module is connected to the main control module, and the high-voltage pulse excitation module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface I, and the ultrasonic thickness gauge probe is placed on the outer wall of the measured pipe; the ultrasonic signal receiving module includes an analog conditioning module, an echo acquisition module and an ultrasonic thickness gauge probe interface II; the analog conditioning module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface II; the echo acquisition module is connected to the analog conditioning module, and both the echo acquisition module and the analog conditioning module are connected to the main control module; the ultrasonic data storage module includes a real-time clock module and an SD card storage module; the real-time clock module and the SD card storage module are both connected to the main control module.

2. A high-precision portable ultrasonic thickness gauge according to claim 1, characterized in that: The main control module adopts a separate FPGA+ARM architecture. The core chip of FPGA is EG4S20BG256, and the core chip of ARM is GD32F407VGT6. The data transmission between FPGA and ARM uses EXMC bus, and the instruction transmission uses UATR bus.

3. A high-precision portable ultrasonic thickness gauge according to claim 2, characterized in that: The high-voltage pulse excitation module includes an isolation module, a PWM drive module, a high-voltage DC module, and a pulse excitation module; The isolation module is connected to the main control module via the GPIO interface of the FPGA, the PWM drive module is connected to the isolation module, the high-voltage DC module is connected to the main control module via the GPIO interface of the FPGA, the PWM drive module and the high-voltage DC module are both connected to the pulse excitation module, and the pulse excitation module is connected to the ultrasonic thickness gauge probe interface I.

4. The high-precision portable ultrasonic thickness gauge according to claim 1, characterized in that: The analog conditioning module includes a limiting module, a preamplifier module, a bandpass filter module, a post-amplifier module, and an output module; the limiting module is connected to the ultrasonic thickness gauge probe via the ultrasonic thickness gauge probe interface II, the preamplifier module is connected to the limiting module, the bandpass filter module is connected to the preamplifier module, the main control module and the bandpass filter module are both connected to the post-amplifier module, and the post-amplifier module and the echo acquisition module are both connected to the output module.

5. A high-precision portable ultrasonic thickness gauge according to claim 4, characterized in that: The post-amplification module includes a DA module, a voltage inversion module, and a variable gain amplifier module; the DA module is connected to the FPGA of the main control module via the SPI bus, the voltage inversion module is connected to the DA module, and the voltage inversion module, output module, and bandpass filter module are all connected to the variable gain amplifier module.

6. A high-precision portable ultrasonic thickness gauge according to claim 4, characterized in that: The echo acquisition module includes a signal attenuation module, a signal conversion module, and an A / D acquisition module; the signal attenuation module is connected to the output module, the signal conversion module is connected to the signal attenuation module, and the FPGA of the signal conversion module and the main control module are both connected to the A / D acquisition module.

7. The high-precision portable ultrasonic thickness gauge according to claim 2, characterized in that: The real-time clock module is connected to the FPGA of the main control module via the IIC bus, and the SD card storage module is connected to the FPGA of the main control module via the SDIO bus.

8. The high-precision portable ultrasonic thickness gauge according to claim 2, characterized in that: It also includes an HMI touch display screen, which is connected to the ARM of the main control module via the UATR bus.

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