PCB (Printed Circuit Board) test fixture with anti-lamination function

Abstract

The utility model relates to a PCB (Printed Circuit Board) test fixture with an anti-lamination function. The PCB test fixture comprises a first board body, a second board body, a plurality of first anti-lamination probes, a plurality of second anti-lamination probes and a test assembly, the first plate body and the second plate body are arranged in an aligned and covering manner, the first anti-overlapping probes are arranged on the first plate body, the second anti-overlapping probes are arranged on the second plate body, each first anti-overlapping probe is aligned with the corresponding second anti-overlapping probe, the testing assembly is arranged on the first plate body, and the testing assembly is arranged on the second plate body. The height of the test assembly is equal to that of the first anti-overlapping probe on the first plate body. Through the PCB test fixture with the anti-lamination function, the condition of lamination during test can be prevented, so that the condition of missing test or test error of the PCB is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board testing fixtures, in particular to a PCB board testing fixture with an anti-stacked board function. Background Art

[0002] A PCB (Printed Circuit Board) test fixture is a piece of auxiliary equipment specifically designed to test and inspect PCB functionality, power calibration, lifespan, and performance. It's typically placed at the end of the production process to verify the integrity of PCB functionality. This test fixture ensures that the PCB's electrical conductivity, soldering quality, and overall performance meet design requirements, thereby improving shipping quality.

[0003] Existing PCB test jigs are typically placed in automated equipment to test the electrical conductivity of PCBs. However, when automated equipment picks up PCBs, it can sometimes load two or more PCBs onto the jig at once. However, PCB test jigs can only test one PCB at a time. When multiple PCBs are placed on the jig simultaneously, stacked PCBs may be missed or errors may occur. Utility Model Content

[0004] Based on this, it is necessary to provide a PCB board test fixture with an anti-stack function.

[0005] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A PCB board test fixture with an anti-overlapping board function includes: a first plate body, a second plate body, a plurality of first anti-overlapping probes, a plurality of second anti-overlapping probes and a test component; the first plate body is aligned and covered with the second plate body, each first anti-overlapping probe is arranged on the first plate body, each second anti-overlapping probe is arranged on the second plate body, each first anti-overlapping probe is aligned with a second anti-overlapping probe, the test component is arranged on the first plate body, and the test component and the first anti-overlapping probe are at the same height on the first plate body.

[0006] In one embodiment, the test assembly includes: a test probe and a mounting seat, the mounting seat is arranged on the first plate, and the test probe is detachably mounted on the mounting seat.

[0007] In one embodiment, the mounting base is provided with a threaded hole, a first thread is provided on the inner wall of the threaded hole, a second thread is provided at one end of the test probe, the end of the test probe having the second thread is inserted into the threaded hole, and the first thread is threadedly connected to the second thread.

[0008] In one embodiment, the end of the test probe away from the mounting base is configured as a round head.

[0009] In one embodiment, each of the first anti-overlapping probes is disposed at four edges and a middle position of the first plate, and each of the second anti-overlapping probes is disposed at four edges and a middle position of the second plate.

[0010] In one embodiment, the first anti-overlapping probes disposed at the four edges of the first plate are equidistantly spaced, and the second anti-overlapping probes disposed at the four edges of the second plate are equidistantly spaced.

[0011] In one embodiment, positioning posts are respectively provided at the four corners of the first plate body, and positioning holes are respectively opened at the four corners of the second plate body. When the second plate body is covered on the first plate body, each positioning post is inserted into one of the positioning holes.

[0012] In one embodiment, the first plate and the second plate have the same cross-sectional shape.

[0013] The beneficial effects of the present invention are as follows: the present invention provides a PCB board test fixture with an anti-overlapping function, wherein a first anti-overlapping probe is provided on a first plate body and a second anti-overlapping probe is provided on a second plate body, and each first anti-overlapping probe on the first plate body is aligned one by one with each second anti-overlapping probe on the second plate body. When a PCB board is placed on the first plate body, the second plate body is then used to cover the first plate body. At this time, the first anti-overlapping probe abuts one side of the PCB board, and the second anti-overlapping probe abuts the other side of the PCB board. Because the first probe and the second probe are aligned, the thickness of a single location on the PCB board can be measured using the first and second probes at the same position. By providing multiple first probes and multiple second probes, the thickness of multiple locations on the PCB board can be measured, thereby improving the accuracy of the measured PCB board thickness. When the measured PCB board thickness exceeds a preset value, that is, when more than two PCB boards are placed on the PCB board test fixture with an anti-overlapping function, the test automation equipment will stop working and issue an alarm to alert the user. The PCB test fixture with the anti-stack function can prevent the occurrence of stacked boards during testing, thereby avoiding the occurrence of PCB board omissions or test errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 A schematic diagram of the three-dimensional structure of a PCB test fixture with an anti-stacked board function in one embodiment;

[0016] Figure 2 In one embodiment Figure 1 Schematic diagram of the locally enlarged structure of part A.

[0017] In the accompanying drawings, 10 is a PCB board test fixture with anti-overlapping function; 100 is a first board body; 110 is a first anti-overlapping probe; 120 is a positioning column; 200 is a second board body; 210 is a second anti-overlapping probe; 220 is a positioning hole; 300 is a test component; 310 is a test probe; 311 is a first thread; 320 is a mounting seat; 321 is a threaded hole; 322 is a second thread. DETAILED DESCRIPTION

[0018] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The following will further describe the technical solution of the present invention in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.

[0019] It should be understood that the same or similar reference numerals in the drawings of the embodiments correspond to the same or similar components. In the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom", etc. indicating an orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to the specific circumstances.

[0020] In one embodiment, Figure 1 and Figure 2As shown, a PCB board test fixture 10 with an anti-overlapping board function includes: a first board body 100, a second board body 200, a plurality of first anti-overlapping probes 110, a plurality of second anti-overlapping probes 210 and a test component 300; the first board body 100 and the second board body 200 are aligned and covered, each first anti-overlapping probe 110 is set on the first board body 100, each second anti-overlapping probe 210 is set on the second board body 200, each first anti-overlapping probe 110 is aligned with a second anti-overlapping probe 210, the test component 300 is set on the first board body 100, and the test component 300 and the first anti-overlapping probe 110 are at the same height on the first board body 100.

[0021] Specifically, the test assembly 300 provided on the first board 100 is used to test the electrical conductivity of a PCB. The first anti-overlapping probes 110 are provided on the first board 100, and the second anti-overlapping probes 210 are provided on the second board 200. Each of the first anti-overlapping probes 110 on the first board 100 is aligned with each of the second anti-overlapping probes 210 on the second board 200. After the PCB is placed on the first board 100 and then covered with the second board 200, the first anti-overlapping probes 110 abut against one side of the PCB, while the second anti-overlapping probes 210 abut against the other side. Since the first and second probes are aligned, the thickness of a single location on the PCB can be measured using the first and second probes at the same location. By providing multiple first and second probes, the thickness of multiple locations on the PCB can be measured, thereby improving the accuracy of the measured thickness. If the measured PCB thickness exceeds a preset value, i.e., if two or more PCBs are placed on the PCB test jig 10 with anti-stacking functionality, the automated test equipment will stop and sound an alarm to alert the user. This prevents stacking during testing, thereby avoiding missed PCB tests or test errors.

[0022] In this embodiment, contact-type thickness measurement is performed by arranging any one of an inductive displacement sensor, a capacitive displacement sensor, a potentiometer displacement sensor, and a Hall-type displacement sensor on the first anti-overlapping probe 110 and the second anti-overlapping probe 210 .

[0023] In order to facilitate the replacement of different test probes 310, in one embodiment, as shown in FIG. Figure 2As shown, the test assembly 300 includes a test probe 310 and a mounting base 320. The mounting base 320 is disposed on the first plate 100, and the test probe 310 is detachably mounted on the mounting base 320. Specifically, the mounting base 320 is fixedly mounted on the first plate 100. By detachably mounting the test probe 310 on the mounting base 320, the test probe 310 can be easily removed from the mounting base 320 for replacement when a better test probe 310 is needed. In this embodiment, the detachable mounting method can be a threaded connection, a snap-fit ​​connection, a bolted connection, or the like.

[0024] In order to facilitate the replacement of different test probes 310, in one embodiment, as shown in FIG. Figure 2 As shown, the mounting base 320 is provided with a threaded hole 321, and a first thread 311 is provided on the inner side wall of the threaded hole 321. A second thread 322 is provided at one end of the test probe 310. The end of the test probe 310 having the second thread 322 is inserted into the threaded hole 321, and the first thread 311 and the second thread 322 are screwed together. Specifically, the threaded hole 321 is a through hole. The threaded hole 321 is configured as a through hole to facilitate the passage of the wires to be connected to the test probe 310. By providing the second thread 322 on the test probe 310 and the first thread 311 on the inner side wall of the threaded hole 321 on the mounting base 320, the test probe 310 can be fixed to the mounting base 320 by threaded connection, thereby facilitating the installation or removal of the test probe 310 on the mounting base 320.

[0025] In order to protect the PCB board, in one embodiment, Figure 2 As shown, the end of the test probe 310 away from the mounting base 320 is configured as a rounded head. Specifically, by configuring the end of the test probe 310 away from the mounting base 320 as a rounded head, that is, the end of the test probe 310 that contacts the PCB is configured as a rounded head. When the rounded-headed test probe 310 contacts the exposed copper area of ​​the PCB, the contact area is larger and the pressure is smaller, thereby ensuring that the test probe 310 minimizes damage to the exposed copper area of ​​the PCB when contacting the exposed copper area of ​​the PCB.

[0026] In order to accurately measure the thickness of the PCB board, in one embodiment, Figure 1As shown, the first anti-overlap probes 110 are positioned at the edges and center of the first board 100, and the second anti-overlap probes 210 are positioned at the edges and center of the second board 200. Specifically, only one first anti-overlap probe 110 is positioned at the center of the first board 100, and only one second anti-overlap probe 210 is positioned at the center of the second board 200. These first and second anti-overlap probes 110 and 210 can accurately measure the thickness of the PCB while effectively avoiding contact with exposed copper areas on the PCB, thus minimizing the impact on the conductivity of the PCB by the test probes 310.

[0027] In order to more accurately measure the thickness of the PCB board, in one embodiment, Figure 1 As shown, the first anti-overlapping probes 110 are spaced evenly along the four edges of the first board 100, and the second anti-overlapping probes 210 are spaced evenly along the four edges of the second board 200. Specifically, this arrangement accurately measures the thickness of the four edges of the PCB. Combined with the thickness of the PCB's center measured by the first and second anti-overlapping probes 110 and 210, the thickness of the PCB can be more accurately calculated.

[0028] In order to facilitate the alignment and covering of the first plate 100 and the second plate 200, in one embodiment, as shown in FIG. Figure 1 As shown, positioning posts 120 are provided at the four corners of the first plate 100, and positioning holes 220 are provided at the four corners of the second plate 200. When the second plate 200 is overlapped with the first plate 100, each positioning post 120 is inserted into one of the positioning holes 220. Specifically, the height of the first positioning post 120 on the first plate 100 is greater than the first anti-overlap probe 110 and the test assembly 300. When the first plate 100 and the second plate 200 are overlapped, the first plate 100 and the second plate 200 are accurately overlapped by first aligning one end of the positioning post 120 and inserting it into the positioning hole 220, and then slowly inserting the positioning post 120 into the positioning opening.

[0029] In one embodiment, Figure 1 As shown, the cross-sectional shapes of the first plate 100 and the second plate 200 are the same. Specifically, through the above arrangement, only one mold is needed to produce the first plate 100 and the second plate 200, thereby saving the production costs of the first plate 100 and the second plate 200.

[0030] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. A person skilled in the art will be able to make other variations or modifications based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A PCB test fixture with anti-stack function, characterized in that: include: A first plate body, a second plate body, a plurality of first anti-overlapping probes, a plurality of second anti-overlapping probes and a test assembly; The first plate body is aligned and overlapped with the second plate body, each first anti-overlapping probe is set on the first plate body, each second anti-overlapping probe is set on the second plate body, each first anti-overlapping probe is aligned with a second anti-overlapping probe, the test component is set on the first plate body, and the test component and the first anti-overlapping probe are at the same height on the first plate body.

2. The PCB test fixture with anti-stack function according to claim 1, characterized in that: The test assembly includes: a test probe and a mounting seat. The mounting seat is arranged on the first plate body, and the test probe is detachably mounted on the mounting seat.

3. The PCB test fixture with anti-stack function according to claim 2, characterized in that: The mounting seat is provided with a threaded hole, the inner side wall of the threaded hole is provided with a first thread, one end of the test probe is provided with a second thread, the end of the test probe with the second thread is inserted into the threaded hole, and the first thread is screwed to the second thread.

4. The PCB test fixture with anti-stack function according to claim 2, characterized in that: One end of the test probe away from the mounting seat is configured as a round head.

5. The PCB test fixture with anti-stack function according to claim 1, characterized in that: The first anti-overlapping probes are arranged at the four edges and the middle of the first plate, and the second anti-overlapping probes are arranged at the four edges and the middle of the second plate.

6. The PCB test fixture with anti-stacked board function according to claim 5, characterized in that: The first anti-overlapping probes arranged at the four edges of the first plate body are equidistantly spaced, and the second anti-overlapping probes arranged at the four edges of the second plate body are equidistantly spaced.

7. The PCB test fixture with anti-stacked board function according to claim 1, characterized in that: Positioning posts are respectively provided at the four corners of the first plate body, and positioning holes are respectively opened at the four corners of the second plate body. When the second plate body covers the first plate body, each positioning post is inserted into one of the positioning holes.

8. The PCB test fixture with anti-stacked board function according to any one of claims 1 to 7, characterized in that: The cross-sectional shapes of the first plate body and the second plate body are the same.

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