High-voltage anti-flashover chip capacitor

Abstract

The utility model relates to a high-voltage anti-flashover chip capacitor, which comprises a main body part and external electrodes arranged at two ends of the main body part, internal electrodes which are distributed in a staggered manner are arranged in the upper part of the main body part; and a hollow part is formed at the lower part of the main body part so as to reduce the contact area with a circuit board during installation. According to the utility model, the hollow part is arranged, so that the contact area between the chip capacitor and the circuit board is reduced when the chip capacitor is installed, welding flux / impurities are prevented from being clamped between the chip capacitor and the circuit board, the generation of electric arcs during high voltage is avoided, and even if the welding flux / impurities are left on the circuit board, the distance between the hollow part and the upper surface of the circuit board is increased due to the hollow part; the difficulty of arc generation is increased; and on the other hand, no internal electrode is arranged in the supporting part, so that when internal cracks are caused by relatively large stress or relatively high temperature borne by the chip capacitor, short circuit cannot be formed, and normal work of the chip capacitor is ensured.

Description

Technical Field

[0001] The utility model relates to the field of tooling, in particular to a high-voltage arc-proof chip capacitor. Background Art

[0002] As one of the most widely used capacitors at present, chip capacitors are widely used in various circuit boards and electronic devices due to their advantages such as wide capacity range, small size, low equivalent series resistance, high rated voltage and non-polarity.

[0003] However, in some high-voltage environments, the two ends of the chip capacitor are soldered to the circuit board. The bottom of the chip capacitor is in close contact with the circuit board, making it difficult to clean after soldering. Solder or impurities may remain, causing arcing / flashover in the high-voltage environment and affecting product quality. Utility Model Content

[0004] In order to solve the above problems in the prior art, the utility model provides a high-voltage arc-proof chip capacitor.

[0005] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0006] A high-voltage arc-proof chip capacitor comprises a main body and external electrodes arranged at both ends of the main body; internal electrodes are arranged in a staggered manner inside the upper part of the main body; and a hollow portion is formed in the lower part of the main body to reduce the contact area with the circuit board during installation.

[0007] Furthermore, the main body is formed by stacking ceramic dielectric diaphragms with printed internal electrodes in a staggered manner.

[0008] Furthermore, the internal electrode exists only on the upper portion of the main body.

[0009] Furthermore, both ends of the lower portion of the main body extend downward to form support portions; a hollow portion is formed between the two support portions.

[0010] Furthermore, no internal electrode is provided in the support portion.

[0011] Furthermore, the outer end surface of the support portion is connected to the external electrode.

[0012] Furthermore, the external electrodes are two end electrodes of the chip capacitor.

[0013] The beneficial effects of the present invention are as follows: by providing a hollow portion, the contact area between the chip capacitor and the circuit board during installation is reduced, thereby preventing solder / impurities from being clamped between the chip capacitor and the circuit board, and avoiding the generation of arcs during high voltage. Even if solder / impurities remain on the circuit board, the hollow portion increases the distance from the upper surface of the circuit board, making it more difficult for an arc to be generated. On the other hand, since no internal electrode is provided inside the supporting portion, when the chip capacitor develops internal cracks due to high stress, an open circuit will be formed instead of a short circuit, which will not cause leakage or even circuit board burning, thereby ensuring the safety of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0015] Figure 1 It is a schematic diagram of the structure of a chip capacitor in the prior art;

[0016] Figure 2 It is a schematic diagram of the structure of the utility model;

[0017] Description of reference numerals:

[0018] 100 , main body; 101 , crack; 110 , external electrode; 120 , internal electrode; 121 , ceramic dielectric diaphragm; 130 , support portion; 140 , hollow portion; 200 , circuit board; 210 , solder. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the utility model for which protection is sought, but merely represents the selected embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0020] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model in specific circumstances.

[0022] Example:

[0023] The inventors have discovered that in some high-voltage environments, the two ends of the chip capacitor are soldered to the circuit board 200 via solder 210, and the bottom of the chip capacitor is in close contact with the circuit board 200. Furthermore, cleaning after soldering is completed may be difficult, and solder 210 or impurities may remain. The close contact and impurities that are difficult to remove may cause arcing / flashover in high-voltage environments, affecting product quality. Furthermore, current chip capacitors are prone to short circuits when subjected to collisions or high stress, resulting in leakage and even burning of the circuit board 200. Short circuits typically occur when cracks 101 form inside the soldered portion under high stress, and the cracks 101 penetrate multiple internal electrodes 120, causing a short circuit.

[0024] The so-called chip capacitor, the full name is: Multilayer Ceramic Capacitor (MLCC), also known as ceramic chip capacitor. It is made of ceramic dielectric diaphragms 121 (i.e. dielectric plates) with printed electrodes (i.e. internal electrodes 120) stacked in a staggered manner. After a one-time high-temperature sintering to form a ceramic chip, a metal layer (i.e. external electrodes 110) is then sealed at both ends of the chip to form a structure similar to a monolithic stone, hence the name monolithic capacitor.

[0025] Generally, a composite perovskite dielectric ceramic powder, typically made from barium titanate (BaTiO3), is mixed with a binder, solvent, and related additives to create a slurry. This is then formed into a green ceramic film by rolling, extrusion, or tape casting. The film is then dried, printed with internal electrodes (120°C), laminated, cut, sintered, coated with end electrodes, and finally fired. The firing temperature ranges from 880°C to 1300°C. Chip capacitors are available in resin-encapsulated versions with leads or bare, unencapsulated, block-shaped versions without leads. Chip capacitors are widely used as external components in printed circuits and thick-film hybrid integrated circuits. They are currently used in a variety of applications, including aircraft, shipboard, automotive, radar, communications, marine, medical equipment, power supplies, and precision instruments.

[0026] The current structure of traditional ceramic chip capacitors refers to Figure 1 As shown, the two ends of the chip capacitor are external electrodes 110, and the core part is made of a ceramic dielectric diaphragm 121 with an internal electrode 120 printed on it, which is stacked in a staggered manner. The external electrode 110 is used for welding, the internal electrode 120 is used to store charge, and the ceramic dielectric diaphragm 121 serves as a dielectric. When the chip capacitor is soldered on the circuit board 200, the external electrode 110 is fixedly connected to the circuit board 200 after being soldered with solder 210. When the stress increases, it will produce the following Figure 1 The crack 101 shown by the dotted line penetrates through the plurality of internal electrodes 120 , thereby causing a short circuit.

[0027] In response to the above problems, the inventor creatively proposed the chip capacitor of the present utility model, such as Figure 2 As shown, a high-voltage arc prevention chip capacitor includes a main body 100 and external electrodes 110 arranged at both ends of the main body 100; the interior of the upper part of the main body 100 is provided with staggered internal electrodes 120; the lower part of the main body 100 is formed with a hollow portion 140 to reduce the contact area with the circuit board 200 during installation; by providing the hollow portion 140, the contact area between the chip capacitor and the circuit board 200 is reduced during installation, thereby avoiding the solder 210 / impurities from being clamped between the chip capacitor and the circuit board 200, avoiding the generation of arcs at high voltage, even if the solder 210 / impurities remain on the circuit board 200, since the hollow portion 140 raises the distance from the upper surface of the circuit board 200, it increases the difficulty of arc generation, effectively solving the problem of high-voltage arcing; in one embodiment, the hollow portion 140 can be as Figure 2 A long strip is provided in the middle, and the whole is a rectangular parallelepiped, which is convenient for production and processing, and has a large spacing space, and has a good anti-flashover effect; in another embodiment, the hollow portion 140 can also be provided as a plurality of hollow portions 140 arranged at intervals. Compared with the previous embodiment, due to the limited reduction in contact area, its anti-flashover ability is weaker than that of the previous embodiment;

[0028] In one embodiment, the internal electrode 120 only exists in the upper part of the main body 100; the two ends of the lower part of the main body 100 extend downward to form a support part 130; a hollow part 140 is formed between the two support parts 130; the internal electrode 120 is not provided in the support part 130; through this structural setting, when the chip capacitor is subjected to stress and an internal crack 101 is generated, the position where the crack 101 is generated only penetrates a single internal motor or does not cause a short circuit of the internal electrode 120, forming an open circuit structure, so that a short circuit will not occur, causing leakage or even burning of the circuit board 200 and other adverse conditions; since the internal electrode 120 is not provided inside the support part 130, the support part 130 raises the height of the chip capacitor, and the area where the crack 101 is generated is limited to the support part 130 where the internal electrode 120 is not provided. Figure 2 The position of the middle dotted line avoids the short circuit of the chip capacitor when it is subjected to external stress; in one embodiment, the outer end surface of the support part 130 is connected to the external electrode 110. Through this structure, the structure of the support part 130 can be strengthened by the external electrode 110; the external electrode 110 is the two end electrodes of the chip capacitor.

[0029] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the description and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A high-voltage arc protection chip capacitor, characterized by: The invention comprises a main body (100) and external electrodes (110) arranged at both ends of the main body (100); internal electrodes (120) are arranged in a staggered manner inside the upper part of the main body (100); and a hollow portion (140) is formed at the lower part of the main body (100) to reduce the contact area with the circuit board (200) during installation.

2. The high-voltage arc protection chip capacitor according to claim 1, characterized in that: The main body (100) is formed by stacking ceramic dielectric diaphragms (121) with printed internal electrodes (120) in a staggered manner.

3. The high-voltage arc protection chip capacitor according to claim 2, characterized in that: The internal electrode (120) exists only on the upper portion of the main body (100).

4. The high-voltage arc protection chip capacitor according to claim 1, characterized in that: Both ends of the lower portion of the main body (100) extend downward to form support portions (130); a hollow portion (140) is formed between the two support portions (130).

5. The high-voltage arc protection chip capacitor according to claim 4, characterized in that: No internal electrode (120) is provided in the support portion (130).

6. The high-voltage arc protection chip capacitor according to claim 4, characterized in that: The outer end surface of the support portion (130) is connected to the external electrode (110).

7. The high-voltage arc protection chip capacitor according to claim 1, characterized in that: The external electrodes (110) are two terminal electrodes of the chip capacitor.

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