Packaging assembly and packaging module

Abstract

The utility model discloses a packaging assembly and a packaging module, the packaging assembly comprises a substrate and a box dam which are stacked, and the substrate is provided with a metal layer; at least one of the metal layer and the box dam is provided with a positioning part, the base plate and the box dam are positioned through the positioning part, a sealing connecting layer is arranged between the box dam and the metal layer, and the sealing connecting layer is connected with the box dam and the metal layer in a sealing mode so as to fix the box dam and the base plate in a sealing mode. The packaging assembly and the packaging module provided by the utility model are used for simplifying the positioning process between the box dam and the substrate and ensuring the air tightness of the packaging assembly.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging, in particular to a packaging component and a packaging module. Background Art

[0002] Packages are used to encapsulate electronic components such as chips. They typically consist of a substrate and a dam. A metal layer is formed on the substrate's surface. The dam is connected to the substrate, and together they enclose a space for accommodating the electronic component. The metal layer exposed within this space is connected to the electronic component.

[0003] When installing the dam and the substrate, it is necessary to ensure that the connection position of the dam and the substrate is accurate. When installing the dam and the substrate in the existing method, the placement position of the dam on the substrate is first found through a visual alignment device, and then the dam and the substrate are sealed and welded. This alignment method is relatively complicated and has high requirements for the welding of the dam and the substrate. Patent No. CN211182238U discloses another alignment method in which the outer contour of the metal layer is retracted into the outer contour of the dam, the outer edge protrusion of the dam is formed to abut against the outer edge of the metal layer and the metal layer is located in the groove surrounded by the outer edge protrusion to position the dam and the substrate; then the dam and the portion of the substrate where the metal layer is not provided are welded and fixed. This positioning method may cause water vapor to flow from between the dam and the metal layer into the interior of the packaging component, resulting in poor airtightness of the packaging component. Utility Model Content

[0004] The purpose of the utility model is to provide a packaging component and a packaging module, which are used to simplify the positioning process between the dam and the substrate and ensure the airtightness of the packaging component.

[0005] The purpose of this utility model is achieved by the following technical solutions:

[0006] A packaging component includes a stacked substrate and a dam, wherein the substrate is provided with a metal layer; at least one of the metal layer and the dam is provided with a positioning portion, and the substrate and the dam are positioned by the positioning portion; a sealing connection layer is provided between the dam and the metal layer, and the sealing connection layer is respectively sealed to the dam and the metal layer to seal and fix the dam and the substrate.

[0007] Preferably, the positioning portion includes a first positioning portion formed by the metal layer and a second positioning portion provided on the dam, and the first positioning portion and the second positioning portion cooperate to form a positioning reference to position the dam when the dam is connected to the substrate.

[0008] Preferably, the sealing connection layer is formed at least at a connection between the first positioning portion and the second positioning portion to seal and fix the dam and the metal layer of the substrate.

[0009] Preferably, the metal layer is provided with a flat surface on a side facing the dam, and the first positioning portion is a protrusion protruding from the flat surface toward the dam along the stacking direction, or a groove recessed away from the dam; the dam includes a connecting end surface facing the metal layer, and the second positioning portion is correspondingly provided as a groove recessed away from the metal layer along the stacking direction, or a protrusion protruding toward the metal layer, from the connecting end surface.

[0010] Part of the sealing connection layer is arranged between the flat surface and the connection end surface to seal the connection between the flat surface and the connection end surface, and part of the sealing connection layer is arranged between the first positioning portion and the second positioning portion to seal the connection between the first positioning portion and the second positioning portion.

[0011] Preferably, the second positioning portion is arranged in the middle of the dam and is spaced apart from the outer edge of the dam, or the second positioning portion is arranged at the edge of the dam; the outer edge of the metal layer exceeds the outer edge of the dam, and the side of the dam facing the substrate is entirely located in the metal layer.

[0012] Preferably, the positioning portion includes a third positioning portion arranged on the metal layer, and the third positioning portion abuts against the inner edge or outer edge of the dam to position the dam when the dam is connected to the substrate; at least part of the sealing connection layer is arranged between the dam and the metal layer along the stacking direction.

[0013] Preferably, part of the sealing connection layer is arranged between the dam and the metal layer along the stacking direction, and part of the sealing connection layer is arranged between the third positioning portion and the dam.

[0014] Preferably, the substrate is connected to an electronic component, the dam and the substrate form an installation space for accommodating the electronic component, and part of the metal layer of the substrate is exposed in the installation space and is used to connect with the electronic component;

[0015] And / or, the dam is an alloy dam, and the sealing connection layer is a solder layer.

[0016] Preferably, it further comprises an upper cover plate, wherein the upper cover plate and the base plate are located on opposite sides of the dam and are used to block the openings on opposite sides of the dam to seal the installation space;

[0017] And / or, the dam is a Kovar alloy dam, and the sealing connection layer is a gold-tin alloy layer.

[0018] A packaging module, comprising:

[0019] Any of the above packaging components;

[0020] An electronic component is packaged in the packaging assembly, and the electronic component is connected to the metal layer of the substrate.

[0021] Compared with the prior art, the beneficial effects of the present invention include at least:

[0022] By setting a positioning part to achieve positioning between the substrate and the dam, there is no need to use a visual alignment device to find the installation position, which is convenient to operate and can simplify the positioning process between the dam and the substrate; by setting a sealing connection layer between the dam and the metal layer to seal the dam and the metal layer, the sealing performance between the dam and the substrate can be enhanced to ensure the airtightness of the packaging component. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a cross-sectional view of the packaging assembly of Example 1 of the present utility model;

[0024] Figure 2 This is an exploded schematic diagram of some components of the packaging assembly of Example 1 of the present utility model;

[0025] Figure 3 It is a top view of some components of the packaging assembly of Example 1 of the present utility model;

[0026] Figure 4 is a cross-sectional view of some components of the packaging assembly of Example 1 of the present utility model in another structure;

[0027] Figure 5 This is an exploded schematic diagram of some components of the packaging assembly of Example 1 of the present utility model in another structure;

[0028] Figure 6 is a cross-sectional view of some components of the packaging assembly of Example 2 of the present utility model;

[0029] Figure 7 It is a schematic diagram of the exploded view of some components of the packaging assembly of Example 2 of the present utility model.

[0030] In the figure: 1. substrate; 11. metal layer; 111. first positioning portion; 112. flat surface; 113. third positioning portion; 2. dam; 21. second positioning portion; 22. connection end surface; 3. sealing connection layer; 4. upper cover; 5. installation space; 6. positioning portion. DETAILED DESCRIPTION

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make this disclosure more comprehensive and complete and to fully convey the concepts of the example embodiments to those skilled in the art. Identical reference numerals in the figures denote identical or similar structures, and thus repeated descriptions thereof will be omitted.

[0032] The words expressing positions and directions described in this utility model are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of this utility model.

[0033] Example 1

[0034] like Figure 1 As shown, the present invention provides a packaging assembly, including a substrate 1 , a dam 2 , and a sealing connection layer 3 , and may also include an upper cover plate 4 .

[0035] The substrate 1 is provided with a metal layer 11. The metal layer 11 can be used to connect with electronic components (not shown). The metal layer 11 can be provided only on the surface of the substrate 1 facing the dam 2, or the metal layer 11 can be provided on the surface of the substrate 1 facing the dam 2 and the surface facing away from the dam 2. The outer edge of the metal layer 11 exceeds the outer edge of the dam 2, and the side of the dam 2 facing the substrate 1 is entirely located in the metal layer 11. The metal layer 11 formed on the surface of the substrate 1 facing the dam 2 is used to connect with electronic components and can be used for a sealed connection with the dam 2. The metal layer 11 formed on the surface of the substrate 1 away from the dam 2 can be used to connect with external circuits or other electronic components. The metal layer 11 can be formed by plating by electroplating, chemical plating, vacuum plating, etc., and the metal layer 11 can specifically be a copper layer. The substrate 1 can specifically be a ceramic substrate 1. Reference Figure 1 and Figure 3 The dam 2 is stacked with the substrate 1 and is sealed and fixedly connected to the substrate 1. The dam 2 and the substrate 1 together enclose an installation space 5 for accommodating electronic components. Part of the metal layer 11 of the substrate 1 is exposed in the installation space 5 and can be connected to the electronic components, for example, by welding. The electronic components are components that need to be packaged, and the electronic components can specifically be chips. The dam 2 can be an alloy dam, and specifically a Kovar alloy dam. Kovar alloy, also known as a constant expansion alloy, has a low thermal expansion coefficient and good welding performance.

[0036] Reference Figure 1The dam 2 and the substrate 1 can be sealed and fixedly connected by sealing and fixing the dam 2 and the metal layer 11 of the substrate 1 with a sealing connection layer 3, thereby achieving a sealed and fixed connection between the dam 2 and the substrate 1. Specifically, the sealing connection layer 3 is disposed between the dam 2 and the metal layer 11 of the substrate 1, and the sealing connection layer 3 can achieve a sealed and fixed connection with the dam 2 and the metal layer 11, respectively, thereby achieving a sealed and fixed connection between the dam 2 and the substrate 1. The sealing connection layer 3 can be a solder layer, through which the dam 2 and the metal layer 11 of the substrate 1 are soldered and fixed. The solder layer can be a solder containing tin, silver, or a copper alloy. After the solder layer is disposed between the dam 2 and the substrate 1, it is heated in a brazing furnace to melt the solder. Alternatively, the solder layer can be a gold-tin alloy layer. After the solder layer is disposed between the dam 2 and the substrate 1, it is heated on a heating platform to melt the solder layer. In other embodiments, the sealing connection layer 3 can also be other structures that can achieve a sealed connection, for example, the sealing connection layer 3 can be an adhesive layer.

[0037] When the dam 2 is connected to the substrate 1, the connection area between the dam 2 and the metal layer 11 of the substrate 1 is large. By setting the sealing connection layer 3 between the dam 2 and the metal layer 11 of the substrate 1, the sealing area between the dam 2 and the metal layer 11 of the substrate 1 can be increased, thereby enhancing the sealing performance between the dam 2 and the substrate 1 and ensuring the airtightness of the packaging component.

[0038] The upper cover plate 4, dam 2, and substrate 1 are stacked in sequence. The upper cover plate 4 and substrate 1 are located on opposite sides of the dam 2 to seal the openings on opposite sides of the dam 2. The upper cover plate 4, substrate 1, and dam 2 seal the mounting space 5 for mounting electronic components. The upper cover plate 4 is typically made of glass. However, the use of a Kovar alloy dam in this application minimizes the difference in thermal expansion coefficient between the dam 2 and the upper cover plate 4, improving the packaging performance of the package assembly.

[0039] To facilitate positioning of the dam 2 when connecting the substrate 1 and the dam 2, a positioning portion 6 is provided on at least one of the metal layer 11 of the substrate 1 and the dam 2. When the substrate 1 and dam 2 need to be connected, the positioning portion 6 serves as a positioning reference to limit the relative position between the substrate 1 and the dam 2, thereby positioning the dam 2 during connection. This allows the dam 2 to be quickly and accurately installed on the substrate 1 without the need for a visual alignment device to locate the installation position, thus simplifying the positioning process between the dam 2 and the substrate 1.

[0040] Reference Figure 2 、 Figure 3 and Figure 5In some specific embodiments, the positioning portion 6 includes a first positioning portion 111 formed by the metal layer 11 and a second positioning portion 21 provided on the dam 2. The first positioning portion 111 and the second positioning portion 21 cooperate in a concave-convex manner to limit the relative position of the dam 2 and the substrate 1 during connection, thereby positioning the dam 2 during connection and improving the positioning accuracy between the substrate 1 and the dam 2. A sealing connection layer 3 is formed at least at the junction of the first positioning portion 111 and the second positioning portion 21 to seal and secure the connection between the dam 2 and the metal layer 11 of the substrate 1. The concave-convex cooperation between the first positioning portion 111 and the second positioning portion 21 increases the area of ​​the joint between the first positioning portion 111 and the second positioning portion 21. As a result, the area of ​​the joint between the first positioning portion 111 and the second positioning portion 21 is larger. By providing the sealing connection layer 3 at the junction between the first positioning portion 111 and the second positioning portion 21, the sealing area of ​​the sealing connection layer 3 is increased, thereby enhancing the sealing and securing effect and bonding stability between the dam 2 and the metal layer 11. In addition, the concave and convex parts form a curved structure, which can also block the flow of water vapor and further improve the airtightness of the packaging component.

[0041] The metal layer 11 has a flat surface 112 on the side facing the dam 2, and the first positioning portion 111 is formed on the flat surface 112. The dam 2 has a connecting end surface 22 on the side facing the metal layer 11, and the second positioning portion 21 is formed on the connecting end surface 22.

[0042] In some embodiments, reference Figure 2 and Figure 5 The first positioning portion 111 is a protrusion extending from the flat surface 112 toward the dam 2 along the stacking direction. The second positioning portion 21 is correspondingly configured as a groove recessed from the connection end surface 22 along the stacking direction away from the metal layer 11. The second positioning portion 21 is used to accommodate the first positioning portion 111. At least a portion of the sealing connection layer 3 is disposed between the wall forming the second positioning portion 21 and the surface of the first positioning portion 111 to ensure a sealed and fixed connection between the wall forming the second positioning portion 21 and the surface of the first positioning portion 111.

[0043] Alternatively, the first positioning portion 111 may be a groove recessed from the flat surface 112 away from the dam 2, and the second positioning portion 21 may be a protrusion protruding from the connection end surface 22 toward the metal layer 11 along the stacking direction. The first positioning portion 111 is used to accommodate the second positioning portion 21. At least part of the sealing connection layer 3 is arranged between the wall forming the first positioning portion 111 and the surface of the second positioning portion 21 so that the wall forming the first positioning portion 111 and the surface of the second positioning portion 21 are sealed and fixedly connected. The stacking direction is the stacking direction of the upper cover plate 4, the dam 2 and the substrate 1. The first positioning portion 111 can be formed by stamping or CNC processing, and the second positioning portion 21 can be formed by integral processing with the metal layer 11 when the metal layer 11 is formed by plating.

[0044] In some preferred embodiments, the connection end surface 22 of the dam 2 can be stacked with the flat surface 112 of the metal layer 11 along the stacking direction, and a partial sealing connection layer 3 can be provided between the connection end surface 22 of the dam 2 and the flat surface 112 of the metal layer 11. Specifically, the partial sealing connection layer 3 is provided at the connection between the first positioning portion 111 and the second positioning portion 21 to seal the first positioning portion 111 and the second positioning portion 21; the partial sealing connection layer 3 is provided at the connection between the connection end surface 22 of the dam 2 and the flat surface 112 of the metal layer 11 to seal the flat surface 112 and the connection end surface 22. This can effectively increase the sealing area when the dam 2 and the metal layer 11 are sealed, further enhance the sealing and fixing effect and bonding stability between the dam 2 and the metal layer 11, and improve the airtightness of the package assembly.

[0045] In some embodiments, reference Figure 1 and Figure 2 The second positioning portion 21 is provided in the middle of the dam 2 and spaced apart from the outer edge of the dam 2. The connecting end surface 22 of the dam 2 surrounds the second positioning portion 21. When the second positioning portion 21 is a groove and the first positioning portion 111 is a protrusion, the second positioning portion 21 covers the top side and all circumferences of the first positioning portion 111.

[0046] Or, refer to Figure 4 and Figure 5 The second positioning portion 21 can be set at the edge of the dam 2, for example, the second positioning portion 21 is set at the inner edge or outer edge of the dam 2. When the second positioning portion 21 is a groove, the second positioning portion 21 is an "L"-shaped groove set at the edge of the dam 2. When the second positioning portion 21 is a protrusion, the second positioning portion 21 is a protrusion set at the edge of the dam 2, so that the cross-section of the dam 2 is L-shaped. When the second positioning portion 21 is an "L"-shaped groove and the first positioning portion 111 is a protrusion, the second positioning portion 21 covers the top side and part of the circumference of the first positioning portion 111. Among them, the inner edge of the dam 2 is the side edge of the dam 2 adjacent to the installation space 5, that is, adjacent to the electronic component, and the outer edge of the metal layer 11 and the outer edge of the dam 2 are the side edges away from the installation space 5, that is, away from the electronic component.

[0047] The present invention also provides a packaging module, comprising an electronic component and the above-mentioned packaging assembly. The electronic component is packaged using the packaging assembly, and the electronic component is connected to the metal layer 11 of the substrate 1. The electronic component is specifically a chip.

[0048] Example 2

[0049] The packaging assembly of this embodiment is substantially the same as that of the first embodiment, except that the positioning portion 6 in this embodiment is a third positioning portion 113 .

[0050] Specifically, refer to Figure 6 and Figure 7 The positioning portion 6 includes a third positioning portion 113 provided on the metal layer 11. The third positioning portion 113 can be a protrusion formed by protruding from the flat surface 112 of the metal layer 11 toward the dam 2 along the stacking direction. When the substrate 1 is connected to the dam 2, the third positioning portion 113 can serve as a positioning reference and abut against the outer edge of the dam 2 to limit the installation position between the dam 2 and the substrate 1, thereby achieving positioning of the dam 2 when the substrate 1 and the dam 2 are connected. This allows the dam 2 to be quickly and accurately installed on the substrate 1 without the need for a visual alignment device to find the installation position, thereby simplifying the positioning process between the dam 2 and the substrate 1. In this case, the dam 2 does not need to be stamped or CNC machined to form additional structures such as depressions or protrusions. The dam 2 has a regular shape and a simple structure, which can make the processing of the dam 2 simpler and facilitate the processing of the dam 2. The third positioning portion 113 can be formed as an integral part of the metal layer 11 when the metal layer 11 is formed by plating.

[0051] The sealing connection layer 3 can be disposed only between the dam 2 and the metal layer 11 along the stacking direction, that is, the sealing connection layer 3 is disposed between the connection end surface 22 of the dam 2 and the flat surface 112 of the metal layer 11 to seal and fix the connection end surface 22 and the flat surface 112. Alternatively, to increase the sealing connection area between the dam 2 and the metal layer 11, a portion of the sealing connection layer 3 is disposed between the dam 2 and the metal layer 11 along the stacking direction, and a portion of the sealing connection layer 3 is disposed between the third positioning portion 113 and the dam 2, that is, between the inner surface of the third positioning portion 113 and the outer surface of the dam 2, to increase the sealing connection area between the dam 2 and the metal layer 11, enhance the sealing connection effect between the dam 2 and the substrate 1, and improve the airtightness of the package assembly.

[0052] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limiting the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the utility model without departing from the principles and purpose of the utility model. All of these changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A packaging component, characterized in that: The invention comprises a stacked substrate (1) and a dam (2), wherein the substrate (1) is provided with a metal layer (11); at least one of the metal layer (11) and the dam (2) is provided with a positioning portion (6); the substrate (1) and the dam (2) are positioned via the positioning portion (6); a sealing connection layer (3) is provided between the dam (2) and the metal layer (11); the sealing connection layer (3) is sealedly connected to the dam (2) and the metal layer (11) respectively, so as to seal and fix the dam (2) and the substrate (1); The positioning portion (6) comprises a first positioning portion (111) formed by the metal layer (11) and a second positioning portion (21) provided on the dam (2); the first positioning portion (111) and the second positioning portion (21) cooperate to position the dam (2) when the substrate (1) and the dam (2) are connected; the second positioning portion (21) is a groove provided on the outer edge of the dam (2); and the first positioning portion (111) is a protrusion formed by protruding from the metal layer (11); Alternatively, the outer edge of the metal layer (11) exceeds the outer edge of the dam (2), and the positioning portion (6) includes a third positioning portion (113) provided on the metal layer (11), and the third positioning portion (113) abuts against the outer edge of the dam (2) to position the dam (2) when the dam (2) is connected to the substrate (1).

2. The packaging assembly according to claim 1, wherein: The sealing connection layer (3) is formed at least at the connection between the first positioning portion (111) and the second positioning portion (21) to seal and fix the dam (2) and the metal layer (11) of the substrate (1).

3. The packaging assembly according to claim 2, wherein: The metal layer (11) is provided with a flat surface (112) on the side facing the dam (2); the first positioning portion (111) is a protrusion protruding from the flat surface (112) toward the dam (2) along the stacking direction; the dam (2) includes a connecting end surface (22) facing the metal layer (11); the second positioning portion (21) is correspondingly provided as a groove recessed from the connecting end surface (22) along the stacking direction away from the metal layer (11); Part of the sealing connection layer (3) is arranged between the flat surface (112) and the connection end surface (22) to seal the connection between the flat surface (112) and the connection end surface (22), and part of the sealing connection layer (3) is arranged between the first positioning portion (111) and the second positioning portion (21) to seal the connection between the first positioning portion (111) and the second positioning portion (21).

4. The packaging assembly according to claim 1, wherein: At least a portion of the sealing connection layer (3) is arranged between the dam (2) and the metal layer (11) along the stacking direction.

5. The packaging assembly according to claim 4, wherein: Part of the sealing connection layer (3) is arranged between the dam (2) and the metal layer (11) along the stacking direction, and part of the sealing connection layer (3) is arranged between the third positioning portion (113) and the dam (2).

6. The packaging assembly according to claim 1, wherein: The substrate (1) is connected to an electronic component, the dam (2) and the substrate (1) enclose an installation space (5) for accommodating the electronic component, and a portion of the metal layer (11) of the substrate (1) is exposed in the installation space (5) and is used for connection with the electronic component; And / or, the dam (2) is an alloy dam, and the sealing connection layer (3) is a solder layer.

7. The packaging assembly according to claim 6, wherein: It also includes an upper cover plate (4), wherein the upper cover plate (4) and the base plate (1) are located on opposite sides of the dam (2) and are used to block the openings on opposite sides of the dam (2) to seal the installation space (5); And / or, the dam (2) is a Kovar alloy dam, and the sealing connection layer (3) is a gold-tin alloy layer.

8. A packaging module, characterized in that: include: The packaging assembly according to any one of claims 1 to 7; An electronic component is packaged in the packaging assembly, and the electronic component is connected to the metal layer (11) of the substrate (1).

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