Circuit packaging structure

Abstract

The utility model discloses a circuit packaging structure. The circuit package structure includes: a base package including a substrate and a molding compound covering the substrate, an opening of the molding compound at least partially exposing a first pad on the substrate; the upper package is located above the base package, and a preset distance is formed between the upper package and the base package; one end of the connecting piece is connected with the second bonding pad located on the upper package, the other end of the connecting piece extends into the base package from the open hole and is connected with the first bonding pad, and the connecting piece is used for forming a conductive path between the base package and the upper package. The base package and the upper package which are independent from each other are connected through the connecting piece, so that the internal thermal resistance of the circuit package structure is reduced, the design flexibility of the circuit package structure is improved, and the product performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a circuit packaging structure. Background Art

[0002] In existing electronic devices, particularly miniature electronic devices like mobile phones and tablets, the packaging technology for the integrated circuits (ICs) plays a crucial role in device performance and reliability. While conventional planar packaging technology has met the IC size and performance requirements of electronic devices to a certain extent, it still presents some significant challenges.

[0003] For example, with the development of system-level packaging technology, multiple high-power chips are integrated into a single package. When current flows through these chips, a large amount of heat is generated inside the package. Because the internal structure of the package is not conducive to effective heat dissipation, it can easily lead to increased thermal resistance within the package, affecting product performance and reliability.

[0004] Furthermore, traditional circuit packaging structures use molds to determine the thickness and shape of the package. However, the physical limitations of the mold make it difficult to increase the package thickness, limiting the number and complexity of devices that can be integrated into the package, and thus limiting the improvement of product performance.

[0005] Therefore, a new circuit packaging structure is urgently needed to solve the above problems. Utility Model Content

[0006] In view of the above problems, the purpose of this application is to provide a circuit packaging structure, which is conducive to reducing the internal thermal resistance of the circuit packaging structure, improving the flexibility of the circuit packaging structure design, and thus improving product performance.

[0007] According to one aspect of the present application, a circuit packaging structure is provided, characterized in that the circuit packaging structure includes: a base package, including a substrate and a molding material covering the substrate, an opening of the molding material at least partially exposing a first solder pad located on the substrate; an upper package, located above the base package and spaced a preset distance from the base package; and a connector, one end of the connector is connected to the second solder pad located on the upper package, and the other end extends into the base package from the opening and is connected to the first solder pad, the connector being used to form a conductive path between the base package and the upper package.

[0008] Optionally, a first circuit is further mounted on the substrate, the first pad is located on at least one side of the first circuit on the substrate, and the molding compound covers the first circuit.

[0009] Optionally, the first circuit includes a chip structure; or the first circuit includes a chip structure and discrete components.

[0010] Optionally, the chip structure includes at least one chip arranged in a stacked manner.

[0011] Optionally, the connection method between the connector and the base package and / or the upper package includes reflow soldering.

[0012] Optionally, resin glue is filled between the connecting piece and the opening.

[0013] Optionally, the column cross-section of the connector is an inverted L-shape, the shape of the opening is adapted to the shape of the connector, and the connector includes: a connecting portion, a first end of the connecting portion extending into the base package and connected to the first solder pad; and a supporting portion, the supporting portion extending from the second end of the connecting portion in a direction perpendicular to the connecting portion, the supporting portion being connected to the second solder pad and supporting the upper package.

[0014] Optionally, the connecting member is columnar, and the column cross-section of the connecting member includes a rectangular cross-section, an inverted L-shaped cross-section and a T-shaped cross-section, and the shape of the opening is adapted to the shape of the connecting member.

[0015] Optionally, the upper package includes surface mount components and / or surface mount package bodies.

[0016] Optionally, the surface mount package includes a grid array package and a ball grid array package.

[0017] By adopting a stacked structure of an upper package and a base package, the overall thickness of the circuit package structure is not limited by the thickness of a single upper package or base package, providing greater design flexibility. The spacing between the upper and base packages facilitates heat dissipation, effectively reducing the internal thermal resistance of the package, allowing the internal circuit to operate stably under high loads and improving product reliability. In addition, connecting the base package and the upper package through independent connectors reduces restrictions on the upper circuit package structure, making it easier to select and stack packages or independent devices with different functions to expand the product according to different application requirements, thereby improving product performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0019] Figure 1 A schematic structural diagram showing the circuit packaging structure of the present application;

[0020] Figure 2 A perspective view showing the circuit packaging structure of the present application;

[0021] Figure 3 A schematic structural diagram of a substrate is shown;

[0022] Figure 4 A schematic structural diagram of a base package is shown;

[0023] Figure 5 a schematic perspective view showing a molding compound opening;

[0024] Figure 6 Shows a schematic structural diagram of the connecting piece. DETAILED DESCRIPTION

[0025] Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, identical elements are represented by identical or similar reference numerals. For the sake of clarity, the various parts in the accompanying drawings are not drawn to scale.

[0026] Certain terms are used in this specification and claims to refer to specific components. Those skilled in the art will understand that manufacturers may use different terms to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in their functions.

[0027] It should be understood that in the following description, a "circuit" may include a single or multiple combined hardware circuits, programmable circuits, state machine circuits, and / or elements capable of storing instructions executed by programmable circuits. When an element or circuit is said to be "connected to" another element or an element or circuit is said to be "connected" between two nodes, it can be directly coupled or connected to the other element or there can be intermediate elements. The connection between the elements can be physical, logical, or a combination thereof. Conversely, when an element is said to be "directly coupled to" or "directly connected to" another element, it means that there are no intermediate elements between the two.

[0028] In addition, it should be noted that, in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element.

[0029] For ease of description, spatially relative terms such as "under," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature to other elements or features as shown in the accompanying drawings. It should be understood that the spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation shown in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, then the elements described as "under" or "beneath" other elements or features will be positioned "above" the other elements or features. Thus, the exemplary term "under" can include both the orientations of "above" and "under." The device can be positioned otherwise (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein interpreted accordingly.

[0030] Figure 1 A schematic structural diagram showing the circuit packaging structure of the present application; Figure 2 The perspective view of the circuit packaging structure of the present application is shown. Figure 1 and Figure 2 In the illustrated embodiment, one base package 100 is connected to two upper packages 200 as an example. However, it should be understood that the present application should not be limited thereto. For example, one base package 100 may be connected to one or more than two upper packages 200 .

[0031] The circuit packaging structure provided in this application is used, for example, as a system-in-package (SiP). However, it should be understood that the circuit packaging structure provided in this application should not be limited thereto and can also be used, for example, in a small outline package (SOP) or other types of packaging structures.

[0032] See also Figure 1 and Figure 2 The circuit packaging structure 10 provided in the present application includes a base package 100 , an upper package 200 and a connector 300 that are independent of each other.

[0033] The base package 100 includes a substrate 110 and a molding material 120 covering the substrate 110 . An opening 121 of the molding material 120 at least partially exposes a first pad on the substrate 110 .

[0034] The upper package 200 is located above the base package and is spaced apart from the base package 100 by a preset distance.

[0035] The connector 300 has one end connected to the second pad on the upper package 200 and the other end extending from the opening into the base package 100 and connected to the first pad. The connector 300 is used to form a conductive path between the base package 100 and the upper package 200.

[0036] Figure 3 A schematic structural diagram of a substrate is shown; Figure 4 A schematic structural diagram of a base package is shown; Figure 5 A schematic perspective view of a molded material opening is shown below. Figures 3 to 5 Describe the base package in detail.

[0037] In some embodiments, the substrate 110 serves as the base of the base package, and is made of, for example, a printed circuit board or a ceramic board. Figure 3 As shown, the first pad 111 is located on the upper surface of the substrate 110 (close to the upper package side surface). The upper surface of the substrate 110 is also mounted with a first circuit 112, and the first pad 111 is located on at least one side of the first circuit 112 on the substrate 110. Figure 3 In the embodiment, for example, first pads 111 are provided on both sides of the first circuit 112 .

[0038] In some embodiments, the first circuit 112 includes a chip structure 112a. Chip structure 112a includes at least one chip in a stacked arrangement. Chip structure 112a is mounted on the upper surface of substrate 110 using a mounting method such as flip-chip bonding. The present application does not specifically limit the function of chip structure 112a; for example, chip structure 112a may be a logic chip and / or a memory chip. In some embodiments, depending on circuit requirements, the first circuit 112 also includes discrete components 112b.

[0039] In some embodiments, first pads 111 and first circuit 112 are directly connected to conductive vias (not shown) extending through the upper and lower surfaces of substrate 110. These vias connect to bottom pads on the lower surface of substrate 110 and further electrically connect to the main circuit board or module board. In some embodiments, due to the limited number and location of conductive vias, first pads 111 and / or first circuit 112 are connected to the conductive vias via metal traces disposed on the upper surface of substrate 110.

[0040] The molding material 120 is formed on the surface of the substrate 110, surrounding and covering the substrate 110 and the first circuit 112. The molding material 120 is, for example, epoxy molding material or polyimide. Figure 4 and Figure 5 As shown, the molding material 120 has an opening 121 at a position corresponding to the first pad 111 , and the opening 121 exposes at least a portion of the first pad 111 .

[0041] In some embodiments, the opening 121 is formed by laser drilling or gas etching. Solder paste is applied to the first pad 111 through the opening 121, and one end of the connector 300 extending into the base package 100 is connected to the first pad 111 by reflow soldering.

[0042] Furthermore, in some embodiments, resin glue is filled between the opening 121 and the connector 300. Sealing the opening 121 with the resin glue can also prevent the connector 300 from shifting within the opening 121 and causing product damage. Sealing the opening 121 with the resin glue can also prevent solder from leaking out during multiple reflows during the connection process, resulting in poor connections and affecting product reliability. Furthermore, sealing the opening 121 with the resin glue can prevent moisture and dust from entering the base package through the opening 121 during use, thereby improving product life.

[0043] It should be noted that the shape of the opening 121 is compatible with the shape of the connector 300. In some embodiments, the connector 300 is a column, such as a cylindrical column (i.e., the column cross-section is rectangular), and the opening 121 is also a cylindrical opening. In a preferred embodiment, in order to facilitate connection with the upper package and provide support for the upper package, the connector 300 is a special-shaped column with an inverted L-shaped or T-shaped column cross-section, and the opening 121 is also a special-shaped opening with the corresponding column cross-section. However, it should be understood that the present application does not impose too many restrictions on the shape of the connector 300 and the opening 121, and connectors of corresponding shapes and sizes can be selected according to actual requirements such as installation requirements and size requirements.

[0044] Figure 6 Schematic diagram of the connecting piece is shown. Figure 6 As shown, as an example, connector 300 includes a connecting portion 310 and a supporting portion 320. The first end of connecting portion 310 extends into base package 100 and is connected to first pad 111 by welding or other means. Support portion 320 extends from the second end of connecting portion 310 in a direction perpendicular to connecting portion 310, giving connector 300 an inverted L-shaped cross-section. Support portion 320 is connected to the second pad of upper package 200 by welding or other means, and provides support for upper package 200, maintaining a predetermined distance from the base package.

[0045] Connectors 300 connect the base package 100 and the upper package 200, spacing the upper package 200 and the base package 100 at a predetermined distance to facilitate heat dissipation. Furthermore, the provision of independent connectors reduces structural constraints on the upper package 200 and / or the base package 100, thereby enhancing product design flexibility.

[0046] Further, if Figure 6 As shown, in a preferred embodiment, the support portion 320 is further chamfered to prevent the rough surface of the support portion 320 from scratching the upper package.

[0047] In some embodiments, after the connector 300 is connected to the base package 100, a top portion of the connector 300 (eg Figure 6 The supporting portion 320 is coated with solder paste and mounted with the upper package 200, and the connector 300 and the upper package 200 are welded by, for example, reflow soldering.

[0048] The upper package 200 includes a surface mount package and / or surface mount components. The surface mount package includes a ball grid array (BGA) package and a land grid array (LGA) package. The surface mount components include an inductor.

[0049] By adopting a stacked structure of an upper package and a base package, the overall thickness of the circuit package structure is not limited by the thickness of a single upper package or base package, providing greater design flexibility. The spacing between the upper package and the base package facilitates heat dissipation, effectively reducing the thermal resistance within the package, allowing the internal circuit to operate stably under high loads and improving product reliability. In addition, connecting the base package and the upper package through independent connectors reduces restrictions on the upper circuit package and / or base package structure, making it easier to select and stack packages or independent devices with different functions to expand the product according to different application requirements, thereby improving product performance.

[0050] The embodiments of the present application are as described above, and these embodiments do not describe all details in detail, nor do they limit the present application to specific embodiments. Obviously, based on the above description, many modifications and variations can be made. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The scope of protection of the present application shall be based on the scope defined by the claims of the present application.

Claims

1. A circuit packaging structure, characterized in that: The circuit packaging structure includes: A base package includes a substrate and a molding compound covering the substrate, wherein an opening of the molding compound at least partially exposes a first pad located on the substrate; an upper package, located above the base package and spaced apart from the base package by a preset distance; and A connector, one end of which is connected to the second pad located on the upper package, and the other end of which extends from the opening into the base package and is connected to the first pad, wherein the connector is used to form a conductive path between the base package and the upper package.

2. The circuit packaging structure according to claim 1, wherein: A first circuit is also mounted on the substrate. The first pad is located on at least one side of the first circuit on the substrate. The molding compound covers the first circuit.

3. The circuit packaging structure according to claim 2, wherein: The first circuit includes a chip structure; or The first circuit includes a chip structure and discrete components.

4. The circuit packaging structure according to claim 3, wherein: The chip structure includes at least one chip arranged in a stack.

5. The circuit packaging structure according to claim 4, wherein: The connection method of the connecting member and the base package and / or the upper package includes reflow soldering.

6. The circuit packaging structure according to claim 1, wherein: Resin glue is filled between the connecting piece and the opening.

7. The circuit packaging structure according to claim 1, wherein: The column cross-section of the connecting member is an inverted L-shape, the shape of the opening is adapted to the shape of the connecting member, and the connecting member comprises: a connecting portion, a first end of which extends into the base package and is connected to the first pad; and A supporting portion extends from the second end of the connecting portion in a direction perpendicular to the connecting portion, the supporting portion being connected to the second pad and supporting the upper package.

8. The circuit packaging structure according to claim 1, wherein: The connecting piece is columnar, and the column cross-section of the connecting piece includes a rectangular cross-section, an inverted L-shaped cross-section and a T-shaped cross-section. The shape of the opening is adapted to the shape of the connecting piece.

9. The circuit packaging structure according to claim 1, wherein: The upper package includes surface mount components and / or surface mount package bodies.

10. The circuit packaging structure according to claim 9, wherein: The surface mount package includes a grid array package and a ball grid array package.

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