Radio frequency three-dimensional system integrated three-dimensional packaging and heat dissipation packaging structure

Abstract

The utility model provides a three-dimensional packaging and heat dissipation structure integrated by a radio frequency three-dimensional system, a groove is arranged in a substrate, and a through hole is arranged in an area where the groove is located; a first region of the first metal region is arranged in the through hole, and a second region of the first metal region is connected with the first region, is formed on the inner wall and the bottom surface of the groove and extends to the first surface of the substrate; the second metal region is connected with a second region of the first metal region, and the second metal region is arranged on the first surface; the heat dissipation fins are connected with the second metal region; and the inner diameter of the through hole is gradually reduced and then gradually increased. Heat formed by radio frequency three-dimensional system integration is firstly transmitted to the first area of the first metal area and then is further transmitted to the second area, and heat transmitted through the second area further acts on the second metal area, then acts on the heat dissipation fins and is transmitted out through the heat dissipation area fins. The defect that the heat transfer efficiency of three-dimensional packaging integrated by a radio frequency three-dimensional system is insufficient is effectively overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging, in particular to a three-dimensional packaging and heat dissipation packaging structure for radio frequency three-dimensional system integration. Background Art

[0002] 3D packaging technology in RF 3D system integration is a packaging method that stacks multiple RF 3D system integrations or components vertically. This technology can significantly reduce the size and weight of electronic products while improving performance and functional density.

[0003] In the prior art, to effectively address the heat generated by 3D packaging in RF 3D system integration, a heat dissipation structure is typically provided. This structure is used to dissipate the heat generated by the 3D packaging in RF 3D system integration. However, as the integration level of RF 3D systems increases, thermal management becomes a significant challenge. High-density integration leads to higher power density and more complex heat dissipation issues. Therefore, the industry is eager to provide a heat dissipation structure to effectively address the heat generated by 3D packaging in RF 3D system integration. Utility Model Content

[0004] In view of the defects of the prior art, the utility model provides a heat dissipation structure of a three-dimensional package integrated with a radio frequency three-dimensional system and a three-dimensional package integrated with a radio frequency three-dimensional system.

[0005] The utility model provides a three-dimensional package heat dissipation structure for radio frequency three-dimensional system integration, which is characterized by comprising

[0006] A substrate (1), the substrate (1) comprising a first portion and a second portion, the first portion of the substrate (1) having a first surface (102) and a second surface (103) disposed opposite to each other; the second portion of the substrate (1) having a third surface (104) and a fourth surface (105) disposed opposite to each other; wherein the third surface (104) is lower than the first surface (102), the fourth surface (105) and the second surface (103) are coplanar, and the side wall of the first portion of the substrate (1) located between the first surface (102) and the third surface (104) and the third surface (104) form a groove (101);

[0007] A plurality of through holes (2) are provided in the second portion of the base (1) and pass through the third surface (104) and the fourth surface (105) of the second portion of the base (1);

[0008] a first metal region (3), comprising a first region (301) and a second region (302), wherein the first region (301) is arranged in the through hole (2), and the second region (302) is connected to the first region (301) and is formed on the inner wall and bottom surface of the groove (101) and the first surface (102) of the substrate (1);

[0009] a second metal area (4) connected to the second area (302) of the first metal area (3), wherein the second metal area (4) is arranged on the first surface (102);

[0010] heat dissipation fins (5), connected to the second metal area (4);

[0011] Wherein, along the direction from the third surface (104) to the fourth surface (105), the inner diameter of the through hole (2) first gradually decreases and then gradually increases.

[0012] Furthermore, the inner diameter of the through hole (2) on the side close to the fourth surface (105) is greater than or equal to the inner diameter of the through hole (2) on the side close to the third surface (104).

[0013] Furthermore, the opposite side walls of the through hole (2) are arranged in a hyperbolic shape.

[0014] Furthermore, the minimum inner diameter of the through hole (2) is R1, the maximum inner diameter of the through hole (2) is R2, and the ratio range of R1 / R2 is 1 / 6-5 / 6.

[0015] Furthermore, the height of the through hole (2) is H1, the height of the groove (101) is H2, and the ratio of H1 / H2 is in the range of 0.2-0.5.

[0016] Furthermore, the thermal conductivity of the heat dissipation fin (5) is greater than the thermal conductivity of the second metal area (4), and the thermal conductivity of the second metal area (4) is greater than the thermal conductivity of the first metal area (3).

[0017] Furthermore, a wiring layer (7) is formed on the second surface (103) and the fourth surface (105) of the substrate (1), and the wiring layer (7) is not in contact with the metal area in at least one of the through holes (2).

[0018] Another aspect of the present invention provides a three-dimensional package for radio frequency three-dimensional system integration, comprising: any of the aforementioned heat dissipation packaging structures; at least one radio frequency three-dimensional system integration (6), arranged on the second surface (103) of the substrate and located in a region corresponding to at least one of the through holes (2);

[0019] Furthermore, the surface of the radio frequency three-dimensional system integration (6) is coated with a heat absorbing material.

[0020] Furthermore, the heat absorbing material is graphene.

[0021] The beneficial effects of the utility model are:

[0022] In the present invention, the heat generated by the integration of the RF three-dimensional system will first be transferred to the first area of ​​the first metal area, and then further transferred to the second area. The heat transferred through the second area will further act on the position of the second metal area, and then further act on the heat dissipation fins, and the heat will be transferred out through the heat dissipation fins.

[0023] With the structure provided by the present invention, the inner diameter of the through-hole gradually decreases and then gradually increases. At this time, the metal in the corresponding first zone also simultaneously undergoes a deformation, first increasing in size and then decreasing in size. This arrangement effectively increases the heat absorption area at the junction of the through-hole and the RF three-dimensional system integration, thereby further increasing the total amount of heat conducted per unit time. Furthermore, since the size of the through-hole decreases from large to small and then increases again, the through-hole will form a shape similar to that of a Raoult tube. The heat transferred through the first zone will also produce a similar effect of fluid acceleration in a Raoult tube. That is, the total amount of heat transferred from the first zone to the second zone per unit time will also gradually increase, thereby effectively improving the heat dissipation capacity of the RF three-dimensional system integration.

[0024] In the present invention, the inner diameter of the through hole on the side closest to the RF 3D system integration is greater than or equal to the inner diameter of the other side of the through hole. This arrangement further increases the heat absorption capacity of the metal in the through hole, further improving the thermal conductivity of the RF 3D system integration.

[0025] In the present invention, the thermal conductivity of the heat dissipation zone is greater than that of the second metal zone, which in turn is greater than that of the first metal zone. With this arrangement, since the heat dissipation zone has the highest thermal conductivity, the thermal conductivity of the second metal zone is sandwiched between the heat dissipation zone and the first metal zone. This allows the heat dissipation zone to drive heat to flow sequentially along the second and first metal zones, thereby creating a similar pulling effect on the heat of the integrated RF three-dimensional system. This allows the heat from the integrated RF three-dimensional system to spontaneously enter the first, second, and heat dissipation zones, effectively improving the overall heat dissipation level. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The following description of the present invention will provide a more comprehensive understanding of the above and other purposes, features, and advantages of the present invention, with reference to the accompanying drawings. The accompanying drawings are intended only to illustrate the principles of the present invention. The sizes and relative positions of elements in the drawings are not necessarily drawn to scale.

[0027] Figure 1This is a schematic diagram of the heat dissipation packaging structure provided by the present utility model;

[0028] Figure 2 yes Figure 1 Magnified view of area A in the middle.

[0029] Description of Reference Numerals

[0030] 1. Base; 101. Groove; 102. First surface; 103. Second surface; 104. Third surface; 105. Fourth surface 105;

[0031] 2. Through hole; 3. First metal area; 301. First area; 302. Second area;

[0032] 4. Second metal area; 5. Heat sink fins; 6. RF three-dimensional system integration; 7. Wiring layer; 8. Solder joints. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present invention more readily apparent, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings, so that the above-mentioned and other objects, features, and advantages of the present invention will become more apparent. Like reference numerals denote like parts throughout the drawings. The drawings are not drawn to scale; emphasis is placed on illustrating the subject matter of the present invention.

[0034] The terms and words used in the following description and claims are not limited to the bibliographical meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present invention. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided for illustration purposes only and not for the purpose of limiting the present invention as defined by the appended claims and their equivalents.

[0035] It should be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to a "module" includes reference to one or more such modules. The advantages and features of the present invention and methods of implementing the present invention may be more readily understood by reference to the detailed description and accompanying drawings of the embodiments below. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be thorough and complete and will fully convey the concepts of the present invention to those skilled in the art.

[0036] Example

[0037] See also Figure 1-Figure 2 , Figure 1 This is a schematic diagram of the heat dissipation packaging structure provided by the present utility model; Figure 2 yes Figure 1 A magnified view of area A in the middle. Figure 1-2 As shown, this embodiment provides a heat dissipation structure, including

[0038] The substrate 1 includes a first portion and a second portion, wherein the first portion of the substrate 1 has a first surface 102 and a second surface 103 disposed opposite to each other; the second portion of the substrate 1 has a third surface 104 and a fourth surface 105 disposed opposite to each other; wherein the third surface 104 is lower than the first surface 102, and the fourth surface 105 is coplanar with the second surface 103. The sidewall of the first portion of the substrate 1 located between the first surface 102 and the third surface 104 and the third surface 104 constitute a groove 101. The structure of the groove 101 itself is not limited and can adopt a cubic structure, a rectangular parallelepiped structure, or a cylindrical structure, as long as a certain accommodation space can be formed by the groove 101. In this embodiment, the groove 101 can be formed on the second portion of the substrate 1 by wet etching or dry etching.

[0039] Specifically, the substrate 1 may be an organic substrate 1; or a glass substrate. When a glass substrate is used, it has good light transmittance and can quickly dissipate heat.

[0040] like Figure 1 As shown, the first surface 102 of the first part of the substrate 1 is arranged at the upper part of the substrate 1, and the second surface 103 of the first part of the substrate 1 is arranged at the lower part of the substrate 1. The third surface 104 of the second part of the substrate 1 is arranged between the first surface 102 and the second surface 103.

[0041] A plurality of through holes 2 are provided in the second portion of the base 1 . The through holes 2 extend in the height direction and pass through the third surface 104 and the fourth surface 105 of the second portion of the base 1 .

[0042] Specifically, there is no limitation on the method for forming the through hole 2, as long as a hole structure can be formed on the substrate 1, and common methods such as etching or laser drilling can be used to form the hole. In this embodiment, the through hole 2 can be formed by dry etching.

[0043] The first metal area 3 includes a first area 301 and a second area 302. The first area 301 is arranged in the through hole 2, and the second area 302 is connected to the first area 301 and is deposited on the inner wall and bottom surface (i.e., the third surface) of the groove 101 and extends to the first surface 102 of the first part of the substrate 1.

[0044] The first area 301 of the first metal area 3 can quickly transfer the heat generated by the radio frequency three-dimensional system integration 6 to the second area 302 of the first metal area 3, and achieve the purpose of rapid heat dissipation through the expanded surface area of ​​the second area. The material of the first metal area 3 is not limited in the present invention, and a metal with high thermal conductivity can be selected. As an embodiment, the first metal area 3 is made of copper. In this embodiment, the first area 301 and the second area 302 can be formed on the inner wall of the groove 101 and the through hole 2 by sputtering or electroplating. As a preparation process, the lower surface position of the base 1 can be bonded to the substrate structure, and the first area 301 and the second area 302 can be formed by sputtering or electroplating, and then the substrate bonded to the lower surface of the base 1 is removed to form a stable and precisely positioned first metal area 3. At the same time, as Figure 1 As shown, after removing the substrate bonded to the lower surface of the base 1, a wiring layer 7 may be formed on the lower surface of the base 1, and the wiring layer 7 does not contact the metal area in the at least one through hole 2. Figure 1 As shown, the wiring layer 7 is provided in the region between the two through-holes 2 .

[0045] When the substrate 1 is made of silicon, an insulating layer can be first formed on the lower surface of the silicon substrate by chemical vapor deposition or other methods, and then a layer of copper or other high thermal conductivity metal can be formed in at least one through hole 2 and on the lower surface of the groove 101 and the side surface of the groove 101 by sputtering or electroplating to form a first metal area 3.

[0046] a second metal region 4 connected to the second region 302 of the first metal region 3 , wherein the second metal region 4 is disposed on the first surface 102 ;

[0047] heat dissipation fins 5, disposed on the second metal area 4 and connected to the second metal area 4;

[0048] Specifically, the material of the heat dissipation fins 5 can be metal. The provision of the heat dissipation fins 5 can allow the heat generated by the radio frequency three-dimensional system integration 6 to be dissipated more quickly.

[0049] Specifically, the structure of the heat dissipation fins 5 is not limited, and the heat dissipation fins 5 may adopt a traditional dendritic structure to increase the overall heat dissipation area. Figure 1 As shown, the heat dissipation fins 5 are a plurality of metal structures arranged on the top of the second metal area 4. The heat dissipation fins 5 can be made of copper metal with good thermal conductivity.

[0050] At least one radio frequency three-dimensional system integration 6, welded to the fourth surface 105 of the substrate and located in the area corresponding to the at least one through hole 2;

[0051] like Figure 1As shown, at least one RF three-dimensional system integration 6 is bonded to the lower surface of the collective and is located in the area corresponding to at least one through hole 2. By bonding at least one RF three-dimensional system integration 6 to the lower surface of the collective and the area corresponding to at least one through hole 2, the heat generated by the RF three-dimensional system integration 6 can be quickly transferred to the second metal area 4 and the fin 5 through the first metal 3 in the substrate, and then dissipated outside the three-dimensional package.

[0052] In this embodiment, the connection with the wiring layer 7 can be achieved through the soldering points 8. The connection with the wiring layer 7 is completed by setting the soldering points 8 on the upper surface of the radio frequency three-dimensional system integration 6, thereby completing the heat transfer.

[0053] like Figure 1 and Figure 2 As shown, along the direction from the first surface 102 to the second surface 103 , the inner diameter of the through hole 2 first gradually decreases and then gradually increases.

[0054] Along the direction from the first surface 102 to the second surface 103, the aperture of the through hole 2 first gradually decreases and then gradually increases. At this time, the metal in the corresponding first zone 301 also simultaneously deforms from large to small. Through this arrangement, the heat absorption area at the junction of the through hole 2 and the RF three-dimensional system integration 6 can be effectively increased, thereby further increasing the total amount of heat conducted per unit time. Furthermore, since the aperture size of the through hole 2 changes from large to small and then to large, the through hole 2 will form a shape similar to that of a Raoult tube. The heat transferred through the first zone 301 will also produce an effect similar to the fluid acceleration in the Raoult tube. That is, the total amount of heat transferred from the first zone 301 to the second zone 302 per unit time will also gradually increase, thereby effectively improving the heat dissipation capacity of the RF three-dimensional system integration 6.

[0055] Furthermore, the aperture of the through hole 2 near the third surface 104 and the aperture near the fourth surface 105 may be different in size. More preferably, the aperture near the fourth surface 105 is greater than or equal to the aperture near the third surface 104. In this case, the through hole 2 has a stronger heat absorption capacity for the RF 3D system integration 6, and more heat can be extracted from the RF 3D system integration 6.

[0056] In addition, in the prior art, the thermal through-hole is usually set as a regular cylindrical structure. In this embodiment, the through-hole 2 is set as a Raoult tube shape in which the inner diameter is first reduced or increased. According to the process requirements, when the minimum inner diameter of the through-hole 2 is consistent with the prior art, the dimensions of the two ends of the through-hole 2 will be larger than the end dimensions of the thermal through-hole in the prior art. At this time, the heat absorption area of ​​the through-hole 2 is also larger, thereby effectively ensuring the heat dissipation performance of the RF three-dimensional system integration 6.

[0057] As another embodiment, Figure 1 and Figure 2As shown, the through hole 2 is arranged in a hyperbolic shape, that is, the upper size and the lower size of the through hole 2 are consistent. The above arrangement will be more convenient for processing.

[0058] In this embodiment, Figure 1 As shown, the minimum inner diameter of the through hole 2 is R1, the maximum inner diameter of the through hole 2 is R2, and the ratio range of R1 / R2 is 1 / 6-5 / 6.

[0059] The above arrangement ensures that the through hole 2 has a certain processing strength, thus preventing the stability of the substrate 1 from being affected by the presence of the through hole 2. Furthermore, by limiting the two to the above range, the heat conduction performance of the RF three-dimensional system integration 6 can be ensured.

[0060] Furthermore, if Figure 1 As shown, the height of the through hole 2 is H1, the height of the groove 101 is H2, and the ratio of H1 / H2 is in the range of 0.2-0.5.

[0061] Through the above-mentioned setting method, first of all, the proportional relationship between the groove 101 and the through hole 2 can be ensured to prevent the groove 101 from being too deep and affecting the stability of the structure; at the same time, by limiting the ratio of the through hole 2 to the groove 101, the heat transferred through the inside of the through hole 2 can be fully transferred to the second zone 302, ensuring the rapid transfer of heat generated by the RF three-dimensional system integration 6.

[0062] Furthermore, in this embodiment, a heat-absorbing material is coated on the surface of the RF 3D system integration 6. By providing a heat-absorbing material layer on the surface of the RF 3D system integration 6, heat from the RF 3D system integration 6 is first transferred to the heat-absorbing material layer, which then exchanges heat with the outside world. Because the heat-absorbing material has a higher thermal conductivity, the heat retained in the RF 3D system integration 6 can be quickly transferred to the outside world.

[0063] In this embodiment, the material of the heat absorbing material is not limited, and common heat absorbing materials in the prior art can be used. As an implementation method, the heat absorbing material is graphene.

[0064] Furthermore, the thermal conductivity of the heat sink fins 5 is greater than that of the second metal region 4, and the thermal conductivity of the second metal region 4 is greater than that of the first metal region 3. Through the above-mentioned configuration, since the thermal conductivity of the heat sink fins 5 is the largest and the thermal conductivity of the second metal region 4 is between that of the heat sink fins 5 and the first metal region 3, the heat sink fins 5 can drive heat to flow along the second metal region 4 and the first metal region 3 in sequence, thereby forming a similar pulling effect on the heat of the RF three-dimensional system integration 6, so that the heat of the RF three-dimensional system integration 6 spontaneously enters the first metal region 3, the second metal region 4 and the heat sink fins 5, thereby effectively improving the overall heat dissipation level.

[0065] As an implementation manner, the heat sink fins 5 may be made of silver, the second metal region 4 may be made of copper, and the first metal region 3 may be made of gold.

[0066] This embodiment also provides a three-dimensional package for radio frequency three-dimensional system integration, including:

[0067] A packaging substrate, including the heat dissipation packaging structure provided in this embodiment;

[0068] The radio frequency three-dimensional system is integrated and connected to the packaging substrate through a welding structure.

[0069] Although the technology has been illustrated and described with respect to one or more embodiments, changes and / or modifications may be made to the illustrated examples without departing from the spirit and scope of the appended claims. In particular, with respect to the various functions performed by the components or structures (assemblies, devices, circuits, systems, etc.) described above, terms used to describe such components (including references to "means") are intended to correspond to any component or structure that performs the designated function of the described component (e.g., functionally equivalent), even if not structurally equivalent to the disclosed structure that performs the function in the example embodiments described herein, unless otherwise indicated. In addition, although a particular feature may have been disclosed with respect to one embodiment among several embodiments, such feature may be combined with one or more other features in other embodiments as may be desired and advantageous for any given or particular application. Furthermore, to the extent that the terms "comprising," "including," "having," "having," "containing," or variations thereof are used in the detailed description or claims, such terms are intended to be inclusive in a manner similar to the term "comprising."

[0070] In the above description, many specific details are set forth in order to fully understand the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited by the specific implementation disclosed above. At the same time, any person skilled in the art can use the above-disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the present invention without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A three-dimensional heat dissipation packaging structure for radio frequency three-dimensional system integration, characterized in that: include A substrate (1), the substrate (1) comprising a first portion and a second portion, the first portion of the substrate (1) having a first surface (102) and a second surface (103) disposed opposite to each other; the second portion of the substrate (1) having a third surface (104) and a fourth surface (105) disposed opposite to each other; wherein the third surface (104) is lower than the first surface (102), the fourth surface (105) and the second surface (103) are coplanar, and the side wall of the first portion of the substrate (1) located between the first surface (102) and the third surface (104) and the third surface (104) form a groove (101); A plurality of through holes (2) are provided in the second portion of the base (1) and pass through the third surface (104) and the fourth surface (105) of the second portion of the base (1); a first metal region (3), comprising a first region (301) and a second region (302), wherein the first region (301) is arranged in the through hole (2), and the second region (302) is connected to the first region (301) and is formed on the inner wall and bottom surface of the groove (101) and the first surface (102) of the substrate (1); a second metal area (4) connected to the second area (302) of the first metal area (3), wherein the second metal area (4) is arranged on the first surface (102); heat dissipation fins (5), connected to the second metal area (4); Wherein, along the direction from the third surface (104) to the fourth surface (105), the inner diameter of the through hole (2) first gradually decreases and then gradually increases.

2. The heat dissipation packaging structure according to claim 1, characterized in that: The inner diameter of the through hole (2) on the side close to the fourth surface (105) is greater than or equal to the inner diameter of the through hole (2) on the side close to the third surface (104).

3. The heat dissipation packaging structure according to claim 2, characterized in that: The opposite side walls of the through hole (2) are arranged in a hyperbolic shape.

4. The heat dissipation packaging structure according to claim 3, characterized in that: The minimum inner diameter of the through hole (2) is R1, the maximum inner diameter of the through hole (2) is R2, and the ratio range of R1 / R2 is 1 / 6-5 / 6.

5. The heat dissipation packaging structure according to any one of claims 1 to 4, characterized in that: The height of the through hole (2) is H1, the height of the groove (101) is H2, and the ratio of H1 / H2 is in the range of 0.2-0.

5.

6. The heat dissipation packaging structure according to claim 5, characterized in that: The thermal conductivity of the heat dissipation fin (5) is greater than the thermal conductivity of the second metal area (4), and the thermal conductivity of the second metal area (4) is greater than the thermal conductivity of the first metal area (3).

7. The heat dissipation packaging structure according to claim 5, characterized in that: A wiring layer (7) is formed on the second surface (103) and the fourth surface (105) of the substrate (1), and the wiring layer (7) is not in contact with the metal area in at least one of the through holes (2).

8. A three-dimensional package for radio frequency three-dimensional system integration, characterized in that: include: The heat dissipation packaging structure according to any one of claims 1 to 7; At least one radio frequency three-dimensional system integration (6) is arranged on the second surface (103) of the substrate and is located in a region corresponding to at least one of the through holes (2).

9. The three-dimensional package according to claim 1, characterized in that: The surface of the radio frequency three-dimensional system integration (6) is coated with a heat-absorbing material.

10. The three-dimensional package according to claim 6, characterized in that: The heat absorbing material is graphene.

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