Probe type connecting device

Abstract

The utility model relates to the technical field of CPU installation, in particular to a probe type connecting device which comprises a probe seat and a probe. The probe seat is arranged on the mainboard and forms a contact surface, and the contact surface covers a projection area of the CPU chip on the mainboard; a plurality of mounting through holes arranged in an array are formed in the probe seat, the probes are inserted into the mounting through holes, one ends of the probes abut against a middle layer structure on the CPU chip, and the other ends of the probes abut against a contact part on the mainboard. Electric signal connection between the CPU chip intermediate layer structure and the mainboard is realized through the probe, welding is avoided, disassembly and assembly are facilitated, the production cost can be effectively reduced, and the production yield is improved.

Description

Technical Field

[0001] The present application relates to the technical field of CPU installation, and in particular to a probe-type connection device. Background Art

[0002] An interposer (middle layer structure) is usually set between the CPU chip and the motherboard to complete the connection of electrical signals and the physical support of the CPU chip and the motherboard, thereby achieving efficient and reliable signal transmission. The current interposer structure needs to be welded to the motherboard in advance during the connection, and then the pins on the CPU chip are connected to the solder balls of the interposer structure one by one. Due to the large number of solder joints, not only is the operation difficult, but it is also easy to cause cold solder joints during the production process, resulting in abnormal electrical signal transmission, resulting in low production yield and high production costs. In addition, after the CPU chip is connected to the motherboard by welding, it is difficult to disassemble in the event of a fault, making it inconvenient to disassemble and assemble. Utility Model Content

[0003] The purpose of this application is to provide a probe-type connection device, which uses a probe to achieve electrical signal connection between the middle layer structure of the CPU chip and the motherboard, avoiding welding, facilitating disassembly and assembly, and can effectively reduce production costs and improve production yield.

[0004] The embodiment of the present application is implemented as follows:

[0005] An embodiment of the present application provides a probe-type connection device for connecting a CPU chip and a motherboard, the probe-type connection device including a probe holder and a probe; the probe holder is arranged on the motherboard and forms a contact surface, the contact surface covers the projection area of ​​the CPU chip on the motherboard; a plurality of mounting through holes arranged in an array are provided on the probe holder, the probe is inserted into the mounting through hole, one end abuts against the intermediate layer structure on the CPU chip, and the other end abuts against the contact portion on the motherboard.

[0006] As an optional embodiment, it also includes a first fixed seat connected to the main board through a locking member, a window is opened on the first fixed seat, and the probe seat is embedded in the window; a limiting structure is provided around the window, which abuts against the surface of the probe seat facing away from the main board, for preventing the probe seat from moving away from the main board.

[0007] As an optional embodiment, a second fixing seat is provided on the side of the mainboard away from the first fixing seat; the locking piece passes through the connection hole on the mainboard and is connected to the second fixing seat; the second fixing seat has a groove close to the side of the mainboard for avoiding electronic components on the mainboard.

[0008] As an optional embodiment, the probe includes a central sleeve and two needle heads respectively inserted in the central sleeve; a spring element is provided inside the central sleeve, and the two needle heads are forced to approach each other axially and compress the spring element.

[0009] As an optional embodiment, the probe seat includes a first probe seat and a second probe seat arranged in a stacked manner; a blocking platform is provided in the mounting through holes of the first probe seat and the second probe seat; the blocking platform on the first probe seat abuts against one end face of the middle sleeve, and the blocking platform on the second probe seat abuts against the other end face of the middle sleeve.

[0010] As an optional embodiment, a locking plate is installed on the side of the first fixing seat facing away from the mainboard, and an elastic pressing component is provided on the locking plate. The elastic pressing component abuts against the surface of the middle layer structure facing away from the mainboard, generating an elastic force that pushes the middle layer structure close to the probe.

[0011] As an optional embodiment, the elastic pressing assembly includes an abutting portion and an elastic member connecting the abutting portion and the locking plate; the abutting portion is arranged around the circumference of the CPU chip and abuts against the circumferential edge of the intermediate layer structure.

[0012] As an optional embodiment, the first fixing seat is provided with a plurality of guide posts arranged at intervals around the circumference of the CPU chip; the locking plate is provided with a plurality of guide holes, and the guide posts are correspondingly plugged into the guide holes.

[0013] As an optional embodiment, the inner wall of the window is provided with a lateral limiting surface abutting against the circumferential side surface of the intermediate layer structure, so as to prevent the intermediate layer structure from moving within the plane where the window is located.

[0014] As an optional implementation, both the first fixing seat and the intermediate layer structure are provided with identification structures for alignment installation.

[0015] The beneficial effects of the embodiments of the present application include:

[0016] The embodiment of the present application provides a probe-type connection device for connecting a CPU chip to a mainboard. The probe-type connection device provided by the embodiment of the present application includes a probe seat and a probe; the probe seat is arranged on the mainboard and forms a contact surface, and the contact surface covers the projection area of ​​the CPU chip on the mainboard. The probe seat of the embodiment of the present application is provided with a plurality of mounting holes arranged in an array, wherein the mounting holes extend perpendicular to the plane where the mainboard is located, and the probe is inserted into the mounting holes, with one end abutting against the middle layer structure on the CPU chip and the other end abutting against the contact portion on the mainboard. Compared with the prior art, the embodiment of the present application connects the middle layer structure of the CPU chip to the contact portion on the mainboard through the probes arranged in an array, realizes the abutment and conduction between the CPU chip and the mainboard, avoids the implementation of welding, thereby facilitating disassembly and assembly, and can effectively reduce production costs and improve production yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is one of the structural diagrams of the probe-type connection device according to an embodiment of the present application;

[0019] Figure 2 This is the second structural diagram of the probe-type connection device according to an embodiment of the present application;

[0020] Figure 3 This is the third structural diagram of the probe-type connection device according to an embodiment of the present application;

[0021] Figure 4 This is the fourth structural diagram of the probe-type connection device according to an embodiment of the present application;

[0022] Figure 5 This is the fifth structural diagram of the probe-type connection device according to an embodiment of the present application;

[0023] Figure 6 This is the sixth structural diagram of the probe-type connection device according to an embodiment of the present application;

[0024] Figure 7 This is the seventh structural diagram of the probe-type connection device according to an embodiment of the present application.

[0025] icon:

[0026] 100-middle layer structure; 101-mainboard; 102-probe seat; 1020-first probe seat; 1021-second probe seat; 103-probe; 104-mounting through hole; 105-first fixing seat; 106-window; 107-limiting structure; 108-second fixing seat; 109-sink; 110-middle sleeve; 111-needle head; 112-blocking platform; 113-locking plate; 114-elastic pressing assembly; 115-abutment portion; 116-elastic member; 117-guide column; 118-guide hole; 119-CPU chip. DETAILED DESCRIPTION

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without creative work are within the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," "third," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0030] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] An interposer (intermediate layer structure 100) is typically provided between the CPU chip 119 and the motherboard 101 to connect electrical signals and physically support the CPU chip 119 and the motherboard 101, thereby achieving efficient and reliable signal transmission. Conventional interposers 100 require pre-soldering the interposer 100 to the motherboard 101, and then connecting the pins on the CPU chip 119 to the solder balls of the interposer 100 in a one-to-one correspondence. The numerous solder joints make operation difficult and easily lead to cold solder joints during production, resulting in abnormal electrical signal transmission. This results in a low production yield and high production costs. Furthermore, after the CPU chip 119 and the motherboard 101 are connected by soldering, disassembly becomes difficult and inconvenient in the event of a malfunction.

[0032] In order to solve the above technical problems, an embodiment of the present application provides a probe-type connection device.

[0033] Reference Figure 1 、 Figure 2 as well as Figure 3As shown, an embodiment of the present application provides a probe-type connection device for connecting a CPU chip 119 with a motherboard 101, and the probe-type connection device includes a probe seat 102 and a probe 103; the probe seat 102 is arranged on the motherboard 101 and forms a contact surface, and the contact surface covers the projection area of ​​the CPU chip 119 on the motherboard 101; a plurality of array-arranged mounting through holes 104 are provided on the probe seat 102, and the probe 103 is inserted into the mounting through hole 104, with one end abutting against the intermediate layer structure 100 on the CPU chip 119 and the other end abutting against the contact portion on the motherboard 101.

[0034] The embodiment of the present application provides a probe 103 type connection device for connecting a CPU chip 119 with a motherboard 101 . The probe 103 type connection device provided in the embodiment of the present application includes a probe seat 102 and a probe 103 .

[0035] It should be noted that the probe seat 102 can be one structural component or two structural components.

[0036] Exemplarily, the probe base 102 is a structural component, and the probe 103 is inserted into a mounting through hole 104 formed in the probe base 102 , with both ends thereof respectively abutting against the intermediate layer structure 100 and the main board 101 .

[0037] For example, refer to Figure 2 、 Figure 3 as well as Figure 6 As shown, the probe base 102 includes a first probe base 1020 and a second probe base 1021, which are stacked. Stopping platforms 112 are provided within the mounting holes 104 of both the first and second probe bases 1020 and 1021. The stopping platform 112 on the first probe base 1020 abuts one end surface of the central sleeve 110, while the stopping platform 112 on the second probe base 1021 abuts the other end surface of the central sleeve 110. The provision of stopping platforms 112 in this embodiment of the present application prevents axial movement of the probe 103, thereby improving the stability of the probe 103 on the probe base 102.

[0038] The probe seat 102 of the embodiment of the present application is arranged on the mainboard 101 and forms a contact surface, which covers the projection area of ​​the CPU chip 119 on the mainboard 101 .

[0039] It should be noted that the contact surface formed by the probe seat 102 and the mainboard 101 of the embodiment of the present application covers the projection area of ​​the CPU chip 119 on the mainboard 101, ensuring that the probe 103 inserted on the probe seat 102 can accurately abut against the intermediate layer structure 100. As needed, the contact surface can be made to coincide with the projection area of ​​the CPU chip 119 on the mainboard 101, or the contact surface of the probe seat 102 and the mainboard 101 can be larger than the projection area of ​​the CPU chip 119 on the mainboard 101, and the projection area is located within the contact surface.

[0040] The probe seat 102 of the embodiment of the present application is provided with a plurality of mounting holes 104 arranged in an array, wherein the mounting holes 104 extend perpendicularly to the plane where the motherboard 101 is located, and the probe 103 is inserted into the mounting holes 104, with one end abutting against the intermediate layer structure 100 on the CPU chip 119 and the other end abutting against the contact portion on the motherboard 101.

[0041] It should be noted that the probe 103 abuts against the intermediate layer structure 100 to achieve a conductive connection with the CPU chip 119, and the probe 103 abuts against the contact portion on the motherboard 101 to achieve an electrical connection with the motherboard 101. The probe 103 is vertically sandwiched between the CPU chip 119 and the motherboard 101, thereby achieving an electrical connection between the CPU chip 119 and the motherboard 101.

[0042] It should be noted that the probes 103 correspond one-to-one with the contact portions 115 on the intermediate layer structure 100 and the contact portions on the mainboard 101. In other words, the projection of the contact portions 115 formed on the intermediate layer structure 100 on the mainboard 101 overlaps or coincides with the contact portions on the mainboard 101. The probe holder 102 enables the probes 103 to be positioned vertically between the CPU chip 119 and the mainboard 101, ensuring that the upper and lower ends of the probes 103 respectively abut against the CPU chip 119 and the mainboard 101 to be connected, thereby enabling electrical signal transmission.

[0043] The present embodiment avoids the use of soldering, thereby resolving the problem of multiple solder joints and resulting cold solder joints. The electrical connection between the CPU chip 119 and the motherboard 101 can be achieved through simple assembly. This not only facilitates operation during production, but also effectively improves production efficiency, increases production yield, and reduces production costs. Furthermore, it is easy to disassemble and assemble during production or later use, making it easier for staff to detect and repair abnormalities.

[0044] Compared with the prior art, the embodiment of the present application connects the intermediate layer structure 100 of the CPU chip 119 with the contact portion on the mainboard 101 through array-arranged probes 103, thereby achieving abutment conductivity between the CPU chip 119 and the mainboard 101, avoiding welding, thereby facilitating disassembly and assembly, and can effectively reduce production costs and improve production yield.

[0045] Reference Figure 1 、 Figure 4 As shown, as an optional embodiment, it also includes a first fixing seat 105 connected to the main board 101 through a locking member, and a window 106 is provided on the first fixing seat 105, and the probe seat 102 is embedded in the window 106; the window 106 is circumferentially provided with a limiting structure 107 that abuts against the surface of the probe seat 102 facing away from the main board 101, which is used to prevent the probe seat 102 from moving away from the main board 101.

[0046] Furthermore, the embodiment of the present application also includes a first fixing seat 105, which is installed on the mainboard 101 through a locking member, wherein the locking member can be a bolt or other fixing member, and technicians in this field can set it according to needs.

[0047] In the embodiment of the present application, a window 106 is opened on the first fixing seat 105 , and the probe seat 102 is embedded in the window 106 .

[0048] It should be noted that the window 106 can limit the movement of the probe seat 102 within the plane of the mainboard 101, that is, the inner wall of the window 106 is provided with a limiting portion abutting against the circumferential side of the probe seat 102, which can be used to prevent the probe seat 102 from moving within the window 106.

[0049] In the embodiment of the present application, the limiting structure 107 can be used to support the probe seat 102 to prevent the probe seat 102 from moving away from the plane where the mainboard 101 is located, ensuring that the probe seat 102 is arranged in contact with the surface of the mainboard 101.

[0050] Furthermore, the inner wall of the window 106 is provided with a lateral limiting surface that abuts against the circumferential side surface of the intermediate layer structure 100 , so as to prevent the intermediate layer structure 100 from moving within the plane where the window 106 is located.

[0051] It should be noted that the probe seat 102 of the embodiment of the present application includes a first probe seat 1020 and a second probe seat 1021 that are stacked; a blocking platform 112 is provided in the mounting through holes 104 of the first probe seat 1020 and the second probe seat 1021; the blocking platform 112 on the first probe seat 1020 abuts against one end face of the middle sleeve 110, and the blocking platform 112 on the second probe seat 1021 abuts against the other end face of the middle sleeve 110.

[0052] Among them, reference Figure 3 As shown, the first probe seat 1020 is close to the motherboard 101, and the second probe seat 1021 is close to the CPU chip 119. The first probe seat 1020 is provided with a threaded connection hole, and the second probe seat 1021 is fixed to the first probe seat 1020 by connecting the second probe seat 1021 to the first probe seat 1020. Similarly, the first fixing seat 105 is provided with a threaded connection hole, and the first probe seat 1020 is fixed to the first fixing seat 105 by connecting the first probe seat 1020 to the first fixing seat 105.

[0053] The above arrangement allows the entire probe base 102 and probe 103 to form a modular assembly, which is convenient for fixing to the first fixing base 105. It should be noted that a guide shaft hole can be provided on the first probe base 1020, and the guide shaft hole can be connected to the guide rod on the first fixing base 105, so as to improve the positioning accuracy of the probe 103 on the probe base 102.

[0054] Reference Figure 1 、 Figure 5 As shown, as an optional embodiment, a second fixing seat 108 is provided on the side of the mainboard 101 away from the first fixing seat 105; the locking member passes through the connection hole on the mainboard 101 and is connected to the second fixing seat 108; the second fixing seat 108 has a groove 109 on the side close to the mainboard 101 for avoiding electronic components on the mainboard 101.

[0055] An insulating layer structure is sandwiched between the second fixing base 108 and the mainboard 101 .

[0056] Furthermore, the embodiment of the present application also includes a second fixing seat 108. The second fixing seat 108 and the first fixing seat 105 are distributed on both sides of the mainboard 101. The second fixing seat 108 and the first fixing seat 105 can clamp the mainboard 101 through a locking member to achieve a stable connection between the entire device and the mainboard 101.

[0057] It should be noted that the present application generally forms two modules located on either side of the motherboard 101. The first module is mainly composed of the first fixing seat 105, on which the probe seat 102, probe 103, and CPU chip 119 are mounted. The other module is the second fixing seat 108 located on the other side of the motherboard 101. The two modules are clamped and assembled on the motherboard 101 to achieve electrical connection between the CPU chip 119 and the motherboard 101.

[0058] The locking member may be a bolt or other connecting member, and its purpose is to install the first fixing seat 105 and the second fixing seat 108 on the mainboard 101 .

[0059] It should be noted that, in the embodiment of the present application, a recess 109 is provided on the second fixing seat 108, and an escape space is formed by the recess 109 for accommodating electrical components on the mainboard 101, thereby preventing the generation of squeezing force on the electrical components and avoiding damage to the electrical components.

[0060] It should be noted that, as needed, a recessed groove 109 may be provided on the first fixing seat 105 to accommodate electrical components on the surface of the motherboard 101 on the side where the CPU chip 119 is installed, to prevent the generation of squeezing force on the electrical components and to avoid damage to the electrical components.

[0061] Reference Figure 6 As shown, as an optional embodiment, the probe 103 includes a middle sleeve 110 and two needle heads 111 respectively inserted into the middle sleeve 110; a spring element is provided inside the middle sleeve 110, and the two needle heads 111 can be forced to approach each other axially and compress the spring element.

[0062] Furthermore, the probe 103 of the embodiment of the present application includes a central sleeve 110, within which a spring element is disposed. When the two needle heads 111 abut against the intermediate structure 100 and the main board 101, respectively, the resulting abutting thrust pushes the needle heads 111 to compress the spring element, thereby achieving elastic abutment between the two ends of the probe 103 and the intermediate structure 100 and the main board 101. This elastic abutment ensures close contact between the two ends of the probe 103 and the intermediate structure 100 and the main board 101, while also providing a certain degree of assembly tolerance in the axial direction.

[0063] Reference Figure 1 As shown, as an optional embodiment, a locking plate 113 is installed on the side of the first fixing seat 105 facing away from the main board 101, and an elastic pressing component 114 is provided on the locking plate 113. The elastic pressing component 114 abuts against the surface of the middle layer structure 100 facing away from the main board 101, generating an elastic force that pushes the middle layer structure 100 close to the probe 103.

[0064] Among them, reference Figure 7 As shown, the elastic pressing assembly 114 includes an abutting portion 115 and an elastic member 116 connecting the abutting portion 115 and the locking plate 113 ; the abutting portion 115 is arranged around the circumference of the CPU chip 119 and abuts against the circumferential edge of the intermediate layer structure 100 .

[0065] It should be noted that in the embodiment of the present application, the elastic pressing component 114 presses the CPU chip 119 to ensure that the CPU chip 119 and the probe 103 can effectively abut. By abutting the circumferential edge of the intermediate layer structure 100, the intermediate layer structure 100 can be evenly stressed, ensuring the parallelism between the intermediate layer structure 100 and the probe seat 102.

[0066] Reference Figure 4 As shown, as an optional embodiment, the first fixing seat 105 is provided with a plurality of guide columns 117 circumferentially spaced around the CPU chip 119; the locking plate 113 is provided with a plurality of guide holes 118, and the guide columns 117 are correspondingly plugged into the guide holes 118.

[0067] Furthermore, in the embodiment of the present application, a guide column 117 is provided on the first fixing seat 105 . The precise cooperation between the guide column 117 and the guide hole 118 enables the locking plate 113 to be precisely installed, ensuring that the elastic pressing component 114 can achieve precise contact with the CPU chip 119 .

[0068] As an optional implementation, both the first fixing seat 105 and the intermediate layer structure 100 are provided with identification structures for alignment installation.

[0069] The embodiment of the present application can prevent the CPU chip 119 from being installed incorrectly by setting the identification structure, facilitating quick assembly. It should be noted that the identification structure can be any identification, and can be a substantial structural identification, such as a protrusion or groove formed by processing, or a flat identification attached by adhesive.

[0070] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A probe-type connection device for connecting a CPU chip (119) and a motherboard (101), characterized in that: The probe (103) type connection device comprises a probe seat (102) and a probe (103); the probe seat (102) is arranged on the mainboard (101) and forms a contact surface, and the contact surface covers the projection area of ​​the CPU chip (119) on the mainboard (101); the probe seat (102) is provided with a plurality of mounting through holes (104) arranged in an array, and the probe (103) is inserted into the mounting through holes (104), with one end abutting against the intermediate layer structure (100) on the CPU chip (119) and the other end abutting against the contact portion on the mainboard (101).

2. The probe type connection device according to claim 1, characterized in that: The invention also comprises a first fixing seat (105) connected to the main board (101) through a locking member, wherein a window (106) is provided on the first fixing seat (105), and the probe seat (102) is embedded in the window (106); the window (106) is circumferentially provided with a limiting structure (107) which abuts against a surface of a side of the probe seat (102) facing away from the main board (101), and is used to prevent the probe seat (102) from moving away from the main board (101).

3. The probe type connection device according to claim 2, characterized in that: A second fixing seat (108) is provided on the side of the mainboard (101) facing away from the first fixing seat (105); the locking member passes through the connection hole on the mainboard (101) and is connected to the second fixing seat (108); a sink groove (109) is provided on the side of the second fixing seat (108) close to the mainboard (101) for avoiding electronic components on the mainboard (101).

4. The probe type connection device according to any one of claims 1 to 3, characterized in that: The probe (103) comprises a middle sleeve (110) and two needle heads (111) respectively inserted into the middle sleeve (110); a spring element is arranged inside the middle sleeve (110), and the two needle heads (111) can be forced to approach each other axially and compress the spring element.

5. The probe type connection device according to claim 4, characterized in that: The probe seat (102) comprises a first probe seat (1020) and a second probe seat (1021) which are stacked; a blocking platform (112) is provided in the mounting through hole (104) of the first probe seat (1020) and the second probe seat (1021); the blocking platform (112) on the first probe seat (1020) abuts against one end surface of the middle sleeve (110), and the blocking platform (112) on the second probe seat (1021) abuts against the other end surface of the middle sleeve (110).

6. The probe type connection device according to claim 2 or 3, characterized in that: A locking plate (113) is installed on the side of the first fixing seat (105) facing away from the main board (101), and an elastic pressing component (114) is provided on the locking plate (113). The elastic pressing component (114) abuts against the surface of the middle layer structure (100) on the side facing away from the main board (101), thereby generating an elastic force that pushes the middle layer structure (100) close to the probe (103).

7. The probe type connection device according to claim 6, characterized in that: The elastic pressing assembly (114) includes an abutting portion (115) and an elastic member (116) connecting the abutting portion (115) and the locking plate (113); the abutting portion (115) is arranged around the circumference of the CPU chip (119) and abuts against the circumferential edge of the intermediate layer structure (100).

8. The probe type connection device according to claim 6, characterized in that: The first fixing seat (105) is provided with a plurality of guide posts (117) arranged at intervals in the circumferential direction around the CPU chip (119); the locking plate (113) is provided with a plurality of guide holes (118), and the guide posts (117) are correspondingly plugged into the guide holes (118).

9. The probe type connection device according to any one of claims 2-3 and claims 7-8, characterized in that: The inner wall of the window (106) is provided with a lateral limiting surface that abuts against the circumferential side surface of the intermediate layer structure (100) and is used to prevent the intermediate layer structure (100) from moving within the plane where the window (106) is located.

10. The probe type connection device according to any one of claims 2-3 and claims 7-8, characterized in that: The first fixing seat (105) and the intermediate layer structure (100) are both provided with identification structures for alignment installation.

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